A test device for a rotary mechanism of a semiconductor EPI apparatus
By integrating concentricity and sealing testing mechanisms into the testing device, the problem of low testing efficiency of rotating mechanisms in the prior art is solved, and efficient and accurate evaluation of rotating mechanisms is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI YUEJIANG IND CO LTD
- Filing Date
- 2025-12-05
- Publication Date
- 2026-07-24
AI Technical Summary
Existing rotating mechanism testing equipment is outdated and cannot perform rotational concentricity and sealing tests simultaneously on the same platform, resulting in low testing efficiency and inaccurate results.
A testing device integrating a concentricity testing mechanism and a sealing testing mechanism was designed. The concentricity and sealing performance of the rotating shaft are tested using a light curtain sensor and a pressure-holding connecting pipe. The concentricity and sealing performance are evaluated by measuring the edge position change and air pressure difference of the rotating shaft using the light curtain sensor.
This invention integrates concentricity and sealing tests for rotating mechanisms, simplifying the testing process and improving testing efficiency and accuracy.
Smart Images
Figure CN224552452U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and in particular relates to a testing device for the rotating mechanism of semiconductor EPI equipment. Background Technology
[0002] In the semiconductor field, EPI (Epoch-Proofing) equipment, or epitaxial growth equipment, is a key device used to grow an epitaxial layer of semiconductor material with specific properties on a semiconductor wafer. Each cavity in an EPI device is equipped with a rotation mechanism to lift and rotate the wafer within the cavity. This rotation mechanism must maintain its own rotational concentricity and a certain pressure while rotating. As the core moving component in wafer epitaxial growth, the rotational concentricity and pressure maintenance capabilities of the rotation mechanism directly determine the uniformity of the epitaxial layer and the stability of the process. Therefore, during the assembly stage, rotational concentricity testing and pressure holding testing are performed on the rotation mechanisms used for assembly.
[0003] Currently, the rotational concentricity test and pressure holding test of the rotating mechanism are performed separately in two testing devices, and the existing rotating mechanism testing devices are relatively outdated. For example, the concentricity test device uses a fixture and dial indicator to detect the concentricity of the wafer substrate; the dial indicator reading accuracy is poor, and after long-term use, the sensitivity of the front-end striker changes, leading to inaccurate test results. The pressure holding test requires a dedicated sealing test device, rather than being integrated into the platform where the rotating mechanism is located. In addition, the existing concentricity test device can only test either cylinder-driven or motor-driven rotating mechanisms, and cannot test two different types of rotating mechanisms on the same testing platform, making the testing process cumbersome and inefficient.
[0004] Therefore, it is necessary to provide a test apparatus for the rotating mechanism of semiconductor EPI equipment to simplify the test process and improve test efficiency. Utility Model Content
[0005] This invention provides a testing device for the rotating mechanism of semiconductor EPI equipment, which simplifies the testing process and improves testing efficiency.
[0006] To achieve the above objectives, this utility model provides the following technical solution: A testing device for a rotating mechanism in a semiconductor EPI device, the rotating mechanism comprising a rotating drive structure, a lifting drive structure, and a connecting structure, wherein the lifting drive structure is connected to the rotating drive structure to drive the rotating drive structure to move up and down, the rotating drive structure is connected to a rotating shaft to drive the rotating shaft to rotate, and the connecting structure is connected to the rotating drive structure and sleeved outside the rotating shaft, the connecting structure comprising a bellows and an upper connector, the bellows connecting the rotating drive structure and the upper connector, characterized in that the testing device comprises a machine base and a concentricity testing mechanism and a sealing testing mechanism disposed on the machine base, the top of the machine base is provided with a testing platform, the rotating mechanism is disposed in the machine base and the upper connector is embedded in the testing platform, the concentricity testing mechanism comprises a light curtain sensor and a moving positioning structure, the light curtain sensor comprising a receiving end and a transmitting end, the receiving end and the transmitting end being disposed opposite to each other on the moving positioning structure. When the mobile positioning structure extends, the receiving end and the transmitting end are respectively located on both sides of the rotating shaft. When the mobile positioning structure retracts, the light curtain sensor moves away from the rotating shaft. The sealing test mechanism includes a pressure-holding connecting pipe. One end of the pressure-holding connecting pipe is provided with a sealing connecting plate, and the other end is provided with a connecting interface. The sealing connecting plate is used to seal the connection with the upper connecting piece, and the connecting interface is used to connect to the vacuum detection system. During the concentricity test, the rotating shaft rises, the mobile positioning structure extends, the rotating shaft rotates, and the light curtain sensor measures the change in edge position during the rotation of the rotating shaft. During the sealing test, the rotating shaft descends, the mobile positioning structure retracts, the pressure-holding connecting pipe is sealed to the upper connecting piece through the sealing connecting plate, and the connecting interface is connected to the vacuum detection system. After evacuation, nitrogen is introduced into the rotating mechanism, and after a set pressure holding time, the pressure difference is measured.
