Low-cost barometer with anti-corrosion function

Abstract

The utility model discloses a low -cost with anticorrosive function's barograph relates to barometer technical field, including MEMS silicon base differential pressure type chip, ASIC circuit conditioning chip and lower casing, the lower casing upper end is equipped with the mounting recess, MEMS silicon base differential pressure type chip and ASIC circuit conditioning chip all install in the mounting recess, the lower casing upper end is equipped with the sealing cover, the wiring hole is equipped with the wiring layer, the wiring layer one end with the gold bond line between, gold bond line and MEMS silicon base differential pressure type chip between all are through gold bond line electric connection, the mounting recess bottom and MEMS silicon base differential pressure type chip position corresponding place are equipped with the air hole. The utility model discloses through adopting novel packaging form, in the environment of severe environment, the life is higher, the anticorrosive grade is higher, the service life is longer, and the manufacturing cost is lower, and the corresponding rate is faster.

Description

Technical Field

[0001] This utility model relates to the field of barometer technology, specifically a low-cost barometer with corrosion resistance. Background Technology

[0002] MEMS pressure sensors work by detecting changes in external atmospheric pressure and converting them into measurable electrical signals. At their core is a micro-machined pressure-sensitive element, typically a suspended thin film made of silicon. When external pressure is applied to this diaphragm, it undergoes extremely small deformation. This deformation changes the resistance of a piezoresistive resistor integrated on the diaphragm, which is then converted into a voltage signal output through circuit structures such as a Wheatstone bridge, thus enabling precise pressure measurement. Currently, thanks to mass production technologies compatible with integrated circuit processes, MEMS pressure sensors can be manufactured on a large scale and are cost-effective, leading to their widespread application in consumer electronics (such as altimeters in smartphones and smartwatches), process control in industrial automation, medical and health monitoring equipment, and asset tracking and positioning in logistics.

[0003] However, this high-sensitivity structure of MEMS pressure sensors also brings inherent fragility, especially when exposed to harsh chemical environments, which drastically shortens their lifespan. The root of the problem lies in the fact that the core chip of the sensor is directly exposed to the measured medium. Once the precision piezoresistive elements and metal interconnects integrated on it come into contact with liquids or gases containing corrosive components, a rapid chemical corrosion reaction occurs, leading to electrode oxidation and corrosion, short circuits, or material degradation, ultimately causing sensor failure. To address this challenge, the industry commonly employs oil-filled isolation encapsulation technology for protection in applications requiring exposure to harsh media. This technology constructs a completely sealed cavity using a robust stainless steel diaphragm and sensor housing, filling the cavity with incompressible silicone oil. The silicone oil transmits external pressure seamlessly to the internal MEMS chip, effectively isolating the chip from direct contact with corrosive media. However, this protection scheme also brings significant drawbacks.

[0004] Based on this, a low-cost barometer with corrosion resistance is provided, which can eliminate the drawbacks of existing devices. Utility Model Content

[0005] The purpose of this invention is to provide a low-cost barometer with corrosion resistance to solve the problems in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A low-cost, corrosion-resistant barometer includes a MEMS silicon-based differential pressure chip, an ASIC circuit conditioning chip, and a lower housing. The upper end of the lower housing is provided with a mounting groove, in which the MEMS silicon-based differential pressure chip and the ASIC circuit conditioning chip are both installed. A sealing cover is installed on the upper end of the lower housing, and a wiring hole is provided at the bottom end of the mounting groove, in which a wiring layer is installed.

[0008] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0009] In one alternative: one end of the wiring layer extends to the outside of the lower housing, and the wiring layer is electrically connected to Kingston wires, and Kingston wires are also electrically connected to MEMS silicon-based differential voltage chips via Kingston wires.

[0010] In one alternative: a vent hole is provided at the bottom of the mounting groove corresponding to the position of the MEMS silicon-based differential pressure chip.

[0011] In one alternative: a connecting ring is fixedly provided at the bottom of the MEMS silicon-based differential pressure chip, and the connecting ring is coaxially arranged with the vent hole.

