A new embedded industrial motherboard

Abstract

The utility model discloses a novel embedded industrial mainboard belongs to industrial mainboard field, aims at solving the existing technology under the influence of machining equipment precision, operator skill level and production environment and many other factors, and the punching precision of thread hole often exists deviation. Once the error of punching appears, even if it is the tiny position shift, can also cause the bolt to be unable to pass through the installation hole of the four corners of the mainboard simultaneously, and accurately with the thread hole of main machine inner wall is completed the thread connection. This not only will cause the mainboard installation difficult, even lead to unable to install, the problem of serious influence production efficiency. Including mainboard main part, the upper end of mainboard main part is installed with CPU, and the upper end of mainboard main part is provided with heat dissipation mechanism, and the outer end of mainboard main part is provided with mounting mechanism, and the mounting mechanism includes the round axle connected to the four corners inside mainboard main part, and the lower side of round axle is fixedly connected with round plate, and the upper side of round axle is fixedly connected with rotating plate.

Description

Technical Field

[0001] This utility model belongs to the field of industrial motherboards, specifically relating to a novel embedded industrial motherboard. Background Technology

[0002] In the assembly of industrial equipment, the secure installation of the industrial motherboard is a crucial step in ensuring the normal operation of the equipment. Currently, the mainstream installation method for industrial motherboards involves using bolts to pass through the mounting holes on the motherboard and then threadedly connecting it to pre-drilled threaded holes on the inner wall of the host machine, thereby fixing the motherboard inside the host machine. This installation method is widely used in the industrial field due to its simple structure and stable connection.

[0003] However, this installation method requires extremely high precision in drilling the threaded holes for the motherboard inside the main unit. In actual production, the drilling precision of the threaded holes is often affected by various factors such as the precision of the processing equipment, the skill level of the operators, and the production environment. Once an error occurs in drilling, even a slight positional offset will prevent the bolts from simultaneously passing through the mounting holes at all four corners of the motherboard and accurately connecting with the threaded holes on the inner wall of the main unit. This will not only make motherboard installation difficult but may even prevent installation altogether, severely impacting production efficiency.

[0004] Furthermore, to address the issue of drilling deviations, manufacturers often need to expend additional manpower and time to correct or reprocess the drilling positions, increasing production costs. Moreover, forcibly installing a motherboard with positional deviations will subject it to uneven stress. During equipment operation, the motherboard may deform due to vibrations or other factors, thereby affecting the performance of electronic components on the motherboard and reducing the stability and lifespan of the industrial equipment.

[0005] Therefore, there is an urgent need for a new type of embedded industrial motherboard that can overcome the installation difficulties caused by drilling accuracy deviations. Utility Model Content

[0006] (1) Technical problems to be solved

[0007] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a novel embedded industrial motherboard. This solution addresses the common issue in existing technologies where the drilling accuracy of threaded holes is often compromised due to factors such as the precision of processing equipment, the skill level of operators, and the production environment. Even a slight misalignment during drilling can prevent bolts from simultaneously passing through the mounting holes at all four corners of the motherboard and accurately connecting with the threaded holes on the inner wall of the motherboard. This not only makes motherboard installation difficult but can even prevent installation altogether, severely impacting production efficiency.

[0008] (2) Technical solution

[0009] To address the aforementioned technical problems, this utility model provides a novel embedded industrial motherboard, comprising a motherboard body, a CPU mounted on the upper end of the motherboard body, a heat dissipation mechanism provided on the upper end of the motherboard body, and a mounting mechanism provided on the outer end of the motherboard body. The mounting mechanism includes round shafts connected to the four corners inside the motherboard body, a round plate fixedly connected to the lower side of the round shafts, a rotating plate fixedly connected to the upper side of the round shafts, an adjusting plate connected to the end of the rotating plate away from the motherboard body, a bolt connected to the end of the adjusting plate away from the rotating plate, a threaded rod connected to the outer end of the adjusting plate, and a rotating handle welded to the end of the threaded rod away from the adjusting plate.

[0010] Furthermore, the heat dissipation mechanism includes heat dissipation fins fixedly connected to the upper side of the CPU, support rods fixedly connected to the upper side of the motherboard body at the four corners of the CPU, a cooling fan fixedly connected to the upper end of the support rods, and a fan interface installed at the upper front end of the motherboard body.

[0011] Furthermore, the main body of the motherboard has rotating holes at its four internal corners, and the outer circumferential surface of the circular shaft is rotatably connected to the inner side of the rotating holes.

