A kind of SIC drive high heat dissipation aluminum base circuit board of super-charged pile power module
By introducing structures such as side pillars, center pillars, heat-conducting plates, and heat dissipation grooves into the SiC driver circuit board, a heat dissipation channel is formed, which solves the problem of insufficient heat dissipation in supercharging piles, realizes efficient heat conduction and heat dissipation, and meets the needs of high-power output outdoors.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN QIANGSHUNXING ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-09-01
- Publication Date
- 2026-07-21
AI Technical Summary
Existing SiC driver circuit boards have insufficient heat dissipation performance in supercharging piles, especially in outdoor environments where heat accumulates severely and cannot meet the heat dissipation requirements of high power output.
A high-heat-dissipation aluminum-based circuit board for driving supercharging pile power modules was designed. By setting side pillars and central pillars between the insulating layer and the metal base layer to form a heat dissipation channel, and equipped with structures such as heat-conducting plates, heat-conducting rods, heat dissipation grooves and heat dissipation rods, the heat conduction and heat dissipation efficiency are enhanced.
It effectively improves the heat dissipation efficiency of the circuit board, can quickly remove heat, adapt to the high power output requirements of supercharging piles, and has a simple structure and low cost.
Smart Images
Figure CN224538411U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and in particular to a high heat dissipation aluminum-based circuit board for SiC driving of a supercharging pile power module. Background Technology
[0002] Superchargers are high-performance charging devices that utilize DC fast charging technology and typically have a charging power of 150kW or higher. Their core advantage lies in significantly shortening charging time through high power output, making them a key direction for upgrading new energy vehicle charging infrastructure. SiC drive circuit boards are adapted to the application requirements of superchargers and are widely used in the fast charging field.
[0003] The SiC driver circuit board operates under high pressure and generates significant heat, necessitating robust heat dissipation capabilities. Furthermore, charging stations are typically located outdoors, and the external heat from sunlight also affects the circuit board's temperature. All these factors place even greater demands on the circuit board's heat dissipation performance. Therefore, a high-heat-dissipation aluminum-based circuit board for SiC drivers in supercharging station power modules is proposed. Utility Model Content
[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.
[0005] Therefore, one objective of this utility model is to propose a SiC driver high heat dissipation aluminum-based circuit board for supercharging pile power modules, so as to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.
[0006] To achieve the above objectives, one embodiment of this utility model provides a SiC driver high heat dissipation aluminum-based circuit board for a supercharging pile power module, comprising a circuit layer, an insulating layer, and a metal base layer. A plurality of side posts and a plurality of center posts are disposed between the insulating layer and the metal base layer. The metal base layer and the insulating layer are connected through the side posts and center posts to form a heat dissipation channel. A plurality of heat-conducting plates are fixedly connected to the bottom surface of the insulating layer, and heat-conducting rods are fixedly connected to the bottom surface of the heat-conducting plates. A heat dissipation groove is formed on the bottom surface of the metal base layer, and a plurality of heat dissipation rods are fixedly connected within the heat dissipation groove.
[0007] Preferably, as described in any of the above schemes, both the side pillars and the central pillars adopt a rectangular structure and are made of metal.
[0008] The above technical solution employs a circuit layer, an insulating layer, and a metal substrate to form the basic structure of an aluminum-based circuit board. The circuit layer carries high current, while the insulating layer isolates the current. The insulating layer should ideally be made of a low thermal resistance, thermally conductive insulating material, such as ceramic-filled polymer. The metal substrate is typically an aluminum or copper plate, which dissipates heat to the environment through conduction and convection. Side pillars and center pillars are placed between the insulating layer and the metal substrate. These pillars provide support, creating a heat dissipation channel through which heat from the insulating layer can dissipate. The side pillars and center pillars are made of metal, which generally has a high thermal conductivity, such as copper and aluminum. This allows heat from the insulating layer to be conducted to the metal substrate or directly dissipated to the outside.
[0009] Preferably, of any of the above schemes, a plurality of the side posts and a plurality of the center posts are evenly arranged between the insulating layer and the metal base layer.
[0010] The above technical solution involves a number of side columns and central columns evenly arranged, which not only provides a balanced and stable connection between the insulation layer and the metal base layer, but also facilitates the more even conduction and dissipation of heat from the insulation layer to the metal base layer or into the heat dissipation channel.
[0011] Preferably, in any of the above embodiments, both the heat-conducting plate and the heat-conducting rod are cylindrical in shape and both are made of metal.
