Optical package structure
By designing substrate slots in the optical packaging structure and using reinforcements to fix the optical area of photonic components, the problems of connecting photonic integrated circuits to external optical fibers and warping issues are solved, enabling convenient connection of optical fibers and efficient heat dissipation of components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SILICONWARE PRECISION IND CO LTD
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-10
AI Technical Summary
In existing optical integrated packaging structures, the optical signals of photonic integrated circuits are difficult to connect with external optical fibers or fiber array units, and there is a warping problem that cannot be effectively improved.
An optical packaging structure is designed, including a substrate, photonic elements, electronic components, and reinforcement components. The optical area of the photonic elements is fixed by slotting the substrate and using reinforcement components. The optical area of the photonic elements is exposed outside the slot of the substrate so that optical fibers or optical fiber array units can be connected. At the same time, the reinforcement components can serve as heat sinks to improve heat dissipation.
It effectively improves the warpage problem of optical packaging structure, easily realizes the connection between optical fiber or optical fiber array unit and photonic element, and improves the heat dissipation effect of photonic element and electronic component.
Smart Images
Figure CN224482068U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor packaging technology, and more particularly to an optical packaging structure. Background Technology
[0002] With the development of artificial intelligence (AI) related applications, the amount of data that data centers (DCs) need to process is increasing. Currently, the bottleneck of data transmission has shifted from the processor to the transmission interface. In order to increase the amount of data transmitted while reducing power consumption, the Co-Packaged Optics (CPO) structure has been proposed.
[0003] Optical integrated package (CPO) structures mainly integrate electronic integrated circuits (EICs) and photonic integrated circuits (PICs). The packaging design of electronic integrated circuits (EICs) is similar to that of traditional logic integrated circuits. However, the signals transmitted by photonic integrated circuits (PICs) are optical signals and need to be connected to external optical fibers or fiber optic array units (FAUs). Therefore, the packaging design of photonic integrated circuits (PICs) requires special consideration.
[0004] The optical region (optical path) of a common photonic integrated circuit (PIC) is designed on the bump side of the PIC. However, this design makes it difficult for the optical signal of the PIC to be connected to external optical fibers or fiber array units.
[0005] Furthermore, the aforementioned optically integrated package (CPO) structure cannot improve or reduce the potential warpage problem of the optically integrated package (CPO) structure, nor can it easily connect optical fibers or fiber array units to the optical region of a photonic integrated circuit (PIC).
[0006] Therefore, overcoming any of the problems of the existing technologies mentioned above has become an urgent issue to be addressed. Utility Model Content
[0007] In view of the deficiencies in the prior art, this application provides an optical packaging structure, including: a substrate having a slot; a photonic element having an optical region and disposed on the slotted substrate and electrically connected to the substrate; an electronic element disposed on the slotted substrate and electrically connected to the substrate and the photonic element; and a reinforcement fixed to the slotted substrate, wherein a portion of the reinforcement and the optical region of the photonic element correspond to the slot of the substrate, and the optical region of the photonic element is exposed outside the slot of the substrate, so that an optical fiber and / or an optical fiber array unit can be connected to the optical region of the photonic element through the slot of the substrate.
[0008] The aforementioned optical packaging structure may include a bonding layer, wherein the reinforcement is annular in shape, the reinforcement is fixed to the slotted substrate by the bonding layer, and the reinforcement surrounds the periphery of the photonic element and the electronic element.
[0009] In the aforementioned optical packaging structure, the reinforcement has a first side and a second side, the first side of the reinforcement is located outside the optical region of the photonic element, the second side of the reinforcement is located outside the electronic element, and the thickness of the first side of the reinforcement is greater than the thickness of the second side of the reinforcement.
[0010] In the aforementioned optical packaging structure, the reinforcement has a first side and a second side, the first side of the reinforcement is located outside the optical region of the photonic element, the second side of the reinforcement is located outside the electronic element, and the thickness of the first side of the reinforcement is less than the thickness of the second side of the reinforcement.
[0011] In the aforementioned optical packaging structure, the substrate has a first surface and a second surface opposite to each other, photonic elements and electronic elements are disposed on the first surface of the substrate, and reinforcement members are disposed on the first surface or the second surface of the substrate.
