Diode chip gluing device

Abstract

The utility model discloses a diode patch gluing device, including work table, the top of work table is provided with the steel sheet, and the circuit board body is located the just below of steel sheet, and the inside of work table is provided with the first clamping plate and second clamping plate for clamping circuit board body, and the below of work table is provided with the first drive mechanism for driving two first clamping plate simultaneous movement to second drive mechanism for driving two second clamping plate simultaneous movement, the utility model places the circuit board body in the inside of material receiving groove, and through first motor drive two first clamping plate each other close, again through second motor drive two second clamping plate each other close, can fix the position of circuit board body, after with the steel sheet corresponding with circuit board body is fixed on work table, can start brushing glue, thereby need not customizing multiple base fixed different size's circuit board body, and then reduced production cost.

Description

Technical Field

[0001] This utility model relates to the field of diode chip adhesive application, and in particular to a diode chip adhesive application device. Background Technology

[0002] In the controller assembly process, the pick-and-place machine undertakes the core assembly task. The pick-and-place machine automatically solders small components such as resistors, diodes, and temperature sensors onto the PCB board. Among them, the pick-and-place diode is a semiconductor device using surface mount technology (SMT). It is composed of PN junctions made of P-type and N-type semiconductor materials and has unidirectional conductivity. It is mainly used for functions such as rectification, switching, transient protection, and voltage regulation in circuits. In addition, the diode pick-and-place adhesive application refers to the precise application of solder paste to the circuit board pads. Then, the pick-and-place diode is precisely placed in the solder paste position by the pick-and-place machine. Then, the solder paste is melted and solidified by reflow soldering to form electrical and mechanical connections.

[0003] Chinese patent CN114289248A discloses an automatic solder paste application device for surface mount diodes. The device can accurately apply solder paste to the required position of the surface mount diode through a placement device, and then apply the solder paste evenly through a spreading device, ensuring that there is no residue on the spreading path, while improving the spreading efficiency.

[0004] In the above solution, before applying glue, the circuit board body needs to be placed in the groove inside the base, and then the steel plate is fixed on the top of the circuit board body. Since different circuit boards have different length and width dimensions, custom bases must be manufactured to match different sizes. However, custom bases are expensive, and multiple bases lead to high costs when dealing with the glue application needs of circuit boards of various sizes. Therefore, a diode chip glue application device is proposed to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a diode surface mount adhesive application device to solve the problem in the background art where multiple bases lead to high costs when applying adhesive to circuit boards of various sizes. This invention provides a solution that is significantly different from the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A diode surface mount adhesive application device includes a workbench, a steel plate is disposed above the workbench, a circuit board body is located directly below the steel plate, a first clamping plate and a second clamping plate are disposed inside the workbench for clamping the circuit board body, a first driving mechanism for driving the two first clamping plates to move simultaneously and a second driving mechanism for driving the two second clamping plates to move simultaneously are disposed below the workbench.

[0008] Preferably, the steel plate has a positioning frame on its side and a through hole on its surface. The through hole is located directly above the diode pads on the circuit board body, and solder paste falls from the through hole onto the pads.

[0009] Preferably, the workbench is provided with a positioning groove and a material receiving groove on its upper surface, a limit groove inside the workbench, a slide rail below the workbench, a positioning frame inside the positioning groove, and the circuit board body placed inside the material receiving groove.

[0010] Preferably, a first slider and a second slider are respectively provided below the first clamping plate and the second clamping plate. The first slider and the second slider are respectively located inside the two limiting grooves, and the lower ends of the first slider and the second slider are respectively installed inside the two slide rails.

[0011] Preferably, the first driving mechanism includes a first turntable, a first extension rod, a first transmission rod, a first motor, and a rotating shaft. The first extension rod is fixed to the side of the first turntable. One end of the first transmission rod is connected to the shaft of the first extension rod, and the other end of the first transmission rod is connected to the shaft of the first slider. The first turntable is mounted on the rotating shaft. The upper end of the rotating shaft is connected to the worktable through a bearing, and the lower end of the rotating shaft is connected to the first motor.

[0012] Preferably, the second driving mechanism includes a second turntable, a second extension rod, a second transmission rod, a second motor, a driving gear, a sleeve, and a driven gear. The second extension rod is fixed to the side of the second turntable, one end of the second transmission rod is connected to the shaft of the second extension rod, and the other end of the second transmission rod is connected to the shaft of the second slider.

