一种高速高精度固晶机
By combining the bonding module with the transfer station, rapid chip pickup, multi-dimensional calibration, and precise die bonding are achieved, solving the problems of low efficiency and insufficient precision of traditional die bonding machines and improving die bonding efficiency and precision.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHEN ZHEN TALUER TECH CO LTD
- Filing Date
- 2025-07-28
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional die bonders, due to their single-wafer stage and single-bonding head module design, suffer from low efficiency in chip picking, transfer, and die bonding processes, long idle time, low capacity, and lack of chip transfer and calibration links, making it difficult to meet the requirements of high-precision processes.
The first bonding module works in conjunction with the wafer stage module. A transfer station is used to quickly pick up and calibrate the chip in multiple dimensions. The chip is then fixed by vacuum holes. The second bonding module performs precise die bonding. The XY moving platform and rotating components are combined to adjust the chip position in multiple dimensions, thereby improving the die bonding efficiency.
It significantly improves die bonding efficiency, reduces equipment waiting time, optimizes the die bonding process, enhances die bonding accuracy and capacity, and meets the requirements of high-precision processes.
Smart Images
Figure CN224521553U_ABST
Abstract
Claims
1. A high-speed high-precision die bonder comprising a mounting table (10), characterized in that: Both sides of the upper end of the mounting platform (10) are fixed with base plates (11), and wafer stage modules (20) are fixed at the upper ends of the two base plates (11). Support plates (12) are fixed at the upper end of the mounting platform (10) on the side away from the two base plates (11). Two first bonding head modules (13) and two second bonding head modules (14) are fixed sequentially from one side to the other at the upper ends of the two support plates (12). The two first bonding head modules (13) and the two second bonding head modules (14) cooperate with the wafer stage modules (20) on the corresponding sides to form a front-end production module and a back-end production module, respectively. The platform also includes: A transfer station (30) is mounted on the upper end of the mounting platform (10) and is located between the first head module (13) and the second head module (14).
2. The high-speed high-precision die bonder according to claim 1, wherein: The swing angle of the first head module (13) and the second head module (14) is 90 degrees.
3. The high-speed high-precision die bonder of claim 1, wherein: The upper end of the support plate (12) is fixed with a first camera module (15), which is located at the upper end of the wafer stage module (20).
4. The high-speed high-precision die bonder of claim 1, wherein: The upper end of the support plate (12) is fixed with a second camera module (16), which is located at the upper end of the transfer station (30).
5. The high-speed high-precision die bonder of claim 1, wherein: The upper end of the mounting platform (10) away from the wafer stage module (20) is equipped with a die bonding mechanism (17), and the upper end of the support plate (12) away from the first camera module (15) is fixed with a third camera module (18).
6. The high-speed high-precision die bonder of claim 1, wherein: The transfer station (30) includes an XY moving platform (31) and a rotating component (32). The XY moving platform (31) is fixed to the upper end of the mounting platform (10), and the rotating component (32) is assembled on the upper end of the XY moving platform (31).
7. The high-speed high-precision die bonder of claim 1, wherein: The upper end of the transfer station (30) is provided with a vacuum hole (33).