Cross-coupled antenna device

Abstract

A cross-coupling antenna device includes at least a chip antenna, which includes a carrier and an upper radiation layer. The carrier has a top surface and a bottom surface, and has two long sides and two short sides between the top surface and the bottom surface. The upper radiation layer includes two rake-shaped first and second radiation layers that are symmetrically arranged on the top surface and the two short sides of the carrier. The first and second radiation layers are arranged in a cross-coupling manner on the top surface of the carrier. The chip antenna can reduce the frequency and size, and the cross-coupling antenna device can be installed and used in small 3C electronic products.

Description

Technical Field

[0001] This utility model relates to an antenna, and more particularly to a cross-coupled antenna device that can reduce size and frequency. Background Technology

[0002] Current 3C electronic products, including Bluetooth headsets, smart bracelets, smartwatches, wireless modules, and other small products, are all being developed and designed to be lightweight, thin, and compact, so that users can carry them around easily.

[0003] As 3C electronic products become thinner and lighter, the size of the antennas installed inside these products to transmit and receive wireless communication signals also needs to be reduced, or the antenna device type needs to be changed so that the antenna device can be installed inside the electronic product.

[0004] Currently, the most common type of chip antenna on the market is the multi-frequency single-feed chip antenna. During manufacturing, a ceramic material is first formed into a square shape, and a radiation pattern layer for signal transmission or reception is formed on the surface of this square shape using etching technology. After the chip antenna is electrically connected to the antenna substrate and installed in a 3C electronic product, it can then transmit wireless communication signals.

[0005] Because the radiating lines on the surface of a chip antenna, while capable of transmitting wireless communication signals, cannot be designed with a fixed shape or pattern for their routing or layout, chip antenna designs cannot effectively reduce antenna frequency and size. This results in stagnant performance and low frequency adjustability. Furthermore, it prevents the antenna substrate used with chip antennas from being miniaturized enough for installation in thin, lightweight 3C electronic products.

[0006] Therefore, how to solve the problems in the design of the radiation circuit on the surface of traditional chip antennas, so that the chip antenna can be reduced in size and frequency, is the problem that this utility model aims to solve. Utility Model Content

[0007] The main purpose of this invention is to address the shortcomings of traditional methods. This invention utilizes a relatively symmetrical two-rake-shaped radiating pattern design and sets the two-rake-shaped radiating pattern on one or both sides of the chip antenna in a cross-coupled manner. This allows the chip antenna to reduce its frequency and size, enabling the cross-coupled antenna device to be installed and used inside small 3C electronic products.

[0008] To achieve the above objectives, this utility model provides a cross-coupled antenna device, comprising at least one chip antenna, which includes: a carrier and an upper radiating layer. The carrier has a top surface and a bottom surface, with two long sides and two short sides between the top and bottom surfaces. The upper radiating layer includes a first radiating layer and a second radiating layer in a symmetrical rake shape, located on the top surface and the two short sides of the carrier. The first and second radiating layers are arranged in a cross-coupled configuration on the top surface of the carrier.

[0009] In one embodiment of this utility model, the carrier is a square body made of glass fiber or ceramic material.

[0010] In one embodiment of the present invention, the first radiating layer and the second radiating layer respectively have a first longitudinal metal line and a second longitudinal metal line located on the two short sides, and the first longitudinal metal line and the second longitudinal metal line are electrically connected to a plurality of claw-shaped first transverse metal lines and a second transverse metal line.

[0011] In one embodiment of the present invention, the first transverse metal wires and the second transverse metal wires are arranged in a cross-coupled manner on the top surface of the carrier.

[0012] In one embodiment of the present invention, the chip antenna further includes a lower radiating layer, which includes a third radiating layer and a fourth radiating layer in a symmetrical rake shape, the third radiating layer and the fourth radiating layer being located on the bottom surface and the two short sides of the carrier.

[0013] In one embodiment of the present invention, the third radiating layer and the fourth radiating layer respectively have a third longitudinal metal line and a fourth longitudinal metal line located on the two short sides, and the third longitudinal metal line and the fourth longitudinal metal line are electrically connected to a plurality of claw-shaped third transverse metal lines and fourth transverse metal lines respectively.

