A semiconductor package structure and a de-gluing device thereof

Abstract

The application provides a semiconductor packaging structure glue removing device, and relates to the technical field of semiconductor packaging. The device comprises a polishing glue removing mechanism, the polishing glue removing mechanism comprises a first shell and a second shell connected with the first shell, the second shell is provided with a glue removing structure, the end of the second shell away from the first shell is provided with a plurality of second through holes, the inner walls of the plurality of second through holes are all inserted with dust suction pipes, one end of the plurality of dust suction pipes is connected with a connecting pipe, the end of the connecting pipe away from the dust suction pipe is connected with a connecting head, and the connecting head is fixedly connected to the end of the first shell away from the second shell. The dust suction pipes, the connecting pipe and the connecting head are arranged, the connecting head is connected with the existing dust suction equipment through the pipeline, the dust suction equipment can suck the generated glue scraps and dust in real time through the connecting head, the connecting pipe and the dust suction pipes during polishing, the glue scraps and dust are effectively prevented from flying everywhere in the working environment, and the working environment is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and more specifically, to a device for removing adhesive from semiconductor packaging structures. Background Technology

[0002] In semiconductor packaging processes, photoresist removal is a critical step. After semiconductor chips complete packaging steps such as wiring and surface mounting, their surfaces or specific areas often have residual photoresist, protective adhesive, and other adhesive substances. If these residual adhesives are not thoroughly removed, they will seriously affect subsequent process operations. Currently, traditional methods for removing adhesive from semiconductor packaging mainly include chemical cleaning and mechanical polishing. Mechanical polishing uses equipment such as polishing machines to remove the adhesive layer through friction between the polishing head and the adhesive layer. However, during actual operation, adhesive debris and dust generated during polishing fly everywhere, polluting the working environment and posing a health hazard to operators. Therefore, we have made improvements and proposed an adhesive removal device for semiconductor packaging structures. Utility Model Content

[0003] This utility model provides a glue removal device for semiconductor packaging structures, including a grinding and glue removal mechanism. The grinding and glue removal mechanism includes a first housing and a second housing connected to the first housing. The second housing is provided with a glue removal structure. The end of the second housing away from the first housing is provided with a plurality of second through holes. A vacuum tube is inserted into the inner wall of each of the plurality of second through holes. A connecting tube is connected between one end of the plurality of vacuum tubes. A connector is connected to the end of the connecting tube away from the vacuum tube. The connector is fixedly connected to the end of the first housing away from the second housing.

[0004] As a preferred technical solution of this application, the adhesive removal structure includes a motor installed in the second housing, the output shaft of the motor passing through the second housing and extending to the outside of the second housing and fixedly connected to a connecting seat, and a grinding head is provided at the end of the connecting seat away from the second housing.

[0005] As a preferred technical solution of this application, the connecting seat is provided with a slot in the middle, one end of the grinding head is inserted into the slot, the grinding head is provided with a first through hole, and a fixing bolt is threadedly connected to the connecting seat, and the fixing bolt is inserted into the inner wall of the first through hole.

[0006] As a preferred technical solution of this application, the outer surfaces of several of the suction pipes are in contact with the outer surface of the motor.

[0007] As a preferred technical solution of this application, the outer periphery of the second housing is provided with a plurality of heat dissipation vents, and a mesh is provided at the heat dissipation vents.

[0008] As a preferred technical solution of this application, a fixing member is provided between the first housing and the second housing, and the fixing member is used to fix the first housing and the second housing.

[0009] As a preferred technical solution of this application, the fastener includes a plurality of threaded holes disposed on the first housing and a plurality of fastening bolts disposed on the second housing, wherein the fastening bolts are threadedly connected to the inner wall of the threaded holes.

[0010] As a preferred technical solution of this application, a protective sleeve is provided on the outer surface of the first housing.

[0011] As a preferred technical solution of this application, the first housing is provided with a switch button, which is connected to the motor through a wire.

