Ceramic substrate with high heat dissipation efficiency

Abstract

The utility model discloses a high -efficient ceramic substrate of heat dissipation, including ceramic base layer, upper circuit layer, lower circuit layer, metal dam, first heat conduction column and first heat dissipation layer, the surface of this ceramic base layer is formed with the through hole that passes through, and the through hole is formed with the through column, the upper circuit layer is formed on the upper surface of ceramic base layer and is connected with the upper end through column, the lower circuit layer is formed on the lower surface of ceramic base layer and is connected with the lower end through column, the metal dam sets up on the upper surface of ceramic base layer, through the outside surface extension of metal dam has a plurality of extension, a plurality of extension all have the positioning part, and again cooperate on the ceramic base layer and set up a plurality of positioning cavities, and the first heat conduction column is filled in the positioning cavity and is formed, the aforementioned positioning part inserts the positioning cavity, and the first heat conduction column is contacted with the positioning part, first heat dissipation layer, and the metal dam increases a heat dissipation way, can make full use of the heat conductivity of metal, and further improve the heat dissipation capacity of ceramic substrate.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrates, and in particular to a ceramic substrate with high heat dissipation efficiency. Background Technology

[0002] Ceramic substrates are special process boards where copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at high temperatures. The resulting ultra-thin composite substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. Like PCB boards, they can be etched with various patterns and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure technology and interconnection technology. Ultraviolet (UV) light-emitting diodes (LEDs) offer advantages such as energy saving, environmental friendliness, long lifespan, small size, and controllable wavelength. Deep UV LEDs, with an emission wavelength less than 300nm, can be applied in sterilization, water purification, and biochemical detection. UV LEDs are typically packaged using ceramic substrates. To facilitate the packaging of the UV chip, the ceramic substrate has metal dams forming a packaging cavity to house and encapsulate the UV chip.

[0003] As a crucial carrier for integrated circuit chips, the ceramic substrate is in direct contact with the circuitry and is responsible for efficiently dissipating the heat generated by the circuitry. High-power devices generate a significant amount of heat during operation; if this heat cannot be dissipated in time, the chip temperature will rise, potentially leading to performance degradation, reduced stability, or even damage. Current methods mostly improve the heat dissipation capacity of the ceramic substrate by adding a heat dissipation layer to the ceramic base layer. However, this only improves the heat dissipation capacity of the ceramic base layer and does not utilize the heat dissipation capacity of the metal dam. Metal is an excellent heat conductor; if the heat dissipation capacity of the metal dam can be fully utilized, the heat dissipation capacity of the ceramic substrate can be further improved. Therefore, it is necessary to improve existing ceramic substrates. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a ceramic substrate with high heat dissipation efficiency. This effectively solves the problem that existing ceramic substrates do not fully utilize the heat dissipation capacity of the metal dam when improving heat dissipation performance, thus failing to further improve the heat dissipation capacity of the ceramic substrate.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A ceramic substrate with high heat dissipation efficiency includes a ceramic base layer, an upper circuit layer, a lower circuit layer, a metal dam, a first heat-conducting pillar, and a first heat dissipation layer.

[0007] The ceramic substrate has multiple positioning cavities that vertically penetrate the surface of the ceramic substrate, and the surface of the ceramic substrate has through-holes with through-posts formed in the through-holes.

[0008] The upper circuit layer is formed on the upper surface of the ceramic substrate and is electrically connected to the upper end of the conductive post; the lower circuit layer is formed on the lower surface of the ceramic substrate and is electrically connected to the lower end of the conductive post.

[0009] The metal dam is set on the upper surface of the ceramic substrate, and the metal dam and the upper surface of the ceramic substrate form an encapsulation cavity. The aforementioned through hole is opened at the bottom of the encapsulation cavity, and the aforementioned upper circuit layer is formed on the bottom surface of the encapsulation cavity. Multiple extensions extend from the outer side of the metal dam, and each of the multiple extensions has a positioning part, which is inserted into the corresponding positioning cavity for positioning.

[0010] There are multiple first heat-conducting pillars, each of which is filled and molded in a corresponding positioning cavity and contacts the corresponding positioning part; the first heat dissipation layer is disposed on the lower surface of the ceramic base layer and contacts the corresponding first heat-conducting pillar.

[0011] As a preferred embodiment, the bottom surface of the encapsulation cavity is further provided with a second heat dissipation layer, which is located beside the upper circuit layer and in contact with the inner surface of the metal dam.

[0012] As a preferred embodiment, a solder resist layer is formed by filling the space between the second heat dissipation layer and the upper circuit layer with ink.

[0013] As a preferred embodiment, the bottom surface of the encapsulation cavity is provided with a heat-conducting hole, and a second heat-conducting pillar is filled and formed inside the heat-conducting hole. The upper end of the second heat-conducting pillar is in contact with the second heat dissipation layer, and the lower end of the second heat-conducting pillar is in contact with the first heat dissipation layer.