[0013] Preferably, the second turntable is located directly below the first turntable, the second turntable and the driven gear are fixed to the upper and lower ends of the sleeve respectively, the sleeve is mounted on the rotating shaft, the driving gear is connected to the second motor shaft, and the driving gear meshes with the driven gear.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention places the circuit board body inside the material receiving groove, and then drives the first turntable to rotate via the first motor, causing the two first clamping plates to move closer together. Then, drives the second turntable to rotate via the second motor, causing the two second clamping plates to move closer together. This fixes the position of the circuit board body. After that, the steel plate corresponding to the circuit board body is fixed on the worktable, and the glue can be applied. This eliminates the need to customize multiple bases to fix circuit board bodies of different sizes, thereby reducing production costs. Attached Figure Description

[0016] Figure 1 A schematic diagram of the main structure of a diode surface mount adhesive application device;

[0017] Figure 2 This is a schematic diagram of the workbench in a diode surface mount adhesive application device.

[0018] Figure 3 This is a schematic diagram of the slide rail in a diode surface mount adhesive application device.

[0019] Figure 4 This is a schematic diagram of the structure of the first turntable in the diode surface mount adhesive application device;

[0020] Figure 5 This is a schematic diagram of the rotating shaft in a diode surface mount adhesive application device.

[0021] In the diagram: 1. Workbench; 101. Positioning groove; 102. Material receiving groove; 103. Limiting groove; 104. Slide rail; 2. Steel plate; 201. Positioning frame; 202. Through hole; 3. First turntable; 301. First extension rod; 302. First transmission rod; 303. First slider; 304. First clamping plate; 4. Second turntable; 401. Second extension rod; 402. Second transmission rod; 403. Second slider; 404. Second clamping plate; 5. First motor; 501. Rotating shaft; 6. Second motor; 601. Driving gear; 602. Sleeve; 603. Driven gear. Detailed Implementation

[0022] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-5 In this utility model, a diode chip adhesive application device includes a workbench 1, characterized in that: a steel plate 2 is provided above the workbench 1, the circuit board body is located directly below the steel plate 2, a first clamping plate 304 and a second clamping plate 404 for clamping the circuit board body are provided inside the workbench 1, and a first turntable 3 and a second turntable 4 are provided below the workbench 1.

[0026] A positioning frame 201 is provided on the side of the steel plate 2, and multiple through holes 202 are provided on the surface of the steel plate 2. The through holes 202 are located directly above the diode pads on the circuit board body. Multiple steel plates 2 correspond to different circuit board bodies through different arrangements of the through holes 202, and the multiple steel plates 2 are the same size.

[0027] Example 1: Please refer to Figure 1-5 In this embodiment of the utility model, a diode chip adhesive application device is provided. The workbench 1 is provided with a positioning groove 101 and a material receiving groove 102 on its upper surface. The workbench 1 is provided with a limit groove 103 inside its interior. The workbench 1 is provided with a slide rail 104 below its interior. The positioning frame 201 is located inside the positioning groove 101. The circuit board body is placed inside the material receiving groove 102.

[0028] A first slider 303 and a second slider 403 are respectively provided below the first clamping plate 304 and the second clamping plate 404. The first slider 303 and the second slider 403 are respectively located inside the two limiting grooves 103. The lower ends of the first slider 303 and the second slider 403 are respectively installed inside the two slide rails 104.

[0029] The first extension rod 301 is fixed to the side of the first turntable 3. One end of the first transmission rod 302 is connected to the shaft of the first extension rod 301, and the other end of the first transmission rod 302 is connected to the shaft of the first slider 303. The first turntable 3 is mounted on the rotating shaft 501. The upper end of the rotating shaft 501 is connected to the worktable 1 through a bearing, and the lower end of the rotating shaft 501 is connected to the first motor 5. After the first motor 5 is started, it drives the first turntable 3 to rotate through the rotating shaft 501, thereby driving the two first clamping plates 304 to move simultaneously along the two slide rails 104, so that the two first clamping plates 304 move closer to or further away from each other.

[0030] The second extension rod 401 is fixed to the side of the second turntable 4. One end of the second transmission rod 402 is connected to the shaft of the second extension rod 401, and the other end of the second transmission rod 402 is connected to the shaft of the second slider 403. The second turntable 4 is located directly below the first turntable 3. The second turntable 4 and the driven gear 603 are respectively fixed to the upper and lower ends of the sleeve 602. The sleeve 602 is mounted on the rotating shaft 501. The driving gear 601 is connected to the shaft of the second motor 6. The driving gear 601 meshes with the driven gear 603. After the second motor 6 is started, it sequentially drives the driving gear 601, the driven gear 603, the sleeve 602, and the second turntable 4 to rotate, thereby driving the two second clamping plates 404 to move simultaneously along the two slide rails 104, so that the two second clamping plates 404 move closer to each other or further away from each other.

