A machining device, a machining robot and a hybrid robot machining apparatus

By designing a movable chip removal unit, the problem of poor adsorption effect caused by the fixed position of the vacuum chip removal mechanism was solved, achieving more efficient chip removal and ensuring processing accuracy and environmental cleanliness.

CN224489148UActive Publication Date: 2026-07-14中科先进(深圳)集成技术有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
中科先进(深圳)集成技术有限公司
Filing Date
2025-08-08
Publication Date
2026-07-14

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Abstract

The utility model relates to the technical field of aircraft wing manufacturing technique provides a kind of processing device, processing robot and composite robot processing equipment, wherein, a kind of processing device, comprising: processing assembly and chip removal assembly;Processing assembly includes processing tool, chip removal assembly is installed on processing assembly, chip removal assembly includes at least one chip removal unit, chip removal unit is movably close or far from processing tool.In this way, by the movable setting of chip removal unit, so that chip removal unit can be closer to processing tool when working, so that chip removal unit compared with prior art can be flexibly moved to the position closer to processing tool, and further make the range of vacuum suction and the core area distance of the processing chip generated closer, thereby effectively enhance the adsorption effect of chip removal assembly to chip.
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Description

Technical Field

[0001] This utility model relates to the field of aircraft wing manufacturing technology, specifically to a processing device, a processing robot, and a composite robot processing equipment. Background Technology

[0002] Aircraft wings are the core components that generate lift, bearing the weight of the fuselage and balancing flight attitude. Their structural design and manufacturing process directly determine the aircraft's payload capacity, range, and safety factor. A wing consists of a smooth outer skin and an internal, crisscrossing skeleton. The skin must maintain a perfect aerodynamic curve to reduce air resistance, while the skeleton must have sufficient strength to withstand airflow impacts and fuselage loads. Their synergistic effect is the foundation for stable flight. In aircraft wing manufacturing in the aerospace industry, drilling is a crucial step in connecting the skin and skeleton, ensuring the wing's structural strength and aerodynamic performance. It requires extremely high precision, necessitating advanced technologies such as laser positioning and five-axis CNC machine tools to ensure accurate drilling positions and smooth hole walls. This maintains the reliability of the skin-skeleton connection while avoiding damage to the wing's aerodynamic shape, preventing increased drag and reduced flight efficiency. However, in addition to precision control, the handling of debris generated during drilling is equally important. If this debris is not removed promptly and effectively, it can not only affect processing accuracy but also interfere with subsequent processes.

[0003] Existing processing equipment typically relies on simple vacuum chip removal mechanisms to remove chips generated during processing. However, most of the vacuum chip removal mechanisms currently in use are fixed in place, and their positions cannot be adjusted according to the specific location of the processing tool. This means they cannot be flexibly moved closer to the processing tool, resulting in a certain distance between the vacuum adsorption range and the core area where the processing chips are generated, leading to poor chip adsorption effect. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a processing device, a processing robot, and a composite robot processing equipment.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] In a first aspect, a processing apparatus is provided, comprising: a processing component and a chip removal component;

[0007] The processing assembly includes a processing tool, and the chip removal assembly is mounted on the processing assembly. The chip removal assembly includes at least one chip removal unit that is movable toward or away from the processing tool.

[0008] In some embodiments, the chip removal unit includes a negative pressure generator and at least one chip removal arm, the chip removal arm being movable toward or away from the machining tool, and the negative pressure generator being connected to the chip removal arm.

[0009] In some embodiments, the chip removal arm is provided with a receiving portion, the processing tool can be at least partially received in the receiving portion, and the negative pressure generator is connected to the receiving portion of the chip removal arm.

[0010] In some embodiments, the number of chip removal arms is two. The two chip removal arms can move relative to each other to simultaneously approach the processing tool, or move away from each other to simultaneously move away from the processing tool. When the two chip removal arms move relative to each other to contact each other, the receiving portions of the two chip removal arms cooperate to receive the processing tool in the two receiving portions.

[0011] In some embodiments, the processing assembly further includes a flow guide sleeve, which is sleeved on the processing tool. The flow guide sleeve is provided with a flow guide hole. When the two chip removal arms move relative to each other to contact each other, the flow guide sleeve is received in the receiving portion of the two chip removal arms, and the flow guide hole is disposed opposite to the receiving portion.

[0012] In some embodiments, the flow guide sleeve is movably fitted onto the processing tool.