[0014] As a preferred embodiment, the first heat dissipation layer, the second heat dissipation layer, the first heat-conducting pillar, and the second heat-conducting pillar are all made of graphene.

[0015] As a preferred embodiment, both the outer and inner surfaces of the metal dam are coated with a graphene layer.

[0016] As a preferred embodiment, the inner wall of the encapsulation cavity is provided with a fixing groove. The fixing groove is designed so that after the adhesive is sealed and cured to form an encapsulation component, the encapsulation component and the encapsulation cavity can be more firmly and reliably combined.

[0017] As a preferred embodiment, the cross-section of the fixing groove is gourd-shaped. This design can extend the path for external moisture to enter the bottom of the encapsulation cavity and complicate the path, thus providing waterproofing for the ceramic substrate.

[0018] As a preferred embodiment, the upper end of the encapsulation cavity is provided with a groove for embedding a glass cover plate. The bottom surface of the groove is recessed with a wave-shaped groove. The wave-shaped groove can extend the path of external moisture into the encapsulation cavity and complicate the water inlet path, thereby preventing external moisture from entering the encapsulation cavity.

[0019] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0020] Multiple extensions extend from the outer side of the metal dam, each extension having a positioning part. In conjunction with multiple positioning cavities formed on the ceramic substrate, a first heat-conducting column is filled and formed inside the positioning cavity. The aforementioned positioning part is inserted into the positioning cavity, and the first heat-conducting column contacts the positioning part and the first heat dissipation layer, adding a heat dissipation path to the metal dam. This can fully utilize the thermal conductivity of the metal, further improve the heat dissipation capacity of the ceramic substrate, and make the heat dissipation of the ceramic substrate more efficient.

[0021] To more clearly illustrate the structural features and effects of this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments: Attached Figure Description

[0022] Figure 1 This is a cross-sectional view of a preferred embodiment of the present invention.

[0023] Explanation of reference numerals in the attached diagram:

[0024] 10. Ceramic base layer 101. Positioning cavity

[0025] 102. Through hole; 11. Through post

[0026] 20. Upper circuit layer; 30. Lower circuit layer

[0027] 40. Metal dam 41. Encapsulation cavity

[0028] 42. Extension section 43. Positioning section

[0029] 44. Heat-conducting hole; 45. Second heat-conducting column

[0030] 46. ​​Fixing groove 47. Embedded groove

[0031] 471, Wave-shaped concave section 50, First heat-conducting column

[0032] 60. First heat dissipation layer; 70. Second heat dissipation layer

[0033] 80. Solder resist layer. Detailed Implementation

[0034] Please refer to Figure 1As shown, it illustrates the specific structure of a preferred embodiment of the present invention, including a ceramic base layer 10, an upper circuit layer 20, a lower circuit layer 30, a metal dam 40, a first heat-conducting column 50, and a first heat dissipation layer 60.

[0035] The ceramic base layer 10 has multiple positioning cavities 101 that vertically penetrate the surface of the ceramic base layer 10, and the surface of the ceramic base layer 10 has through holes 102 formed therethrough, with through holes 102 forming through the through holes 102.

[0036] The upper circuit layer 20 is formed on the upper surface of the ceramic base layer 10 and is electrically connected to the upper end of the conductive post 11; the lower circuit layer 30 is formed on the lower surface of the ceramic base layer 10 and is electrically connected to the lower end of the conductive post 11.

[0037] The metal dam 40 is disposed on the upper surface of the ceramic base layer 10, and the metal dam 40 and the upper surface of the ceramic base layer 10 together form an encapsulation cavity 41. The aforementioned through hole 102 is opened at the bottom of the encapsulation cavity 41, and the aforementioned upper circuit layer 20 is formed on the bottom surface of the encapsulation cavity 41. Multiple extensions 42 extend from the outer side of the metal dam 40, and each of the multiple extensions 42 has a positioning part 43, which is inserted into the corresponding positioning cavity 101 for positioning. In this embodiment, a second heat dissipation layer 70 is also provided on the bottom surface of the encapsulation cavity 41. The second heat dissipation layer 70 is located beside the upper circuit layer 20 and contacts the inner side of the metal dam 40, and a solder resist layer 80 is formed between the second heat dissipation layer 70 and the upper circuit layer 20 by filling ink. Specifically, a heat conduction hole 44 is opened on the bottom surface of the encapsulation cavity 41, and a second heat conduction layer is formed inside the heat conduction hole 44. The upper end of the second heat-conducting pillar 45 contacts the second heat dissipation layer 70. In addition, the outer and inner surfaces of the metal dam 40 are coated with graphene layers (not shown in the figure). The inner wall of the encapsulation cavity 41 is provided with a fixing groove 46. The fixing groove 46 is designed to make the encapsulation component and the encapsulation cavity 41 more firmly and reliably bonded after the adhesive is cured to form the encapsulation component. The cross-section of the fixing groove 46 is gourd-shaped. This design can extend the path of external moisture into the bottom of the encapsulation cavity 41 and complicate the path, providing waterproof function for the ceramic substrate. In addition, the upper end of the encapsulation cavity 41 is provided with a groove 47 for embedding a glass cover plate. The bottom surface of the groove 47 is recessed with a wave-shaped recess 471. The wave-shaped recess 471 can extend the path of external moisture into the encapsulation cavity 41 and complicate the water inlet path, preventing external moisture from entering the encapsulation cavity 41.