[0007] Preferably, the mobile positioning structure includes a fixed plate and a sliding plate. The fixed plate is disposed on a test platform and has a slide rail. A slider is slidably disposed on the slide rail and fixed to the bottom of the sliding plate. The middle of the end of the sliding plate near the rotation axis is hollowed out. The receiving end and the transmitting end are respectively disposed on both sides of the end of the sliding plate near the rotation axis. When the sliding plate moves along the slide rail toward the rotation axis, the mobile positioning structure extends out. When the sliding plate moves along the slide rail away from the rotation axis, the mobile positioning structure retracts.
[0008] Preferably, the moving positioning structure further includes a moving cylinder, which is connected to the sliding plate, and the moving cylinder drives the sliding plate to move along the slide rail.
[0009] Preferably, the concentricity testing mechanism further includes a reflective sensor. During the concentricity test, the rotating shaft rises, and a wafer base is coaxially mounted on the top of the rotating shaft. The reflective sensor is mounted on the outside of the wafer base via a sensor bracket and is positioned relative to the outer wall of the wafer base to measure the change in distance between the outer wall and the wafer base as the rotating shaft rotates.
[0010] Preferably, it also includes a fastener, through which the upper connector is fixed to the test platform.
[0011] Preferably, the sealing connection pressure plate has a central hole, and the sealing connection pressure plate is sealed to the upper connecting member around the central hole. The sealing connection pressure plate is fixedly connected to the fixing member around its periphery by a pressure plate locking member.
[0012] Preferably, it further includes a control module, which connects to and controls the rotating mechanism, the moving positioning structure and the vacuum detection system, and the control module connects to the light curtain sensor to acquire measurement data.
[0013] Preferably, it also includes a touch screen, which is connected to the control module to display measurement data and test results.
[0014] Compared with the prior art, the technical solution of this utility model has beneficial effects.
[0015] For example, a testing apparatus for a rotating mechanism in a semiconductor EPI device includes a machine base and a concentricity testing mechanism and a sealing testing mechanism mounted on the machine base. A testing platform is located on top of the machine base. The rotating mechanism is housed within the machine base, and an upper connector is embedded in the testing platform. The concentricity testing mechanism includes a light curtain sensor and a moving positioning structure. The light curtain sensor includes a receiver and a transmitter, which are positioned opposite each other on the moving positioning structure. When the moving positioning structure extends, the receiver and transmitter are located on opposite sides of the rotating axis; when the moving positioning structure retracts, the light curtain sensor moves away from the rotating axis. The sealing testing mechanism includes a pressure-holding connecting tube, one end of which is provided with a sealing connection pressure. The plate has a connection interface at one end and a sealing connection plate for sealing connection with the upper connector. The connection interface is used to connect to the vacuum detection system. During the concentricity test, the rotating shaft rises, the moving positioning structure extends, the rotating shaft rotates, and the light curtain sensor measures the change in edge position during the rotation of the rotating shaft. During the sealing test, the rotating shaft descends, the moving positioning structure retracts, the pressure-holding connection pipe is sealed to the upper connector through the sealing connection plate, and the connection interface is connected to the vacuum detection system. After evacuation, nitrogen is introduced into the rotating mechanism, and after a set pressure holding time, the pressure difference is measured. This integrates the concentricity test and the sealing test on the same device, simplifying the testing process, improving testing efficiency, and enhancing the accuracy of the test results. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the test device for the rotation mechanism of a semiconductor EPI device in an embodiment of the present invention, when performing a concentricity test. Figure 2 This is a schematic diagram of the test device for the rotating mechanism of a semiconductor EPI device in an embodiment of the present invention, during a sealing test. Figure 3 This is a schematic diagram of the concentricity testing mechanism in an embodiment of this utility model; Figure 4 This is a schematic diagram of the sealing test mechanism in an embodiment of this utility model.
[0017] Explanation of reference numerals in the attached figures: 100 - Rotation mechanism; 101 - Rotation shaft; 102 - Upper connector; 103 - Wafer base; 1-Machine; 11-Testing platform; 2-Concentricity testing mechanism; 21-Light curtain sensor; 211-Receiver; 212-Transmitter; 22- 221-Moving positioning structure; 222-Fixed plate; 223-Sliding plate; 224-Moving cylinder; 25-Reflective sensor Device; 231-Sensor bracket; 3-Sealing test mechanism; 31-Pressure holding connection pipe; 32-Sealing connection pressure plate; 321-Pressure plate locking Component; 33 - Connection interface; 4-Factors; 5-Touchscreen. Detailed Implementation
[0018] To make the objectives, features, and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described below are merely for explaining this utility model and are not intended to limit it. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc., may be omitted.