[0012] In the aforementioned optical packaging structure, the reinforcement is elongated and is positioned at the slot of the substrate and spans both sides of the slot.
[0013] In the aforementioned optical packaging structure, the reinforcement is a heat sink, a part of which corresponds to the slot in the substrate, and the other part of which covers the surface of the photonic element.
[0014] The aforementioned optical packaging structure may include a thermally conductive layer formed between the photonic element and the heat sink.
[0015] In the aforementioned optical packaging structure, the reinforcement is a heat sink, a part of which corresponds to the slot in the substrate, and the other part of which covers the surface of the photonic element and the surface of the electronic element.
[0016] The aforementioned optical packaging structure may include a first thermally conductive layer and a second thermally conductive layer, wherein the first thermally conductive layer is formed between the photonic element and the heat sink, and the second thermally conductive layer is formed between the electronic element and the heat sink.
[0017] In the aforementioned optical packaging structure, the reinforcement has at least one recess to accommodate the optical fiber and / or optical fiber array unit through the recess of the reinforcement.
[0018] As can be seen from the above, in the optical packaging structure of this application, the reinforcement can be fixed on the substrate with slots. A part of the reinforcement and the optical area of the photonic element both correspond to the slots of the substrate, and the optical area of the photonic element is exposed outside the slots of the substrate. The warping problem of the optical packaging structure can be effectively improved or reduced through the fixing function of the reinforcement. It can also make the optical fiber and / or optical fiber array unit easily connected to the optical area of the photonic element through the slots of the substrate.
[0019] Furthermore, the reinforcement in this application can be a heat sink, and the reinforcement can cover the surface of the photonic element so that the reinforcement can quickly dissipate the heat generated by the photonic element, thereby effectively improving the heat dissipation effect of the photonic element.
[0020] Alternatively, the reinforcement in this application can be a heat sink, which can be applied to the surfaces of both the photonic element and the electronic element to rapidly dissipate the heat generated by the photonic element and the electronic element, thereby effectively improving the heat dissipation effect of the photonic element and the electronic element.
[0021] Alternatively, the reinforcement component of this application may have at least one recess, and the recess of the reinforcement component corresponds to the slot of the substrate, so as to easily accommodate or fix at least one optical fiber and / or optical fiber array unit through the recess of the reinforcement component. Attached Figure Description
[0022] Figure 1 and Figures 1A to 1C This is a schematic diagram of the first embodiment of the optical packaging structure of this application, wherein, Figure 1 This is a top view. Figure 1A and Figure 1B They are respectively Figure 1 Cross-sectional views of different line segments, and Figure 1C for Figure 1B A cross-sectional view of the structure with added optical fibers and optical fiber arrays.
[0023] Figures 2A to 2B For this application Figure 1B A schematic diagram of the changing state of the optical packaging structure.
[0024] Figure 3 and Figures 3A to 3B This is a schematic diagram of a second embodiment of the optical packaging structure of this application, wherein, Figure 3 It is a top view, and Figure 3A and Figure 3B They are respectively Figure 3 A cross-sectional view of different line segments.
[0025] Figure 4 and Figures 4A to 4B This is a schematic diagram of a third embodiment of the optical packaging structure of this application, wherein, Figure 4 It is a top view, and Figure 4A and Figure 4B They are respectively Figure 4 A cross-sectional view of different line segments.
[0026] Figure 5 and Figures 5A to 5B This is a schematic diagram of the fourth embodiment of the optical packaging structure of this application, wherein, Figure 5 It is a top view, and Figure 5A and Figure 5B They are respectively Figure 5 A cross-sectional view of different line segments.
[0027] Figure 6 and Figures 6A to 6B This is a schematic diagram of the fifth embodiment of the optical packaging structure of this application, wherein, Figure 6 It is a top view, and Figure 6A and Figure 6B They are respectively Figure 6 A cross-sectional view of different line segments.
[0028] Figure 7 and Figures 7A to 7B This is a schematic diagram of the sixth embodiment of the optical packaging structure of this application, wherein, Figure 7 This is a top view. Figure 7A for Figure 7 A cross-sectional view of the line segment in the diagram, and Figure 7B for Figure 7A A cross-sectional view with optical fibers added.
