A multi-duct heat dissipation device and a laser engraving machine

Abstract

The application provides a multi-air-duct heat dissipation device and a laser engraving machine. The multi-air-duct heat dissipation device comprises a shell, a heat dissipation seat and a laser module. The shell is provided with a containing cavity, the containing cavity is provided with a first containing space and a second containing space, the first containing space and the second containing space are communicated, the heat dissipation seat is installed on the shell and is located in the first containing space, the heat dissipation seat is provided with a first heat dissipation air duct, the laser module is used for outputting laser light to an object to be engraved, one end of the laser module is connected to the heat dissipation seat and is attached to a first side wall of the heat dissipation seat, the laser module is located in the second containing space, a second heat dissipation air duct is formed between the laser module and an inner side wall of the second containing space, the second heat dissipation air duct is arranged on one side of the first heat dissipation air duct and is compatible with the same containing cavity, so that multi-air-duct arrangement is realized, the laser module is facilitated to perform multi-path heat dissipation, only one heat dissipation air duct is avoided, and the heat dissipation effect of the multi-air-duct heat dissipation device is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of laser engraving machines, and in particular to a multi-channel heat dissipation device and a laser engraving machine. Background Technology

[0002] With the development of technology, laser engraving machines are being used in industry. These machines can be placed on a table or desktop for user operation. A laser engraving machine includes a heat dissipation device and a main body, with the main body supporting the heat dissipation device, which is an integral part of the machine. In existing technology, the heat dissipation device includes a housing and a laser module. The housing has a receiving cavity, and the laser module is housed within this cavity. A heat dissipation channel is formed between the laser module and the inner wall of the receiving cavity. However, this single heat dissipation channel results in poor heat dissipation performance for existing devices. Utility Model Content

[0003] The purpose of this utility model is to provide a multi-channel heat dissipation device and a laser engraving machine. The housing is provided with a receiving cavity, which has a first receiving space and a second receiving space. The first receiving space and the second receiving space are connected. A heat sink is installed on the housing and is located in the first receiving space. The heat sink has a first heat dissipation channel. A laser module is used to output laser light to the workpiece to be engraved. One end of the laser module is connected to the heat sink and is attached to the first side wall of the heat sink. The laser module is located in the second receiving space. A second heat dissipation channel is formed between the laser module and the inner side wall of the second receiving space. The second heat dissipation channel is set on one side of the first heat dissipation channel and is compatible with the same receiving cavity to realize a multi-channel arrangement, thereby facilitating multi-path heat dissipation of the laser module, avoiding only a single heat dissipation channel, and improving the heat dissipation effect of the multi-channel heat dissipation device.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a multi-channel heat dissipation device applied to a laser engraving machine, the multi-channel heat dissipation device comprising:

[0005] The housing has a receiving cavity, which has a first receiving space and a second receiving space; the first receiving space and the second receiving space are connected.

[0006] A heat sink is installed on the housing and located in the first receiving space; the heat sink is provided with a first heat dissipation air duct;

[0007] A laser module is used to output laser light to the workpiece to be engraved; one end of the laser module is connected to the heat sink and is attached to the first side wall of the heat sink; the laser module is located in the second receiving space; a second heat dissipation channel is formed between the laser module and the inner side wall of the second receiving space; the second heat dissipation channel is disposed on one side of the first heat dissipation channel and is compatible with the same receiving cavity.

[0008] Optionally, both the first and second heat dissipation ducts extend along the length of the housing;

[0009] The second heat dissipation duct is arranged at an interval from the first heat dissipation duct. The second heat dissipation duct is used to allow the second gas to pass through. The second gas passes through the laser module and carries away part of the heat output by the laser module.

[0010] The laser module is in contact with the heat sink, and the heat sink exchanges heat with the laser module and provides contact-type heat dissipation for the laser module.

[0011] The first heat dissipation duct is used to allow the first gas to pass through, which passes through the heat sink and cools the heat sink, so that the laser module can dissipate heat through multiple paths in the cavity.

[0012] Optionally, the multi-channel heat dissipation device includes a first cooling fan, the first cooling fan and the laser module are respectively located in different directions of the heat sink; the exhaust end of the first cooling fan faces the first heat dissipation channel and outputs a first gas into the first heat dissipation channel.