[0019] Figure 1 This is a schematic diagram of the test device for the rotation mechanism of a semiconductor EPI device in an embodiment of the present invention, when performing a concentricity test. Figure 2 This is a schematic diagram of the test device for the rotating mechanism of a semiconductor EPI device in an embodiment of the present invention, during a sealing test. Figure 3 This is a schematic diagram of the concentricity testing mechanism in an embodiment of this utility model; Figure 4This is a schematic diagram of the sealing test mechanism in an embodiment of this utility model.
[0020] Reference Figures 1-4 This utility model provides a testing device for the rotation mechanism of a semiconductor EPI device.
[0021] The rotating mechanism 100 of the semiconductor EPI device includes a rotating drive structure (not shown), a lifting drive structure (not shown), and a connecting structure. The lifting drive structure is connected to the rotating drive structure to drive the rotating drive structure to move up and down. The rotating drive structure is connected to the rotating shaft 101 to drive the rotating shaft 101 to rotate. The connecting structure is connected to the rotating drive structure and sleeved outside the rotating shaft 101. The connecting structure includes a bellows (not shown) and an upper connector 102. The bellows connects the rotating drive structure and the upper connector 102. When applied to the semiconductor EPI device, the rotating drive structure is located at the bottom of the cavity, the upper connector 102 is sealed to the cavity, and the rotating shaft 101 extends into the cavity.
[0022] Specifically, the testing apparatus for the rotating mechanism of a semiconductor EPI device includes a machine base 1 and a concentricity testing mechanism 2 and a sealing testing mechanism 3 mounted on the machine base 1. A testing platform 11 is mounted on the top of the machine base 1. The rotating mechanism 100 is disposed within the machine base 1, and an upper connector 102 is embedded in the testing platform 11. The concentricity testing mechanism 2 includes a light curtain sensor 21 and a moving positioning structure 22. The light curtain sensor 21 includes a receiver 211 and a transmitter 212, which are positioned opposite each other on the moving positioning structure 22. When the moving positioning structure 22 is extended, the receiver 211 and the transmitter 212 are located on opposite sides of the rotating shaft 101. When the moving positioning structure 22 is retracted, the light curtain sensor 21 moves away from the rotating shaft 101. The sealing testing mechanism 3... The test mechanism 3 includes a pressure-holding connecting pipe 31. One end of the pressure-holding connecting pipe 31 is provided with a sealing connecting plate 32, and the other end is provided with a connecting interface 33. The sealing connecting plate 32 is used to seal and connect with the upper connecting member 102, and the connecting interface 33 is used to connect to a vacuum detection system (not shown). During the concentricity test, the rotating shaft 101 rises, the moving positioning structure 22 extends, the rotating shaft 101 rotates, and the light curtain sensor 21 measures the change in edge position when the rotating shaft 101 rotates. During the sealing test, the rotating shaft 101 falls, the moving positioning structure 22 retracts, the pressure-holding connecting pipe 31 is sealed and connected with the upper connecting member 102 through the sealing connecting plate 32, and the connecting interface 33 is connected to the vacuum detection system. After evacuation, nitrogen is introduced into the rotating mechanism 100, and after a pressure holding time is set, the pressure difference is measured.
[0023] Specifically, when the change in edge position measured by the light curtain sensor 21 during the rotation of the rotating shaft 101 is within the set allowable range, the concentricity is deemed to be qualified; otherwise, the concentricity is deemed to be unqualified. After the pressure holding time is set, when the measured air pressure difference is within the set allowable range, the sealing performance is deemed to be qualified; otherwise, the sealing performance is deemed to be unqualified.
[0024] Specifically, the vacuum detection system should use existing technology to achieve vacuuming and measure the negative pressure during vacuuming, and to achieve nitrogen filling and measure the pressure during nitrogen filling; no specific limitations are imposed here.
[0025] Specifically, during the sealing test, the pressure was evacuated to -0.1 MPa, then filled with nitrogen to 0.5 MPa, and the pressure difference was measured after holding the pressure for 30 minutes.
[0026] Specifically, by controlling the lifting drive structure of the rotating mechanism 100 itself to drive the rotating drive structure to rise and fall, the rotating mechanism 100 itself drives the rotating shaft 101 to rotate. Regardless of whether the drive structure of the rotating mechanism 100 itself is driven by a motor or a cylinder, concentricity testing can be achieved.