[0012] As a preferred technical solution of this application, the switch button is also connected to a power cord, which passes through the first housing and extends to the outside of the first housing and is connected to a plug.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: In the scheme of this application: This application, through the installation of a suction pipe, a connecting pipe, and a connector, connects to an existing dust collection device via a pipe. During the grinding process, the dust collection device can suck up the generated adhesive residue and dust in real time through the connector, connecting pipe, and suction pipe, effectively reducing the amount of adhesive residue and dust flying around in the working environment, improving the working environment, and reducing the risk of operators inhaling harmful dust. Attached Figure Description

[0014] Figure 1 A schematic diagram of the adhesive removal device for the semiconductor packaging structure provided in this application; Figure 2 A schematic diagram of the slot for the adhesive removal device for the semiconductor packaging structure provided in this application; Figure 3 A schematic diagram of the structure of the second through hole provided in this application; Figure 4 This is a schematic diagram of the motor structure provided in this application; Figure 5 This is a structural diagram of the suction pipe, connecting pipe, and connector provided in this application.

[0015] The image shows: 1. Grinding and adhesive removal mechanism; 101. First housing; 102. Protective sleeve; 103. Second housing; 104. Fastening bolt; 105. Threaded hole; 106. Partition mesh; 107. Motor; 108. Connecting seat; 109. Slot; 110. Grinding head; 111. First through hole; 112. Fixing bolt; 113. Switch button; 114. Power cord; 115. Second through hole; 2. Vacuum suction pipe; 201. Connecting pipe; 202. Connector. Detailed Implementation

[0016] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0017] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0018] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0019] For an example, please refer to... Figures 1-5 A device for removing adhesive from a semiconductor packaging structure includes a grinding and adhesive removal mechanism 1. The grinding and adhesive removal mechanism 1 includes a first housing 101 and a second housing 103 connected to the first housing 101. The second housing 103 is provided with an adhesive removal structure. A plurality of second through holes 115 are provided at the end of the second housing 103 away from the first housing 101. A suction pipe 2 is inserted into the inner wall of each of the plurality of second through holes 115. A connecting pipe 201 is connected between the ends of the plurality of suction pipes 2. A connector 202 is connected to the end of the connecting pipe 201 away from the suction pipes 2. The connector 202 is fixedly connected to the end of the first housing 101 away from the second housing 103. After the connector 202 is connected to an existing vacuuming device through a pipe, the vacuuming device can suck up the generated adhesive debris and dust in real time during the grinding process through the connector 202, the connecting pipe 201, and the suction pipes 2, effectively reducing the adhesive debris and dust flying around in the working environment, improving the working environment, and reducing the risk of operators inhaling harmful dust. Connector 202 is specifically an external threaded connector that can be connected to existing internal threaded connectors. Specifically, the pipe is connected to the existing internal threaded connector and connector 202 to achieve connection with existing vacuum cleaner equipment.

[0020] Furthermore, the adhesive removal structure includes a motor 107 installed inside the second housing 103. The output shaft of the motor 107 passes through the second housing 103 and extends to the outside of the second housing 103 and is fixedly connected to a connecting seat 108. A grinding head 110 is provided at one end of the connecting seat 108 away from the second housing 103. A bearing is provided at the connection between the output shaft of the motor 107 and the second housing 103. The output shaft of the motor 107 is welded to the connecting seat 108.

[0021] Furthermore, the connecting seat 108 has a slot 109 in the middle, one end of the grinding head 110 is inserted into the slot 109, the grinding head 110 has a first through hole 111, the connecting seat 108 is threaded with a fixing bolt 112, and the fixing bolt 112 is inserted into the inner wall of the first through hole 111. The grinding head 110 and the connecting seat 108 can be fixed together by the cooperation of the fixing bolt 112 and the first through hole 111.

[0022] Furthermore, the outer surfaces of several suction pipes 2 are in contact with the outer surface of the motor 107. The suction pipes 2 are made of aluminum. The heat generated by the motor 107 can be transferred to the suction pipes 2. Since the air circulation speed inside the suction pipes 2 is fast, heat exchange can be accelerated, which facilitates heat dissipation of the motor 107.

[0023] Furthermore, the outer periphery of the second housing 103 is provided with several heat dissipation vents, and a mesh 106 is provided at the heat dissipation vents. The heat dissipation vents facilitate heat dissipation of the motor 107, while the mesh 106 reduces the entry of dust into the second housing 103.

