A substrate coating anti-warping pressing device and a coating equipment

Abstract

The utility model discloses a kind of substrate coating anti-warping down-pressing device and coating equipment, including cover plate, further include: bolt column, vertically through in cover plate along cover plate height direction;Bolt, through inside bolt column is set;Contact part, set in bolt bottom end portion, and contact part is in with bolt bottom end portion and is connected with the down-pressing spring that is set, further include protection spring, limit the relative displacement of bolt and bolt column and guarantee the reset of bolt, bolt column surface has screw thread, bolt column is set with locating nut at the upper and lower surface of through cover plate by screw thread cooperation, bolt column is fixed firmly, bolt top end is equipped with limit nut, limit bolt from bolt column slide down, one end of protection spring is connected with locating nut, the other end is connected with limit nut, the utility model is in the whole process of substrate coating by each component cooperation real-time flexible pressing and closing non-working area of substrate without pressing and damaging substrate, reduce substrate warping, guarantee coating uniform.

Description

Technical Field

[0001] This utility model belongs to the field of vacuum sputtering coating technology, and particularly relates to a substrate coating anti-warping pressure device and coating equipment. Background Technology

[0002] Physical vapor deposition (PVD) equipment is frequently used in chip manufacturing to form thin films of various materials. These films can be used to improve the electrical, mechanical, and thermal properties of chips, such as conductive layers, insulating layers, or protective layers. PVD is mainly divided into three categories: vacuum evaporation deposition, vacuum sputtering deposition, and vacuum ion plating. Vacuum sputtering deposition accelerates and impacts ions in plasma onto a target that is shaped according to the film formed on the surface of the substrate to be treated, causing the target atoms to scatter and thus forming a thin film on the surface of the substrate to be treated.

[0003] After the substrate is loaded onto the carrier platform of the vacuum sputtering coating equipment, it needs to be fixed before coating. The existing substrate fixing method is generally mechanical clamping. Mechanical clamping can cause substrate warping, edge damage, and edge coating shadows. For large-size substrates, vacuum adsorption is generally used for fixing. However, unevenness on the back of the substrate and substrate warping can cause local air leakage and adsorption failure, affecting the coating.

[0004] Therefore, there is an urgent need to design a substrate coating anti-warping pressure device and coating equipment to solve the above problems. Utility Model Content

[0005] To achieve the above objectives, this utility model proposes a substrate coating anti-warping pressing device and coating equipment; the substrate coating anti-warping pressing device includes a cover plate, and further includes: Bolt studs penetrate the cover plate perpendicularly along its height. Bolts are inserted through the bolt post; The contact part is sleeved on the bottom end of the bolt, and a compression spring connected to the bottom end of the bolt is provided inside the contact part.

[0006] The pressing device also includes a protective spring to limit the relative displacement between the bolt and the bolt post and to ensure the bolt returns to its original position.

[0007] The bolt post has threads on its surface, and a positioning nut is provided at the upper and lower surfaces of the cover plate through the threaded engagement to firmly fix the bolt post.

[0008] The bolt is provided with a limiting nut at its top to prevent it from sliding down from inside the bolt post.

[0009] One end of the protective spring is connected to the positioning nut, and the other end is connected to the limiting nut.

[0010] Wherein, the compression stiffness of the contact portion is less than the stiffness coefficient of the compression spring, which is less than the stiffness coefficient of the protective spring.

[0011] When the contact portion is pressed down, it is pressed into the non-working area of ​​the substrate.

[0012] The contact part is a hollow transparent tube, and the bottom end of the contact part is a flared opening.

[0013] Wherein, the effective length of the contact portion is greater than the length of the compression spring in the initial state.

[0014] A coating apparatus includes the aforementioned substrate coating anti-warping pressing device, and also includes a support portion.

[0015] The support portion supports the substrate, and the support portion and the contact portion are distributed vertically and vertically relative to the substrate. Both the support portion and the contact portion are pressed onto the non-working area of ​​the substrate.