[0012] In one alternative: the connecting ring and the ASIC circuit conditioning chip are both fixedly connected to the lower housing with anti-corrosion adhesive, and the sealing cover is fixedly connected to the lower housing with anti-corrosion adhesive.

[0013] In one alternative: the back cavity of the MEMS silicon-based differential pressure chip is a corrosion-resistant pure silicon structure, and the pure silicon structure is bonded and sealed to the MEMS silicon-based differential pressure chip by an anti-corrosion adhesive.

[0014] In one alternative: the sealing cap has a vent hole at its upper end.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This invention employs a novel packaging method, resulting in a longer lifespan even in harsh environments. Furthermore, compared to oil-filled corrosion-resistant pressure sensors, it features a simpler manufacturing process, lower cost, and expands the user's application scenarios. Compared to similar pressure sensors on the market, it offers higher corrosion resistance, longer service life, lower manufacturing costs, and faster response times. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model.

[0018] Figure label annotations: 11 MEMS silicon-based differential voltage chip, 12 ASIC circuit conditioning chip, 13 Kingston wire, 14 lower housing, 15 wiring layer, 16 vent hole, 17 sealing cap, 18 anti-corrosion adhesive. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0020] In one embodiment, such as Figure 1 As shown, a low-cost barometer with corrosion resistance includes a MEMS silicon-based differential pressure chip 11, an ASIC circuit conditioning chip 12, and a lower housing 14. The upper end of the lower housing 14 is provided with a mounting groove, and the MEMS silicon-based differential pressure chip 11 and the ASIC circuit conditioning chip 12 are both installed in the mounting groove. A sealing cover 17 is installed on the upper end of the lower housing 14. A wiring hole is provided at the bottom end of the mounting groove, and a wiring layer 15 is installed in the wiring hole.

[0021] One end of the wiring layer 15 extends to the outside of the lower housing 14. The wiring layer 15 is electrically connected to the Kingpin wire 13 and the MEMS silicon-based differential voltage chip 11 through the Kingpin wire 13. In use, the MEMS silicon-based differential voltage chip 11 is electrically connected to the ASIC circuit conditioning chip 12, and the ASIC circuit conditioning chip 12 is electrically connected to the external control components through the Kingpin wire 13 and the wiring layer 15.

[0022] A vent 16 is provided at the bottom of the mounting groove corresponding to the position of the MEMS silicon-based differential pressure chip 11, so that external gas can act on the MEMS silicon-based differential pressure chip 11 during use.

[0023] The MEMS silicon-based differential pressure chip 11 is fixedly provided with a connecting ring at the bottom end. The connecting ring is coaxially arranged with the vent hole 16, which facilitates the sealing of the installation groove during use.

[0024] Both the connecting ring and the ASIC circuit conditioning chip 12 are fixedly connected to the lower housing 14 via anti-corrosion adhesive 18. The sealing cover 17 is also fixedly connected to the lower housing 14 via anti-corrosion adhesive 18. In use, the connecting ring is fixedly connected to the bottom of the mounting groove via anti-corrosion adhesive 18, thus sealing the end of the vent hole 16. During operation, external pressure signals act on the back cavity of the MEMS silicon-based differential pressure chip 11, causing the flexible silicon film of the MEMS silicon-based differential pressure chip 11 to deform, resulting in a change in the resistance of the piezoresistive element on the film, thereby realizing the acquisition of the applied pressure value. The ASIC circuit conditioning chip 12 converts the pressure signal into an analog quantity (such as voltage or current) or a digital quantity and outputs it to an external device. In addition, the ASIC circuit conditioning chip 12 is also responsible for calibration and compensation functions. Depending on the application scenario, the sealing cover 17 and the lower housing 14 can be bonded in a vacuum environment. In this case, the other side of the MEMS silicon-based differential pressure chip 11 is in the vacuum chamber (i.e., in an unpressurized state), and only the back cavity end of the MEMS silicon-based differential pressure chip 11 is pressurized, thereby realizing the acquisition of absolute pressure.