[0012] Furthermore, the upper side of the circular plate is slidably connected to the four corners of the lower side of the main body, and the lower side of the rotating plate is slidably connected to the four corners of the upper side of the main body.

[0013] Furthermore, the adjusting plate has a through mounting hole at the middle of the end away from the rotating plate, and the outer side of the bolt is slidably connected to the inner side of the mounting hole.

[0014] Furthermore, the adjusting plate has an adjusting groove inside, the outer side of the rotating plate is slidably connected to the inner side of the adjusting groove, a threaded hole is opened at the front of the adjusting plate near the rotating plate, the outer side of the threaded rod is threadedly connected to the inner side of the threaded hole, and the rear end of the threaded rod abuts against the front side of the rotating plate.

[0015] Furthermore, the heat dissipation fins are made of copper sheets.

[0016] Furthermore, a high-performance thermal grease is applied between the heat sink fins and the CPU.

[0017] (3) Beneficial effects

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] This invention, by setting up an installation mechanism, allows the rotating shaft and the circular plate to rotate to any angle around the inner side of the rotating hole, enabling the bolt to rotate to different positions. By sliding the rotating plate along the inner side of the adjustment groove and then fixing the rotating plate, the bolt can be moved to different distances from the four corners of the main body. This allows the bolt to be positioned at the four corners of the main body for small-range adjustment. Furthermore, when there is a deviation in the precision of the threaded hole used to install the main body, the bolt can be adjusted to the installation position for precise installation.

[0020] This invention, by setting up a heat dissipation mechanism, allows the heat generated by the CPU during operation to be drawn into the heat dissipation fins when the cooling fan is turned on. The heat is then dissipated from the heat dissipation fins and drawn away from the motherboard body along with the airflow generated by the cooling fan, thereby cooling down the CPU. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the heat dissipation mechanism of this utility model;

[0024] Figure 3 This is a schematic diagram of the structure at the circular shaft of this utility model;

[0025] Figure 4 This is a schematic diagram of the installation mechanism of this utility model.

[0026] The labels in the attached diagram are as follows: 1. Mainboard body; 2. CPU; 301. Heat sink fins; 302. Support rod; 303. Cooling fan; 304. Fan connector; 401. Round shaft; 402. Round plate; 403. Rotating plate; 404. Adjusting plate; 405. Bolt; 406. Threaded rod; 407. Rotating handle. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] This specific embodiment is a novel embedded industrial motherboard, the structural diagram of which is shown below. Figure 1 and Figure 2 As shown, the system includes a motherboard body 1, with a CPU 2 mounted on its upper end. A heat dissipation mechanism is also provided on the upper end of the motherboard body 1. This mechanism includes heat dissipation fins 301 fixedly connected to the upper side of the CPU 2. The heat dissipation fins 301 are made of copper. By fixing the highly thermally conductive copper heat dissipation fins 301 to the surface of the CPU 2, the heat generated by the CPU 2 during operation can be absorbed more quickly by the heat dissipation fins 301.

[0029] The motherboard body 1 has support rods 302 fixedly connected to the four corners of the CPU 2 on its upper side. Cooling fans 303 are fixedly connected to the upper ends of the support rods 302, and fan headers 304 are installed at the front upper side of the motherboard body 1. High-performance thermal grease is applied between the heatsink fins 301 and the CPU 2. This ensures that the heat from the CPU 2 can be more effectively transferred to the heatsink fins 301.

[0030] Cooperate Figure 3 and Figure 4 As shown, a mounting mechanism is provided at the outer end of the motherboard body 1. The mounting mechanism includes a circular shaft 401 connected to the four corners inside the motherboard body 1. Rotating holes are provided at the four corners inside the motherboard body 1. The outer circumferential surface of the circular shaft 401 is rotatably connected to the inner side of the rotating hole. A circular plate 402 is fixedly connected to the lower side of the circular shaft 401, and a rotating plate 403 is fixedly connected to the upper side of the circular shaft 401. The upper side of the circular plate 402 is slidably connected to the four corners of the lower side of the motherboard body 1, and the lower side of the rotating plate 403 is slidably connected to the four corners of the upper side of the motherboard body 1. Thus, when the rotating plate 403 rotates, the circular shaft 401 can rotate within the rotating hole.