[0016] The substrate coating anti-warping pressing device and coating equipment provided by this utility model have the following advantages: 1. Throughout the substrate coating process, the non-working areas of the substrate are flexibly pressed in real time by the cooperation of various components without compressing or damaging the substrate. When the pressure spring is compressed to the critical point, the bolt moves upward relative to the bolt post to protect the spring from stretching. While improving substrate warping, the pressure on the substrate is adjusted to avoid over-pressure damage to the substrate and to avoid excessive compression of the pressure spring, thereby reducing substrate warping and ensuring uniform coating. 2. The contact and support parts are symmetrically distributed vertically, the substrate is subjected to uniform force, the bottom is effectively supported, and the structure is simple and reliable. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the unpressed substrate state of the substrate coating anti-warping pressing device of this utility model; Figure 2 This is a schematic diagram of the contact portion of the substrate pressing state of the substrate of the substrate coating anti-warping pressing device of this utility model; Figure 3 This is a schematic diagram of the pressing spring pressing the substrate in the state of the substrate of the substrate anti-warping pressing device of the present invention; Figure 4 This is a schematic diagram of the compression limit of the pressing spring and the tension state of the protective spring in the substrate coating anti-warping pressing device of this utility model; Figure 5 This is a schematic diagram of the pressing and rebound state of a substrate coating anti-warping pressing device according to the present invention; Figure 6 This is a schematic diagram of the assembly of bolt columns, bolts, and other structures of a substrate coating anti-warping pressing device according to this utility model.

[0018] In the diagram: 1. Cover plate; 2. Bolt post; 3. Bolt; 4. Contact part; 5. Compression spring; 6. Protective spring; 7. Positioning nut; 8. Limiting nut. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. The content of this utility model will be described below with reference to specific implementation methods. Examples of the implementation methods are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout.

[0020] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein. Directional terms mentioned in this utility model, such as: up, down, left, right, front, back, inside, outside, front, back, side, etc., are only for reference to the accompanying drawings. The embodiments and directional terms used in the following description with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Furthermore, the various specific processes and materials provided in this utility model are examples of applications of other processes and / or the use of other materials that can be recognized by those skilled in the art.

[0021] The existing methods for fixing substrates to equipment carriers are generally mechanical clamping, such as using clamps (spring clips, screws, claws) to directly fix the edges or holes of the substrate. This kind of fixing may cause substrate warping, edge damage, edge coating shadows, etc. Moreover, due to equipment space limitations, the mechanical clamping size is limited and it is not suitable for large-size substrates. The warping of the substrate during the coating process due to mechanical clamping is essentially caused by uneven stress distribution resulting from changes in substrate force or temperature. 1. The clamping force is too large or uneven; The contact points between the clamp and the substrate (non-working areas) are subject to concentrated force. If the clamping force exceeds the substrate's resistance to deformation, it will cause local plastic deformation and warping after release. If the force at each clamping point is inconsistent, the substrate will bend towards the side with less force.

[0022] 2. Deformation caused by thermal stress; During the coating process, the substrate heats up (usually 50-300℃) due to the absorption of sputtered particle kinetic energy or environmental heating, and thermal expansion occurs. However, the clamping part has a lower temperature than other areas of the substrate because of the fast heat conduction with the metal clamp. As a result, the substrate is constrained by the clamp when it expands and cannot expand and contract freely, forming thermal stress. When cooling, the substrate contracts, but the clamping part still restricts the contraction, and eventually warping occurs due to stress release.

[0023] 3. Relief of internal stress in the substrate; The substrate may have residual internal stress during processing. Mechanical clamping can disrupt the original stress balance, leading to the release of internal stress and causing warping.

[0024] 4. The coefficients of thermal expansion of the fixture and the substrate do not match; If the coefficients of thermal expansion of the clamp material and the substrate material are significantly different, their expansion and contraction will differ when the temperature changes. The clamp will forcibly pull or squeeze the substrate, causing the substrate to deform under stress.

[0025] 5. Insufficient contact area leads to excessive local compressive stress; The smaller the contact area between the fixture and the substrate, the greater the compressive stress per unit area, which may damage the substrate surface and cause local deformation, eventually leading to overall warping.