[0027] In some embodiments, the movable positioning structure 22 includes a fixed plate 221 and a sliding plate 222. The fixed plate 221 is disposed on the test platform 11. A slide rail (not shown) is disposed on the fixed plate 221. A slider (not shown) is slidably disposed on the slide rail. The slider is fixed to the bottom of the sliding plate 222. The middle of the end of the sliding plate 222 near the rotation axis 101 is hollowed out. The receiving end 211 and the transmitting end 212 are respectively disposed on both sides of the end of the sliding plate 222 near the rotation axis 101. When the sliding plate 222 moves along the slide rail toward the direction close to the rotation axis 101, the movable positioning structure 22 extends out. When the sliding plate 222 moves along the slide rail away from the rotation axis 101, the movable positioning structure 22 retracts.
[0028] In some embodiments, the movable positioning structure 22 further includes a movable cylinder 223, which is connected to the sliding plate 222 and drives the sliding plate 222 to move along the slide rail.
[0029] In some embodiments, the concentricity testing mechanism 2 further includes a reflective sensor 23. During the concentricity test, the rotating shaft 101 rises, and a wafer base 103 is coaxially mounted on the top of the rotating shaft 101. The reflective sensor 23 is mounted on the outside of the wafer base 103 via a sensor bracket 231 and is positioned relative to the outer wall of the wafer base 103. It is used to measure the change in the distance between the outer wall of the wafer base 103 and the outer wall as the rotating shaft 101 rotates.
[0030] Specifically, when the change in distance between the outer wall and the rotating shaft 101 measured by the reflective sensor 23 exceeds the set allowable range, the concentricity is deemed unqualified.
[0031] The accuracy of the detection results is improved by simultaneously measuring concentricity using a light curtain sensor 21 and a reflective sensor 23.
[0032] In some embodiments, a fastener 4 is also included, through which the upper connector 102 is fixed to the test platform 11.
[0033] In some embodiments, the sealing connection pressure plate 32 has a central hole, and the sealing connection pressure plate 32 is sealed to the upper connector 102 around the central hole. The sealing connection pressure plate 32 is fixedly connected to the fixing member 4 around its periphery by the pressure plate locking member 321.
[0034] Specifically, the pressure plate locking component 321 is a screw.
[0035] In some embodiments, a control module (not shown) is also included. The control module is disposed in the machine base 1. The control module is connected to and controls the rotating mechanism 100, the moving positioning structure 22 and the vacuum detection system. The control module is connected to the light curtain sensor 21 to acquire measurement data.
[0036] Specifically, the control module connects to the reflective sensor 23 to acquire measurement data; the control module connects to the vacuum detection system to acquire measurement data.
[0037] In some embodiments, a touch screen 5 is also included, which is connected to the control module to display measurement data and test results.
[0038] In summary, the testing device for the rotating mechanism of a semiconductor EPI device provided by this utility model includes a machine base 1 and a concentricity testing mechanism 2 and a sealing testing mechanism 3 disposed on the machine base 1. A testing platform 11 is provided on the top of the machine base 1. The rotating mechanism 100 is disposed in the machine base 1, and the upper connecting member 102 is embedded in the testing platform 11. The concentricity testing mechanism 2 includes a light curtain sensor 21 and a moving positioning structure 22. The light curtain sensor 21 includes a receiving end 211 and a transmitting end 212, which are arranged opposite to each other on the moving positioning structure 22. When the moving positioning structure 22 is extended, the receiving end 211 and the transmitting end 212 are located on both sides of the rotating shaft 101. When the moving positioning structure 22 is retracted, the light curtain sensor 21 moves away from the rotating shaft 101. The sealing testing mechanism 3 includes a pressure-holding connecting pipe 31. One end of component 1 is provided with a sealing connection plate 32, and the other end is provided with a connection interface 33. The sealing connection plate 32 is used to seal and connect with the upper connector 102, and the connection interface 33 is used to connect to a vacuum detection system (not shown). During the concentricity test, the rotating shaft 101 rises, the moving positioning structure 22 extends, the rotating shaft 101 rotates, and the light curtain sensor 21 measures the change in edge position when the rotating shaft 101 rotates. During the sealing test, the rotating shaft 101 falls, the moving positioning structure 22 retracts, the pressure holding connection pipe 31 is sealed and connected to the upper connector 102 through the sealing connection plate 32, and the connection interface 33 is connected to the vacuum detection system. After evacuation, nitrogen is introduced into the rotating mechanism 100. After a set pressure holding time, the pressure difference is measured. This integrates the concentricity test and the sealing test in the same device, simplifies the test process, improves test efficiency, and enhances the accuracy of the test results.
