A degradable plastic sheet layer and wood layer multi-layer composite double-interface smart card
By using a composite structure of multiple layers of wood and biodegradable plastic sheets, the environmental protection and texture issues of existing smart cards are solved, achieving both environmentally friendly treatment and improved texture.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ASIA SMART CARD TECHNOLOGY (HUIZHOU) CO LTD
- Filing Date
- 2025-09-12
- Publication Date
- 2026-07-21
AI Technical Summary
Existing dual-interface smart cards are not environmentally friendly during the production and processing process, and the plastic material lacks texture, affecting the user experience.
The card base is made of a composite structure consisting of multiple layers of wood and biodegradable plastic sheets. The INLAY layer is then laminated on the top and bottom surfaces to enhance both its environmental friendliness and texture.
It achieves environmentally friendly processing and improved texture of smart cards, meets bending resistance standards, and enhances the user experience.
Smart Images
Figure CN224536536U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of smart card technology, and in particular to a multi-layer composite dual-interface smart card consisting of a biodegradable plastic sheet layer and a wood layer. Background Technology
[0002] Smart cards are media used to identify individuals and store their information, characterized by large storage capacity and high security. Various smart cards are widely used in daily life, including but not limited to various work permits, ID cards, financial transaction cards, membership cards, transportation cards, and access control cards. Existing dual-interface smart cards typically consist of a plastic layer and a rigid material layer. An antenna is embedded within the plastic layer, and mounting holes are provided within the rigid material layer. An IC chip is encapsulated on the plastic plate with the embedded antenna. This step ensures that the IC chip is correctly mounted on the plastic layer, and that the antenna's position and function are guaranteed.1 The plastic plate is milled to form an appropriate shape and structure, ensuring accurate mounting of the IC chip and other components. A rigid material plate is bonded to one side of the plastic plate, so that the IC chip is located within the mounting holes of the rigid material layer, and the IC chip's electrical contacts are exposed on the surface of the smart card. This step ensures the stability of the card body and the correct position of the IC chip. Existing dual-interface smart cards use upper and lower plastic layers laminated together with an inner layer in the middle. The use of pure plastic layers to make the smart card base is not environmentally friendly during the production and processing process, and plastic smart cards lack a sense of quality. Further optimization and improvement of existing smart cards are needed. Utility Model Content
[0003] In view of this, this utility model proposes a multi-layer composite dual-interface smart card consisting of a biodegradable plastic sheet layer and a wood layer. The dual-interface smart card, made by using multiple wood layers and multiple biodegradable plastic sheet layers, achieves environmental protection through the use of biodegradable materials, while also providing the card with a wood grain texture, thus enhancing the user experience.
[0004] The technical solution disclosed in this utility model is a multi-layer composite dual-interface smart card consisting of a biodegradable plastic sheet layer and a wood layer, comprising an INLAY layer, a top substrate layer and a bottom substrate layer respectively laminated on and below the INLAY layer. The INLAY layer includes at least one composite unit, which is composed of a wood layer sandwiching a biodegradable plastic sheet layer. At least one biodegradable plastic sheet layer of the INLAY layer is provided with an RF coil and a dual-interface smart card chip. A first through-hole position for embedding the dual-interface smart card chip is provided on the wood layer or the wood layer and the biodegradable plastic sheet layer corresponding to the dual-interface smart card chip. The top substrate layer and the bottom substrate layer are respectively a top wood layer and a bottom wood layer, and the top wood layer is provided with a second through-hole position exposing the contact surface of the dual-interface smart card chip.
[0005] Furthermore, the INLAY layer includes a first composite unit, which includes a first biodegradable plastic sheet layer, a first wood layer and a second wood layer respectively laminated on the first biodegradable plastic sheet layer, wherein the radio frequency coil is disposed on the first biodegradable plastic sheet layer by an ultrasonic embedding device, and the first wood layer is provided with a first through hole.
[0006] Preferably, the INLAY layer further includes a second composite unit, which is laminated on the top or bottom surface of the first composite unit. The second composite unit includes a second biodegradable plastic sheet layer, a third wood layer, and a fourth wood layer, which are respectively laminated on the top and bottom surfaces of the second biodegradable plastic sheet layer.