[0026] For large substrates like this, they can be fixed by vacuum adsorption. That is, the back of the substrate is evacuated through the micropores of the adsorption stage and fixed by the pressure difference. However, unevenness on the back of the substrate and uneven static distribution can cause the substrate to warp. When the substrate warps, it is easy to cause air leakage, which will affect the adsorption and fixation.

[0027] Since large-size substrates are generally used in conjunction with planar targets, the substrate and the target are usually placed parallel to each other, with the target located at the cathode and the substrate located at or near the anode. The center of the target needs to be coaxial or coincide with the center of the substrate to ensure uniform substrate coating.

[0028] The warping of electrostatically adsorbed substrates is essentially a stress imbalance caused by the combined effects of electrostatic force distribution, substrate characteristics, and external environmental factors. 1. Uneven distribution of electrostatic adsorption forces: For large-size substrates, uneven electrostatic force distribution can occur due to defects in the electrode design of the adsorption stage, unevenness or contamination of the adsorption stage surface, and deviation in parallelism between the substrate and the adsorption stage, leading to local stress differences and warping.

[0029] 2. Residual stress in the substrate itself is released or redistributed; Large-size substrates accumulate residual stress during manufacturing. When electrostatic adsorption occurs, the external electrostatic force will disrupt the original stress balance of the substrate, causing the residual stress to be released or redistributed, which in turn leads to warping.

[0030] 3. The superposition of thermal stress during the coating process; During sputtering deposition, the target particles bombard the substrate and release energy, causing the substrate temperature to rise. This is especially true for large-sized substrates, which have a large heated area and are prone to uneven temperature distribution. The temperature change, combined with electrostatic adsorption, will exacerbate warping.

[0031] When a large substrate warps, its geometry deviates from the designed position. For example, if the edge warps up to a height exceeding the equipment's safety clearance, it is prone to interference with surrounding structures during vacuum pumping, substrate transport, or sputtering, increasing the risk of mechanical damage. The distance between the warped substrate surface and the target changes, causing significant variations in the path length and deposition rate of sputtered particles reaching different areas of the substrate, deviating from the set values. This results in uneven coating and poor coating effect.

[0032] Therefore, it is necessary to improve the substrate fixing method to reduce warping in order to ensure the coating effect.

[0033] This utility model provides a substrate coating anti-warping pressing device and coating equipment, aiming to solve the problem that mechanical clamping or adsorption fixation of substrates in existing related technologies is difficult to solve the problem of substrate warping and affect coating. The following is in conjunction with the appendix... Figure 1-5 Describe it.

[0034] The substrate coating anti-warping pressing device includes a cover plate 1, and also includes: Bolt post 2, which penetrates vertically through cover plate 1 along the height direction of cover plate 1, has threads on its surface, and is provided with positioning nuts 7 at the points where it penetrates the upper and lower surfaces of cover plate 1 through thread engagement to secure bolt post 2. Bolt 3 is fitted through the inside of bolt post 2. A limiting nut 8 is provided at the top of bolt 3 to restrict bolt 3 from sliding down from inside bolt post 2. The lower end of bolt 3 extends out of the inside of bolt post 2. The protective spring 6 limits the relative displacement between the bolt 3 and the bolt post 2 and ensures the reset of the bolt 3. One end of the protective spring 6 is connected to the positioning nut 7, and the other end is connected to the limit nut 8. The contact part 4 is sleeved on the bottom end of the bolt 3, and a compression spring 5 connected to the bottom end of the bolt 3 is provided inside the contact part 4. The contact part 4 is a hollow transparent flexible tube, and the bottom end of the contact part 4 is a flared mouth. The effective length of the contact part 4 is greater than the length of the compression spring 5 in the initial state. The compression stiffness of the contact part 4 is less than the stiffness coefficient of the compression spring 5 and less than the stiffness coefficient of the protective spring 6.

