TO263t lead frame and top heat dissipation package device

Abstract

The application provides a TO263T lead frame and a top heat dissipation packaged device. The frame comprises frame units arranged in a multi-row and multi-column array on a frame body. The frame units comprise a base island, an eighth pin, a seventh pin, a sixth pin and a fifth pin connected to one side of the base island and arranged in sequence with intervals, and a first pin, a second pin, a third pin and a fourth pin arranged in sequence with intervals on the other side of the base island and arranged in sequence with intervals. The plane where the base island, the eighth pin, the seventh pin, the sixth pin and the fifth pin are located has a height difference from the plane where the first pin, the second pin, the third pin and the fourth pin are located. The bottom surface of the base island is used for bonding a chip during packaging, and the top surface is used for exposing as a heat dissipation fin after packaging. Some pins are widened. The top heat dissipation packaged device comprises a plastic encapsulation body and a TO263T lead frame. The plastic encapsulation body wraps the frame units and the chip bonded on the base island. The scheme can achieve better heat dissipation effect and improve the utilization rate of the frame body material.

Description

Technical Field

[0001] This application belongs to the field of semiconductor device packaging technology, specifically relating to a TO263T lead frame and a top heat dissipation packaging device. Background Technology

[0002] The TO-263 is a surface-mount package in the Transistor Outline series. Currently, the most commonly used TO-263 package in the industry features a single-row, single-sided lead frame design. This design has shortcomings in terms of lead frame metal material utilization and unit package output efficiency. Furthermore, as a high-power surface-mount package, the existing frame structure limits its heat dissipation performance, failing to meet the heat dissipation requirements of some current high-power devices. Utility Model Content

[0003] To address the shortcomings of the aforementioned prior art, this application provides a TO263T lead frame and a top heat dissipation package, which can achieve better heat dissipation and improve the utilization rate of the frame body material.

[0004] To achieve the above objectives, the present invention employs the following technology:

[0005] A TO263T lead frame includes frame units formed in a rectangular array of multiple rows and columns on the frame body. The frame unit includes: a base island; an eighth pin, a seventh pin, a sixth pin, and a fifth pin connected to one side of the base island and arranged at intervals in sequence; and a first pin, a second pin, a third pin, and a fourth pin arranged at intervals on the other side of the base island.

[0006] The plane containing the base island, the eighth pin, the seventh pin, the sixth pin, and the fifth pin has a height difference from the plane containing the first pin, the second pin, the third pin, and the fourth pin.

[0007] Furthermore, the frame units are formed in a rectangular array of multiple rows and columns on the frame body.

[0008] Furthermore, the bottom surface of the base island is used to bond the chip during packaging, while the top surface is exposed after packaging to serve as a heat sink.

[0009] Furthermore, several pins among the first, second, third, fourth, fifth, sixth, seventh, and eighth pins are widened.

[0010] Furthermore, the eighth, seventh, sixth, and fifth pins are connected by the first transverse connecting rib, and the first, second, third, and fourth pins are connected by the second transverse connecting rib. A connecting rib is provided on one side of the frame unit. The connecting rib includes a horizontal high section connected to the first transverse connecting rib, a horizontal low section connected to the second transverse connecting rib, and an inclined section that is inclined between the horizontal high section and the horizontal low section.

[0011] A top heat dissipation package includes a molding compound and a frame unit in the TO263T lead frame. The molding compound encapsulates the frame unit and the chip bonded to the bottom surface of the base island. The top surface of the base island is exposed outside the molding compound to form a heat sink.

[0012] The beneficial effects of this utility model are as follows:

[0013] 1. By setting the base island and some pins at one horizontal level, and the remaining pins at another horizontal level, the bottom surface of the base island is used for chip bonding through the height difference, which can meet the TO-263T-8L package type. The top surface of the base island is used as a heat sink, which can be exposed in the molded body after molding, which can meet the heat dissipation requirements of high power packages. On this basis, some pins are widened to further improve the heat dissipation effect.

[0014] 2. By arranging the frame units in a two-row, multi-column array, the space of the frame body is greatly saved, and the compactness of the layout and the utilization rate of the frame body are improved. Attached Figure Description

[0015] Figure 1 This is a partial top view of the TO263T lead frame according to an embodiment of this application.

[0016] Figure 2 This is a partial perspective view of the TO263T lead frame according to an embodiment of this application.

[0017] Figure 3 This is a top view of the frame unit in an embodiment of this application.

[0018] Figure 4 This is a perspective view of the frame unit of an embodiment of this application.

[0019] Figure 5 This is a perspective view of the frame unit in an embodiment of this application.