[0031] The rotating plate 403 has an adjusting plate 404 connected to its end away from the main body 1. A bolt 405 is connected to the adjusting plate 404, which is also away from the rotating plate 403. A through-hole is located at the middle of the adjusting plate 404's end away from the rotating plate 403. The outer side of the bolt 405 is slidably connected to the inner side of the mounting hole. Thus, by passing the bolt 405 through the mounting hole and threading it into a threaded hole on the inner wall of the main unit, the main body 1 can be installed inside the main unit.

[0032] Furthermore, a threaded rod 406 is connected to the outer end of the adjusting plate 404, and a rotating handle 407 is welded to the end of the threaded rod 406 away from the adjusting plate 404. An adjusting groove is formed inside the adjusting plate 404, and the outer side of the rotating plate 403 is slidably connected to the inner side of the adjusting groove. A threaded hole is formed at the front of the adjusting plate 404 near the end of the rotating plate 403, and the outer side of the threaded rod 406 is threadedly connected to the inner side of the threaded hole. The rear end of the threaded rod 406 abuts against the front side of the rotating plate 403. Thus, after the rotating plate 403 slides along the inner side of the adjusting groove, and then the threaded rod 406 is rotated in the threaded hole, the end of the threaded rod 406 away from the rotating handle 407 moves to abut against the front side of the rotating plate 403, allowing the rotating plate 403 and the adjusting plate 404 to be fixed relative to each other again.

[0033] Working principle: When installing the motherboard body 1, after placing the motherboard body 1 in the mounting position inside the host, rotate the rotating plate 403 and the adjusting plate 404, and slide the rotating plate 403 along the inner side of the adjusting groove to move the position of the bolt 405 to the mounting hole on the inner wall of the host. Then rotate the bolt 405 so that its thread is connected to the mounting hole on the inner wall of the host, thus completing the installation of the motherboard body 1 in the host.

[0034] All technical features in this embodiment can be freely combined according to actual needs.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel embedded industrial motherboard, comprising a motherboard body (1), characterized in that, The CPU (2) is mounted on the upper end of the motherboard body (1). A heat dissipation mechanism is provided on the upper end of the motherboard body (1). An installation mechanism is provided on the outer end of the motherboard body (1). The installation mechanism includes a round shaft (401) connected to the four corners inside the motherboard body (1). A round plate (402) is fixedly connected to the lower side of the round shaft (401). A rotating plate (403) is fixedly connected to the upper side of the round shaft (401). An adjustment plate (404) is connected to the end of the rotating plate (403) away from the motherboard body (1). A bolt (405) is connected to the end of the adjustment plate (404) away from the rotating plate (403). A threaded rod (406) is connected to the outer end of the adjustment plate (404). A rotating handle (407) is welded to the end of the threaded rod (406) away from the adjustment plate (404).

2. The novel embedded industrial motherboard according to claim 1, characterized in that, The heat dissipation mechanism includes heat dissipation fins (301) fixedly connected to the upper side of the CPU (2), support rods (302) fixedly connected to the upper side of the motherboard body (1) at the four corners of the CPU (2), a cooling fan (303) fixedly connected to the upper end of the support rods (302), and a fan interface (304) installed on the upper front end of the motherboard body (1).

3. A novel embedded industrial motherboard according to claim 1, characterized in that, Rotating holes are provided at the four corners of the main body (1), and the outer circumferential surface of the circular shaft (401) is rotatably connected to the inner side of the rotating hole.

4. A novel embedded industrial motherboard according to claim 1, characterized in that, The upper side of the circular plate (402) is slidably connected to the four corners of the lower side of the main body (1), and the lower side of the rotating plate (403) is slidably connected to the four corners of the upper side of the main body (1).

5. A novel embedded industrial motherboard according to claim 1, characterized in that, The adjusting plate (404) has a through mounting hole at the middle of one end away from the rotating plate (403), and the outer side of the bolt (405) is slidably connected to the inner side of the mounting hole.

6. A novel embedded industrial motherboard according to claim 1, characterized in that, The adjusting plate (404) has an adjusting groove inside. The outer side of the rotating plate (403) is slidably connected to the inner side of the adjusting groove. The adjusting plate (404) has a threaded hole at the front of one end near the rotating plate (403). The outer side of the threaded rod (406) is threadedly connected to the inner side of the threaded hole. The rear end of the threaded rod (406) abuts against the front side of the rotating plate (403).

7. A novel embedded industrial motherboard according to claim 2, characterized in that, The heat dissipation fins (301) are made of copper.

8. A novel embedded industrial motherboard according to claim 2, characterized in that, High-performance thermal grease is applied between the heat sink fins (301) and the CPU (2).

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