[0035] The substrate is placed on the support of the coating equipment, which normally supports the substrate. At this time, the cover plate 1 is parallel to the substrate. The cover plate 1 is mounted on the robotic arm of the coating equipment (not shown in the figure). The robotic arm of the coating equipment starts and moves the cover plate 1 downward. The contact part 4 first contacts the substrate. The compression spring 5 is in its initial free length state. The compression stiffness of the contact part 4 is less than the stiffness coefficient of the compression spring 5. The contact part 4 of the hollow transparent tube is compressed, pressing the substrate for the first time to prevent warping. The support and the contact part 4 are correspondingly distributed on the upper and lower parts of the substrate, and the substrate is evenly stressed. One end of spring 6 is connected to positioning nut 7, and the other end is connected to limiting nut 8. When the pressing device is not pressed, the protective spring 6 is in the initial free length state. When the substrate is severely deformed and warped, in order to prevent the warped cover plate 1 from continuing to press down, the pressing spring 5 contacts the substrate and begins to compress. When the pressing spring 5 is compressed to the critical point, the deformation force of the pressing spring 5 causes the bolt 3 to move upward relative to the bolt post 2, and the protective spring 6 is stretched. The pressing spring 5 returns to the compression amount when the compression amount is less than the critical point, so that the pressure of the pressing spring 5 on the substrate is controllable, so as to prevent the substrate from being damaged due to excessive pressure.

[0036] Preparations before starting the coating equipment: PVD (Physical Vapor Deposition) sputtering is a physical process that uses high-energy particles to bombard a target material, causing the target atoms to escape and deposit on the substrate surface to form a thin film.

[0037] Pretreatment is required before substrate coating: Substrate cleaning: The substrate is ultrasonically cleaned using solvents such as alcohol and deionized water to remove oil, dust and oxides from the substrate surface. If necessary, plasma etching is performed to further remove impurity molecules adsorbed on the substrate surface without damaging the substrate and avoiding the impurity molecules affecting the adhesion of the film layer. Target selection: The matching between the target and the substrate directly affects the uniformity of the film, the deposition rate and the utilization rate of the target. The particles (atoms, molecules or ions) generated by the sputtering of the target move in a vacuum environment and are eventually deposited on the surface of the substrate to form a thin film. The appropriate target should be selected according to the type of thin film to be formed.

[0038] The working process of the coating equipment after startup: In the field of chip manufacturing, PVD is used in substrate packaging to form thin films such as conductive layers, insulating layers, or protective layers that can improve the electrical, mechanical, and thermal properties of the chip. The specific coating process is as follows: S1: First, load the large-size substrate to be coated onto the carrier platform of the coating equipment. The substrate is placed on the support part, which is made of silicone or other materials to avoid rigid damage to the substrate. The substrate is in a horizontal state.

[0039] S2: The robotic arm starts, the cover plate 1 is pressed down, the bottom of the contact part 4 and the pressing spring 5 are pressed onto the substrate, the support part and the contact part 4 are distributed vertically to clamp the substrate firmly, the support part and the contact part 4 are pressed into the non-working area of ​​the substrate, and the cover plate 1 is kept at a certain safe distance from the substrate to avoid affecting the normal coating of the product area and to ensure uniform coating.

[0040] When the cover plate 1 presses down on the substrate, the compression of the compression spring 5 is X0 when it reaches the critical point. When the compression of the compression spring 5 is less than X0, the bolt 3 does not move (the protective spring 6 is not under force and is in its initial free length state). When the compression reaches X0, the bolt 3 begins to move upward along the bolt post 2, and the protective spring 6 is stretched (the stretch increases synchronously with the upward movement distance of the bolt 3). The spring constant k of the compression spring 5 下 Free length L 0下 ; The total downward pressure on the substrate is F, and the direction is downward; The spring constant k of the protective spring 6 保 Free length L 0保 The upward movement distance of bolt 3 (the stretching amount Y of the protective spring 6); (within the elastic limit, the elastic force on the spring is proportional to the deformation X of the stretching or compression. The larger the value of k, the stiffer the spring and the less likely it is to deform).

