A screw type quantitative delivery device for a curing agent

CN224529563UActive Publication Date: 2026-07-21NANJING EDDIE LUBO NEW MATERIAL TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
NANJING EDDIE LUBO NEW MATERIAL TECHNOLOGY CO LTD
Filing Date
2025-09-22
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

The existing screw feeder for curing agents lacks heating and dehumidification structures, which makes the curing agent prone to absorbing moisture and clumping due to the influence of ambient humidity during the feeding stage, increasing its viscosity and causing blockage at the feed inlet.

Method used

A spiral quantitative conveying device including a heating mechanism and a dehumidification mechanism was designed. The bottom of the feeding hopper is heated by a semiconductor heating plate. The temperature and humidity are monitored and adjusted in real time by a humidity sensor and a PLC controller. Humid air is discharged by a dehumidifying fan. The feeding rate is adjusted by a baffle plate to ensure material flowability and conveying stability.

Benefits of technology

It effectively prevents the curing agent from clumping due to low temperature, reduces inlet blockage, ensures material flowability and continuous conveying, avoids premature reaction or failure caused by high temperature, and realizes quantitative delivery of the curing agent.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a solidifying agent spiral formula quantitative conveying device belongs to solidifying agent conveying technical field, and its technical scheme main points include spiral feeder body, the top fixed connection of spiral feeder body has the feeding hopper, the rear side welding of feeding hopper has heating mechanism, the top welding of heating mechanism has the dehumidification mechanism, and heating mechanism even heats the bottom of feeding hopper through semiconductor heating plate, can effectively reduce the problem of solidifying agent viscosity rise caused by low temperature, makes material more easily slide along the slope, reduces the retention accumulation in the feeding hopper, and temperature sensor real -time monitoring installation shell inside temperature is adjusted semiconductor heating plate working condition through PLC controller linkage, can control heating temperature stable in solidifying agent physicochemical performance is not affected safe interval, avoids low temperature caking, prevents high temperature and leads to solidifying agent early reaction or invalidation, and moderate heating can accelerate the evaporation of trace moisture adsorbed on the surface of material in the feeding hopper.
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