[0012] The above technical solution employs a heat-conducting plate and heat-conducting rod to assist the insulation layer in heat dissipation. Both are located within the heat dissipation channel, allowing airflow to directly act on the heat-conducting plate and rod, thus quickly carrying away heat and accelerating the heat dissipation efficiency of the insulation layer. Similarly, the heat-conducting plate and rod are made of metallic materials, such as copper or aluminum, resulting in better heat dissipation performance.
[0013] Preferably, in any of the above schemes, a plurality of the heat-conducting plates are evenly arranged in the heat dissipation channel.
[0014] The above technical solution involves evenly arranging heat-conducting plates within the heat dissipation channels, which facilitates the more uniform conduction and dissipation of heat from the insulation layer into the heat dissipation channels.
[0015] Preferably, in any of the above embodiments, the bottom end of the heat-conducting rod abuts against the metal base layer, and there are several heat dissipation grooves that are arranged corresponding to the heat-conducting rod.
[0016] The above technical solution involves placing the bottom end of the heat-conducting rod against the metal substrate, allowing heat from the insulation layer to be conducted to the metal substrate via the heat-conducting plate and rod, thus utilizing the metal substrate for heat dissipation. Heat dissipation grooves are created on the bottom surface of the metal substrate; when there are no obstructions, this increases the contact area between the metal substrate and the air, improving its heat dissipation efficiency. The heat dissipation grooves and heat-conducting rods are correspondingly positioned to precisely dissipate heat conducted to the metal substrate via the heat-conducting rods, resulting in even higher heat dissipation efficiency.
[0017] Preferably, in any of the above embodiments, the heat dissipation rod penetrates the metal base layer and is positioned against the heat conduction rod.
[0018] The above technical solution involves installing heat dissipation rods within the heat dissipation grooves. These rods effectively increase the contact area between the metal substrate and the air, thereby improving heat dissipation efficiency. The heat dissipation rods are positioned abutting against the heat-conducting rods, allowing heat from the heat-conducting rods to be directly transferred to the heat dissipation rods, further enhancing heat dissipation efficiency.
[0019] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows: 1. The SiC driver high-heat-dissipation aluminum-based circuit board of this supercharging pile power module utilizes a structure including side posts, central posts, heat-conducting plates, heat-conducting rods, heat dissipation grooves, and heat dissipation rods. The side posts and central posts provide support, creating heat dissipation channels between the insulation layer and the metal base layer, allowing heat from the insulation layer to dissipate through these channels. The heat-conducting plates and rods are located within these channels, allowing airflow to directly act on them, rapidly carrying away heat and accelerating the heat dissipation efficiency of the insulation layer. When there are no obstructions on the bottom surface of the metal base layer, the heat dissipation grooves increase the contact area between the metal base layer and the air, improving its heat dissipation efficiency. Heat dissipation rods within the heat dissipation grooves further increase the contact area between the metal base layer and the air, further enhancing heat dissipation efficiency. The relatively simple structure effectively improves the heat dissipation efficiency of the circuit board without significantly increasing costs, making it more suitable for the needs of supercharging piles.
[0020] 2. The supercharging pile power module features a SiC-driven, high-heat-dissipation aluminum-based circuit board with several evenly distributed side and center posts. This provides a balanced and stable connection between the insulation layer and the metal base layer, and also facilitates the more even conduction and dissipation of heat from the insulation layer to the metal base layer or within the heat dissipation channels. The heat dissipation grooves and heat-conducting rods are correspondingly positioned for precise heat dissipation of heat conducted to the metal base layer via the heat-conducting rods, resulting in higher heat dissipation efficiency. The heat dissipation rods and heat-conducting rods are positioned abutting against each other, allowing heat from the heat-conducting rods to be directly conducted to the heat dissipation rods, further improving heat dissipation efficiency.
[0021] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0022] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a first-view structural diagram of the present invention; Figure 2 This is a schematic diagram of the second-view structure of the present invention; Figure 3 This is a cross-sectional structural diagram of the present invention.
[0023] In the diagram: 1-Circuit layer, 2-Insulation layer, 3-Side pillar, 4-Metal base layer, 5-Center pillar, 6-Heat dissipation channel, 7-Heat conduction plate, 8-Heat conduction rod, 9-Heat dissipation groove, 10-Heat dissipation rod. Detailed Implementation
[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0026] like Figures 1-3 As shown, this utility model includes a circuit layer 1, an insulating layer 2, and a metal base layer 4. A plurality of side posts 3 and a plurality of central posts 5 are provided between the insulating layer 2 and the metal base layer 4. The metal base layer 4 and the insulating layer 2 are connected by the side posts 3 and the central posts 5 to form a heat dissipation channel 6. A plurality of heat-conducting plates 7 are fixedly connected to the bottom surface of the insulating layer 2. A heat-conducting rod 8 is fixedly connected to the bottom surface of the heat-conducting plates 7. A heat dissipation groove 9 is opened on the bottom surface of the metal base layer 4. A plurality of heat dissipation rods 10 are fixedly connected in the heat dissipation groove 9.