[0014] In one embodiment of the present invention, the third transverse metal wires and the fourth transverse metal wires are arranged on the bottom surface of the carrier in a cross-coupled manner.

[0015] In one embodiment of this utility model, the two short sides have two symmetrical semi-circular slots.

[0016] In one embodiment of the present invention, the chip antenna further includes a conductive layer, which includes a first conductive layer and a second conductive layer. The first conductive layer and the second conductive layer are respectively disposed in the semi-circular slot. The first conductive layer electrically connects the first longitudinal metal line of the first radiating layer and the third longitudinal metal line of the third radiating layer, and the second conductive layer electrically connects the second longitudinal metal line of the second radiating layer and the fourth longitudinal metal line of the fourth radiating layer, so that the first radiating layer and the third radiating layer are electrically connected, and the second radiating layer and the fourth radiating layer are electrically connected.

[0017] In one embodiment of this utility model, the cross-coupled antenna device further includes an antenna substrate, which includes a carrier plate, a first ground layer, an electrode, a signal feed line, and a second ground layer. The carrier plate has the first ground layer and a bare area on its front side, with the electrode and signal feed line on the bare area. The carrier plate has a second ground layer corresponding to the first ground layer and a clear area corresponding to the bare area on its back side. The electrode includes a first electrode and a second electrode. The first electrode is electrically connected to a U-shaped metal line segment, with its two ends electrically connected to the first ground layer and the signal feed line, respectively. The first and second electrodes are electrically connected to the first and second electrodes via the first longitudinal metal line of the first radiating layer and the second longitudinal metal line of the second radiating layer on the top surface, or via the third longitudinal metal line of the third radiating layer and the fourth longitudinal metal line of the fourth radiating layer on the bottom surface. The signal feed line includes a first signal feed section and a second signal feed section. There is a first coupling gap between the first signal feed section and the second signal feed section, and there is a second coupling gap between the first signal feed section and the second signal feed section and the first ground layer. The frequency can be adjusted by adjusting the gap between the first coupling gap and the second coupling gap.

[0018] In one embodiment of this invention, the first coupling gap and the second coupling gap are electrically connected to a matching component for impedance and frequency adjustment.

[0019] In one embodiment of this invention, the matching component is a capacitor or an inductor. Attached Figure Description

[0020] Figure 1 This is a three-dimensional schematic diagram of the chip antenna of the cross-coupled antenna device according to the first embodiment of this utility model;

[0021] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the appearance of the other side of the chip antenna;

[0022] Figure 3This is a three-dimensional schematic diagram of the chip antenna of the cross-coupled antenna device according to the second embodiment of this utility model;

[0023] Figure 4 yes Figure 3 A three-dimensional schematic diagram of the appearance of the other side of the chip antenna;

[0024] Figure 5 yes Figure 1 or Figure 3 A schematic diagram showing the exploded appearance of the chip antenna and antenna substrate;

[0025] Figure 6 yes Figure 5 A three-dimensional schematic diagram of the appearance of the chip antenna after it is electrically connected to the antenna substrate;

[0026] Figure 7 yes Figure 6 A schematic diagram of the other side of the antenna substrate. Detailed Implementation

[0027] The technical content and detailed description of this utility model are now explained in conjunction with the accompanying drawings:

[0028] Please see Figure 1 , Figure 2 This is a three-dimensional schematic diagram of the chip antenna of the cross-coupled antenna device according to the first embodiment of this utility model. Figure 1 A three-dimensional schematic diagram of the other side of the chip antenna. As shown in the figure: The cross-coupled antenna device of this utility model includes at least one chip antenna 10, which includes: a carrier 1, an upper radiating layer 2, a lower radiating layer 3 and a conductive layer 4.

[0029] The carrier 1 is a square body with a top surface 11 and a bottom surface 12. Two long sides 13 and two short sides 14 are located between the top surface 11 and the bottom surface 12. Two symmetrical semi-circular slots 15 are also present on the two short sides 14. In this drawing, the carrier 1 is made of fiberglass or ceramic material.

