Wafer stacking apparatus
By designing the feed trough and filter plate of the wafer stacking device, combined with the adjusting cylinder and L-shaped support plate, the problems of low stacking efficiency and difficult filtration in the existing device were solved, and rapid stacking and liquid control were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU ANYEDA ULTRASONIC EQUIP CO LTD
- Filing Date
- 2025-06-26
- Publication Date
- 2026-07-24
AI Technical Summary
Existing wafer stacking devices have low stacking efficiency and are difficult to use for filtering.
A wafer stacking device was designed, comprising an inclined feeding trough, a feeding motor, a feeding guide block, and a filter screen. Combined with an adjusting cylinder and an L-shaped support plate, it enables rapid wafer splitting and stacking, and achieves liquid control through the filter screen.
It enables rapid wafer stacking and liquid removal, improving stacking efficiency and filtration effectiveness.
Smart Images
Figure CN224547450U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer manufacturing technology, and in particular to a wafer stacking device. Background Technology
[0002] Wafer blasting is an important step in semiconductor manufacturing, primarily used to remove impurities, oxides, or create specific textures on the wafer surface. After blasting, the wafer needs to be repositioned into a wafer support for storage and transfer. Existing wafer stacking devices have low stacking efficiency and make filtration difficult during the stacking process. Summary of the Invention
[0003] The purpose of this invention is to provide a wafer stacking device that can quickly realize wafer stacking operations.
[0004] To achieve the above objectives, the technical solution of this utility model is as follows: A wafer stacking apparatus includes a stacking support, a support groove on the stacking support, and a material distribution device rotatably mounted on the support groove. The material distribution device includes a material distribution slot, which is inclinedly mounted above the support groove. A distributing motor is fixed at the top of the distributing trough, and a distributing swing rod is fixed on the rotor of the distributing motor. A distributing guide block is provided at the outlet of the distributing trough, which can divide the outlet of the distributing trough into a first outlet and a second outlet. A first filter screen is provided at the bottom of the distributing trough. A wafer receiving device is provided on the right side of the support groove.
[0005] As an improvement: a cover is hinged to the top of the material distribution trough, and a first limiting block and a second limiting block are fixed on the cover. The first limiting block is located on the front side of the material distribution swing rod, and the second limiting block is located on the rear side of the material distribution swing rod.
[0006] As an improvement, a second filter screen is provided at the bottom of the dispensing trough.
[0007] As an improvement: the bottom of the material distribution trough is fixed to a rotating rod, and the rotating rod is limited to rotate inside the support trough; Furthermore, a first limiting plate and a second limiting plate are fixed at the bottom of the material distribution trough. A first adjusting groove and a second adjusting groove are respectively provided on the first limiting plate and the second limiting plate. The first limiting plate and the second limiting plate are adjustablely fixed on the left side of the support groove through the first adjusting groove and the second adjusting groove, respectively. The first limiting plate and the second limiting plate are both located on the left side of the rotating rod.
[0008] As an improvement: the wafer receiving device includes a first adjusting cylinder and a second adjusting cylinder, both of which are fixed at an angle on the stacking support; A first L-shaped support plate is fixed on the piston rod of the first adjusting cylinder, and a first wafer support frame is detachably mounted on the first L-shaped support plate. A second L-shaped support plate is fixed on the piston rod of the second adjusting cylinder, and a second wafer support frame is detachably mounted on the second L-shaped support plate.
[0009] As an improvement, a guide plate is provided inside the support groove. The guide plate is located below the wafer receiving device and is arranged parallel to the first adjusting cylinder and the second adjusting cylinder.
[0010] In summary, this utility model has the following beneficial effects: 1. When the wafers are transported to the inlet of the sorting tank, the sorting motor sequentially diverts the wafers to the first or second outlet. Under the action of gravity, the wafers can fall from the first outlet to the first wafer support frame, or from the second outlet to the second wafer support frame. The height of the first and second wafer support frames is adjusted sequentially by the first and second adjusting cylinders, respectively, so that multiple wafers can be quickly stacked into the corresponding wafer support frames. 2. Liquid on the wafer surface can flow through the first filter screen into the support tank to achieve controlled drying. Attached Figure Description
[0011] To more clearly illustrate the technical solutions in this utility model, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below.