[0013] In some embodiments, the chip removal arm is provided with a connection hole, one end of which communicates with the receiving portion, and the other end of which is connected to the negative pressure generating element through a pipe, so that the negative pressure generating element is connected to the receiving portion of the chip removal arm.

[0014] In some embodiments, the chip removal assembly further includes a slide rail, the chip removal unit being movably disposed on the slide rail along a first direction to move closer to or further away from the machining tool, the slide rail being movably mounted on the machining assembly along a second direction, the first direction being perpendicular to the second direction.

[0015] In a second aspect, a processing robot is provided, the processing robot including a robotic arm and a processing device connected to the robotic arm, the processing device being the processing device described in any of the above embodiments.

[0016] Thirdly, a composite robot processing device is provided, the composite robot processing device including an AGV trolley and a processing robot connected to the AGV trolley, the processing robot being the processing robot described in any of the above embodiments.

[0017] Compared with the prior art, the beneficial effects of this utility model are: by making the chip removal unit movable, the chip removal unit can be closer to the processing tool during operation, thereby making the chip removal unit more flexible to move closer to the processing tool than the prior art, thus making the vacuum adsorption range closer to the core area where the processing chips are generated, thereby effectively enhancing the adsorption effect of the chip removal component on the chips. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the processing device of this utility model;

[0019] Figure 2 This is a partial structural schematic diagram of the processing device of this utility model;

[0020] Figure 3 This is a three-dimensional structural diagram of the processing device of this utility model from another direction;

[0021] Figure 4 This is a schematic diagram of the composite robot processing equipment of this utility model.

[0022] 100. Machining assembly; 110. Machining tool; 120. Flow guide sleeve; 121. Flow guide hole; 130. Spindle drive unit;

[0023] 200. Chip removal assembly; 210. Chip removal unit; 211. Chip removal arm; 212. Receiving part; 213. Pipe; 220. Slide rail; 230. Chip removal drive unit;

[0024] 300. Robotic arm;

[0025] 400. AGV (Automated Guided Vehicle) trolley. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this utility model, not all embodiments.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0028] In the following embodiments and accompanying drawings, reference is made to Figure 1 , Figure 2 and Figure 3 The coordinate system is defined with the arrow pointing to the right on the X-axis, the arrow pointing to the front on the Y-axis, and the arrow pointing to the top on the Z-axis.

[0029] like Figure 1 and Figure 2 As shown, a processing apparatus is provided, including: a processing component 100 and a chip removal component 200; the processing component 100 includes a processing tool 110, the chip removal component 200 is mounted on the processing component 100, and the chip removal component 200 includes at least one chip removal unit 210, the chip removal unit 210 being movable toward or away from the processing tool 110.

[0030] Specifically, the machining component 100 is used to drill holes in the wing frame. The chip removal component 200 is used to adsorb the dust generated during the machining process of the machining tool 110 to prevent dust from flying around and affecting the machining environment; the chip removal unit 210 can adsorb the dust generated during machining through a vacuum adsorption structure, and the chip removal unit 210 can move closer to or further away from the wing frame along the Z-axis to actively adsorb the dust and debris generated during machining by the machining tool 110.

[0031] It is worth noting that by making the chip removal unit 210 movable, the chip removal unit 210 can be closer to the machining tool 110 during operation. This allows the chip removal unit 210 to be moved more flexibly to a position closer to the machining tool 110 compared to the prior art, thereby making the vacuum adsorption range closer to the core area where the machining chips are generated, thus effectively enhancing the chip adsorption effect of the chip removal component 200 on the chips.

[0032] To facilitate the use of the chip removal unit 210, such as Figure 1 and Figure 2 As shown, in some embodiments, the chip removal unit 210 includes a negative pressure generator and at least one chip removal arm 211, which is movably close to or away from the machining tool 110, and the negative pressure generator is connected to the chip removal arm 211.

[0033] Specifically, the negative pressure generating component may be, but is not limited to, a vacuum pump, a negative pressure fan, etc., and is connected to the chip removal arm 211 to form a negative pressure area at the corresponding position of the chip removal arm 211 to adsorb debris.

[0034] In another embodiment, the chip removal arm 211 is configured in an L-shape, thereby making the processing device more space-efficient and aesthetically pleasing.

[0035] To facilitate the use of the chip removal arm 211, such as Figure 1 and Figure 2 As shown, in some embodiments, the chip removal arm 211 is provided with a receiving portion 212, and the processing tool 110 can be at least partially received in the receiving portion 212. The negative pressure generator is connected to the receiving portion 212 of the chip removal arm 211.