[0024] Furthermore, a fastener is provided between the first housing 101 and the second housing 103. The fastener is used to fix the first housing 101 and the second housing 103. The fastener includes a plurality of threaded holes 105 provided on the first housing 101 and a plurality of fastening bolts 104 provided on the second housing 103. The fastening bolts 104 are threadedly connected to the inner wall of the threaded holes 105. The threaded holes 105 and the fastening bolts 104 cooperate with each other to fix the second housing 103 and the first housing 101 together.

[0025] Furthermore, a protective sleeve 102 is fitted onto the outer surface of the first housing 101. The protective sleeve 102 is made of rubber, which can improve the user's comfort when holding and using it.

[0026] Furthermore, the first housing 101 is provided with a switch button 113, which is connected to the motor 107 via a wire; the switch button 113 is also connected to a power cord 114, which passes through the first housing 101 and extends to the outside of the first housing 101 and is connected to a plug; the switch button 113 is used to control the start and stop of the motor 107.

[0027] In use, the motor 107 drives the grinding head 110 to rotate through the connecting seat 108. The grinding head 110 is used to grind and remove the adhesive. The dust and debris generated during the grinding and adhesive removal process are sucked into the existing vacuuming equipment by the suction pipe 2.

[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A de-adhesive removal device for a semiconductor packaging structure, characterized in that, The device includes a sanding and adhesive removal mechanism (1), which includes a first housing (101) and a second housing (103) connected to the first housing (101). The second housing (103) is provided with an adhesive removal structure. The second housing (103) is provided with a plurality of second through holes (115) at one end away from the first housing (101). A vacuum tube (2) is inserted into the inner wall of each of the plurality of second through holes (115). A connecting tube (201) is connected between one end of each of the plurality of vacuum tubes (2). A connector (202) is connected to one end of the connecting tube (201) away from the vacuum tube (2). The connector (202) is fixedly connected to one end of the first housing (101) away from the second housing (103).

2. The adhesive removal device for semiconductor packaging structures according to claim 1, characterized in that, The adhesive removal structure includes a motor (107) installed in the second housing (103). The output shaft of the motor (107) passes through the second housing (103) and extends to the outside of the second housing (103) and is fixedly connected to a connecting seat (108). A grinding head (110) is provided at one end of the connecting seat (108) away from the second housing (103).

3. The adhesive removal device for semiconductor packaging structures according to claim 2, characterized in that, The connecting seat (108) has a slot (109) in the middle, one end of the grinding head (110) is inserted into the slot (109), the grinding head (110) has a first through hole (111), the connecting seat (108) is threaded with a fixing bolt (112), and the fixing bolt (112) is inserted into the inner wall of the first through hole (111).

4. The adhesive removal device for semiconductor packaging structures according to claim 3, characterized in that, The outer surfaces of several of the suction pipes (2) are in contact with the outer surface of the motor (107).

5. The adhesive removal device for semiconductor packaging structures according to claim 1, characterized in that, The outer periphery of the second housing (103) is provided with several heat dissipation vents, and a mesh (106) is provided at the heat dissipation vents.

6. The adhesive removal device for semiconductor packaging structures according to claim 1, characterized in that, A fastener is provided between the first housing (101) and the second housing (103) for fixing the first housing (101) and the second housing (103).

7. The adhesive removal device for semiconductor packaging structures according to claim 6, characterized in that, The fastener includes a plurality of threaded holes (105) provided on the first housing (101) and a plurality of fastening bolts (104) provided on the second housing (103), wherein the fastening bolts (104) are threadedly connected to the inner wall of the threaded holes (105).

8. The adhesive removal device for semiconductor packaging structures according to claim 1, characterized in that, The outer surface of the first housing (101) is covered with a protective sleeve (102).

9. The adhesive removal device for semiconductor packaging structures according to claim 2, characterized in that, The first housing (101) is provided with a switch button (113), which is connected to the motor (107) via a wire.

10. The adhesive removal device for semiconductor packaging structures according to claim 9, characterized in that, The switch button (113) is also connected to a power cord (114), which passes through the first housing (101) and extends to the outside of the first housing (101) and is connected to a plug.

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