[0013] Optionally, the first cooling fan is installed on the other side wall of the heat sink, and the heat sink supports the first cooling fan and the laser module; the first cooling fan is disposed on the upper side of the heat sink, and the laser module is disposed on the periphery of the heat sink;

[0014] Alternatively, the first cooling fan is mounted on the housing, and the heat sink supports the first cooling fan and the laser module; the first cooling fan is located on the upper side of the heat sink, and the laser module is located on the periphery of the heat sink.

[0015] Optionally, when the first cooling fan is installed on the other side wall of the heat sink, the side wall of the first cooling fan relative to the heat sink is in contact with the other side wall of the heat sink.

[0016] The laser module is provided with a first mounting part, which is mounted on one side wall of the heat sink. The side wall of the heat sink is provided with a receiving groove, and the first mounting part is inserted into the receiving groove. The upper side wall of the first mounting part is located on the lower side of the first cooling fan relative to the side wall of the heat sink.

[0017] Optionally, the first mounting part is detachably connected to the heat sink and can elastically fit against the heat sink; the first mounting part is tightly attached to one side wall of the heat sink under elastic force.

[0018] The first mounting part and the heat sink are provided with multiple connection positions, which are arranged in a square array or a ring array; the heat sink is provided with a corresponding clearance groove, which is used to avoid the multiple connection positions.

[0019] Optionally, the heat sink is provided with a second mounting part, which is arranged opposite to the first mounting part; the first mounting part is disposed on one side of the second mounting part and is elastically mounted on the second mounting part, so that the opposite side walls of the first mounting part and the second mounting part are in a flat and fitted state.

[0020] The laser module further includes a connecting shaft and an elastic element; the connecting shaft is movably passed through the second mounting portion and connected to the first mounting portion; the elastic element is sleeved on the connecting shaft and elastically acts on the end of the connecting shaft and the second mounting portion to apply an elastic force to the first mounting portion, so that the first mounting portion is tightly attached to the second mounting portion under the elastic force;

[0021] The second mounting part is provided with a movable hole, and the connecting shaft passes through the movable hole; the end of the connecting shaft is located on the side of the second mounting part away from the first mounting part and contacts one end of the elastic member, and the other end of the elastic member elastically contacts the side wall of the second mounting part away from the first mounting part.

[0022] Optionally, the multi-channel heat dissipation device further includes a circuit board, which is housed in the receiving cavity and protected by the circumferential side of the housing; the circuit board and the laser module are located in the same second receiving space; a heat dissipation gap exists between the circuit board and the laser module;

[0023] The circuit board carries multiple electronic components, which are located on the side of the circuit board facing the heat dissipation gap and are spaced apart from the laser module. The side of the circuit board facing the laser module is the front side, and the side of the circuit board facing away from the laser module is the back side.

[0024] The circuit board is directly opposite an inner wall of the receiving cavity; there is a gap between the surface of the circuit board and an inner wall of the receiving cavity; the circuit board is suspended in the receiving cavity.

[0025] Optionally, the multi-channel heat dissipation device includes a second cooling fan, which is installed on the top of the housing, and the exhaust end of the second cooling fan faces the second heat dissipation channel.

[0026] The exhaust end of the second cooling fan outputs a second gas toward the second cooling duct. The second gas passes through the second cooling duct and the cooling gap, so that the second gas simultaneously carries away the heat generated by the laser module and the heat generated by the circuit board.

[0027] To achieve the above objectives, this utility model provides the following technical solution: a laser engraving machine, comprising the aforementioned multi-channel heat dissipation device and a laser engraving machine body, wherein the laser engraving machine body supports the multi-channel heat dissipation device.

[0028] Compared with the prior art, the beneficial effects of this utility model are:

[0029] This utility model provides a multi-channel heat dissipation device and a laser engraving machine. The housing has a receiving cavity, which has a first receiving space and a second receiving space. The first receiving space and the second receiving space are connected. A heat sink is installed on the housing and is located in the first receiving space. The heat sink has a first heat dissipation channel. A laser module is used to output laser light to the workpiece to be engraved. One end of the laser module is connected to the heat sink and is attached to the first side wall of the heat sink. The laser module is located in the second receiving space. A second heat dissipation channel is formed between the laser module and the inner side wall of the second receiving space. The second heat dissipation channel is set on one side of the first heat dissipation channel and is compatible with the same receiving cavity to realize a multi-channel arrangement, thereby facilitating multi-path heat dissipation of the laser module, avoiding only a single heat dissipation channel, and improving the heat dissipation effect of the multi-channel heat dissipation device. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0032] Figure 1 A schematic diagram of a multi-channel heat dissipation device according to an embodiment of this application is shown.