[0027] Example 1: Both the side posts 3 and the center posts 5 adopt a rectangular structure and are made of metal. The circuit layer 1, together with the insulating layer 2 and the metal base layer 4, forms the basic structure of the aluminum-based circuit board. The circuit layer 1 carries a large current, while the insulating layer 2 isolates the current. It should be made of a low thermal resistance, thermally conductive insulating material, such as ceramic-filled polymer. The metal base layer 4 is generally made of aluminum or copper, which dissipates heat to the environment through thermal conduction and convection. The side posts 3 and center posts 5 are placed between the insulating layer 2 and the metal base layer 4. The support of the side posts 3 and center posts 5 forms a heat dissipation channel 6 between the insulating layer 2 and the metal base layer 4, allowing heat from the insulating layer 2 to dissipate through the heat dissipation channel 6. The side posts 3 and center posts 5 are made of metal, which generally has a high thermal conductivity, such as copper and aluminum, enabling heat conduction from the insulating layer 2 to the metal base layer 4, or direct heat dissipation to the outside. Several side posts 3 and several center posts 5 are evenly arranged between the insulating layer 2 and the metal base layer 4. Several side posts 3 and central posts 5 are evenly arranged, which not only provides a balanced and stable connection between the insulation layer 2 and the metal base layer 4, but also facilitates the more even conduction and dissipation of heat from the insulation layer 2 to the metal base layer 4 or into the heat dissipation channel 6.
[0028] Example 2: Both the heat-conducting plate 7 and the heat-conducting rod 8 adopt a cylindrical structure and are made of metal. Both the heat-conducting plate 7 and the heat-conducting rod 8 are used to assist the insulation layer 2 in heat dissipation. Located within the heat dissipation channel 6, airflow can directly act on the heat-conducting plate 7 and the heat-conducting rod 8, thus quickly carrying away heat and accelerating the heat dissipation efficiency of the insulation layer 2. Similarly, the use of metal materials such as copper and aluminum for the heat dissipation performance is even better. Several heat-conducting plates 7 are evenly arranged within the heat dissipation channel 6. This even arrangement of the heat-conducting plates 7 within the heat dissipation channel 6 facilitates more even heat conduction and dissipation from the insulation layer 2 into the heat dissipation channel 6.
[0029] Example 3: The bottom end of the heat-conducting rod 8 rests against the metal base layer 4. Several heat dissipation grooves 9 are arranged correspondingly to the heat-conducting rod 8. The bottom end of the heat-conducting rod 8 rests against the metal base layer 4, allowing heat from the insulating layer 2 to be conducted to the metal base layer 4 via the heat-conducting plate 7 and the heat-conducting rod 8, thus utilizing the metal base layer 4 for heat dissipation. Heat dissipation grooves 9 are formed on the bottom surface of the metal base layer 4. When there are no obstructions on the bottom surface of the metal base layer 4, the contact area between the metal base layer 4 and the air can be increased, improving its heat dissipation efficiency. The heat dissipation grooves 9 are arranged correspondingly to the heat-conducting rod 8, allowing for precise heat dissipation of the heat conducted to the metal base layer 4 via the heat-conducting rod 8, resulting in higher heat dissipation efficiency. A heat dissipation rod 10 penetrates the metal base layer 4 and rests against the heat-conducting rod 8. The heat dissipation rod 10 is installed within the heat dissipation groove 9, effectively increasing the contact area between the metal base layer 4 and the air, improving heat dissipation efficiency. The heat dissipation rod 10 rests against the heat-conducting rod 8, allowing heat from the heat-conducting rod 8 to be directly conducted to the heat dissipation rod 10, further improving heat dissipation efficiency.
[0030] The working principle of this utility model is as follows: S1. With the support of the side column 3 and the middle column 5, the insulation layer 2 and the metal base layer 4 form a heat dissipation channel 6, which allows the heat on the insulation layer 2 to be dissipated from the heat dissipation channel 6. S2, heat-conducting plate 7 and heat-conducting rod 8 are located in heat dissipation channel 6, and airflow can directly act on heat-conducting plate 7 and heat-conducting rod 8, so that heat can be quickly carried away and the heat dissipation efficiency of insulation layer 2 can be accelerated. S3. When there are no obstructions on the bottom surface of the metal base layer 4, the heat dissipation groove 9 can increase the contact area between the metal base layer 4 and the air, thereby improving its heat dissipation efficiency. A heat dissipation rod 10 is installed inside the heat dissipation groove 9. The heat dissipation rod 10 can effectively increase the contact area between the metal base layer 4 and the air, further improving the heat dissipation efficiency.