[0031] After the circuit board body is placed inside the receiving groove 102, the position of the circuit board body can be fixed by the first motor 5 driving the two first clamping plates 304 to move closer to each other, and the second motor 6 driving the two second clamping plates 404 to move closer to each other. Then, the steel plate 2 is fixed on the workbench 1 by the positioning frame 201 engaging with the positioning groove 101. Finally, solder paste is placed on the steel plate 2, and then the solder paste is evenly spread on the steel plate 2 by the scraper, so that the solder paste falls from the through hole 202 into the diode pads on the circuit board body, thus completing the glue application. Since the circuit board body is fixed in position by the two first clamping plates 304 and the two second clamping plates 404, it is not necessary to customize multiple bases to fix circuit board bodies of different sizes, thereby reducing production costs.

[0032] The working principle of this utility model is as follows: After the circuit board body is placed inside the receiving groove 102, the first clamping plate 304 is brought closer together by the first motor 5, and the two second clamping plates 404 are brought closer together by the second motor 6, which can fix the position of the circuit board body. Then, the steel plate 2 corresponding to the circuit board body is fixed on the workbench 1. Finally, the solder paste is placed on the steel plate 2, and the solder paste is evenly spread on the steel plate 2 by the scraper, so that the solder paste falls from the through hole 202 into the diode pads on the circuit board body, thereby completing the glue application operation. This allows circuit board bodies of different sizes to be fixed without the need to customize multiple bases, thereby reducing production costs.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0034] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A diode surface mount adhesive application device, comprising a worktable (1), characterized in that: A steel plate (2) is provided above the workbench (1), and the circuit board body is located directly below the steel plate (2). The workbench (1) is provided with a first clamping plate (304) and a second clamping plate (404) for clamping the circuit board body. A first driving mechanism for driving the two first clamping plates (304) to move simultaneously and a second driving mechanism for driving the two second clamping plates (404) to move simultaneously are provided below the workbench (1).

2. The diode patch adhesive application device according to claim 1, characterized in that: The steel plate (2) is provided with a positioning frame (201) on its side and a through hole (202) is provided on the surface of the steel plate (2). The through hole (202) is located directly above the diode pad on the circuit board body, and solder paste falls from the through hole (202) onto the pad.

3. The diode surface mount adhesive application device according to claim 1, characterized in that: The workbench (1) is provided with a positioning groove (101) and a material receiving groove (102) on its upper part. The workbench (1) is provided with a limit groove (103) inside its interior. The workbench (1) is provided with a slide rail (104) on its lower part. The positioning frame (201) is located inside the positioning groove (101), and the circuit board body is placed inside the material receiving groove (102).

4. The diode surface mount adhesive application device according to claim 1, characterized in that: The first clamping plate (304) and the second clamping plate (404) are respectively provided with a first slider (303) and a second slider (403). The first slider (303) and the second slider (403) are respectively located inside the two limiting grooves (103). The lower ends of the first slider (303) and the second slider (403) are respectively installed inside the two slide rails (104).

5. The diode surface mount adhesive application device according to claim 1, characterized in that: The first driving mechanism includes a first turntable (3), a first extension rod (301), a first transmission rod (302), a first motor (5), and a rotating shaft (501). The first extension rod (301) is fixed to the side of the first turntable (3). One end of the first transmission rod (302) is connected to the shaft of the first extension rod (301), and the other end of the first transmission rod (302) is connected to the shaft of the first slider (303). The first turntable (3) is mounted on the rotating shaft (501). The upper end of the rotating shaft (501) is connected to the worktable (1) through a bearing, and the lower end of the rotating shaft (501) is connected to the first motor (5).

6. The diode surface mount adhesive application device according to claim 1, characterized in that: The second drive mechanism includes a second turntable (4), a second extension rod (401), a second transmission rod (402), a second motor (6), a drive gear (601), a sleeve (602), and a driven gear (603). The second extension rod (401) is fixed to the side of the second turntable (4). One end of the second transmission rod (402) is connected to the shaft of the second extension rod (401), and the other end of the second transmission rod (402) is connected to the shaft of the second slider (403).

7. A diode surface mount adhesive application device according to claim 6, characterized in that: The second turntable (4) is located directly below the first turntable (3). The second turntable (4) and the driven gear (603) are fixed on the upper and lower ends of the sleeve (602) respectively. The sleeve (602) is mounted on the rotating shaft (501). The driving gear (601) is connected to the shaft of the second motor (6). The driving gear (601) meshes with the driven gear (603).

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