[0030] The upper radiating layer 2 includes a first radiating layer 21 and a second radiating layer 22 in a symmetrical, rake-like shape. The first radiating layer 21 and the second radiating layer 22 are located on the top surface 11 and two short sides 14 of the carrier 1, respectively. The first radiating layer 21 and the second radiating layer 22 each have a first longitudinal metal line 211 and a second longitudinal metal line 221 located on the two short sides 14. Multiple claw-shaped first transverse metal lines 212 and second transverse metal lines 222 are electrically connected to each other. In this embodiment, the number of these first transverse metal lines 212 and second transverse metal lines 222 is, but not limited to, two claws. These first transverse metal lines 212 and second transverse metal lines 222 are arranged on the top surface 11 of the carrier 1 in a cross-coupled manner. In this drawing, the upper radiating layer 2 is a copper foil.

[0031] The lower radiating layer 3 includes a symmetrically shaped third radiating layer 31 and a fourth radiating layer 32. The third radiating layer 31 and the fourth radiating layer 32 are located on the bottom surface 12 and two short sides 14 of the carrier 1. The third radiating layer 31 and the fourth radiating layer 32 each have a third longitudinal metal line 311 and a fourth longitudinal metal line 321 located on the two short sides 14. Multiple claw-shaped third transverse metal lines 312 and fourth transverse metal lines 322 are electrically connected to each other. In this embodiment, the number of these claw-shaped third transverse metal lines 312 and fourth transverse metal lines 322 is, but not limited to, two. These third transverse metal lines 312 and fourth transverse metal lines 322 are arranged on the bottom surface 12 of the carrier 1 in a cross-coupled manner. In this drawing, the lower radiating layer 3 is a copper foil.

[0032] The conductive layer 4 includes a first conductive layer 41 and a second conductive layer 42. The first conductive layer 41 and the second conductive layer 42 are respectively disposed in the semi-circular slot 15. The first conductive layer 41 electrically connects the first longitudinal metal line 211 of the first radiating layer 21 and the third longitudinal metal line 311 of the third radiating layer 31, and the second conductive layer 42 electrically connects the second longitudinal metal line 221 of the second radiating layer 22 and the fourth longitudinal metal line 321 of the fourth radiating layer 32, so that the first radiating layer 21 and the third radiating layer 31 are electrically connected, and the second radiating layer 22 and the fourth radiating layer 32 are also electrically connected. In this drawing, the conductive layer 4 is silver or tin.

[0033] It is worth mentioning that the first radiating layer 21, the second radiating layer 22, the third radiating layer 31, and the fourth radiating layer 32 on the chip antenna 10 of this utility model all utilize a symmetrical two-rake shape design. The first transverse metal line 212, the second transverse metal line 222, the third transverse metal line 312, and the fourth transverse metal line 322 of the claws are arranged in a cross-coupled manner on the surface of the carrier 1. This design can reduce the size of the chip antenna, for example, it can be reduced from the original 3.2mm x 1.6mm chip antenna to 2.0mm x 1.2mm or to 1.6mm x 0.8mm, and can be applied to small products such as Bluetooth headsets, smart bracelets, smartwatches, wireless modules, or GPS.

[0034] More notably, the first radiating layer 21, the second radiating layer 22, the third radiating layer 31, and the fourth radiating layer 32 on the chip antenna 10 of this invention utilize a symmetrical two-rake shape design. This not only reduces the size but also lowers the frequency. Combined with the double-sided design of the upper radiating layer 2 and the lower radiating layer 3, even greater frequency reductions can be achieved during coupling. For example, the frequency reduction can be from approximately 3GHz to 2.45GHz, 3GHz to 1.575GHz, etc. This frequency reduction is to conform to the frequency bands of antenna applications (e.g., Bluetooth 2.4G, GPS, etc.). The applicable frequency bands of this invention are 2.4~2.5GHz (Bluetooth, Wi-Fi 2.4G) and 1.555GHz~1.595GHz (GPS).

[0035] Furthermore, the radiating layer (upper radiating layer 2 or lower radiating layer) on the chip antenna 10 of this invention can be designed on one side or on both sides to more effectively reduce the frequency and achieve a smaller size. Compared with other chip antenna designs, it can improve efficiency and has higher frequency adjustability.

