A detection module of a charger heat sink plate

Abstract

The application relates to the technical field of charger structure, in particular to a detection module of a charger heat dissipation plate, which comprises a circuit mainboard, a heat dissipation plate is arranged on the circuit mainboard, a detection element for monitoring the temperature of the heat dissipation plate is arranged on one side of the circuit mainboard located on the heat dissipation plate, and a wire assembly is further arranged on one side of the heat dissipation plate close to the detection element. The heat dissipation plate is arranged on the circuit mainboard, the detection element for monitoring the temperature of the heat dissipation plate is arranged on one side of the circuit mainboard located on the heat dissipation plate, so that the real-time temperature of the heat dissipation plate during work can be monitored through the detection element; the wire assembly is further arranged on one side of the heat dissipation plate close to the detection element, so that the detection element can be limited and guided through the wire assembly, the end of the detection element is ensured to abut against the heat dissipation plate, the accuracy of temperature detection is prevented from being affected by the deviation of the detection element, the detection element is limited and guided, and the temperature monitoring accuracy of the heat dissipation plate is ensured.

Description

Technical Field

[0001] This application relates to the field of charger structure technology, and in particular to a detection module for a charger heat sink. Background Technology

[0002] With the continuous development of technology, the types and production volume of electronic devices are increasing, leading to a greater demand for circuit boards. To prevent internal components from causing excessive heat and damaging the circuit board, existing circuit boards typically have a heat sink soldered inside. To monitor the heat sink's efficiency and operating status, a temperature probe is installed inside the circuit board, resting against the heat sink. However, existing temperature probes lack guiding and limiting structures, making them prone to misalignment due to movement, thus affecting the accuracy of heat sink temperature detection. Utility Model Content

[0003] To address the aforementioned technical problems, this application provides a detection module for a charger heat sink, including a circuit board with a heat sink disposed on the circuit board. A detection element for monitoring the temperature of the heat sink is disposed on one side of the circuit board near the heat sink. A wire assembly is also disposed on the side of the heat sink near the detection element to limit and guide the detection element, thereby ensuring the accuracy of heat sink temperature monitoring.

[0004] Preferably, the detection element includes a detection module, and a temperature probe is installed in the detection module. The temperature probe is attached to the heat sink through the wire assembly to monitor the temperature of the heat sink.

[0005] Preferably, the wire assembly includes a mounting base, a plurality of guide and limiting blocks are spaced apart along the height direction on the mounting base, a wire bundle block is provided at the top of the mounting base, and an adjustment component is also provided on the side of the wire bundle block facing the heat sink to limit and guide the temperature sensing probe and avoid the temperature sensing probe from deviating and affecting accuracy.

[0006] Preferably, the cable bundle includes a mounting block disposed at the top of the mounting base, a rotating shaft is rotatably disposed on the mounting block, a first cable bundle ring and a second cable bundle ring are respectively connected to both sides of the rotating shaft, and a snap-fit ​​block is disposed on the first cable bundle ring to fasten to the second cable bundle ring, thereby guiding and bending the cable portion of the temperature sensing probe to ensure that the end of the temperature sensing probe faces the heat sink.

[0007] Preferably, the adjustment assembly includes a fixed frame, with a plurality of adjustment knobs arranged in a ring around the fixed frame, and an adjustment ring threaded to the adjustment knobs inside the fixed frame, thereby adjusting the end contact of the temperature sensing probe.

[0008] Preferably, the center of the wire harness block and the center of the adjustment ring are located on the same axis.

[0009] As can be seen from the above, the following beneficial effects can be obtained by applying the method provided in this application: This application provides a heat sink on a circuit board, a detection element for monitoring the temperature of the heat sink is provided on one side of the circuit board near the heat sink, and a wire assembly is also provided on the side of the heat sink near the detection element. By providing a heat sink on the circuit board and a detection element for monitoring the temperature of the heat sink on one side of the circuit board near the heat sink, the real-time operating temperature of the heat sink can be monitored through the detection element. Furthermore, by providing a wire assembly on the side of the heat sink near the detection element, the detection element can be limited and guided by the wire assembly, ensuring that the end of the detection element abuts against the heat sink, preventing the detection element from shifting and affecting the accuracy of temperature detection, thus achieving the limiting and guiding of the detection element and ensuring the accuracy of heat sink temperature monitoring. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments of this application or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only a part of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the charger module according to an embodiment of this application;

[0012] Figure 2 Examples of this application Figure 1 Enlarged view of part A in the image.