[0033] Figure 2 A cross-sectional view of a multi-channel heat dissipation device according to an embodiment of this application is shown.

[0034] Figure 3 A schematic diagram of the internal structure of a multi-channel heat dissipation device according to an embodiment of this application is shown.

[0035] Figure 4A schematic diagram showing the connection between the heat sink and the laser module of a multi-channel heat dissipation device according to an embodiment of this application is shown.

[0036] Figure 5 A cross-sectional view of the heat sink and laser module of a multi-channel heat dissipation device according to an embodiment of this application is shown.

[0037] Figure Labels

[0038] 100. Multi-channel heat dissipation device;

[0039] 10. Shell; 10a. Receiving cavity; 10b. First receiving space; 10c. Second receiving space;

[0040] 20. Heat sink base; 20a. First heat dissipation duct; 20b. Receiving slot; 20c. Clearance slot; 21. Second mounting part; 21a. Moving hole;

[0041] 30. Laser module; 30a. Second heat dissipation duct; 31. First mounting part; 32. Connecting shaft; 321. First shaft body; 322. Second shaft body; 33. Elastic element;

[0042] 40. First cooling fan;

[0043] 50. Circuit board; 51. Electronic component;

[0044] 60. Second cooling fan. Detailed Implementation

[0045] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0046] Please refer to the attached document. Figures 1-5 This application provides a multi-channel heat dissipation device 100, which is applied to a laser engraving machine and is used to dissipate heat from the laser module 30 through multiple paths.

[0047] Please refer to the attached document. Figures 1-5In this embodiment, the multi-channel heat dissipation device 100 includes a housing 10, a heat sink 20, and a laser module 30. The housing 10 has a receiving cavity 10a, which has a first receiving space 10b and a second receiving space 10c. The first receiving space 10b and the second receiving space 10c are connected. The heat sink 20 is installed on the housing 10 and is located in the first receiving space 10b. The heat sink 20 has a first heat dissipation channel 20a. The laser module 30 is used to output laser light to the workpiece to be engraved. One end is connected to the heat sink 20 and fits against the first side wall of the heat sink 20; the laser module 30 is located in the second receiving space 10c; a second heat dissipation air duct 30a is formed between the laser module 30 and the inner side wall of the second receiving space 10c; the second heat dissipation air duct 30a is set on one side of the first heat dissipation air duct 20a and is compatible with the same receiving cavity 10a to realize the multi-air duct arrangement, thereby facilitating the laser module 30 to perform multi-path heat dissipation, avoiding only one heat dissipation air duct, and improving the heat dissipation effect of the multi-air duct heat dissipation device 100.

[0048] Please refer to the attached document. Figures 1-5 In this embodiment, the housing 10 serves as a supporting component of the multi-channel heat dissipation device 100, and is used to support the heat sink 20 and the laser module 30. The housing 10 is provided with a receiving cavity 10a, which serves as the internal space of the housing 10. The receiving cavity 10a is provided with a first receiving space 10b and a second receiving space 10c; the first receiving space 10b and the second receiving space 10c are connected.

[0049] The heat sink 20 is installed on the housing 10 and is located in the first receiving space 10b. The heat sink 20 is provided with a first heat dissipation duct 20a, which is used to allow a first gas to pass through. The first gas passes through the heat sink 20 and carries away the heat of the heat sink 20.

[0050] The laser module 30 is used to output laser beams to the workpiece to be engraved; one end of the laser module 30 is connected to the heat sink 20 and is attached to the first side wall of the heat sink 20; the laser module 30 is located in the second receiving space 10c; a second heat dissipation air duct 30a is formed between the laser module 30 and the inner side wall of the second receiving space 10c; the second heat dissipation air duct 30a is set on one side of the first heat dissipation air duct 20a and is compatible with the same receiving cavity 10a to realize the multi-air duct arrangement, thereby facilitating multi-path heat dissipation of the laser module 30, avoiding only one heat dissipation air duct, and improving the heat dissipation effect of the multi-air duct heat dissipation device 100.