[0036] Specifically, the left end of the chip removal arm 211 is provided with a receiving portion 212, and the receiving portion 212 is recessed at the end near the processing tool 110. A corresponding suction port is formed in this recessed area to create negative pressure at the receiving portion 212 to adsorb debris. The suction port can be a large hole, multiple evenly distributed small holes, or other configurations depending on actual production needs; no limitation is made here. Furthermore, the shape of the processing tool 110 is adapted to the recessed shape of the receiving portion 212. That is, the cross-sectional shape of the processing tool 110 is circular, and the cross-sectional shape of the recessed portion 212 is adapted to fit it, so that it can cover the outer peripheral surface of the processing tool 110. This allows the processing tool 110 to be at least partially contained within the receiving portion 212, bringing the processing tool 110 closer to the negative pressure area, thereby effectively enhancing the adsorption effect.

[0037] To further enhance the dandruff removal effect, such as Figure 1 and Figure 2 As shown, in some embodiments, there are two chip removal arms 211. The two chip removal arms 211 can move relative to each other to simultaneously approach the machining tool 110, or move away from each other to simultaneously move away from the machining tool 110. When the two chip removal arms 211 move relative to each other to contact each other, the receiving portions 212 of the two chip removal arms 211 cooperate to house the machining tool 110 in the two receiving portions 212.

[0038] Specifically, the two chip removal arms 211 are positioned on both sides of the machining tool 110 during operation, thereby vacuum adsorbing the dust generated during machining from opposite sides. When the two receiving parts 212 are closed, the concave areas of the two receiving parts 212 surround and cover the outer periphery of the machining tool 110, that is, the two concave areas form a complete circle when closed. At this time, the dust and debris can be better adsorbed, and the debris generated during machining can be effectively prevented from splashing out from the gap between the two receiving parts 212.

[0039] In another embodiment, three or four chip removal arms 211 may be provided, and each chip removal arm 211 is arranged along the circumference of the processing tool 110 to adsorb the chips.

[0040] To facilitate adsorption, such as Figure 3 As shown, in some embodiments, the processing assembly 100 further includes a flow guide sleeve 120, which is sleeved on the processing tool 110. The flow guide sleeve 120 is provided with a flow guide hole 121. When the two chip removal arms 211 move relative to each other to contact each other, the flow guide sleeve 120 is received in the receiving portion 212 of the two chip removal arms 211, and the flow guide hole 121 and the receiving portion 212 are arranged opposite to each other.

[0041] Specifically, a flow guide sleeve 120 is sleeved around the outer side of the machining tool 110, and the flow guide sleeve 120 has a flow guide hole 121 radially. It can be understood that the flow guide sleeve 120 is a limiting clamping sleeve, which is installed on the spindle sleeve to ensure the stability and accuracy of the tool during machining. In the machining state, the concave areas of the two receiving portions 212 fit and cover the outer periphery of the flow guide sleeve 120 (not shown in the figure). The flow guide hole 121 is correspondingly arranged with the suction port of the receiving portion 212, so that debris can flow from the flow guide hole 121 to the suction port, thus facilitating debris collection.

[0042] To facilitate processing by the processing tool 110, in some embodiments, the guide sleeve 120 is movably fitted onto the processing tool 110.

[0043] Specifically, the guide sleeve 120 slides on the machining tool 110 by means of a slider and a groove, so as to facilitate the machining of the machining tool 110.

[0044] To facilitate the generation of negative pressure by the negative pressure generating element, such as Figure 3 As shown, in some embodiments, the chip removal arm 211 is provided with a connection hole, one end of which is connected to the receiving part 212, and the other end of which is connected to the negative pressure generating element through the pipe 213, so that the negative pressure generating element is connected to the receiving part 212 of the chip removal arm 211.

[0045] Specifically, the rear end of the pipe 213 is connected to the negative pressure generator, and a connection hole is provided on the right side of the chip removal arm 211. The connection hole is connected to the receiving part 212 and the front end of the pipe 213, so that when the negative pressure generator is working, negative pressure can be generated at the suction port of the receiving part 212.

[0046] To facilitate the operation of the chip removal unit 210, such as Figure 3 As shown, in some embodiments, the chip removal assembly 200 further includes a slide rail 220, on which the chip removal unit 210 is movably disposed along a first direction to move closer to or further away from the processing tool 110, and the slide rail 220 is movably mounted on the processing assembly 100 along a second direction, the first direction being perpendicular to the second direction.