[0013] Figure Labels

[0014] 10. Circuit board; 11. Heat sink; 12. Detection element; 13. Wire assembly; 121. Detection module; 122. Temperature probe; 131. Mounting base; 132. Guide limit block; 133. Wire bundle block; 134. Adjustment assembly; 1331. Mounting block; 1332. Rotating shaft; 1333. First wire bundle ring; 1334. Second wire bundle ring; 1335. Snap-fit ​​block; 1341. Fixing bracket; 1342. Adjustment knob; 1343. Adjustment ring. Detailed Implementation

[0015] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0016] Example

[0017] To address the aforementioned technical problems, this embodiment provides a detection module for a charger heat sink, such as... Figure 1 As shown, the circuit includes a main board 10, a heat sink 11, and a detection element 12 for monitoring the temperature of the heat sink 11 on one side of the main board 10. A wire assembly 13 is also provided on the side of the heat sink 11 near the detection element 12. By providing a heat sink 11 on the main board 10 and a detection element 12 for monitoring the temperature of the heat sink 11 on one side of the main board 10, the real-time operating temperature of the heat sink 11 can be monitored through the detection element 12. Furthermore, by providing a wire assembly 13 on the side of the heat sink 11 near the detection element 12, the detection element 12 can be limited and guided by the wire assembly 13, ensuring that the end of the detection element 12 abuts against the heat sink 11. This prevents the detection element 12 from shifting and affecting the accuracy of temperature detection, thus achieving the limiting and guiding of the detection element 12 and ensuring the accuracy of heat sink temperature monitoring.

[0018] Specifically, such as Figure 2 As shown, the detection element 12 includes a detection module 121, on which a temperature probe 122 is installed. The temperature probe 122 is attached to the heat sink 11 via a wire assembly 13. By providing a detection module 121 on the circuit board 10, and extending the temperature probe 122 to contact the heat sink 11, the real-time temperature of the heat sink 11 can be detected by the temperature probe 122. The temperature probe 122 is then guided and limited by the wire assembly 13. Thus, when detecting the temperature of the heat sink 11, the temperature probe 122 can effectively avoid misalignment of its end due to shaking, thereby effectively ensuring the accuracy of temperature detection and realizing the monitoring of the temperature of the heat sink 11.

[0019] In the above scheme, the wire assembly 13 includes a mounting base 131, with a plurality of guide limiting blocks 132 spaced apart along the height direction on the mounting base 131, and a wire harness block 133 at the top of the mounting base 131. An adjustment component 134 is also provided on the side of the wire harness block 133 facing the heat sink 11. By spaced apart along the height direction on the mounting base 131, the cable portion of the temperature sensor 122 can be guided and limited by the guide limiting blocks 132. Furthermore, by providing the wire harness block 133 at the top of the mounting base 131, the temperature sensor 122 can be... The cable portion of 22 is bent so that the end of the temperature probe 122 faces the heat sink 11, preventing the bent portion of the temperature probe 122 cable from warping and causing misalignment. Furthermore, an adjustment component 134 is provided on the side of the cable bundle 133 facing the heat sink 11, which allows the end of the temperature probe 122 to be adjusted and limited. This allows the contact point of the temperature probe with the heat sink 11 to be adjusted as needed, and further limits the end of the temperature probe 122 to prevent misalignment, thus achieving limiting and guiding the temperature probe 122 and preventing the temperature probe 122 from shifting and affecting accuracy.

[0020] Furthermore, the cable harness block 133 includes a mounting block 1331 disposed at the top of the mounting base 131. A rotating shaft 1332 is rotatably disposed on the mounting block 1331. A first cable harness ring 1333 and a second cable harness ring 1334 are respectively connected to both sides of the rotating shaft 1332. A snap-fit ​​block 1335 is provided on the first cable harness ring 1333 to engage with the second cable harness ring 1334. By rotatably disposing of the rotating shaft 1332 on the mounting block 1331 and connecting the first cable harness ring 1333 and the second cable harness ring 1334 to both sides of the rotating shaft 1332, it is possible to... Rotating shaft 1332 adjusts the first wire harness 1333 and the second wire harness 1334, thereby bending and fixing the temperature probe 122 cable passing through the wire harness. Then, by setting a snap-fit ​​block 1335 in the first wire harness 1333 that is fastened to the second wire harness 1334, the first wire harness 1333 and the second wire harness 1334 can be closed or opened by snap-fit ​​block 1335, thereby adjusting the bending and fixing or unbending of the temperature probe 122 cable, so as to guide the bending of the cable portion of the temperature probe 122 and ensure that the end of the temperature probe 122 faces the heat sink 11.