[0007] Furthermore, the first composite unit and the second composite unit are laminated multilayer composite units as a whole. When the second composite unit is laminated below the first composite unit, the second composite unit omits the third wood layer and sequentially laminates a second biodegradable plastic sheet layer and a fourth wood layer on the bottom surface of the first composite unit. When the second composite unit is laminated above the first composite unit, the second composite unit omits the fourth wood layer and sequentially laminates a second biodegradable plastic sheet layer and a third wood layer on the top surface of the first composite unit.
[0008] Furthermore, a third biodegradable plastic sheet layer and a fourth biodegradable plastic sheet layer are laminated on the surfaces of the top wood layer and the bottom wood layer, respectively, and a third through hole is provided on the third biodegradable plastic sheet layer at the position corresponding to the second through hole position.
[0009] Furthermore, the thickness of the first biodegradable plastic sheet layer, the second biodegradable plastic sheet layer, the third biodegradable plastic sheet layer, and the fourth biodegradable plastic sheet layer is 0.05mm to 0.06mm, the thickness of the first wood layer, the second wood layer, the third wood layer, and the fourth wood layer is 0.17mm to 0.35mm, and the thickness of the top wood layer and the bottom wood layer is 0.3mm to 0.35mm.
[0010] Furthermore, the first biodegradable plastic sheet layer, the second biodegradable plastic sheet layer, the third biodegradable plastic sheet layer, and the fourth biodegradable plastic sheet layer are any one of biodegradable PVC sheet, biodegradable PET sheet, biodegradable ABS sheet, and biodegradable PC sheet.
[0011] The beneficial effects of the dual-interface smart card designed in this scheme are as follows: The smart card's inlay layer is made of multiple layers of wood sandwiched with biodegradable plastic sheets. Furthermore, a top and bottom wood layer are laminated onto the top and bottom surfaces of the inlay layer, respectively. This results in a smart card base structure made of a composite of wood and biodegradable plastic sheets, which facilitates more environmentally friendly disposal after the smart card is discarded or recycled. The alternating lamination of multiple layers of wood and biodegradable plastic sheets ensures that the card meets bending resistance standards. Additionally, the laminated top and bottom wood layers sandwiched with the inlay layer give the overall card base a wood grain texture, enhancing the user experience. Attached Figure Description
[0012] Figure 1 This is an exploded view of the first composite unit structure of the INLAY layer of this utility model.
[0013] Figure 2 This is an exploded view of the second composite unit structure of the INLAY layer of this utility model.
[0014] Figure 3 This is an exploded view of the structure of the first composite unit and the second composite unit laminated structure of the INLAY layer of this utility model.
[0015] Figure 4 This is an exploded view of the structure of the first composite unit and the second composite unit laminated structure of the INLAY layer of this utility model, according to Embodiment 2.
[0016] Figure 5 This is an exploded view of the dual-interface smart card structure of this utility model.
[0017] Figure 6 This is a cross-sectional view of the structure of a first embodiment of the dual-interface smart card of this utility model.
[0018] Figure 7 This is a cross-sectional view of the structure of Embodiment 2 of the dual-interface smart card of this utility model.
[0019] Figure 8 This is a cross-sectional view of the structure of Embodiment 3 of the dual-interface smart card of this utility model. Detailed Implementation
[0020] The technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are also within the scope of protection of this disclosure.
[0021] Please refer to Figures 1 to 8 This technical solution provides a multi-layer composite dual-interface smart card consisting of a biodegradable plastic sheet layer and a wood layer, comprising an INLAY layer, a top substrate layer, and a bottom substrate layer laminated on and below the INLAY layer. The INLAY layer includes at least one composite unit, which is composed of a wood layer sandwiching a biodegradable plastic sheet layer. At least one biodegradable plastic sheet layer of the INLAY layer is provided with an RF coil and a dual-interface smart card chip 200. A first through-hole position for embedding the dual-interface smart card chip 200 is provided on the wood layer or the wood layer and biodegradable plastic sheet layer corresponding to the dual-interface smart card chip 200. The top substrate layer and bottom substrate layer are respectively a top wood layer 70 and a bottom wood layer 80. The top wood layer 70 is provided with a second through-hole position exposing the contact surface of the dual-interface smart card chip 200. This solution uses an INLAY layer made by sandwiching a biodegradable plastic sheet layer between wood layers, and a dual-interface smart card made by sandwiching an INLAY layer between wood layers. The overall card base is mainly achieved by laminating wood layers and biodegradable plastic sheet layers alternately, which not only meets the bending resistance standard, but also facilitates more environmentally friendly disposal of the smart card after it is discarded or replaced. At the same time, the wood grain of the wood layer can enhance the texture of the smart card and improve the user experience.
