Wafer carrier for semiconductor processing

By installing an automatic limiting device inside the wafer carrier, automatic locking or unlocking is achieved using gravity and the reverse support force of the platform, solving the problem of wafer slippage and falling in the prior art and improving the safety and stability during the handling process.

CN224482015UActive Publication Date: 2026-07-10ZHENGYONG TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHENGYONG TECHNOLOGY CO LTD
Filing Date
2025-05-27
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing wafer carriers rely on manual operation for limiting functions during handling, which is not safe enough and can easily cause wafers to slip or fall, resulting in losses.

Method used

Design an automatic limiting device that uses the gravity of the baffle and the reverse supporting force of the platform to automatically lock or unlock the wafer carrier, avoiding manual operation. By setting inclined guide slots and transverse guide pillars in the longitudinal notch, the stability of the wafer during the handling process is ensured.

Benefits of technology

It enables automatic locking or unlocking of wafer carriers, improving the stability of wafers during handling, preventing slippage and drops, ensuring safety, and avoiding wafer damage.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224482015U_ABST
    Figure CN224482015U_ABST
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Abstract

The utility model discloses a wafer carrier for semiconductor process, its inside both sides are equipped with sliding slot support spare, to support the edge of a wafer, its characterized in that: the side of wafer carrier is equipped with one longitudinal slot; An automatic positioner is installed in the longitudinal slot, and it includes: the upper and lower positions of the left and right sides of longitudinal slot are equipped with corresponding inclined guide slots respectively; A shell is arranged on the outer side of longitudinal slot, to cover longitudinal slot; A baffle is installed in the longitudinal slot, and it is equipped with two branch horizontal guide columns relative to the inclined guide slot of longitudinal slot, and the two branch horizontal guide columns can slide in the guide slot, so that when the bottom surface of wafer carrier leaves a platform, the baffle is displaced downward and inward along the inclined direction of guide slot by gravity, and the bottom end protrudes out of longitudinal slot, at this time, the baffle locks the sliding slot support spare, preventing the wafer from falling; Furthermore, when the wafer carrier reaches a platform, the baffle protruding out of longitudinal slot is displaced upward and outward by the jacking reaction force of platform, at this time, the baffle unlocks the sliding slot support spare. Therefore, the wafer carrier can be automatically locked or unlocked.
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Description

Technical Field

[0001] This utility model relates to a wafer carrier for semiconductor manufacturing processes, and more particularly to a structural design that enables the wafer carrier to automatically lock or unlock. Background Technology

[0002] Wafer processing is the foundation of the semiconductor manufacturing industry. However, in the semiconductor manufacturing process, it is necessary to move wafers. In order to facilitate personnel carrying, robotic arms to grasp and position wafers, facilitate wafer processing, and reduce wafer contamination, wafers are usually placed in layers in a wafer carrier (commonly known as a basket) during storage or transportation. This avoids external environmental contamination of the wafers, ensures that the wafer quality meets the requirements of subsequent processes, and allows the wafers to be removed by robotic arms when necessary.

[0003] As shown in Figure 1 and Figure 2 As shown, the existing wafer carrier 10 supports the edges of the wafer (W) through side sliding support members 11, while the center of the wafer (W) is unsupported to facilitate the removal of the wafer by a robotic arm. However, it has been found that during the handling process, the wafer (W) is prone to slipping, and even entire stacks of wafers (W) may fall out of the side sliding support members 11, causing significant losses. Therefore, the current wafer carrier 10 has a rotatable "U"-shaped stop bar 12 on each side of the housing. These "U"-shaped stop bars 12 are normally retracted within the wafer carrier 10. Figure 1A , 1B As shown, the wafer (W) can freely enter and exit at this time. After the wafer (W) is stored in the wafer carrier 10, the normal SOP procedure is to rotate the "U"-shaped stop bar 12 approximately 230 degrees from the side and place it in front of the wafer (W) to prevent the wafer (W) from sliding during handling or falling out of the support member 11. However, due to negligence or forgetfulness by the on-site personnel, this procedure was not followed. Figure 1B The SOP procedure shown places the "ㄈ"-shaped stop lever 12 in front of the wafer (W) after rotating it from the side. As a result, when handling the wafer carrier (basket) 10, it may tilt slightly if not handled carefully, causing the expensive wafer (W) to slip out and resulting in significant loss.