[0039] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of this utility model disclosure, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this utility model disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and may be derived from the technical features of the respective independent claims in any suitable manner rather than solely by the specific combinations listed in the claims.
[0040] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. A testing device for a rotating mechanism of a semiconductor EPI device, the rotating mechanism comprising a rotating drive structure, a lifting drive structure, and a connecting structure, wherein the lifting drive structure is connected to the rotating drive structure to drive the rotating drive structure to move up and down, the rotating drive structure is connected to a rotating shaft to drive the rotating shaft to rotate, and the connecting structure is connected to the rotating drive structure and sleeved outside the rotating shaft, the connecting structure comprising a bellows and an upper connector, the bellows connecting the rotating drive structure and the upper connector, characterized in that, The testing apparatus includes a machine base and a concentricity testing mechanism and a sealing testing mechanism mounted on the machine base. A testing platform is located on the top of the machine base. The rotating mechanism is disposed within the machine base, and the upper connecting member is embedded in the testing platform. The concentricity testing mechanism includes a light curtain sensor and a moving positioning structure. The light curtain sensor includes a receiving end and a transmitting end, which are positioned opposite each other on the moving positioning structure. When the moving positioning structure is extended, the receiving end and the transmitting end are located on opposite sides of the rotating axis; when the moving positioning structure is retracted, the light curtain sensor moves away from the rotating axis. The sealing testing mechanism includes a... The pressure-holding connecting pipe has a sealing connecting plate at one end and a connecting interface at the other end. The sealing connecting plate is used to seal the connection with the upper connecting piece, and the connecting interface is used to connect to a vacuum detection system. During the concentricity test, the rotating shaft rises, the moving positioning structure extends, the rotating shaft rotates, and the light curtain sensor measures the change in edge position during the rotation of the rotating shaft. During the sealing test, the rotating shaft descends, the moving positioning structure retracts, the pressure-holding connecting pipe is sealed to the upper connecting piece through the sealing connecting plate, and the connecting interface is connected to the vacuum detection system. After evacuation, nitrogen is introduced into the rotating mechanism, and after a set pressure holding time, the pressure difference is measured.
2. The testing apparatus for the rotating mechanism of a semiconductor EPI device according to claim 1, characterized in that, The mobile positioning structure includes a fixed plate and a sliding plate. The fixed plate is disposed on a test platform and has a slide rail. A slider is slidably disposed on the slide rail and fixed to the bottom of the sliding plate. The middle of the end of the sliding plate near the rotation axis is hollowed out. The receiving end and the transmitting end are respectively disposed on both sides of the end of the sliding plate near the rotation axis. When the sliding plate moves along the slide rail toward the rotation axis, the mobile positioning structure extends out. When the sliding plate moves along the slide rail away from the rotation axis, the mobile positioning structure retracts.
3. The testing apparatus for the rotating mechanism of a semiconductor EPI device according to claim 2, characterized in that, The moving positioning structure also includes a moving cylinder, which is connected to the sliding plate and drives the sliding plate to move along the slide rail.
4. The testing apparatus for the rotating mechanism of a semiconductor EPI device according to claim 2, characterized in that, The concentricity testing mechanism also includes a reflective sensor. During the concentricity test, the rotating shaft rises, and a wafer base is coaxially mounted on the top of the rotating shaft. The reflective sensor is mounted on the outside of the wafer base via a sensor bracket and is positioned relative to the outer wall of the wafer base. It is used to measure the change in the distance between the outer wall and the wafer base as the rotating shaft rotates.
5. The testing apparatus for the rotating mechanism of a semiconductor EPI device according to claim 1, characterized in that, It also includes a fastener, through which the upper connector is fixed to the test platform.
6. The testing apparatus for the rotating mechanism of a semiconductor EPI device according to claim 5, characterized in that, The sealing connection pressure plate has a central hole, and the sealing connection pressure plate is sealed to the upper connecting member around the central hole. The sealing connection pressure plate is fixedly connected to the fixing member around its periphery by a pressure plate locking member.
7. The testing apparatus for the rotating mechanism of a semiconductor EPI device according to claim 1, characterized in that, It also includes a control module, which connects to and controls the rotating mechanism, the moving positioning structure and the vacuum detection system, and the control module connects to the light curtain sensor to acquire measurement data.
8. The testing apparatus for the rotating mechanism of a semiconductor EPI device according to claim 7, characterized in that, It also includes a touch screen, which is connected to the control module to display measurement data and test results.