[0029] Explanation of reference numerals in the attached figures
[0030] 1. Optical Packaging Structure
[0031] 10 substrate
[0032] 10a First Surface
[0033] 10b Second Surface
[0034] 11. Grooving
[0035] 12 Conductive elements
[0036] 13 Passive Components
[0037] 20 photonic elements
[0038] 20a Optical Region
[0039] 21 First conductor
[0040] 22 First base rubber
[0041] 23 First heat-conducting layer
[0042] 30 Electronic components
[0043] 31 Second conductor
[0044] 32 Second base rubber
[0045] 33 Second thermal conductive layer
[0046] 40 reinforcement parts
[0047] 40a First side
[0048] 40b Second side
[0049] 41 recess
[0050] 50, 51 bonding layer
[0051] 60 fiber optic cables
[0052] 61 Fiber optic array units
[0053] Line segment A1 to A6
[0054] B1 to B5 line segment
[0055] H1 and H2 thicknesses. Detailed Implementation
[0056] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0057] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "above," "below," "one," "two," "first," "second," and "third" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0058] Figure 1 and Figures 1A to 1C This is a schematic diagram of the first embodiment of the optical packaging structure 1 of this application, wherein, Figure 1 This is a top view. Figure 1A and Figure 1B They are respectively Figure 1 Cross-sectional views of different line segments A1 and B1, and Figure 1C for Figure 1B A cross-sectional view including optical fiber 60 and optical fiber array unit 61 is included. Furthermore, in this application, "at least one" refers to one or more (e.g., one, two, or three), and "multiple" refers to two or more (e.g., two, three, four, or ten or more).
[0059] like Figure 1 and Figures 1A to 1C As shown, the optical packaging structure 1 can be an optically integrated package (CPO) structure with suspended reinforcement, and includes a substrate 10, a photonic element 20, at least one (or more) electronic element 30 and a reinforcement 40.
[0060] The substrate 10 may have a slot 11, a first surface 10a (as the upper surface) and a second surface 10b (as the lower surface), and a photonic element 20 may be disposed on the first surface 10a of the substrate 10 having the slot 11, so that the photonic element 20 is electrically connected to the substrate 10. The photonic element 20 may have an optical region 20a (such as an optical section / optical interface / optical path) corresponding to the slot 11 of the substrate 10, and the slot 11 of the substrate 10 exposes the optical region 20a of the photonic element 20, so that the optical fiber 60 and / or the optical fiber array unit 61 can be connected to the optical region 20a of the photonic element 20 through the slot 11 of the substrate 10 to transmit optical signals. At the same time, an electronic element 30 may be disposed on the first surface 10a of the substrate 10 having the slot 11, so that the electronic element 30 is electrically connected to the substrate 10 and the photonic element 20 in sequence.
[0061] In one embodiment, the reinforcement 40 may be annular in shape and may be fixed to the first surface 10a of the substrate 10 having a slot 11. A portion of the reinforcement 40 may correspond to the slot 11 of the substrate 10 and span across both sides of the slot 11, so that the reinforcement 40 surrounds the periphery of the photonic element 20 and the electronic element 30, so as to effectively improve or reduce the warping problem of the optical packaging structure 1 through the fixing function of the reinforcement 40.
[0062] In one embodiment, the optical packaging structure 1 may include a plurality of conductive elements 12 and at least one (such as a plurality of) passive elements 13, and the plurality of conductive elements 12 and passive elements 13 may be formed on the second surface 10b of the substrate 10 to be electrically connected to the substrate 10 respectively.
[0063] In one embodiment, the optical packaging structure 1 may include a plurality of first conductors 21 and a plurality of second conductors 31. The plurality of first conductors 21 may be formed between the first surface 10a of the substrate 10 and the photonic element 20 to electrically connect the substrate 10 and the photonic element 20. The plurality of second conductors 31 may be formed between the first surface 10a of the substrate 10 and the electronic element 30 to electrically connect the substrate 10 and the electronic element 30. The photonic element 20 and the electronic element 30 may be electrically connected to each other through the plurality of first conductors 21, the substrate 10 and the plurality of second conductors 31.