[0021] To adapt to monitoring requirements and adjust the position of the end contact of the temperature probe 122, in a preferred embodiment, the adjustment assembly 134 includes a fixing frame 1341. Several sets of adjustment knobs 1342 are arranged in a ring around the fixing frame 1341. An adjustment ring 1343 connected to the adjustment knobs 1342 is disposed within the fixing frame 1341. By arranging several sets of adjustment knobs 1342 in a ring around the fixing frame 1341 and providing adjustment rings 1343 within the fixing frame 1341, the relative position of each adjustment ring 1343 can be adjusted via the adjustment knobs 1342. This allows the adjustment rings 1343 to contact and guide the end of the temperature probe 122, thereby adjusting the contact point of the temperature probe 122 at the heat sink 11, thus achieving adjustment of the end contact point of the temperature probe 122.

[0022] Specifically, the center of the wire harness block 133 and the center of the adjustment ring 1343 are located on the same axis. By aligning the center of the wire harness block 133 and the center of the adjustment ring 1343 on the same axis, when the temperature sensor 122 is bundled and fixed by the wire harness block 133, the end of the temperature sensor 122 can be simultaneously guided and fixed by the adjustment ring 1343, thus completing the overall outgoing and fixing of the temperature sensor 122, preventing the temperature sensor 122 from shifting or misaligning, and ensuring the accuracy of the heat sink temperature monitoring.

[0023] In summary, in one or more embodiments of this application, this application provides a detection module for a charger heat sink, including a circuit board with a heat sink. A detection element for monitoring the heat sink temperature is located on one side of the circuit board near the heat sink. A wire assembly is also provided on the side of the heat sink near the detection element. By providing a heat sink on the circuit board and a detection element for monitoring the heat sink temperature on one side of the circuit board near the heat sink, the real-time operating temperature of the heat sink can be monitored through the detection element. Furthermore, by providing a wire assembly on the side of the heat sink near the detection element, the detection element can be limited and guided by the wire assembly, ensuring that the end of the detection element abuts against the heat sink, preventing the detection element from shifting and affecting the accuracy of temperature detection. This achieves the limitation and guidance of the detection element, ensuring the accuracy of heat sink temperature monitoring.

[0024] The embodiments described above do not constitute a limitation on the scope of protection of this technical solution. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the above embodiments should be included within the scope of protection of this technical solution.

Claims

1. A detection module for a charger heat sink, characterized in that: The circuit board (10) includes a heat sink (11) on the circuit board (10), a detection element (12) for monitoring the temperature of the heat sink (11) is provided on the side of the circuit board (10) located on the heat sink (11), and a wire assembly (13) is also provided on the side of the heat sink (11) near the detection element (12).

2. The detection module for the charger heat sink according to claim 1, characterized in that: The detection element (12) includes a detection module (121), and a temperature probe (122) is installed in the detection module (121). The temperature probe (122) is attached to the heat sink (11) through the wire assembly (13).

3. The detection module for the charger heat sink according to claim 2, characterized in that: The wire assembly (13) includes a mounting base (131), a plurality of guide limiting blocks (132) are provided at intervals along the height direction on the mounting base (131), a wire bundle block (133) is provided at the top of the mounting base (131), and an adjustment component (134) is also provided on the side of the wire bundle block (133) facing the heat sink (11).

4. The detection module for the charger heat sink according to claim 3, characterized in that: The wire harness block (133) includes a mounting block (1331) disposed at the top of the mounting base (131), a rotating shaft (1332) is rotatably disposed on the mounting block (1331), a first wire harness ring (1333) and a second wire harness ring (1334) are respectively connected to both sides of the rotating shaft (1332), and a snap-fit ​​block (1335) is disposed on the first wire harness ring (1333) to engage with the second wire harness ring (1334).

5. The detection module for the charger heat sink according to claim 3, characterized in that: The adjustment assembly (134) includes a fixed frame (1341), a plurality of adjustment knobs (1342) are arranged in a ring on the fixed frame (1341), and an adjustment ring (1343) connected to the adjustment knobs (1342) is provided in the fixed frame (1341).

6. The detection module for the charger heat sink according to claim 5, characterized in that: The center of the wire harness block (133) and the center of the adjusting ring (1343) are on the same axis.

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