[0004] Therefore, relying solely on the "ㄈ"-shaped stop lever 12 for its limiting function, and requiring on-site personnel to press and unlock and rotate it 180 degrees during operation, makes manual locking insufficiently safe to use, thus leaving room for improvement.

[0005] Therefore, how to improve the limiting method of the existing wafer carrier 10 is the problem to be solved by this utility model. Utility Model Content

[0006] The purpose of this utility model is to provide a wafer carrier for semiconductor manufacturing processes, which has an automatic wafer positioning function. By setting the positioning element, the stability of the wafer in the wafer carrier can be improved, avoiding the wafer from sliding and falling off during transportation, and enhancing the effectiveness of preventing wafer damage.

[0007] Another objective of this invention is to provide a wafer carrier for semiconductor manufacturing processes that requires no manual operation. The wafer carrier utilizes the downward gravity of its limiting elements and the reverse support force when its bottom surface contacts the platform to automatically lock or unlock the wafer carrier, thereby improving efficiency.

[0008] To achieve the above objectives, the present invention comprises: a wafer carrier having sliding support members on both sides of its inner casing for supporting the edge of a wafer; characterized in that: the wafer carrier has a longitudinal notch on one side; an automatic limiting device installed within the longitudinal notch, comprising: corresponding inclined guide grooves at the upper and lower positions on the left and right sides of the longitudinal notch; a housing disposed on the outer side of the longitudinal notch for covering the longitudinal notch; and a baffle installed within the longitudinal notch, which is positioned relative to the longitudinal notch. The inclined guide groove is equipped with two transverse guide posts that can slide within the groove. When the bottom surface of the wafer carrier leaves a platform, the baffle moves downward and inward along the inclined direction of the guide groove by gravity, with its bottom end protruding from the longitudinal notch. At this time, the baffle locks the slide support to prevent the wafer from falling. Furthermore, when the wafer carrier reaches a platform, the bottom end of the baffle protruding from the longitudinal notch is moved upward and outward by the supporting reaction force of the platform. At this time, the baffle unlocks the slide support.

[0009] Furthermore, in a preferred embodiment, the bottom end of the guide groove in the inclined direction extends into a short longitudinal groove.

[0010] Furthermore, in a preferred embodiment, the bottom end of the baffle is formed into a flat shape.

[0011] Furthermore, in a preferred embodiment, the top end of the baffle is provided with a recess for installing an elastic component and a rounded top member. The rounded top member abuts against the top surface of the longitudinal notch, applying a downward elastic force to the baffle.

[0012] Furthermore, in a preferred embodiment, a "ㄈ"-shaped stop bar is provided on one side of the wafer carrier, and the automatic limiting device is provided on the corresponding side of the "ㄈ"-shaped stop bar.

[0013] Furthermore, in a preferred embodiment, the housing has two inclined surfaces relative to the guide groove, and the complete guide groove shape is formed only after the housing covers the longitudinal notch.

[0014] This utility model has the following advantages:

[0015] I. The wafer carrier of this utility model requires no human operation. It can automatically lock or unlock the wafer carrier by the downward gravity of the baffle limiting element and the reverse supporting force when the bottom surface contacts the platform. In this way, even if the on-site personnel fail to turn the "I"-shaped baffle 230 degrees due to negligence or forgetfulness, there is still the automatic locking as a second safety guarantee, which improves the absolute safety of the wafer carrier.

[0016] II. The wafer carrier with automatic wafer positioning of this utility model can improve the stability of the wafer in the wafer carrier by setting the limiting element, avoid the wafer from sliding and falling during the transportation process, and improve the effectiveness of preventing the wafer from being damaged. Attached Figure Description

[0017] Figure 1A A perspective view of the external appearance of an existing wafer carrier for semiconductor manufacturing process, showing the latch;

[0018] Figure 1B A perspective view of an existing wafer carrier for semiconductor manufacturing processes, showing the unlocked state;

[0019] Figure 2 This is a perspective view of the preferred embodiment of the present invention;

[0020] Figure 3 This is another perspective view of a preferred embodiment of the present invention;

[0021] Figure 4A This is an exploded perspective view of the main structure of this utility model;

[0022] Figure 4B This is an exploded side view of the main structure of this utility model;

[0023] Figure 5A This is a sectional perspective view of the main structure of this utility model;

[0024] Figure 5B This is a perspective view of the main structure of this utility model from another angle.