[0020] Figure 6 This is a perspective view of the overall structure of the TO263T lead frame according to an embodiment of this application.

[0021] Figure 7 This is a perspective view of the packaging device according to an embodiment of this application.

[0022] Figure 8 This is a left view of the packaging device according to an embodiment of this application. Detailed Implementation

[0023] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.

[0024] One aspect of this application provides a TO263T lead frame, including frame units 2 arrayed on a frame body 1, such as... Figure 1 , Figure 2 and Figure 6 As shown, the two-row, multi-column arrangement can improve the utilization rate of the frame material and enable a single lead frame to produce more frame units 2. Preferably, it is two rows of 16 columns. The two rows of frame units 2 are symmetrically arranged, which facilitates symmetrical injection of glue from both sides of the frame body 1 during injection molding and improves the injection molding effect.

[0025] like Figures 2-5 As shown, frame unit 2 includes base island A0, first pin A1, second pin A2, third pin A3, fourth pin A4, fifth pin A5, sixth pin A6, seventh pin A7, and eighth pin A8.

[0026] Pins A8, A7, A6, and A5 are connected to one side of base island A0 and arranged in sequence at intervals; pins A1, A2, A3, and A4 are arranged at intervals on the other side of base island A0; wherein pin A1 corresponds to pin A8, pin A2 corresponds to pin A7, pin A3 corresponds to pin A6, and pin A4 corresponds to pin A5.

[0027] Among them, the plane containing base island A0, eighth pin A8, seventh pin A7, sixth pin A6, and fifth pin A5 has a height difference from the plane containing first pin A1, second pin A2, third pin A3, and fourth pin A4, such as... Figure 2 , Figure 4 and Figure 5 As shown.

[0028] Specifically, as a connection method between the base island, pins, and frame body 1, pins A8, A7, A6, and A5 are connected by a first transverse connecting rib, and pins A1, A2, A3, and A4 are connected by a second transverse connecting rib. A connecting rib 4 is provided on one side of frame unit 2. The connecting rib 4 includes a horizontal high section 41 connected to the first transverse connecting rib, a horizontal low section 43 connected to the second transverse connecting rib, and an inclined section 42 inclined between the horizontal high section 41 and the horizontal low section 43. The horizontal high section 41, the first transverse connecting rib, and pins A8, A7, A6, and A5 are on the same plane, as are the horizontal low section 43, the second transverse connecting rib, and pins A1, A2, A3, and A4. This forms two planes on the frame body 1, connected by the connecting rib 4, facilitating processing and maintaining the overall structural stability of the lead frame.

[0029] This height difference structure design allows the bottom surface of the base island A0 to be set as the side for bonding the chip during packaging, while the top surface is set as a heat sink exposed after packaging, which can meet the heat dissipation requirements of high-power packaging.

[0030] Preferably, to further improve heat dissipation, several pins of the first pin A1, second pin A2, third pin A3, fourth pin A4, fifth pin A5, sixth pin A6, seventh pin A7, and eighth pin A8 are widened. As an optional example, such as... Figures 2-5 As shown, the first pin A1 and the second pin A2 are widened pins. The width of the widened pins is greater than that of the other pins, and the widened pins can also provide more heat dissipation area.

[0031] Optional, such as Figure 5 As shown, two locking holes 3 are provided through one side of the base island A0. The locking holes 3 are waist-shaped, and their length direction is parallel to the length direction of the frame body 1. The distance of the locking holes 3 from one side of the base island A0 is less than the distance from the other side of the base island A0. By setting these locking holes 3, the bonding force with the molding compound required when the top surface of the base island A0 is exposed to the molding compound can be improved, thus ensuring the structural stability after molding.

[0032] As another alternative example, such as Figure 5 As shown, anti-overflow grooves 5 are provided at the edges of multiple sides of the bottom surface of the base island A0. The anti-overflow grooves 5 are used to prevent soft solder, such as excessive solder paste, from overflowing into areas outside the base island A0.

[0033] As an alternative, the bottom surface of the base island A0 is provided with locking grooves 6 corresponding to the positions of the eighth pin A8, the seventh pin A7, the sixth pin A6, and the fifth pin A5, respectively. Figure 5 As shown, the adhesive-locking groove 6 does not penetrate the base island A0. It is used for adhesive locking and to prevent moisture from entering through the pins during packaging and affecting the chip. A further alternative is that the bottom surfaces of the first pin A1, second pin A2, third pin A3, and fourth pin A4 are provided with blocking grooves 7. The blocking grooves 7 extend along the length of the frame body 1 through the first pin A1, second pin A2, third pin A3, and fourth pin A4, and are used to prevent moisture from entering through the pins and affecting the chip.