[0036] Please see Figure 3 , Figure 4 This is a three-dimensional schematic diagram of the chip antenna of the cross-coupled antenna device according to the second embodiment of this utility model. Figure 3 A three-dimensional schematic diagram of the other side of the chip antenna is shown. As shown in the figure, the chip antenna 10 of the second embodiment of this utility model is generally the same as that of the first embodiment, except that the number of the first horizontal metal lines 212, the second horizontal metal lines 222, the third horizontal metal lines 312, and the fourth horizontal metal lines 322 is, but not limited to, three claws. The more claws there are, the more effectively the frequency can be reduced. The number of claws is selected according to the application frequency band.

[0037] Please see Figures 5 to 7 ,yes Figure 1 or Figure 3 The exploded view of the chip antenna and antenna substrate is shown in the diagram. Figure 5A three-dimensional schematic diagram of the appearance of the chip antenna after it is electrically connected to the antenna substrate. Figure 6 A schematic diagram of another side of the antenna substrate. The chip antenna 10 is electrically connected to the antenna substrate 20, which is illustrated on an antenna substrate 20 having a clearance area 52.

[0038] The antenna substrate 20 includes a carrier plate 5, which has a first ground layer 6 and a bare area 51 on its front side. The bare area 51 has an electrical terminal 7 and a signal feed line 8.

[0039] The electrode 7 includes a first electrode 71 and a second electrode 72. The first electrode 71 is electrically connected to a U-shaped metal line segment 73. The two ends of the metal line segment 73 are electrically connected to the first ground layer 6 and the signal feed line 8, respectively.

[0040] The signal feed line 8 includes a first signal feed section 81 and a second signal feed section 82. A first coupling gap 83 exists between the first signal feed section 81 and the second signal feed section 82, and a second coupling gap 84 exists between the first signal feed section 81 and the second signal feed section 82 and the first ground layer 6. Besides adjusting the size of the first coupling gap 83 and the second coupling gap 84 to adjust the frequency, a matching component (not shown in the figure) can also be electrically connected to the first coupling gap 83 and the second coupling gap 84 to perform impedance and frequency adjustment. In this diagram, the matching component is a capacitor or an inductor.

[0041] Additionally, the back of the carrier plate 5 has a second grounding layer 9 corresponding to the first grounding layer 6, and a clearance area 52 corresponding to the bare area 51.

[0042] When the chip antenna 10 is electrically connected to the antenna substrate 20, it is electrically connected to the first vertical metal line 211 of the first radiating layer 21 and the second vertical metal line 221 of the second radiating layer 22 on the top surface 11, or to the third vertical metal line 311 of the third radiating layer 31 and the fourth vertical metal line 321 of the fourth radiating layer 32 on the bottom surface 12, and to the first electrical terminal 71 and the second electrical terminal 72 of the electrode terminal 7. After the chip antenna 10 is electrically connected to the antenna substrate 20, the frequency can be effectively reduced to achieve a smaller size. Compared with other chip antenna designs, it can improve efficiency and has higher frequency adjustability.

[0043] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. All equivalent variations and modifications made within the scope of the claims of this utility model are covered by the patent scope of this utility model.

[0044] [Symbol Explanation]

[0045] 10: Chip Antenna

[0046] 1: Carrier

[0047] 11: Top surface

[0048] 12 Bottom

[0049] 13: Long side

[0050] 14: Short side

[0051] 15: Semi-circular slot

[0052] 2: Upper Radiation Layer

[0053] 21: First Radiation Layer

[0054] 211: First longitudinal metal line

[0055] 212: First horizontal metal line

[0056] 22: Second Radiation Layer

[0057] 221: Second longitudinal metal line

[0058] 222: Second horizontal metal line

[0059] 3: Lower Radiation Layer

[0060] 31: Third Radiation Layer

[0061] 311: Third vertical metal line

[0062] 312: Third horizontal metal line

[0063] 32: Fourth Radiation Layer

[0064] 321: Fourth vertical metal line

[0065] 322: Fourth horizontal metal line

[0066] 4: Conductive layer

[0067] 41: First conductive layer

[0068] 42: Second conductive layer

[0069] 20: Antenna substrate

[0070] 5: Carrier board

[0071] 51: Bare Space Zone

[0072] 52: Clearance Zone

[0073] 6: First grounding layer

[0074] 7: Electric poles

[0075] 71: First electrode

[0076] 72: Second electrode

[0077] 73: Metallic line segment

[0078] 8: Signal feed line

[0079] 81: First signal feed section

[0080] 82: Second signal feed section

[0081] 83: First coupling gap

[0082] 84: Second coupling gap

[0083] 9: Second grounding layer.

