QSFP-CWDM heat dissipation structure based on TO-CAN scheme
By employing TO-CAN packaged independent laser components and a distributed layout structure in the QSFP-CWDM optical module, the heat concentration and thermal crosstalk caused by laser integration are resolved, achieving efficient heat dissipation and cost reduction.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MAO XUN LTD
- Filing Date
- 2025-10-17
- Publication Date
- 2026-07-24
AI Technical Summary
Existing QSFP-CWDM optical modules suffer from problems such as heat concentration, severe thermal crosstalk, and high cost due to the high integration of lasers.
The TO-CAN-based solution is adopted, in which four laser components are independently packaged and distributed in the optical module housing through the mounting structure. High thermal conductivity materials are used to achieve heat dissipation, avoid thermal crosstalk and reduce costs.
It effectively disperses heat sources, solves the problem of thermal crosstalk, reduces module costs, and improves heat dissipation efficiency.
Smart Images
Figure CN224553543U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical module heat dissipation technology, specifically to a QSFP-CWDM heat dissipation structure based on the TO-CAN scheme. Background Technology
[0002] With the explosive growth of global data traffic, the demand for high-speed optical transceiver modules in data centers and optical transmission networks is increasing rapidly. QSFP (Quad Small Form-factor Pluggable) packaging, due to its high density and hot-pluggable characteristics, has become the mainstream standard for 40Gbps, 100Gbps, and higher speed interfaces. Among them, CWDM (Coarse Wavelength Division Multiplexing) technology achieves a highly cost-effective bandwidth increase by transmitting four different wavelengths of optical signals on a single optical fiber.
[0003] A typical QSFP-CWDM optical module contains four independent lasers, each corresponding to a different CWDM wavelength. These lasers are the main heat sources in the module, consuming several watts of power in total, and their performance (such as wavelength stability, output optical power, and lifespan) is extremely sensitive to operating temperature. Therefore, efficient and reliable heat dissipation is crucial to ensuring the performance and stability of the QSFP-CWDM module.
[0004] Current mainstream technologies typically integrate four laser chips into a complex, hermetic package (such as a "box" or butterfly package) called a TOSA (Transmitter Optical Sub-Assembly). In this approach, the four lasers are soldered side-by-side onto a common substrate with minimal spacing between them. The drawbacks of this design are obvious: Highly concentrated heat: The simultaneous operation of four lasers forms a "point heat source" with extremely high power density, putting enormous pressure on the heat dissipation of the module's casing.
[0005] Severe thermal crosstalk: The heat generated by one laser can be easily conducted to adjacent lasers, causing the temperature of each channel to affect each other, making precise temperature control difficult.
[0006] High cost and complex process: The highly integrated TOSA module packaging process is complex and requires the use of expensive temperature control components such as TEC (Thermo-Electric Cooler), which significantly increases the material cost, assembly difficulty and power consumption of the optical module.
[0007] Therefore, there is an urgent need for a low-cost, high-efficiency, and simple heat dissipation solution to solve the thermal management problem inside QSFP-CWDM modules. Summary of the Invention
[0008] This invention aims to solve the problems of heat concentration, severe thermal crosstalk, high cost and complex process caused by the high integration of lasers in existing QSFP-CWDM optical modules, and provides an innovative heat dissipation structure based on standard discrete devices and achieving efficient heat dissipation through optimized spatial layout.
[0009] This utility model is achieved through the following technical solution: A QSFP-CWDM heat dissipation structure based on a TO-CAN solution is applied inside the housing of an optical module, comprising: At least four independent laser assemblies, each laser assembly being in an independent TO-CAN package; and a mounting structure for securing the laser assemblies; The mounting structure is disposed inside the optical module housing and has at least four mutually separate mounting parts, each mounting part being used to fix one of the TO-CAN packaged laser components, such that the at least four laser components are distributed in a distributed manner within the optical module housing.
[0010] The mounting structure has at least four mounting portions arranged to distribute the laser components crosswise in four different areas inside the optical module housing, and the mounting portions are connected by connecting portions.
[0011] The mounting structure is a support component that is integrally formed with or detachably connected to the housing of the optical module.
[0012] Each of the mounting sections is designed to enable the TO-CAN packaged laser assembly mounted thereon to form thermally conductive contact with the inner wall of the optical module housing.
[0013] The distributed layout is a linear array layout along the length or width of the optical module housing.
[0014] The mounting structure is provided with positioning holes or clamping slots for each TO-CAN packaged laser component, which are used to fix the laser component and separate it in space.