[0012] Figure 1 This is a schematic diagram of the overall structure of a wafer stacking device; Figure 2 A front view of a wafer stacking device; Figure 3 This is a partial structural schematic diagram of a wafer stacking device; The components include: 1. Stacking bracket; 2. Support groove; 3. Material distribution groove; 4. Material distribution motor; 5. Material distribution swing rod; 6. Material distribution guide block; 7. First discharge port; 8. Second discharge port; 9. First filter screen; 10. Cover; 11. First limiting block; 12. Second limiting block; 13. Second filter screen; 14. First limiting plate; 15. Second limiting plate; 16. First adjusting channel; 17. Second adjusting channel; 18. First adjusting cylinder; 19. Second adjusting cylinder; 20. First L-shaped support plate; 21. Second L-shaped support plate; 22. First wafer support frame; 23. Second wafer support frame; 24. Guide plate. Detailed Implementation
[0013] The present invention will now be described in further detail with reference to the accompanying drawings.
[0014] Please refer to Figures 1-3 A wafer stacking device includes a stacking support 1, a support groove 2 on the stacking support 1, and a material distribution device rotatably mounted on the support groove 2. The material distribution device includes a material distribution groove 3, which is inclinedly mounted above the support groove 2. A dispensing motor 4 is fixed at the top of the dispensing tank 3, and a dispensing swing rod 5 is fixed on the rotor of the dispensing motor 4. A dispensing guide block 6 is provided at the outlet of the dispensing tank 3. The dispensing guide block 6 can divide the outlet of the dispensing tank 3 into a first outlet 7 and a second outlet 8. A first filter screen 9 is provided at the bottom of the dispensing tank 3. Liquid on the wafer surface can flow into the support tank 2 through the first filter screen 9 to achieve controlled drying.
[0015] A cover 10 is hinged to the top of the material distribution trough 3. A first limiting block 11 and a second limiting block 12 are fixed on the cover 10. The first limiting block 11 is located in front of the material distribution swing rod 5, and the second limiting block 12 is located behind the material distribution swing rod 5.
[0016] In this embodiment, when the wafer is transported to the inlet of the distribution tank 3, the distribution motor 4 sequentially distributes the wafer to the first outlet 7 or the second outlet 8. Under the action of gravity, the wafer can fall from the first outlet 7 to the first wafer support frame 22, or from the second outlet 8 to the second wafer support frame 23. The height of the first wafer support frame 22 and the second wafer support frame 23 are adjusted sequentially by the first adjusting cylinder 18 and the second adjusting cylinder 19, thereby quickly stacking multiple wafers into the corresponding wafer support frames.
[0017] A second filter screen 13 is provided at the bottom of the material distribution trough 3. The bottom of the material distribution trough 3 is fixed to a rotating rod, and the rotating rod is limited to rotation inside the support groove 2. Furthermore, a first limiting plate 14 and a second limiting plate 15 are fixed at the bottom of the material distribution trough 3. A first adjusting groove 16 and a second adjusting groove 17 are respectively provided on the first limiting plate 14 and the second limiting plate 15. The first limiting plate 14 and the second limiting plate 15 are adjustablely fixed on the left side of the support groove 2 through the first adjusting groove 16 and the second adjusting groove 17, respectively. The first limiting plate 14 and the second limiting plate 15 are both located on the left side of the rotating rod.
[0018] A wafer receiving device is provided on the right side of the support groove 2. The wafer receiving device includes a first adjusting cylinder 18 and a second adjusting cylinder 19, both of which are fixed at an angle on the stacking bracket 1. A first L-shaped support plate 20 is fixed on the piston rod of the first adjusting cylinder 18, and a first wafer support frame 22 is detachably mounted on the first L-shaped support plate 20. A second L-shaped support plate 21 is fixed on the piston rod of the second adjusting cylinder 19, and a second wafer support frame 23 is detachably mounted on the second L-shaped support plate 21.