Claims

1. A cross-coupled antenna device, characterized in that, It includes at least one chip antenna, said chip antenna comprising: A carrier having a top surface and a bottom surface, with two long sides and two short sides between the top surface and the bottom surface; An upper radiation layer comprises a first radiation layer and a second radiation layer in the shape of two symmetrical rakes, the first radiation layer and the second radiation layer being located on the top surface and the two short sides of the carrier; The first radiating layer and the second radiating layer are disposed on the top surface of the carrier in a cross-coupled configuration.

2. The cross-coupled antenna device according to claim 1, characterized in that, The carrier is a square shape made of fiberglass or ceramic material.

3. The cross-coupled antenna device according to claim 1, characterized in that, The first radiating layer and the second radiating layer each have a first longitudinal metal line and a second longitudinal metal line located on the two short sides, and the first longitudinal metal line and the second longitudinal metal line are electrically connected to a plurality of claw-shaped first transverse metal lines and a second transverse metal line.

4. The cross-coupled antenna device according to claim 3, characterized in that, These first transverse metal wires and these second transverse metal wires are arranged on the top surface of the carrier in a cross-coupled manner.

5. The cross-coupled antenna device according to claim 4, characterized in that, The chip antenna also includes a lower radiating layer, which includes a third radiating layer and a fourth radiating layer in a symmetrical rake shape, the third radiating layer and the fourth radiating layer being located on the bottom surface and the two short sides of the carrier.

6. The cross-coupled antenna device according to claim 5, characterized in that, The third radiating layer and the fourth radiating layer each have a third longitudinal metal line and a fourth longitudinal metal line located on the two short sides, and the third longitudinal metal line and the fourth longitudinal metal line are electrically connected to a plurality of claw-shaped third transverse metal lines and a fourth transverse metal line.

7. The cross-coupled antenna device according to claim 6, characterized in that, These third and fourth transverse metal wires are arranged in a cross-coupled manner on the bottom surface of the carrier.

8. The cross-coupled antenna device according to claim 7, characterized in that, The two short sides have two symmetrical semi-circular slots.

9. The cross-coupled antenna device according to claim 8, characterized in that, The chip antenna further includes a conductive layer, which comprises a first conductive layer and a second conductive layer. The first conductive layer and the second conductive layer are respectively disposed in the semi-circular slot. The first conductive layer is electrically connected to the first longitudinal metal line of the first radiating layer and the third longitudinal metal line of the third radiating layer, and the second conductive layer is electrically connected to the second longitudinal metal line of the second radiating layer and the fourth longitudinal metal line of the fourth radiating layer, so that the first radiating layer and the third radiating layer are electrically connected, and the second radiating layer and the fourth radiating layer are electrically connected.

10. The cross-coupled antenna device according to claim 9, characterized in that, The cross-coupled antenna device further includes an antenna substrate, which includes a carrier plate, a first ground layer, an electrode, a signal feed line and a second ground layer. The carrier board has a first ground layer and a bare area on its front side, and the bare area has the electrode and the signal feed line. The carrier board has a second ground layer corresponding to the first ground layer and a clear area corresponding to the bare area on its back side. The electrode includes a first electrode and a second electrode. The first electrode is electrically connected to a U-shaped metal line segment. The two ends of the metal line segment are electrically connected to the first ground layer and the signal feed line, respectively. The first longitudinal metal line of the first radiating layer on the top surface and the second longitudinal metal line of the second radiating layer, or the third longitudinal metal line of the third radiating layer on the bottom surface and the fourth longitudinal metal line of the fourth radiating layer, are electrically connected to the first electrode and the second electrode of the electrode. The signal feed line includes a first signal feed section and a second signal feed section. There is a first coupling gap between the first signal feed section and the second signal feed section, and a second coupling gap between the first signal feed section and the second signal feed section and the first ground layer. The frequency can be adjusted by adjusting the gap between the first coupling gap and the second coupling gap.

11. The cross-coupled antenna device according to claim 10, characterized in that, The first coupling gap and the second coupling gap are electrically connected to matching components for impedance and frequency adjustment.

12. The cross-coupled antenna device according to claim 11, characterized in that, The matching component is a capacitor or an inductor.

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