[0025] Figure 6A This is a cross-sectional view of the main structure of this utility model, showing the locking mechanism;

[0026] Figure 6B This utility model Figure 6AThe enlarged view referred to in section 6B;

[0027] Figure 7A This is a cross-sectional view of the main structure of this utility model, showing the unlocked state;

[0028] Figure 7B This utility model Figure 7A The enlarged view indicated by 7B in the image;

[0029] Figure 8 This is a reference diagram showing the usage state of this utility model;

[0030] Explanation of markings in the diagram:

[0031] 10. Wafer carriers;

[0032] 11. Slide support component;

[0033] 12. "ㄈ" type stop lever;

[0034] 13. Side;

[0035] 14. Longitudinal notch;

[0036] 141 Guide groove;

[0037] 142 Longitudinal short groove;

[0038] 20 Automatic limit device;

[0039] 21. Shell;

[0040] 211 bevel;

[0041] 22 baffles;

[0042] 221 Bottom end;

[0043] 222 Recessed hole;

[0044] 23. Horizontal guide posts;

[0045] 24. Flexible components;

[0046] 25. Round-headed top piece;

[0047] 30 platforms;

[0048] (F) Reaction force;

[0049] (G) Gravity;

[0050] (P) Thrust. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0052] Those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of this invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0053] The following is a reference to the appendix. Figure 3 To be continued Figure 8 A preferred embodiment of the "wafer carrier for semiconductor manufacturing process" described in this utility model includes: a wafer carrier 10, with grooved support members 11 on both sides inside to support the edge of a wafer (W). In this embodiment, a "ㄈ"-shaped stop bar 12 is provided on one side of the wafer carrier 10, but it is not limited to this. The above configuration belongs to the prior art and is not the subject of this patent application, so it will not be described in detail.

[0054] The main features of this utility model are as follows: the wafer carrier 10 is provided with a longitudinal notch 14 (ZZ axis) on the other side 13 of the "I"-shaped stop bar 12; an automatic limiting device 20 is installed in the longitudinal notch 14, which includes: corresponding inclined guide grooves 141 are provided at the upper and lower positions on the left and right sides of the longitudinal notch 14.

[0055] In this embodiment, there is only one automatic limiting device 20, which is located on the corresponding side of the "I"-shaped stop bar 12, but it is not limited to this. In another feasible embodiment, the "I"-shaped stop bar 12 may not be required, and a second automatic limiting device 20 may be installed. This is also feasible and will not be elaborated further.

[0056] A housing 21 is provided on the outer side of the longitudinal notch 14 to cover the longitudinal notch 14; a baffle 22 is installed in the longitudinal notch 14, and has two transverse guide posts 23 relative to the inclined guide groove 141 of the longitudinal notch 14, which can slide in the guide groove 141.

[0057] like Figures 4A-4BAs shown, in this embodiment, the inclined guide groove 141 is formed by utilizing the position of the housing 21 relative to the guide groove 141, with two inclined surfaces 211. Only when the housing 21 covers the longitudinal notch 14 is the complete guide groove 141 formed. This design facilitates the insertion of the two transverse guide posts 23 on the baffle 22 into the guide groove 141.

[0058] In this embodiment, the bottom end 221 of the baffle 22 is flattened to facilitate its extension out of the bottom surface of the longitudinal notch 14. Furthermore, the top end of the baffle 22 has a recess 222 for mounting an elastic component 24 and a rounded top member 25. The rounded top member 25 abuts against the top surface of the longitudinal notch 14, applying a downward elastic force to the baffle 22. This ensures that the baffle 22 falls smoothly, but is not limited to this.