[0034] In another aspect of this application, a top heat dissipation package is provided, which is obtained based on the TO263T leadframe package described in the foregoing embodiments, such as... Figure 7 and Figure 8 The diagram shows a single packaged device structure. The single packaged device includes a molding compound 8 and a frame unit 2 within the TO263 lead frame. The molding compound 8 encapsulates the frame unit 2. A MOS chip is bonded to the bottom surface of the base island A0 of the frame unit 2. After die bonding and assembly, the chips are encapsulated together within the molding compound 8. The top surface of the base island A0 protrudes from the molding compound 8, forming a heat sink. The eighth pin A8, seventh pin A7, sixth pin A6, and fifth pin A5 extend from the top surface of the molding compound 8 to one side. The first pin A1, second pin A6, and third pin A5 extend from the top surface of the molding compound 8. Pins A2, A3, and A4 extend from the middle of the molded package 8 in the height direction to the other side. Specifically, each pin extends a predetermined length along its own length direction. The actual extension distance and the width of the extension portion can be implemented according to the TO-263T-8L package outline standard. Thus, after the final stamping, cutting, and bending are completed, it is convenient to form the gull-wing surface mount pins for the packaged chip application. This achieves the formation of a heat sink structure in the TO-263T-8L package form and maintains the stability of the package structure.

[0035] The above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.

Claims

1. A TO263T lead frame, comprising frame units (2) arrayed on a frame body (1), characterized in that, Frame unit (2) includes: Base Island (A0); The eighth pin (A8), seventh pin (A7), sixth pin (A6), and fifth pin (A5) are connected to one side of the base island (A0) and arranged sequentially at intervals; and The first pin (A1), the second pin (A2), the third pin (A3), and the fourth pin (A4) are arranged at intervals on the other side of the base island (A0) and are arranged at intervals in sequence. Among them, the plane containing the base island (A0), the eighth pin (A8), the seventh pin (A7), the sixth pin (A6), and the fifth pin (A5) has a height difference from the plane containing the first pin (A1), the second pin (A2), the third pin (A3), and the fourth pin (A4).

2. The TO263T lead frame according to claim 1, characterized in that, The frame unit (2) is formed in a rectangular array of multiple rows and columns on the frame body (1).

3. The TO263T lead frame according to claim 1, characterized in that, The bottom surface of the base island (A0) is used to bond the chip during packaging, and the top surface is exposed after packaging to serve as a heat sink.

4. The TO263T lead frame according to claim 1, characterized in that, Several pins in the first pin (A1), second pin (A2), third pin (A3), fourth pin (A4), fifth pin (A5), sixth pin (A6), seventh pin (A7), and eighth pin (A8) have been widened.

5. The TO263T lead frame according to claim 1, characterized in that, Several locking holes (3) are provided through one side of the base island (A0).

6. The TO263T lead frame according to claim 1, characterized in that, An overflow prevention groove (5) is provided at the edges of multiple sides of the bottom surface of the base island (A0).

7. The TO263T lead frame according to claim 1, characterized in that, Locking grooves (6) are provided on the bottom side of the base island (A0) at the positions corresponding to the eighth pin (A8), the seventh pin (A7), the sixth pin (A6), and the fifth pin (A5).

8. The TO263T lead frame according to claim 1, characterized in that, The bottom surfaces of the first pin (A1), the second pin (A2), the third pin (A3), and the fourth pin (A4) are provided with blocking grooves (7).

9. The TO263T lead frame according to claim 1, characterized in that, The eighth pin (A8), the seventh pin (A7), the sixth pin (A6), and the fifth pin (A5) are connected by the first transverse connecting rib, and the first pin (A1), the second pin (A2), the third pin (A3), and the fourth pin (A4) are connected by the second transverse connecting rib. A connecting rib (4) is provided on one side of the frame unit (2). The connecting rib (4) includes a horizontal high section (41) connected to the first transverse connecting rib, a horizontal low section (43) connected to the second transverse connecting rib, and an inclined section (42) inclined between the horizontal high section (41) and the horizontal low section (43).

10. A top-heat heat dissipation packaged device, characterized in that, The device includes a molding compound (8) and a frame unit (2) in the TO263T lead frame as described in any one of claims 1-9. The molding compound (8) encapsulates the frame unit (2) and the chip bonded to the bottom surface of the base island (A0). The top surface of the base island (A0) is exposed outside the molding compound (8) to form a heat sink.

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