[0031] Compared with the prior art, the present invention has the following advantages: 1. The SiC driver high-heat-dissipation aluminum-based circuit board of this supercharging pile power module, through the setting of side pillars 3, central pillars 5, heat-conducting plates 7, heat-conducting rods 8, heat dissipation grooves 9, and heat dissipation rods 10, etc., utilizes the support of side pillars 3 and central pillars 5 to form a heat dissipation channel 6 between the insulating layer 2 and the metal base layer 4, allowing heat on the insulating layer 2 to dissipate through the heat dissipation channel 6. The heat-conducting plates 7 and heat-conducting rods 8 are located within the heat dissipation channel 6, and the airflow can directly act on the heat-conducting plates 7 and heat-conducting rods 8, thus quickly carrying away heat and accelerating the heat dissipation efficiency of the insulating layer 2. When there are no obstructions on the bottom surface of the metal base layer 4, the heat dissipation grooves 9 can increase the contact area between the metal base layer 4 and the air, improving its heat dissipation efficiency. The heat dissipation rods 10 are set in the heat dissipation grooves 9, which can effectively increase the contact area between the metal base layer 4 and the air, further improving the heat dissipation efficiency. The structure is relatively simple, effectively improving the heat dissipation efficiency of the circuit board without significantly increasing the cost, and is more suitable for the use requirements of supercharging piles.
[0032] 2. The supercharging pile power module features a SiC-driven high-heat-dissipation aluminum-based circuit board with several side posts 3 and central posts 5 evenly arranged. This provides a balanced and stable connection between the insulation layer 2 and the metal base layer 4, and also facilitates the more even conduction and dissipation of heat from the insulation layer 2 to the metal base layer 4 or into the heat dissipation channels 6. Heat dissipation grooves 9 and heat-conducting rods 8 are correspondingly positioned to precisely dissipate heat conducted to the metal base layer 4 via the heat-conducting rods 8, resulting in higher heat dissipation efficiency. Heat dissipation rods 10 are positioned abutting against the heat-conducting rods 8, allowing heat from the heat-conducting rods 8 to be directly conducted to the heat dissipation rods 10, further improving heat dissipation efficiency.
Claims
1. A SiC driver high-heat-dissipation aluminum-based circuit board for a supercharging pile power module, comprising a circuit layer (1), an insulating layer (2), and a metal base layer (4); characterized in that, A plurality of side posts (3) and a plurality of middle posts (5) are provided between the insulating layer (2) and the metal base layer (4). The metal base layer (4) and the insulating layer (2) are connected by the side posts (3) and the middle posts (5) to form a heat dissipation channel (6). The bottom surface of the insulating layer (2) is fixedly connected to several heat-conducting plates (7), and the bottom surface of the heat-conducting plates (7) is fixedly connected to heat-conducting rods (8). The bottom surface of the metal base layer (4) is provided with heat dissipation grooves (9), and several heat dissipation rods (10) are fixedly connected in the heat dissipation grooves (9).
2. The SiC driver high-heat-dissipation aluminum-based circuit board for a supercharging pile power module as described in claim 1, characterized in that: Both the side pillar (3) and the middle pillar (5) adopt a rectangular structure and are made of metal.
3. The SiC driver high-heat-dissipation aluminum-based circuit board for a supercharging pile power module as described in claim 2, characterized in that: Several of the side posts (3) and several middle posts (5) are evenly arranged between the insulation layer (2) and the metal base layer (4).
4. The SiC driver high-heat-dissipation aluminum-based circuit board for a supercharging pile power module as described in claim 3, characterized in that: Both the heat-conducting plate (7) and the heat-conducting rod (8) adopt a cylindrical structure and are made of metal.
5. The SiC driver high-heat-dissipation aluminum-based circuit board for a supercharging pile power module as described in claim 4, characterized in that: Several heat-conducting plates (7) are evenly arranged in the heat dissipation channel (6).
6. The SiC driver high-heat-dissipation aluminum-based circuit board for a supercharging pile power module as described in claim 5, characterized in that: The bottom end of the heat-conducting rod (8) abuts against the metal base layer (4), and there are several heat dissipation grooves (9) that are arranged corresponding to the heat-conducting rod (8).
7. The SiC driver high-heat-dissipation aluminum-based circuit board for a supercharging pile power module as described in claim 6, characterized in that: The heat dissipation rod (10) penetrates the metal base layer (4) and is abutted against the heat conduction rod (8).