[0047] Specifically, the slide rail 220 is movably disposed on the processing assembly 100 so that it can move along the Y-axis direction on the right side of the processing assembly 100, and the chip removal unit 210 is slidably disposed on the slide rail 220 so that it can move along the Z-axis direction on the slide rail 220.

[0048] The hand or a drive component can drive the machining tool 110 and the chip removal assembly 200 to move along the Y-axis; and the hand or another drive component can also drive the slide rail 220 to move along the Y-axis on the machining assembly 100; in addition, the chip removal unit 210 can also move along the Z-axis on the slide rail 220 to move closer to or further away from the machining tool 110.

[0049] In some embodiments, the driving component that drives the machining assembly 100 to move along the Y-axis is configured as a spindle drive unit 130, that is, the machining assembly 100 further includes a spindle drive unit 130, which is used to drive the machining tool 110 to approach the workpiece and perform machining according to the machining requirements.

[0050] For ease of processing, such as Figure 3 As shown, in some embodiments, the spindle drive unit 130 includes a first driver, a first linear feed module and a spindle motor. The spindle motor is slidably mounted on the first linear feed module, and the output end of the first driver is connected to the spindle motor.

[0051] Specifically, the spindle motor is slidably mounted on the first linear feed module. A first driver is installed on the rear side of the first linear feed module, and the driving direction of the first driver and the guiding direction of the first linear feed module are set to the Y-axis. The first driver is a servo motor, and the output end of the servo motor is connected to the spindle motor to drive the spindle motor to move along the direction of the first linear feed module, thus moving closer to or further away from the workpiece in the Y-axis direction. It is understood that servo motors have advantages such as high positioning accuracy, precise speed control, fast dynamic response, and strong anti-interference ability. Therefore, the servo motor can effectively control the spindle motor to reach the specified coordinates, thereby further controlling the drilling accuracy and ensuring the drilling effect. It is understood that the specific structure of the first linear feed module and the way the first linear feed module cooperates with the servo motor drive component to perform linear motion are technologies known to those skilled in the art and are achievable, and will not be described in detail in this embodiment. For example, a linear feed module typically consists of a guide rail, a slider, a lead screw, or a timing belt. The guide rail provides guidance for linear motion, the slider slides on the guide rail and is used to support the driven components, and the lead screw or timing belt is responsible for converting rotary motion into linear motion.

[0052] For ease of processing, such as Figure 3 As shown, in some embodiments, the machining tool 110 includes a spindle, a chuck, and a cutting tool. The output end of the spindle motor is connected to the spindle, the chuck is connected to the spindle, and the cutting tool is disposed inside the chuck.

[0053] Specifically, the spindle motor is driven by the first driver, thus sliding linearly on the first linear feed module. The spindle is the transmission and execution component, transmitting the rotational motion of the spindle motor to the cutting tool, which then performs cutting operations. A chuck is installed inside the spindle to prevent the cutting tool from falling off during high-speed rotation or cutting, and to transmit the rotational torque of the spindle motor to the cutting tool. In this embodiment, the chuck is a pneumatic chuck; however, it can also be a spring chuck, hydraulic chuck, etc., without limitation. The cutting tool is mounted on the chuck, and machining is achieved through the relative movement of the cutting tool with the workpiece.

[0054] To increase the practicality of the device, such as Figure 3 As shown, in some embodiments, the driving component that drives the machining assembly 100 to move along the Y-axis is configured as a chip removal driving unit 230. The chip removal driving unit 230 includes a second driver and a second linear feed module. The second linear feed module is connected to the first linear feed module through a plate. The slide rail 220 is slidably disposed on the second linear feed module. The second driver is disposed on one side of the second linear feed module. The output end of the second driver is connected to the slide rail 220.

[0055] Specifically, both the second linear feed module and the first linear feed module are guided along the Y-axis. The second linear feed module is connected to the right side of the first linear feed module via a plate, and the slide rail 220 slides on the second linear feed module along the Y-axis. The second driver is installed on the rear end of the second linear feed module. The second driver is a stepper motor, and the output end of the stepper motor is connected to the slide rail 220. The stepper motor drives the slide rail 220 to move, thereby causing the chip removal unit 210 to move closer to or further away from the workpiece along the Y-axis, so as to actively absorb the dust and debris generated during the processing of the machining tool 110.