[0064] In one embodiment, the optical packaging structure 1 may include a first primer 22 and a second primer 32. The first primer 22 may be formed between the first surface 10a of the substrate 10 and the photonic element 20 to cover a plurality of first conductors 21, and the second primer 32 may be formed between the first surface 10a of the substrate 10 and the electronic element 30 to cover a plurality of second conductors 31.
[0065] In one embodiment, the optical packaging structure 1 may include a bonding layer 50 (such as a first bonding layer) for the reinforcement 40 to be bonded or fixed to the first surface 10a of the substrate 10 having a slot 11 via the bonding layer 50.
[0066] In one embodiment, the optical packaging structure 1 may include a bonding layer 51 (such as a second bonding layer) for the reinforcement 40 to bond or fix the optical fiber 60 through the bonding layer 51.
[0067] In one embodiment, the substrate 10 may be a circuit board, a packaging substrate, a circuit board, a circuit structure, a carrier board, or an interposer; the slot 11 may be a groove, a recess, or an opening; the conductive element 12, the first conductor 21, or the second conductor 31 may be a conductive bump, a solder ball, a metal ball, or a solder ball; and the passive element 13 may be a resistor, a capacitor, or an inductor. The photonic element 20 may be a photonic chip or a photonic integrated circuit (PIC); the electronic element 30 may be an electronic chip or an electronic integrated circuit (EIC); the reinforcement 40 may be made of a metal material (such as a metal sheet), a heat dissipation material (such as a heat sink), or an insulating material; and the bonding layer 50 or bonding layer 51 may be an adhesive layer.
[0068] Figures 2A to 2B For this application Figure 1B A schematic diagram of the changing state of the optical packaging structure 1 in the diagram, wherein, Figure 1B The thickness H1 (i.e., height) of the first side 40a (as shown on the left) of the reinforcement 40 is the same as the thickness H2 (i.e., height) of the second side 40b (as shown on the right) of the reinforcement 40, while Figure 2A and Figure 2B The thickness H1 of the first side 40a of the reinforcement 40 shown is different from the thickness H2 of the second side 40b of the reinforcement 40.
[0069] In other words, such as Figure 1 and Figure 1B In the optical packaging structure 1 shown, the reinforcement 40 may have a first side 40a and a second side 40b. The first side 40a of the reinforcement 40 is located at the slot 11 of the substrate 10 and outside the optical region 20a of the photonic element 20. The second side 40b of the reinforcement 40 is located outside the electronic element 30. Simultaneously, the thickness H1 of the first side 40a of the reinforcement 40 is equal to the thickness H2 of the second side 40b of the reinforcement 40, that is, the thickness H1 of the reinforcement 40 outside the photonic element 20 (e.g., on the left side) is equal to the thickness H2 of the reinforcement 40 outside the electronic element 30 (e.g., on the right side).
[0070] In contrast, such as Figure 2A and Figure 2B In the optical packaging structure 1 shown, the thickness H1 of the first side 40a of the reinforcement 40 is different from the thickness H2 of the second side 40b of the reinforcement 40. For example, in Figure 2A In this context, the thickness H1 of the first side 40a of the reinforcement 40 is greater than the thickness H2 of the second side 40b of the reinforcement 40; that is, the thickness H1 of the reinforcement 40 on the outside of the photonic element 20 (e.g., on the left side) is greater than the thickness H2 of the reinforcement 40 on the outside of the electronic element 30 (e.g., on the right side). Figure 2B In the process, the thickness H1 of the first side 40a of the reinforcement 40 is less than the thickness H2 of the second side 40b of the reinforcement 40, that is, the thickness H1 of the reinforcement 40 on the outside of the photonic element 20 (such as the left side) is less than the thickness H2 of the reinforcement 40 on the outside of the electronic element 30 (such as the right side).
[0071] Figure 3 and Figures 3A to 3B This is a schematic diagram of a second embodiment of the optical packaging structure 1 of this application, wherein, Figure 3 It is a top view, and Figure 3A and Figure 3B They are respectively Figure 3 Cross-sectional views of line segments A2 and B2. Meanwhile, Figure 3 , Figure 3A , Figure 3B With the above Figure 1 , Figure 1A , Figure 1B The optical packaging structure is similar to that in section 1, so the similarities will not be described again, but only the following will be explained. Figure 3 and Figures 3A to 3B The main differences in optical packaging structure 1 are as follows.