[0019] A guide plate 24 is provided inside the support groove 2. The guide plate 24 is located below the wafer receiving device and is arranged parallel to the first adjusting cylinder 18 and the second adjusting cylinder 19. The guide plate 24 can improve the transmission stability of the first L-shaped support plate 20 and the second L-shaped support plate 21.
[0020] Working principle: When the wafer is transported to the inlet of the sorting tank 3, the sorting motor 4 rotates and drives the sorting swing to sequentially divert the wafer to the first outlet 7 or the second outlet 8.
[0021] When the wafer is diverted to the first discharge port 7, it can fall into the first wafer support frame 22 under the action of gravity; when the wafer is diverted to the second discharge port 8, it can fall into the second wafer support frame 23 under the action of gravity.
[0022] When the wafer is transferred to the first discharge port 7 again, the height of the first wafer support frame 22 is adjusted by the first adjusting cylinder 18, so that multiple wafers are stacked into the first wafer support frame 22 in sequence and quickly until the first wafer support frame 22 stores the corresponding number of wafers, and the first wafer support frame 22 is removed by an external robot arm.
[0023] When the wafer is transferred to the second discharge port 8 again, the height of the second wafer support frame 23 is adjusted by the second adjusting cylinder 19, so that multiple wafers are stacked into the second wafer support frame 23 in sequence and quickly until the second wafer support frame 23 holds the corresponding number of wafers, and then the second wafer support frame 23 is removed by an external robot arm.
[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit it; although the utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of this utility model or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the technical solution claimed by this utility model.
Claims
1. A wafer stacking device, characterized in that, It includes a stacking support, a support groove on the stacking support, and a material distribution device rotatably mounted on the support groove. The material distribution device includes a material distribution trough, which is inclinedly mounted above the support groove. A distributing motor is fixed at the top of the distributing trough, and a distributing swing rod is fixed on the rotor of the distributing motor. A distributing guide block is provided at the outlet of the distributing trough, which can divide the outlet of the distributing trough into a first outlet and a second outlet. A first filter screen is provided at the bottom of the distributing trough. A wafer receiving device is provided on the right side of the support groove.
2. The wafer stacking apparatus according to claim 1, characterized in that, A cover is hinged to the top of the material distribution trough. A first limiting block and a second limiting block are fixed on the cover. The first limiting block is located on the front side of the material distribution swing rod, and the second limiting block is located on the rear side of the material distribution swing rod.
3. The wafer stacking apparatus according to claim 1, characterized in that, A second filter screen is provided at the bottom of the material distribution trough.
4. The wafer stacking apparatus according to claim 1, characterized in that, The bottom of the material distribution trough is fixed to a rotating rod, and the rotating rod is limited to rotate inside the support trough. Furthermore, a first limiting plate and a second limiting plate are fixed at the bottom of the material distribution trough. A first adjusting groove and a second adjusting groove are respectively provided on the first limiting plate and the second limiting plate. The first limiting plate and the second limiting plate are adjustablely fixed on the left side of the support groove through the first adjusting groove and the second adjusting groove, respectively. The first limiting plate and the second limiting plate are both located on the left side of the rotating rod.
5. The wafer stacking apparatus according to claim 1, characterized in that, The wafer receiving device includes a first adjusting cylinder and a second adjusting cylinder, both of which are mounted and fixed at an angle on the stacking support. A first L-shaped support plate is fixed on the piston rod of the first adjusting cylinder, and a first wafer support frame is detachably mounted on the first L-shaped support plate. A second L-shaped support plate is fixed on the piston rod of the second adjusting cylinder, and a second wafer support frame is detachably mounted on the second L-shaped support plate.
6. The wafer stacking apparatus according to claim 5, characterized in that, A guide plate is provided inside the support groove. The guide plate is located below the wafer receiving device and is arranged parallel to the first adjusting cylinder and the second adjusting cylinder.