[0022] Please refer to Figure 1 , Figure 5 , Figure 6 As one embodiment of the dual-interface intelligence of this solution, the INLAY layer includes a first composite unit a, which includes a first biodegradable plastic sheet layer 10, a first wood layer 20 and a second wood layer 30 respectively laminated on the top and bottom surfaces of the first biodegradable plastic sheet layer 10. An ultrasonic embedding device is used to embed the radio frequency coil on the first biodegradable plastic sheet layer 10. The first wood layer 20 has a first through-hole. The first composite unit a serves as the INLAY layer, laminated with the top wood layer 70 and the bottom wood layer 80, and a third biodegradable plastic sheet layer 90 and a fourth biodegradable plastic sheet layer 100 are laminated on the surfaces of the top wood layer 70 and the bottom wood layer 80, respectively.
[0023] Please refer to Figure 2The INLAY layer further includes a second composite unit b, which is laminated onto the top or bottom surface of the first composite unit a. The second composite unit b includes a second biodegradable plastic sheet layer 40, a third wood layer 50, and a fourth wood layer 60, respectively laminated above and below the second biodegradable plastic sheet layer 40. Since the first composite unit a and the second composite unit b are two independent units, when they need to be laminated together, the thickness of the corresponding third wood layer 50 and fourth wood layer 60 should be thinner. Simultaneously, before laminating the third biodegradable plastic sheet layer 90 and the fourth biodegradable plastic sheet layer 100, the surfaces of the top wood layer 70 and the bottom wood layer 80 are thinned to meet the thickness requirements of the smart card.
[0024] Please refer to Figures 1-3 , Figure 5 , Figure 7 As a second embodiment of the dual-interface intelligence of this solution, the first composite unit a and the second composite unit b are INLAY layers formed by laminating multiple composite units. When the second composite unit b is laminated below the first composite unit a, the third wood layer 50 is omitted from the second composite unit b. A second biodegradable plastic sheet layer 40 and a fourth wood layer 60 are sequentially laminated on the bottom surface of the first composite unit a. A top wood layer 70 and a bottom wood layer 80 are laminated on the upper surface of the first wood layer 20 and the lower surface of the fourth wood layer 60, respectively. A third biodegradable plastic sheet layer 90 and a fourth biodegradable plastic sheet layer 100 are laminated on the surfaces of the top wood layer 70 and the bottom wood layer 80, respectively. The third biodegradable plastic sheet layer 90 has a third through hole corresponding to the position of the second through hole.
[0025] Please refer to Figures 1-2 , Figures 4-5 , Figure 8 As a third embodiment of the dual-interface intelligence of this solution, the first composite unit a and the second composite unit b are INLAY layers formed by laminating multiple composite units. When the second composite unit b is laminated on the first composite unit a, the fourth wood layer 60 is omitted from the second composite unit b. A second biodegradable plastic sheet layer 40 and a third wood layer 50 are sequentially laminated on the top surface of the first composite unit a. A top wood layer 70 and a bottom wood layer 80 are laminated on the upper surface of the third wood layer 50 and the lower surface of the second wood layer 30, respectively. A third biodegradable plastic sheet layer 90 and a fourth biodegradable plastic sheet layer 100 are laminated on the surfaces of the top wood layer 70 and the bottom wood layer 80, respectively. The third biodegradable plastic sheet layer 90 has a third through hole corresponding to the position of the second through hole.
[0026] Preferably, the thicknesses of the first biodegradable plastic sheet layer 10, the second biodegradable plastic sheet layer 40, the third biodegradable plastic sheet layer 90, and the fourth biodegradable plastic sheet layer 100 are all 0.05mm to 0.06mm; the thicknesses of the first wood layer 20, the second wood layer 30, the third wood layer 50, and the fourth wood layer 60 are all 0.17mm to 0.35mm; and the thicknesses of the top wood layer 70 and the bottom wood layer 80 are both 0.3mm to 0.35mm. The first biodegradable plastic sheet layer 10, the second biodegradable plastic sheet layer 40, the third biodegradable plastic sheet layer 90, and the fourth biodegradable plastic sheet layer 100 are any one of biodegradable PVC sheets, biodegradable PET sheets, biodegradable ABS sheets, and biodegradable PC sheets. In actual production, controlling the overall thickness of the dual-interface smart card requires sanding the top wood layer 70 and the bottom wood layer 80 to achieve a suitable overall thickness.