[0072] like Figure 3 and Figures 3A to 3B In the optical packaging structure 1 shown, the photonic element 20 and the electronic element 30 are both disposed on the first surface 10a of the substrate 10, while the reinforcement 40 is disposed on the second surface 10b of the substrate 10.
[0073] In one embodiment, the reinforcement 40 may be annular in shape. The reinforcement 40 may be fixed to the second surface 10b of the substrate 10 having a slot 11 by the bonding layer 50. A portion of the reinforcement 40 may correspond to the slot 11 of the substrate 10 and span across both sides of the slot 11, so that the annular reinforcement 40 surrounds the periphery of the photonic element 20 and the electronic element 30, so as to effectively improve or reduce the warping problem of the optical packaging structure 1 through the fixing function of the reinforcement 40.
[0074] Figure 4 and Figures 4A to 4B This is a schematic diagram of a third embodiment of the optical packaging structure 1 of this application, wherein, Figure 4 It is a top view, and Figure 4A and Figure 4B They are respectively Figure 4 Cross-sectional views of line segments A3 and B3. Meanwhile, Figure 4 , Figure 4A , Figure 4B With the above Figure 1 , Figure 1A , Figure 1B The optical packaging structure is similar to that in section 1, so the similarities will not be described again, but only the following will be explained. Figure 4 and Figures 4A to 4B The main differences in optical packaging structure 1 are as follows.
[0075] like Figure 4 and Figures 4A to 4B In the optical packaging structure 1 shown, the reinforcement 40 is only disposed at the slot 11 of the substrate 10 (as shown above) and spans both sides of the slot 11 of the substrate 10.
[0076] In one embodiment, the reinforcement 40 may be elongated. The reinforcement 40 may be fixed to the first surface 10a of the substrate 10 having a slot 11 by the bonding layer 50. A portion of the reinforcement 40 may correspond to the slot 11 of the substrate 10 and span across both sides of the slot 11, so that the reinforcement 40 corresponds to the slot 11 of the substrate 10 and the optical region 20a of the photonic element 20, so as to effectively improve or reduce the warping problem of the optical packaging structure 1 through the fixing function of the reinforcement 40.
[0077] Figure 5 and Figures 5A to 5B This is a schematic diagram of the fourth embodiment of the optical packaging structure 1 of this application, wherein, Figure 5 It is a top view, and Figure 5A and Figure 5B They are respectively Figure 5 Cross-sectional views of line segments A4 and B4. Also, Figure 5 , Figure 5A , Figure 5BWith the above Figure 1 , Figure 1A , Figure 1B The optical packaging structure is similar to that in section 1, so the similarities will not be described again, but only the following will be explained. Figure 5 and Figures 5A to 5B The main differences in optical packaging structure 1 are as follows.
[0078] like Figure 5 and Figures 5A to 5B As shown, the optical packaging structure 1 may include a first thermally conductive layer 23 (or thermally conductive layer), which may be formed between the photonic element 20 and the reinforcement 40 (such as a heat sink), and the first thermally conductive layer 23 may be a thermal interface material (TIM) layer.
[0079] In one embodiment, the reinforcement 40 may be a heat sink. One side (e.g., the left side) of the reinforcement 40 (e.g., the heat sink) may be fixed to the first surface 10a of the substrate 10 with a slot 11 by the bonding layer 50. A portion of the reinforcement 40 (e.g., the heat sink) may correspond to the slot 11 of the substrate 10, and another portion of the reinforcement 40 (e.g., the heat sink) may cover the surface (e.g., the upper surface) of the photonic element 20. The first thermally conductive layer 23 and the reinforcement 40 (e.g., the heat sink) can quickly dissipate the heat generated by the photonic element 20, so as to effectively improve the heat dissipation effect of the photonic element 20 through the first thermally conductive layer 23 and the reinforcement 40 (e.g., the heat sink).