[0038] There are multiple first heat-conducting pillars 50, each of which is filled and molded in a corresponding positioning cavity 101 and contacts the corresponding positioning part 43. The first heat dissipation layer 60 is disposed on the lower surface of the ceramic base layer 10 and contacts the corresponding first heat-conducting pillar 50. In this embodiment, the lower end of the aforementioned second heat-conducting pillar 45 contacts the first heat dissipation layer 60, and the first heat dissipation layer 60, the second heat dissipation layer 70, the first heat-conducting pillar 50, and the second heat-conducting pillar 45 are all made of graphene.

[0039] The key design feature of this invention is that multiple extensions extend from the outer side of the metal dam, each extension having a positioning part. In addition, multiple positioning cavities are formed on the ceramic substrate, and a first heat-conducting column is filled and formed in the positioning cavity. The aforementioned positioning part is inserted into the positioning cavity, and the first heat-conducting column is in contact with the positioning part and the first heat dissipation layer, thus adding a heat dissipation path to the metal dam. This can make full use of the thermal conductivity of the metal, further improve the heat dissipation capacity of the ceramic substrate, and make the heat dissipation of the ceramic substrate more efficient.

[0040] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A ceramic substrate with high heat dissipation efficiency, characterized in that: It includes a ceramic base layer, an upper circuit layer, a lower circuit layer, a metal dam, a first heat-conducting column, and a first heat dissipation layer; The ceramic substrate has multiple positioning cavities that vertically penetrate the surface of the ceramic substrate, and the surface of the ceramic substrate has through-holes with through-posts formed in the through-holes. The upper circuit layer is formed on the upper surface of the ceramic substrate and is electrically connected to the upper end of the conductive post; the lower circuit layer is formed on the lower surface of the ceramic substrate and is electrically connected to the lower end of the conductive post. The metal dam is set on the upper surface of the ceramic substrate, and the metal dam and the upper surface of the ceramic substrate form an encapsulation cavity. The aforementioned through hole is opened at the bottom of the encapsulation cavity, and the aforementioned upper circuit layer is formed on the bottom surface of the encapsulation cavity. Multiple extensions extend from the outer side of the metal dam, and each of the multiple extensions has a positioning part, which is inserted into the corresponding positioning cavity for positioning. There are multiple first heat-conducting pillars, each of which is filled and molded in a corresponding positioning cavity and contacts the corresponding positioning part; the first heat dissipation layer is disposed on the lower surface of the ceramic base layer and contacts the corresponding first heat-conducting pillar.

2. The high-efficiency heat dissipation ceramic substrate according to claim 1, characterized in that: The bottom surface of the encapsulation cavity is also provided with a second heat dissipation layer, which is located next to the upper circuit layer and in contact with the inner surface of the metal dam.

3. The high-efficiency heat dissipation ceramic substrate according to claim 2, characterized in that: A solder resist layer is formed by filling the space between the second heat dissipation layer and the upper circuit layer with ink.

4. The high-efficiency heat dissipation ceramic substrate according to claim 2, characterized in that: The bottom surface of the encapsulation cavity is provided with a heat-conducting hole, and a second heat-conducting pillar is filled and formed in the heat-conducting hole. The upper end of the second heat-conducting pillar is in contact with the second heat dissipation layer, and the lower end of the second heat-conducting pillar is in contact with the first heat dissipation layer.

5. The high-efficiency heat dissipation ceramic substrate according to claim 4, characterized in that: The first heat dissipation layer, the second heat dissipation layer, the first heat-conducting pillar, and the second heat-conducting pillar are all made of graphene.

6. The high-efficiency heat dissipation ceramic substrate according to claim 1, characterized in that: The outer and inner surfaces of the metal dam are coated with graphene layers.

7. The high-efficiency heat dissipation ceramic substrate according to claim 1, characterized in that: The inner wall of the encapsulation cavity is provided with a fixing groove.

8. The high-efficiency heat dissipation ceramic substrate according to claim 7, characterized in that: The cross-section of the fixing groove is gourd-shaped.

9. The high-efficiency heat dissipation ceramic substrate according to claim 1, characterized in that: The upper end of the encapsulation cavity is provided with a groove for embedding a glass cover plate, and the bottom surface of the groove is recessed with a wave-shaped groove.

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