[0051] Please refer to the attached document. Figures 1-3In this embodiment, both the first heat dissipation duct 20a and the second heat dissipation duct 30a extend along the length of the housing 10, so that the first gas and the second gas pass through the first heat dissipation duct 20a and the second heat dissipation duct 30a respectively in the vertical direction; the second heat dissipation duct 30a is arranged at intervals from the first heat dissipation duct 20a, and the second heat dissipation duct 30a is used for the passage of the second gas, which passes through the laser module 30 and carries away part of the heat output by the laser module 30; the laser module 30 is in contact with the heat sink 20, and the heat sink 20 and the laser module 30 exchange heat and perform contact heat dissipation on the laser module 30; the first heat dissipation duct 20a is used for the passage of the first gas, which passes through the heat sink 20 and performs air cooling on the heat sink 20, so that the laser module 30 can be cooled by multiple paths within the receiving cavity 10a, so that the first gas and the second gas can simultaneously dissipate heat on the laser module 30, avoiding only one heat dissipation duct and improving the heat dissipation effect of the multi-duct heat dissipation device 100.

[0052] Please refer to the attached document. Figures 1-3 In this embodiment, the multi-channel heat dissipation device 100 includes a first cooling fan 40. The first cooling fan 40 and the laser module 30 are located in different directions of the heat sink 20, so that the first cooling fan 40 and the laser module 30 can make full use of the different spaces of the heat sink 20. The exhaust end of the first cooling fan 40 faces the first heat dissipation channel 20a and outputs first gas to the first heat dissipation channel 20a, so that the first cooling fan 40 outputs the first gas to drive the gas in the first heat dissipation channel 20a, thereby realizing heat dissipation of the heat sink 20.

[0053] Please refer to the attached document. Figures 1-3 In this embodiment, the first cooling fan 40 is installed on the other side wall of the heat sink 20, and the heat sink 20 supports the first cooling fan 40 and the laser module 30. The first cooling fan 40 is disposed on the upper side of the heat sink 20, and the laser module 30 is disposed on the periphery of the heat sink 20. This allows the first cooling fan 40 to be fixed on the upper side of the heat sink 20, thereby facilitating the first cooling fan 40 and the laser module 30 to be located in different directions of the heat sink 20.

[0054] Alternatively, the first cooling fan 40 is mounted on the housing 10, and the heat sink 20 supports the first cooling fan 40 and the laser module 30; the first cooling fan 40 is located on the upper side of the heat sink 20, and the laser module 30 is located on the periphery of the heat sink 20, so that the first cooling fan 40 can be fixed to the housing 10, thereby facilitating the first cooling fan 40 and the laser module 30 to be located in different directions of the heat sink 20.

[0055] Please refer to the attached document. Figures 1-3In this embodiment of the application, when the first cooling fan 40 is installed on the other side wall of the heat sink 20, the side wall of the first cooling fan 40 relative to the heat sink 20 is in contact with the other side wall of the heat sink 20; thus improving the heat dissipation effect of the first cooling fan 40 on the heat sink 20.

[0056] The laser module 30 is provided with a first mounting part 31, which is mounted on one side wall of the heat sink 20. The side wall of the heat sink 20 is provided with a receiving groove 20b. The first mounting part 31 is inserted into the receiving groove 20b so that the inner side wall of the receiving groove 20b restricts the range of motion of the first mounting part 31, thereby improving the connection stability of the laser module 30 relative to the heat sink 20. The upper side wall of the first mounting part 31 is located on the lower side of the first cooling fan 40 relative to the side wall of the heat sink 20, so that the laser module 30 and the first cooling fan 40 are located on different side walls of the heat sink 20, making full use of the outer space of the heat sink 20.

[0057] Please refer to the attached document. Figures 1-5 In this embodiment, the first mounting part 31 is detachably connected to the heat sink 20 and can elastically fit against the heat sink 20; the first mounting part 31 is tightly attached to one side wall of the heat sink 20 under elastic force; so as to maintain the elastic mounting state of the laser module 30 relative to the heat sink 20, ensuring the installation stability of the laser module 30 relative to the heat sink 20, overcoming assembly tolerance and dimensional tolerance, and improving the installation convenience of the laser module 30.

[0058] Multiple connection points are provided between the first mounting part 31 and the heat sink 20. These connection points are arranged in a square array or a ring array. By arranging multiple connection points, the connection strength between the first mounting part 31 and the heat sink 20 is increased, preventing the first mounting part 31 and the heat sink 20 from losing their connection effect due to the failure of one connection point. Optionally, there are four connection points. The heat sink 20 is provided with a corresponding clearance groove 20c, which is used to avoid the multiple connection points, ensuring the installation space between the first mounting part 31 and the heat sink 20 and improving the installation efficiency between the first mounting part 31 and the heat sink 20.