[0041] The cover plate 1 moves the bolts 3 and other components downwards, going through the following stages: ① Triggering stage (lower spring 5 is independently compressed, X < X0): At this time, bolt 3 does not move, the protective spring 6 is not under force (f=0), and the downward force is balanced only by the lower spring 5, F=k 下 X, during this stage, the spring force of the compression spring 5 does not exceed the bearing limit of the substrate (to avoid premature damage), and X0 must be less than the maximum compression of the compression spring 5 to prevent the compression spring 5 from failing before the protection spring 6 is triggered.

[0042] ② Post-trigger stage (compression spring 5 continues to compress, protection spring 6 stretches, X = X0 + Y): When bolt 3 moves upward, the total compression of compression spring 5 is X0 + Y (because compression spring 5 continues to be compressed by Y), and the stretch of protection spring 6 is Y. At this time, the force balance relationship is: The upward force of the compression spring 5 is: f 下 =k 下 (X0+Y) The tension of the protective spring 6 is downward (resisting the upward movement of bolt 3; because the protective spring 6 is stretched, the direction of the tension is opposite to the direction of bolt 3's movement): f 保 =k 保 Y The downward force needs to be balanced by the upward net force: F=f 下 -f保 ; Substituting, we get: F=k 下 (X0+Y)-k 保 Y=k 下 X0+(k) 下 -k 保 Y; To ensure that the compression spring 5 is compressed to the critical point, pushing the bolt 3 upward, and protecting the spring 6 from stretching and damage to the substrate due to overpressure, k is designed... 下 <k 保 This ensures that the increase of downward pressure F is limited after triggering. When Y increases, F decreases or remains unchanged as Y increases. The maximum value of F does not exceed the safety threshold. When bolt 3 moves upward, the downward pressure on the substrate decreases instead, which also prevents the downward pressure spring 5 from being over-compressed and damaged.

[0043] ③ Rebound stage (the spring force f of the compression spring 5) 下 >The tension f of the protective spring 6 保 (If F > 0, causing the protective spring 6 to reset): When F decreases, the compression spring 5 must be able to push the bolt 3 downwards, so that the protective spring 6 returns to its original length, i.e., the elastic force f of the compression spring 5. 下 >The tension f of the protective spring 6 保 Since Y≥0, k 下 <k 保 k 下 X0+(k) 下 -k 保 Y > 0; We derive that: k 下 X0>(k 保 -k 下 Y, that is, Y at the maximum upward shift distance Y max At that time, it is still necessary to ensure k 下 X0>(k 保 -k 下 Y max This avoids the tension of the protective spring 6 causing the compression spring 5 to fail to rebound.

[0044] ④ Reset stage (lower spring reset): After the coating is completed, the cover plate 1 moves the bolt 3 and other structures upward, the substrate is no longer under pressure, the contact part 4 is separated from the substrate, the contact part 4 and the lower spring 5 reset, and all components return to their original free state.

[0045] The spring constant is an inherent parameter of a spring, but in actual production and application, the deformation force of a spring is evaluated by its weight. Spring constant: refers to the force required for a spring to deform, and is measured in Newtons per meter (N / m). Spring weight: The elastic force produced by a spring under a certain deformation, measured in grams per force (gf) (1 gf ≈ 9.8 × 10⁻⁶). - 3 N, which is the gravitational force on an object with a mass of 1 gram. According to Hooke's Law: F N (Unit: N) = k × X (Unit: m); When converted to spring weight: F gf (Unit: gf) = F N ×(1÷9.8×10 -3 ) ≈ k × X × 102.04; Therefore, the weight of a spring and its spring constant are directly proportional and can both be used to evaluate the performance of a spring.

[0046] Based on the force relationship between the compression spring 5 and the protective spring 6 described above, two springs with appropriate stiffness coefficients or spring weights are used respectively (the compression stiffness of the contact part 4 is less than the stiffness coefficient k of the compression spring 5). 下 <Spring constant k of protective spring 6 保 ;Y at the maximum upward shift distance Y max At that time, it is necessary to ensure that k 下 X0>(k 保 -k 下 Y max This allows for the adjustment of the pressure range to match the stress-bearing capacity of substrates made of different materials.