[0056] In some embodiments, the movement of the two chip removal arms 211 on the slide rail 220 is driven by a cylinder. The way in which the cylinder drives the two chip removal arms 211 to slide on the slide rail 220 is known to those skilled in the art and is feasible, and will not be described in detail in this embodiment.

[0057] In the above embodiments, the way the motor drive component works is a technique known to those skilled in the art and is achievable, and will not be described in detail in this embodiment.

[0058] It is understood that in this application, the processing device is used to drill holes in the wing frame. In addition, the processing device can also perform other processing operations, which are not limited here. All of them can be processed by the processing device and the chip removal component 200 can remove chips.

[0059] A processing robot is provided, comprising a robotic arm 300 and a processing device connected to the robotic arm 300, wherein the processing device is the processing device of any of the above embodiments.

[0060] Specifically, the robotic arm 300 can be, but is not limited to, a six-axis robotic arm. A six-axis robotic arm can perform multi-angle work and is more practical. The drive end of the robotic arm 300 is connected to the processing device via a mounting flange. That is, the first linear feed module is connected to the drive end of the robotic arm 300 via the mounting flange. The robotic arm 300 can drive the processing tool 110 to approach the workpiece and perform processing according to the processing requirements.

[0061] like Figure 4 As shown, a composite robot processing device is provided. The composite robot processing device includes an AGV trolley 400 and a processing robot connected to the AGV trolley 400. The processing robot is the processing robot of the above embodiment.

[0062] Specifically, the positioning end of the robotic arm 300 is connected to the AGV trolley 400 and is electrically connected to the AGV trolley 400. The AGV trolley 400 can drive the processing device to the designated position, and the robotic arm 300 can adjust the processing device to get closer to the workpiece.

[0063] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0064] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0065] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0066] In this invention, unless otherwise expressly specified and limited, "above or below" the first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" the first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0067] Although the description of this utility model has been given in conjunction with the specific embodiments described above, it is obvious to those skilled in the art that many substitutions, modifications, and variations can be made based on the above description. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.

Claims

1. A processing apparatus, characterized in that, include: Machining components and chip removal components; The processing assembly includes a processing tool, and the chip removal assembly is mounted on the processing assembly. The chip removal assembly includes at least one chip removal unit that is movable toward or away from the processing tool.

2. The processing apparatus according to claim 1, characterized in that: The chip removal unit includes a negative pressure generator and at least one chip removal arm, which is movable toward or away from the machining tool, and the negative pressure generator is connected to the chip removal arm.

3. The processing apparatus according to claim 2, characterized in that, The chip removal arm is provided with a receiving part, and the processing tool can be at least partially received in the receiving part. The negative pressure generator is connected to the receiving part of the chip removal arm.

4. The processing apparatus according to claim 3, characterized in that, The number of chip removal arms is two. The two chip removal arms can move relative to each other to simultaneously approach the processing tool, or move away from each other to simultaneously move away from the processing tool. When the two chip removal arms move relative to each other to contact each other, the receiving parts of the two chip removal arms cooperate to receive the processing tool in the two receiving parts.

5. The processing apparatus according to claim 4, characterized in that, The processing assembly further includes a flow guide sleeve, which is sleeved on the processing tool. The flow guide sleeve is provided with a flow guide hole. When the two chip removal arms move relative to each other to contact each other, the flow guide sleeve is received in the receiving part of the two chip removal arms, and the flow guide hole is arranged opposite to the receiving part.

6. The processing apparatus according to claim 5, characterized in that, The flow guide sleeve is movably fitted onto the processing tool.

7. The processing apparatus according to any one of claims 3 to 6, characterized in that, The chip removal arm is provided with a connection hole. One end of the connection hole is connected to the receiving part, and the other end of the connection hole is connected to the negative pressure generating element through a pipe, so that the negative pressure generating element is connected to the receiving part of the chip removal arm.

8. The processing apparatus according to any one of claims 1 to 6, characterized in that, The chip removal assembly further includes a slide rail, on which the chip removal unit is movably disposed along a first direction to move closer to or further away from the machining tool, and the slide rail is movably mounted on the machining assembly along a second direction, wherein the first direction is perpendicular to the second direction.

9. A processing robot, characterized in that, The processing robot includes a robotic arm and a processing device connected to the robotic arm, wherein the processing device is the processing device according to any one of claims 1 to 8.

10. A composite robot processing equipment, characterized in that, The composite robot processing equipment includes an AGV trolley and a processing robot connected to the AGV trolley, wherein the processing robot is the processing robot as described in claim 9.