[0059] Please refer to the attached document. Figures 1-5In this embodiment, the heat sink 20 is provided with a second mounting portion 21, which is arranged opposite to the first mounting portion 31. The first mounting portion 31 is disposed on one side of the second mounting portion 21 and is elastically mounted on the second mounting portion 21, so that the first mounting portion 31 and the opposite side walls of the second mounting portion 21 are in a flat and fitted state. The elastic deformation allows the second mounting portion 21 to be finely adjusted when subjected to force, ensuring that the side wall of the first mounting portion 31 and the side wall of the second mounting portion 21 are always flat and fitted, ensuring the installation stability of the laser module 30 relative to the heat sink 20, overcoming assembly tolerances and dimensional tolerances, and improving the installation convenience of the laser module 30.

[0060] The laser module 30 also includes a connecting shaft 32 and an elastic element 33. The connecting shaft 32 is movably inserted through the second mounting portion 21 and connected to the first mounting portion 31. The elastic element 33 is sleeved on the connecting shaft 32 and acts elastically on the end of the connecting shaft 32 and the second mounting portion 21 to apply an elastic force to the first mounting portion 31, so that the first mounting portion 31 is tightly attached to the second mounting portion 21 under the elastic force. This allows the first mounting portion 31 to be elastically connected to the second mounting portion 21 through the connecting shaft 32 and the elastic element 33, thereby facilitating the maintenance of the fit between the first mounting portion 31 and the second mounting portion 21 under the elastic action of the elastic element 33. This ensures the installation stability of the laser module 30 relative to the heat sink 20, overcomes assembly tolerances and dimensional tolerances, and improves the installation convenience of the laser module 30.

[0061] The second mounting part 21 is provided with a moving hole 21a, and the connecting shaft 32 passes through the moving hole 21a. The end of the connecting shaft 32 is located on the side of the second mounting part 21 facing away from the first mounting part 31 and contacts one end of the elastic member 33. The other end of the elastic member 33 elastically contacts the side wall of the second mounting part 21 facing away from the first mounting part 31, so that the elastic force applied by the elastic member 33 can transmit the second mounting part 21 toward the first mounting part 31, thereby facilitating the first mounting part 31 to maintain a close fit with the heat sink 20.

[0062] The elastic element 33 is sleeved on the connecting shaft 32 and located on the outer periphery of the connecting shaft 32; the connecting shaft 32 has a first shaft body 321 and a second shaft body 322, which are arranged sequentially along the length of the connecting shaft 32, and the first shaft body 321 is connected to the second shaft body 322; the first shaft body 321 serves as a smooth shaft and passes through a movable hole 21a; the portion of the first shaft body 321 extending beyond the movable hole 21a is sleeved by the elastic element 33, which is located on the outer periphery of the portion of the first shaft body 321 extending beyond the movable hole 21a; the second shaft body 322 serves as a threaded shaft, and the second shaft... The body 322 is located in the second mounting part 21 on the side facing the first mounting part 31 and is screwed to the first mounting part 31. At this time, the connecting shaft 32 is stationary relative to the first mounting part 31 through the second shaft body 322. The second mounting part 21 is in a movable state relative to the connecting shaft 32 by cooperating with the first shaft body 321 through the moving hole 21a, so that the second mounting part 21 can be finely adjusted relative to the first mounting part 31. The elastic element 33 overcomes the assembly tolerance and dimensional tolerance, maintains the fit between the first mounting part 31 and the heat sink 20, and ensures the installation stability of the laser module 30 relative to the heat sink 20.

[0063] Please refer to the attached document. Figures 1-3 In this embodiment, the multi-channel heat dissipation device 100 further includes a circuit board 50, which is housed in a receiving cavity 10a and protected by the circumferential side of the housing 10, so that the circuit board 50 can make full use of the space of the receiving cavity 10a and prevent external components from directly impacting the circuit board 50; the circuit board 50 and the laser module 30 are located in the same second receiving space 10c; there is a heat dissipation gap between the circuit board 50 and the laser module 30; so as to achieve heat dissipation of both the circuit board 50 and the laser module 30 at the same time, avoiding heat dissipation of the circuit board 50 and the laser module 30 separately, and improving the heat dissipation effect of the multi-channel heat dissipation device 100.