[0047] During the sputtering process, the substrate warps. The elastic components in the non-working areas of the substrate adjust the downward pressure on the substrate according to the warping. The substrate is pressed at the bottom through the contact part 4 and the downward pressure spring 5. By setting the elastic components, the substrate is pressed evenly in all parts, reducing the overall warping of the substrate. The contact part 4 and the support part are symmetrical, so the substrate is subjected to uniform force. When the downward pressure spring 5 is compressed to the critical point, the bolt 3 moves upward relative to the bolt post 2, protecting the spring 6 from stretching. While improving the warping of the substrate, the pressure on the substrate is adjusted to avoid damage from excessive pressure and to prevent damage from excessive compression of the downward pressure spring 5.

[0048] S3: The transmission platform feeds the firmly pressed substrate into the coating chamber of the equipment. The mechanical pump evacuates the coating chamber to a low vacuum (approximately 1-10 Pa) to remove a large amount of air. Then, the molecular pump or diffusion pump is started to evacuate to a high vacuum (typically less than 1×10 Pa). - (³Pa), reducing the contamination of the membrane layer by residual gases (such as oxygen, water vapor, etc.), as residual gas impurities can lead to membrane defects or oxidation.

[0049] S4: Introduce argon or other chemically stable inert gases that do not readily react with the target or substrate and have appropriate ion mass into the vacuum chamber. Control the vacuum chamber pressure range to 0.1-10 Pa through valves. Excessive pressure will cause frequent particle collisions, affecting the flight distance of target atoms, while insufficient pressure will make it difficult to maintain plasma.

[0050] S5: The device drives the ionization of argon or other inert gases to form a plasma composed of electrons, ions, and neutral atoms.

[0051] S6: The target material is connected to the negative electrode (cathode), and the substrate is located in or near the positive electrode (anode). Under the action of the electric field, the positive ions in the plasma are accelerated and bombard the surface of the target material at high speed. The kinetic energy of the high-energy ions is transferred to the target material atoms, enabling some target material atoms to obtain enough energy to break free from the lattice bondage (i.e., "sputtering") and form neutral target material atoms or atomic groups.

[0052] S7: Target atoms (or atomic groups) generated by sputtering fly in a vacuum environment and eventually deposit on the substrate surface, forming a continuous and uniform thin film through diffusion, migration and condensation.

[0053] This invention relates to a coating equipment that employs dynamic coating, a coating process in which thin film deposition is completed while the substrate is in motion. It is widely used in the industrial production of large-size, high-volume substrates. Its core feature is that the substrate moves continuously via a conveyor belt or rollers, passing sequentially through a coating source, such as a sputtering target, to achieve continuous and efficient thin film deposition.

[0054] In dynamic coating, a transmission platform transports the substrate into the coating chamber of the equipment for coating. The substrate passes through the coating area at a certain stable speed (e.g., 0.5-10 m / min). The target is designed to be long and narrow, with a width slightly larger than the width of the substrate, to fully cover the width direction of the substrate. Moreover, the target only needs to cover the width direction of the substrate. The length direction of the substrate is fully covered by the transmission platform. During the movement of the substrate, each position along the length direction is sputtered in sequence, eventually forming a uniform thin film.

[0055] S8: Turn off the power, stop the gas supply, restore the vacuum chamber to normal pressure through the venting valve, remove the substrate, and complete the coating process.

[0056] Throughout the substrate coating process, the pressing device uses components such as bolt 3, bolt post 2, pressing spring 5, contact part 4, and protective spring 6 to press the substrate in real time and flexibly without compressing or damaging it, thereby reducing substrate warping and ensuring uniform coating.