[0027] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.
Claims
1. A multi-layer composite dual-interface smart card consisting of a biodegradable plastic sheet layer and a wood layer, comprising an inlay layer, a top substrate layer, and a bottom substrate layer respectively laminated on the upper and lower surfaces of the inlay layer, characterized in that, The INLAY layer includes at least one composite unit, which is composed of a wood layer sandwiched with a biodegradable plastic sheet layer. At least one biodegradable plastic sheet layer of the INLAY layer is provided with an RF coil and a dual-interface smart card chip (200). A first through-hole position for embedding the dual-interface smart card chip (200) is provided on the wood layer or the wood layer and biodegradable plastic sheet layer above the dual-interface smart card chip (200). The top substrate layer and the bottom substrate layer are respectively a top wood layer (70) and a bottom wood layer (80). The top wood layer (70) is provided with a second through-hole position exposing the contact surface of the dual-interface smart card chip (200).
2. The multi-layer composite dual-interface smart card with a biodegradable plastic sheet layer and a wood layer according to claim 1, characterized in that, The INLAY layer includes a first composite unit (a), which includes a first biodegradable plastic sheet layer (10), a first wood layer (20) and a second wood layer (30) respectively laminated on the first biodegradable plastic sheet layer (10). The radio frequency coil is disposed on the first biodegradable plastic sheet layer (10) by an ultrasonic embedding device. The first wood layer (20) is provided with a first through hole.
3. The multi-layer composite dual-interface smart card with a biodegradable plastic sheet layer and a wood layer according to claim 2, characterized in that, The INLAY layer further includes a second composite unit (b), which is laminated on the top or bottom surface of the first composite unit (a). The second composite unit (b) includes a second biodegradable plastic sheet layer (40), a third wood layer (50), and a fourth wood layer (60) respectively laminated on the top and bottom surfaces of the second biodegradable plastic sheet layer (40).
4. The multi-layer composite dual-interface smart card with a biodegradable plastic sheet layer and a wood layer according to claim 3, characterized in that, The first composite unit (a) and the second composite unit (b) are laminated multilayer composite units. When the second composite unit (b) is laminated below the first composite unit (a), the second composite unit (b) omits the third wood layer (50) and sequentially laminates the second biodegradable plastic sheet layer (40) and the fourth wood layer (60) on the bottom surface of the first composite unit (a). When the second composite unit (b) is laminated above the first composite unit (a), the second composite unit (b) omits the fourth wood layer (60) and sequentially laminates the second biodegradable plastic sheet layer (40) and the third wood layer (50) on the top surface of the first composite unit (a).
5. The multi-layer composite dual-interface smart card with a biodegradable plastic sheet layer and a wood layer according to claim 4, characterized in that, The surfaces of the top wood layer (70) and the bottom wood layer (80) are respectively laminated with a third biodegradable plastic sheet layer (90) and a fourth biodegradable plastic sheet layer (100), and the third biodegradable plastic sheet layer (90) is provided with a third through hole position corresponding to the position of the second through hole position.
6. The multi-layer composite dual-interface smart card with a biodegradable plastic sheet layer and a wood layer according to claim 5, characterized in that, The thickness of the first biodegradable plastic sheet layer (10), the second biodegradable plastic sheet layer (40), the third biodegradable plastic sheet layer (90), and the fourth biodegradable plastic sheet layer (100) is 0.05mm to 0.06mm. The thickness of the first wood layer (20), the second wood layer (30), the third wood layer (50), and the fourth wood layer (60) is 0.17mm to 0.35mm. The thickness of the top wood layer (70) and the bottom wood layer (80) is 0.3mm to 0.35mm.
7. The multi-layer composite dual-interface smart card with a biodegradable plastic sheet layer and a wood layer according to claim 6, characterized in that, The first biodegradable plastic sheet layer (10), the second biodegradable plastic sheet layer (40), the third biodegradable plastic sheet layer (90), and the fourth biodegradable plastic sheet layer (100) are made of any one of biodegradable PVC sheet, biodegradable PET sheet, biodegradable ABS sheet, and biodegradable PC sheet.