[0064] The circuit board 50 carries multiple electronic components 51, which are located on the side of the circuit board 50 facing the heat dissipation gap and spaced apart from the laser module 30. The side of the circuit board 50 facing the laser module 30 is the front side, and the side facing away from the laser module 30 is the back side. The number of electronic components 51 connected to the front side is greater than the number connected to the back side. Since the laser module 30 generates a lot of heat, concentrating the electronic components 51 on the side closest to the heat dissipation gap helps to directly guide heat to the heat dissipation channel, reducing thermal resistance. Fewer components on the back side reduce thermal interference to the laser module 30 and prevent heat backflow or accumulation.

[0065] The circuit board 50 is positioned directly opposite an inner wall of the receiving cavity 10a; a gap exists between the surface of the circuit board 50 and the inner wall of the receiving cavity 10a; the circuit board 50 is suspended within the receiving cavity 10a to allow the gap to form a continuous flow channel, whereby the second gas carries away the heat from the circuit board 50. If the circuit board 50 were completely attached to the inner wall of the receiving cavity 10a, the heat output from the circuit board 50 would be trapped by the inner wall; the suspension allows for convection from both sides, improving the heat dissipation efficiency of the circuit board 50.

[0066] Please refer to the attached document. Figures 1-3 In this embodiment, the multi-channel heat dissipation device 100 includes a second cooling fan 60, which is installed on the top of the housing 10. The exhaust end of the second cooling fan 60 faces the second heat dissipation channel 30a. The exhaust end of the second cooling fan 60 outputs a second gas towards the second heat dissipation channel 30a. The second gas passes through the second heat dissipation channel 30a and the heat dissipation gap, so that the second gas simultaneously carries away the heat generated by the laser module 30 and the heat generated by the circuit board 50, so as to accelerate the heat dissipation effect of the laser module 30 and the circuit board 50 through the second cooling fan 60.

[0067] In the second embodiment of the application, a laser engraving machine includes a multi-channel heat dissipation device 100 and a laser engraving machine body. The laser engraving machine body supports the multi-channel heat dissipation device 100 so that the multi-channel heat dissipation device 100 is fixed to the laser engraving machine body, thereby ensuring the stability of the laser output by the multi-channel heat dissipation device 100.

[0068] Compared with the prior art, the beneficial effects of this utility model are:

[0069] This utility model provides a multi-channel heat dissipation device 100 and a laser engraving machine. The housing 10 is provided with a receiving cavity 10a, which has a first receiving space 10b and a second receiving space 10c. The first receiving space 10b and the second receiving space 10c are connected. A heat sink 20 is installed on the housing 10 and is located in the first receiving space 10b. The heat sink 20 is provided with a first heat dissipation channel 20a. A laser module 30 is used to output laser light to the workpiece to be engraved. One end of the laser module 30 is connected to the heat sink 20 and is attached to the first side wall of the heat sink 20. The laser module 30 is located in the second receiving space 10c. A second heat dissipation channel 30a is formed between the laser module 30 and the inner side wall of the second receiving space 10c. The second heat dissipation channel 30a is arranged on one side of the first heat dissipation channel 20a and is compatible with the same receiving cavity 10a to realize a multi-channel arrangement, thereby facilitating multi-path heat dissipation of the laser module 30, avoiding only a single heat dissipation channel, and improving the heat dissipation effect of the multi-channel heat dissipation device 100.

[0070] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0071] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0072] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A multi-channel heat dissipation device, characterized in that, The multi-channel heat dissipation device, used in laser engraving machines, includes: The housing has a receiving cavity, which has a first receiving space and a second receiving space; the first receiving space and the second receiving space are connected. A heat sink is installed on the housing and located in the first receiving space; the heat sink is provided with a first heat dissipation air duct; A laser module is used to output laser light to the workpiece to be engraved; one end of the laser module is connected to the heat sink and is attached to the first side wall of the heat sink; the laser module is located in the second receiving space; a second heat dissipation channel is formed between the laser module and the inner side wall of the second receiving space; the second heat dissipation channel is disposed on one side of the first heat dissipation channel and is compatible with the same receiving cavity.

2. The multi-channel heat dissipation device according to claim 1, characterized in that, Both the first and second heat dissipation ducts extend along the length of the housing. The second heat dissipation duct is arranged at an interval from the first heat dissipation duct. The second heat dissipation duct is used to allow the second gas to pass through. The second gas passes through the laser module and carries away part of the heat output by the laser module. The laser module is in contact with the heat sink, and the heat sink exchanges heat with the laser module and provides contact-type heat dissipation for the laser module. The first heat dissipation duct is used to allow the first gas to pass through, which passes through the heat sink and cools the heat sink, so that the laser module can dissipate heat through multiple paths in the cavity.