[0080] Figure 6 and Figures 6A to 6B This is a schematic diagram of the fifth embodiment of the optical packaging structure 1 of this application, wherein, Figure 6 It is a top view, and Figure 6A and Figure 6B They are respectively Figure 6 Cross-sectional views of line segments A5 and B5. Also, Figure 6 , Figure 6A , Figure 6B With the above Figure 1 , Figure 1A , Figure 1B The optical packaging structure is similar to that in section 1, so the similarities will not be described again, but only the following will be explained. Figure 6 and Figures 6A to 6B The main differences in optical packaging structure 1 are as follows.
[0081] like Figure 6 and Figures 6A to 6BIn the optical packaging structure 1 shown, the optical packaging structure 1 may include a first thermally conductive layer 23 and a second thermally conductive layer 33. The first thermally conductive layer 23 may be formed between the photonic element 20 and the reinforcement 40 (such as a heat sink), and the second thermally conductive layer 33 may be formed between the electronic element 30 and the reinforcement 40 (such as a heat sink). Both the first thermally conductive layer 23 and the second thermally conductive layer 33 may be thermal interface material (TIM) layers.
[0082] In one embodiment, the reinforcement 40 can be a heat sink. The opposite sides (e.g., left and right sides) of the reinforcement 40 (e.g., heat sink) can be fixed to the first surface 10a of the substrate 10 with a slot 11 by the bonding layer 50. A part of the reinforcement 40 (e.g., heat sink) can correspond to the slot 11 of the substrate 10, and another part of the reinforcement 40 (e.g., heat sink) can cover the surfaces (e.g., the upper surface) of both the photonic element 20 and the electronic element 30. The first thermal conductive layer 23 and the reinforcement 40 (e.g., heat sink) can quickly dissipate the heat generated by the photonic element 20, and the second thermal conductive layer 33 and the reinforcement 40 (e.g., heat sink) can quickly dissipate the heat generated by the electronic element 30, so as to effectively improve the heat dissipation effect of the photonic element 20 and the electronic element 30 through the first thermal conductive layer 23, the second thermal conductive layer 33 and the reinforcement 40 (e.g., heat sink).
[0083] Figure 7 and Figures 7A to 7B This is a schematic diagram of the sixth embodiment of the optical packaging structure 1 of this application, wherein, Figure 7 This is a top view. Figure 7A for Figure 7 The sectional view of line segment A6 in the diagram, and Figure 7B for Figure 7A A cross-sectional view of fiber 60 is added. Meanwhile, Figure 7 With the above Figure 1 The optical packaging structure is similar to that in section 1, so the similarities will not be described again, but only the following will be explained. Figure 7 and Figures 7A to 7B The main differences in optical packaging structure 1 are as follows.
[0084] like Figure 7 and Figures 7A to 7B In the optical packaging structure 1 shown, the surface of the reinforcement 40 (as shown below) may have at least one (or more) recesses 41. The shape of the recesses 41 may be, for example, semi-circular or semi-elliptical, and the recesses 41 of the reinforcement 40 correspond to the slots 11 of the substrate 10, so that at least one (or more) optical fiber 60 and / or optical fiber array unit 61 can be easily accommodated or fixed through the recesses 41 of the reinforcement 40 (see Figure 1C This allows the optical fiber 60 and / or the optical fiber array unit 61 to be connected to the optical region 20a of the photonic element 20 through the slot 11 of the substrate 10 to transmit optical signals.
[0085] In summary, the optical packaging structure 1 of this application has at least the following features, advantages or technical effects.
[0086] 1. This application can fix the reinforcement 40 onto the substrate 10 with a slot 11. A portion of the reinforcement 40 and the optical region 20a of the photonic element 20 both correspond to the slot 11 of the substrate 10, and the slot 11 of the substrate 10 exposes the optical region 20a of the photonic element 20. The fixing function of the reinforcement 40 can effectively improve or reduce the warping problem of the optical packaging structure 1. It can also make the optical fiber 60 and / or the optical fiber array unit 61 easily connected to the optical region 20a of the photonic element 20 through the slot 11 of the substrate 10 to transmit optical signals.
[0087] 2. The shape of the reinforcement 40 in this application can be ring-shaped, so that the reinforcement 40 surrounds the periphery of the photonic element 20 and the electronic element 30, so as to effectively improve or reduce the warping problem of the optical packaging structure 1 through the fixing function of the reinforcement 40.