[0015] The beneficial effects of this utility model are: This invention discloses a QSFP-CWDM heat dissipation structure based on the TO-CAN scheme, which disperses the concentrated heat source into four independent small heat sources with considerable spacing. Since each laser component is clearly separated in physical space, the heat conduction path between them is effectively lengthened and blocked, fundamentally solving the thermal crosstalk problem caused by close-range layout and ensuring the independence and stability of each optical signal channel. Attached Figure Description
[0016] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.
[0017] Figure 1 This is a three-dimensional structural diagram of the present invention.
[0018] Figure Labels Installation structure--100, mounting part--101, connecting part--102. Detailed Implementation
[0019] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.
[0020] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0022] like Figure 1 As shown, this embodiment provides a QSFP-CWDM heat dissipation structure based on the TO-CAN scheme, which is applied to standard four-channel optical modules such as QSFP-CWDM. The core idea of this structure is to spatially distribute the four lasers, which are the main heat sources, inside the module.
[0023] Specifically, this invention employs at least four independent laser components. Unlike traditional solutions, each laser component here utilizes a mature, low-cost TO-CAN package. The TO-CAN package is a cylindrical, hermetically sealed metal package with excellent thermal conductivity.
[0024] To secure and position these four independent laser components, this invention provides a mounting structure. This mounting structure is located inside the optical module housing and has at least four separate mounting portions. Each mounting portion is specifically designed to mount one TO-CAN packaged laser component.
[0025] The key to this design lies in securing the four laser components within the optical module housing in a distributed layout, guided by the mounting structure. For example, these four mounting sections can be designed as a linear array evenly arranged along the length or width of the optical module housing. This layout ensures sufficient physical distance between any two adjacent lasers.
[0026] In a preferred embodiment, the four mounting portions on the mounting structure are configured to distribute the laser components crosswise in four different quadrants or regions inside the optical module housing, and all mounting portions are connected by connecting portions. Preferably, all mounting portions and connecting portions are integrally formed. This crosswise distribution layout maximizes the utilization of the entire housing's heat dissipation area, avoids the formation of local hot spots, and results in a more uniform temperature distribution within the housing, achieving optimal overall heat dissipation.
[0027] To ensure unobstructed heat dissipation, each mounting section is designed to allow the TO-CAN-encapsulated laser assembly mounted on it to form efficient thermally conductive contact with the inner wall of the optical module housing. For example, the mounting structure itself can be made of a highly thermally conductive metal (such as copper or aluminum alloy), and the mounting section for securing the TO-CAN can be directly or through a thermal interface material to fit tightly against the inner wall of the optical module housing. In this way, the heat generated by each TO-CAN laser can be rapidly conducted away through this short and efficient path of the TO-CAN housing, the mounting section, and the optical module housing.
[0028] In terms of manufacturing, the mounting structure can be designed flexibly. It can be an internal boss or bracket integrally formed during the manufacturing of the optical module shell (usually a zinc alloy or aluminum alloy die casting); or it can be a separately machined support component that is detachably connected to the shell during assembly by means of screws or clips. The latter has more advantages in terms of assembly flexibility.
[0029] To ensure precise installation, the mounting structure features pre-designed positioning holes or clamping slots for each TO-CAN packaged laser component. During assembly, simply insert the TO-CAN laser's pins or sockets into the positioning holes or clamping slots for quick and accurate fixation and spatial separation.
[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.
Claims
1. A QSFP-CWDM heat dissipation structure based on a TO-CAN scheme, applied inside the housing of an optical module, characterized in that, include: At least four independent laser components, each in its own TO-CAN package; And a mounting structure for fixing the laser assembly; The mounting structure is disposed inside the optical module housing and has at least four mutually separate mounting parts, each mounting part being used to fix one of the TO-CAN packaged laser components, such that the at least four laser components are distributed in a distributed manner within the optical module housing.
2. The heat dissipation structure according to claim 1, characterized in that: At least four mounting portions on the mounting structure are configured to distribute the laser components crosswise in four different areas inside the optical module housing, and the mounting portions are connected by connecting portions.
3. The heat dissipation structure according to claim 1 or 2, characterized in that: The mounting structure is a support component that is integrally formed with or detachably connected to the housing of the optical module.
4. The heat dissipation structure according to claim 1, characterized in that: Each of the mounting sections is designed to allow the TO-CAN packaged laser assembly mounted thereon to form thermally conductive contact with the inner wall of the optical module housing.
5. The heat dissipation structure according to claim 1, characterized in that: The distributed layout is a linear array layout along the length or width of the optical module housing.
6. The heat dissipation structure according to claim 1, characterized in that: The mounting structure is provided with positioning holes or clamping slots for each TO-CAN packaged laser component, which are used to fix the laser component and separate it in space.