[0059] like Figures 5A-6B As shown, in this invention, when the bottom surface of the wafer carrier 10 leaves a platform 30, the baffle 22 moves downward and inward along the inclined direction of the guide groove 141 by gravity (G), and the bottom end 221 protrudes from the longitudinal notch 14. At this time, the baffle 22 locks the slide support 11 to prevent the wafer (W) from falling.

[0060] In this embodiment, the bottom end of the guide groove 141 extends in the inclined direction to form a short longitudinal groove 142 (ZZ axis). For example... Figure 6B As shown, the design of the longitudinal short groove 142 can prevent the lateral thrust (P) (YY axis) acting forward (XX axis) of the wafer (W) edge during handling from causing the baffle 22 to slide upward due to tension, thus unlocking the slide support 11. Therefore, the design of the longitudinal short groove 142 has the effect of improving safety in use.

[0061] Furthermore, such as Figures 7A-7B As shown, when the wafer carrier 10 reaches a platform 30, the bottom end 221 of the baffle 22 protruding from the longitudinal notch 14 is displaced upward and outward by the top support reaction force (F) of the platform 30. At this time, the baffle 22 unlocks the slide support 11.

[0062] By utilizing the above-mentioned technical features, this utility model has the following advantages, which require further explanation:

[0063] I. The wafer carrier 10 of this utility model requires no human intervention. The wafer carrier 10 can be automatically locked or unlocked by the downward gravity of the limiting element of the baffle 22 and the reverse supporting force when the bottom surface contacts the platform 30. In this way, even if the on-site personnel fail to turn the "I"-shaped baffle 12 230 degrees due to negligence or forgetfulness, there is still the second safety guarantee of automatic locking, which improves the absolute safety of the wafer carrier 10 in use.

[0064] II. The wafer carrier 10 of this utility model with automatic wafer positioning can improve the stability of the wafer (W) in the wafer carrier 10 by setting the limiting element, avoid the wafer (W) from sliding and falling during the transportation process, and improve the effectiveness of preventing the wafer (W) from being damaged.

[0065] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer carrier for semiconductor manufacturing processes, comprising: A wafer carrier has grooved supports on both sides to support the edges of a wafer; Its features are: The wafer carrier has a longitudinal notch on one side; An automatic limiting device is installed within the longitudinal notch, comprising: At the top and bottom positions on the left and right sides of the longitudinal notch, corresponding inclined guide grooves are provided respectively; A housing is provided on the outer side of the longitudinal notch to cover the longitudinal notch; A baffle is installed within the longitudinal notch. Two transverse guide posts are provided relative to the inclined guide groove of the longitudinal notch. These transverse guide posts can slide within the guide groove. When the bottom surface of the wafer carrier leaves a platform, the baffle, under the influence of gravity, moves downward and inward along the inclined direction of the guide groove, with its bottom end protruding from the longitudinal notch. At this time, the baffle locks the slide support member to prevent the wafer from falling. Furthermore, when the wafer carrier reaches a platform, the bottom end of the baffle protruding from the longitudinal notch is moved upward and outward by the supporting reaction force of the platform. At this time, the baffle unlocks the slide support member.

2. The wafer carrier for semiconductor manufacturing according to claim 1, wherein, The bottom end of the guide channel extends into a short longitudinal groove in the inclined direction.

3. The wafer carrier for semiconductor manufacturing according to claim 1, wherein, The bottom end of the baffle is flat.

4. The wafer carrier for semiconductor manufacturing according to claim 1, wherein, The top of the baffle has a recessed hole for installing an elastic component and a rounded top piece. The rounded top piece abuts against the top surface of the longitudinal notch, applying a downward elastic force to the baffle.

5. The wafer carrier for semiconductor manufacturing according to claim 1, wherein, The wafer carrier has a "ㄈ"-shaped stop bar on one side, and the automatic limit device is located on the corresponding side of the "ㄈ"-shaped stop bar.

6. The wafer carrier for semiconductor manufacturing according to claim 1, wherein, The housing has two inclined surfaces relative to the guide groove. Only when the housing covers the longitudinal notch can the complete guide groove shape be formed.