[0088] Third, the shape of the reinforcement 40 in this application can be elongated to span (cross) both sides of the slot 11 of the substrate 10, so that the reinforcement 40 corresponds to the slot 11 of the substrate 10 and the optical region 20a of the photonic element 20, so as to effectively improve or reduce the warping problem of the optical packaging structure 1 through the fixing function of the reinforcement 40.
[0089] Fourth, the reinforcement 40 of this application can be a heat sink, and the heat sink can cover the surface of the photonic element 20 so that the heat sink (or the first thermal conductive layer 23) can quickly dissipate the heat generated by the photonic element 20, so as to effectively improve the heat dissipation effect of the photonic element 20 through the heat sink (first thermal conductive layer 23).
[0090] V. The reinforcement 40 of this application can be a heat sink, and the heat sink can cover the surfaces of both the photonic element 20 and the electronic element 30, so that the heat sink (or the first thermal conductive layer 23) can quickly dissipate the heat generated by the photonic element 20, and the heat sink (or the second thermal conductive layer 33) can quickly dissipate the heat generated by the electronic element 30, so as to effectively improve the heat dissipation effect of the photonic element 20 and the electronic element 30 through the heat sink (first thermal conductive layer 23 / second thermal conductive layer 33).
[0091] VI. The reinforcement 40 of this application may have at least one (or more) recesses 41, and the recesses 41 of the reinforcement 40 correspond to the slots 11 of the substrate 10, so as to easily accommodate or fix at least one (or more) optical fibers 60 and / or optical fiber array units 61 through the recesses 41 of the reinforcement 40.
[0092] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An optical packaging structure, characterized in that, include: A substrate having a slot; A photonic element having an optical region is disposed on the substrate having the slot and electrically connected to the substrate. An electronic component is disposed on the substrate having the slot and electrically connected to the substrate and the photonic component; as well as A mounting bracket is fixed to the substrate having the slot; In this embodiment, a portion of the reinforcement corresponds to the optical region of the photonic element in the slot of the substrate, and the optical region of the photonic element is exposed outside the slot of the substrate.
2. The optical packaging structure as described in claim 1, characterized in that, The reinforcement is fixed to the substrate with the slot by a bonding layer, and the reinforcement surrounds the periphery of the photonic element and the electronic element.
3. The optical packaging structure as described in claim 1, characterized in that, The reinforcement has a first side and a second side, the first side of the reinforcement is located outside the optical region of the photonic element, the second side of the reinforcement is located outside the electronic element, and the thickness of the first side of the reinforcement is greater than the thickness of the second side of the reinforcement.
4. The optical packaging structure as described in claim 1, characterized in that, The reinforcement has a first side and a second side, the first side of the reinforcement is located outside the optical region of the photonic element, the second side of the reinforcement is located outside the electronic element, and the thickness of the first side of the reinforcement is less than the thickness of the second side of the reinforcement.
5. The optical packaging structure as described in claim 1, characterized in that, The substrate has a first surface and a second surface opposite to each other. The photonic element and the electronic element are disposed on the first surface of the substrate, and the reinforcement is disposed on the first surface or the second surface of the substrate.
6. The optical packaging structure as described in claim 1, characterized in that, The reinforcement is elongated and is disposed at the slot of the substrate and spans both sides of the slot of the substrate.
7. The optical packaging structure as described in claim 1, characterized in that, The reinforcement is a heat sink, a portion of which corresponds to a slot in the substrate, and another portion of which covers the surface of the photonic element.
8. The optical packaging structure as described in claim 7, characterized in that, The optical packaging structure further includes a thermally conductive layer formed between the photonic element and the heat sink.
9. The optical packaging structure as described in claim 1, characterized in that, The reinforcement is a heat sink, a portion of which corresponds to the slot in the substrate, and another portion of which covers the surface of the photonic element and the surface of the electronic element.
10. The optical packaging structure as described in claim 9, characterized in that, The optical packaging structure also includes a first thermally conductive layer and a second thermally conductive layer, wherein the first thermally conductive layer is formed between the photonic element and the heat sink, and the second thermally conductive layer is formed between the electronic element and the heat sink.
11. The optical packaging structure as described in claim 1, characterized in that, The reinforcement has a recess for accommodating optical fibers and / or optical fiber array units.