3. The multi-channel heat dissipation device according to claim 1, characterized in that, The multi-channel heat dissipation device includes a first cooling fan, and the first cooling fan and the laser module are located in different directions of the heat sink; the exhaust end of the first cooling fan faces the first heat dissipation channel and outputs a first gas into the first heat dissipation channel.

4. The multi-channel heat dissipation device according to claim 3, characterized in that, The first cooling fan is installed on the other side wall of the heat sink, and the heat sink supports the first cooling fan and the laser module; the first cooling fan is located on the upper side of the heat sink, and the laser module is located on the periphery of the heat sink; Alternatively, the first cooling fan is mounted on the housing, and the heat sink supports the first cooling fan and the laser module; the first cooling fan is located on the upper side of the heat sink, and the laser module is located on the periphery of the heat sink.

5. The multi-channel heat dissipation device according to claim 4, characterized in that, When the first cooling fan is installed on the other side wall of the heat sink, the side wall of the first cooling fan relative to the heat sink is in contact with the other side wall of the heat sink; The laser module is provided with a first mounting part, which is mounted on one side wall of the heat sink. The side wall of the heat sink is provided with a receiving groove, and the first mounting part is inserted into the receiving groove. The upper side wall of the first mounting part is located on the lower side of the first cooling fan relative to the side wall of the heat sink.

6. The multi-channel heat dissipation device according to claim 5, characterized in that, The first mounting part is detachably connected to the heat sink and can elastically fit against the heat sink; the first mounting part is tightly attached to one side wall of the heat sink under elastic force. The first mounting part and the heat sink are provided with multiple connection positions, which are arranged in a square array or a ring array; the heat sink is provided with a corresponding clearance groove, which is used to avoid the multiple connection positions.

7. The multi-channel heat dissipation device according to claim 6, characterized in that, The heat sink is provided with a second mounting part, which is arranged opposite to the first mounting part; the first mounting part is disposed on one side of the second mounting part and is elastically mounted on the second mounting part, so that the opposite side walls of the first mounting part and the second mounting part are in a flat and fitted state. The laser module further includes a connecting shaft and an elastic element; the connecting shaft is movably passed through the second mounting portion and connected to the first mounting portion; the elastic element is sleeved on the connecting shaft and elastically acts on the end of the connecting shaft and the second mounting portion to apply an elastic force to the first mounting portion, so that the first mounting portion is tightly attached to the second mounting portion under the elastic force; The second mounting part is provided with a movable hole, and the connecting shaft passes through the movable hole; the end of the connecting shaft is located on the side of the second mounting part away from the first mounting part and contacts one end of the elastic member, and the other end of the elastic member elastically contacts the side wall of the second mounting part away from the first mounting part.

8. The multi-channel heat dissipation device according to claim 1, characterized in that, The multi-channel heat dissipation device also includes a circuit board, which is housed in the receiving cavity and protected by the circumferential side of the housing; the circuit board and the laser module are located in the same second receiving space; a heat dissipation gap exists between the circuit board and the laser module; The circuit board carries multiple electronic components, which are located on the side of the circuit board facing the heat dissipation gap and are spaced apart from the laser module. The side of the circuit board facing the laser module is the front side, and the side of the circuit board facing away from the laser module is the back side. The circuit board is directly opposite an inner wall of the receiving cavity; there is a gap between the surface of the circuit board and an inner wall of the receiving cavity; the circuit board is suspended in the receiving cavity.

9. The multi-channel heat dissipation device according to claim 8, characterized in that, The multi-channel heat dissipation device includes a second cooling fan, which is installed on the top of the housing, and the exhaust end of the second cooling fan faces the second heat dissipation channel. The exhaust end of the second cooling fan outputs a second gas toward the second cooling duct. The second gas passes through the second cooling duct and the cooling gap, so that the second gas carries away the heat generated by the laser module and the heat generated by the circuit board at the same time.

10. A laser engraving machine, characterized in that, It includes a multi-channel heat dissipation device as described in any one of claims 1 to 9 and a laser engraving machine body, wherein the laser engraving machine body supports the multi-channel heat dissipation device.

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