[0057] In addition, during the sputtering process, the particles released by the target material do not only move towards the substrate, but diffuse in all directions, including towards the cover plate 1. After each coating is completed, a film layer will be deposited on the surface of the cover plate 1. With long-term use, the film layer gradually thickens, the adhesion between the film layer and the cover plate 1 becomes poor, and the film layer peels off, easily contaminating the substrate or coating cavity. The increased weight of the film layer affects the elastic relationship between the pressing spring 5 and the protective spring 6 of the pressing device, affecting the stability of the structural performance. Therefore, the cover plate 1 needs to be cleaned and deplated regularly, such as by using plasma etching or mechanical polishing to remove the surface film layer. Finally, sandblasting is performed on the surface of the cover plate 1. Sandblasting physically removes residual impurities through the mechanical impact of high-speed abrasives such as quartz sand. The surface of the cover plate 1 is cleaner, the surface roughness and hardness of the cover plate 1 are kept consistent, and the film layer is less likely to fall off and contaminate the substrate.

[0058] A coating apparatus includes the aforementioned substrate coating anti-warping pressing device, and also includes a support portion.

[0059] The support portion supports the substrate, and the support portion and the contact portion 4 are distributed correspondingly on the substrate from top to bottom. Both the support portion and the contact portion 4 are pressed onto the non-working area of ​​the substrate.

[0060] This utility model's pressing device and coating equipment including the pressing device can flexibly press the non-working area of ​​the substrate in real time without compressing or damaging the substrate during the entire substrate coating process through the cooperation of various components. When the pressing spring 5 is compressed to the critical point, the bolt 3 moves upward relative to the bolt post 2, protecting the spring 6 from stretching. While improving substrate warping, it adjusts the pressure on the substrate to avoid overpressure damage to the substrate and avoids damage due to excessive compression of the pressing spring 5, thereby reducing substrate warping and ensuring uniform coating. The contact part 4 and the support part are symmetrical vertically, and the substrate is subjected to uniform force. The structure is simple and reliable.

[0061] It is understood that this utility model has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this utility model. Furthermore, under the teachings of this utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this utility model are protected by this utility model.

Claims

1. A substrate coating anti-warping pressing device, comprising a cover plate, characterized in that, Also includes: Bolt studs penetrate the cover plate perpendicularly along its height. Bolts are inserted through the bolt post; The contact part is sleeved on the bottom end of the bolt, and a compression spring connected to the bottom end of the bolt is provided inside the contact part.

2. The substrate coating anti-warping pressing device according to claim 1, characterized in that, The pressing device also includes a protective spring to limit the relative displacement between the bolt and the bolt post and to ensure the bolt returns to its original position.

3. The substrate coating anti-warping pressing device according to claim 2, characterized in that, The bolt post has threads on its surface, and a positioning nut is provided at the upper and lower surfaces of the bolt post through the threaded engagement to secure the bolt post firmly.

4. The substrate coating anti-warping pressing device according to claim 3, characterized in that, The bolt is provided with a limiting nut at the top to prevent the bolt from sliding down from inside the bolt post.

5. The substrate coating anti-warping pressing device according to claim 4, characterized in that, One end of the protective spring is connected to the positioning nut, and the other end is connected to the limit nut.

6. The substrate coating anti-warping pressing device according to claim 5, characterized in that, The compressive stiffness of the contact portion is less than the stiffness coefficient of the compression spring, which in turn is less than the stiffness coefficient of the protective spring.

7. The substrate coating anti-warping pressing device according to claim 1, characterized in that, When the contact portion is pressed down, it is pressed into the non-working area of ​​the substrate.

8. The substrate coating anti-warping pressing device according to claim 1, characterized in that, The contact part is a hollow transparent tube, and the bottom end of the contact part is a flared opening.

9. The substrate coating anti-warping pressing device according to claim 8, characterized in that, The effective length of the contact portion is greater than the length of the compression spring in its initial state.

10. A coating apparatus, characterized in that, The substrate coating anti-warping pressing device according to any one of claims 1-9 further includes a support portion.

11. The coating equipment according to claim 10, characterized in that, The support portion supports the substrate, and the support portion and the contact portion are distributed vertically and vertically relative to the substrate. Both the support portion and the contact portion are pressed onto the non-working area of ​​the substrate.

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