[0025] The back cavity of the MEMS silicon-based differential pressure chip 11 is a corrosion-resistant pure silicon structure. The pure silicon structure is bonded and sealed to the MEMS silicon-based differential pressure chip 11 with anti-corrosion adhesive 18. In use, the varistor sensing element, metal wire pads and circuit of the MEMS silicon-based differential pressure chip 11, which are easily corroded, are isolated in the mounting groove, thereby achieving corrosion protection against external corrosive media.

[0026] The sealing cover 17 has a vent hole 16 at the upper end. When in use, the vent hole 16 at the upper end of the sealing cover 17 is connected to the atmosphere, which facilitates the collection of gauge pressure or differential pressure.

[0027] The above embodiment discloses a low-cost barometer with corrosion resistance. The MEMS silicon-based differential pressure chip 11, the ASIC circuit conditioning chip 12, and the wiring layer 15 are electrically connected by Kingston wires 13. The MEMS silicon-based differential pressure chip 11 is installed at the end of the vent hole 16. Then, the connecting ring is fixedly connected to the bottom of the mounting groove through anti-corrosion adhesive 18, so that the connecting ring seals the end of the vent hole 16. The ASIC circuit conditioning chip 12 is fixedly connected to the mounting groove through anti-corrosion adhesive 18.

[0028] During operation, an external pressure signal acts on the back cavity of the MEMS silicon-based differential pressure chip 11, causing the flexible silicon thin film of the MEMS silicon-based differential pressure chip 11 to deform. This results in a change in the resistance of the piezoresistive element on the thin film, thereby acquiring the applied pressure value. The ASIC circuit conditioning chip 12 converts the pressure signal into an analog or digital signal and outputs it to an external device. In addition, the ASIC circuit conditioning chip 12 is also responsible for calibration and compensation functions. At the same time, a vent hole 16 is provided at the upper end of the sealing cover 17 to communicate with the atmosphere, facilitating the acquisition of gauge pressure or differential pressure.

[0029] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A low-cost barometer with corrosion resistance, comprising a MEMS silicon-based differential pressure chip (11), an ASIC circuit conditioning chip (12), and a lower housing (14), wherein the upper end of the lower housing (14) is provided with a mounting groove, characterized in that, The MEMS silicon-based differential pressure chip (11) and the ASIC circuit conditioning chip (12) are both installed in the mounting groove. A sealing cover (17) is installed on the upper end of the lower housing (14). A wiring hole is provided at the bottom of the mounting groove, and a wiring layer (15) is installed in the wiring hole.

2. The barometer with a corrosion prevention function according to claim 1, wherein One end of the wiring layer (15) extends to the outside of the lower housing (14). The wiring layer (15) is electrically connected to the Kingpin wire (13) and the Kingpin wire (13) is electrically connected to the MEMS silicon-based differential voltage chip (11) through the Kingpin wire (13).

3. The low-cost barometer with a corrosion-preventing function according to claim 2, characterized in that, A vent hole (16) is provided at the bottom of the mounting groove corresponding to the position of the MEMS silicon-based differential pressure chip (11).

4. The barometer with a corrosion preventing function according to claim 3, wherein The bottom of the MEMS silicon-based differential pressure chip (11) is fixed with a connecting ring, which is coaxially arranged with the vent (16).

5. The low-cost barometer with a corrosion-preventing function according to claim 4, characterized in that, The connecting ring and the ASIC circuit conditioning chip (12) are both fixedly connected to the lower housing (14) by anti-corrosion glue (18), and the sealing cover (17) is fixedly connected to the lower housing (14) by anti-corrosion glue (18).

6. The low-cost barometer with a corrosion-preventing function according to claim 5, characterized by, The back cavity of the MEMS silicon-based differential pressure chip (11) is a corrosion-resistant pure silicon structure, and the pure silicon structure is bonded and sealed to the MEMS silicon-based differential pressure chip (11) by anti-corrosion adhesive (18).

7. The low-cost barometer with a corrosion-preventing function according to claim 6, characterized by, The sealing cap (17) has a vent hole (16) at its upper end.

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