A superimposed aluminum-copper composite heat dissipation module

Abstract

The utility model discloses a kind of superimposed aluminium-copper composite heat dissipation modules, including pedestal and superimposed composite heat sink, the bottom of the pedestal is equipped with the heat conduction plane that is attached with CPU surface, the superimposed composite heat sink is fixedly connected above the pedestal, the superimposed composite heat sink is by at least two aluminium heat dissipation layers and copper heat conduction layer of height direction stacking and fixed connection along pedestal composition.Copper heat conduction layer exports CPU high heat quickly, its thermal diffusion speed is substantially promoted compared with pure aluminium, and the expansion heat dissipation area of aluminium heat dissipation layer is increased by 50%-80% compared with single-layer structure, form "quick heat conduction-high efficiency heat dissipation" gradient system, thermal resistance is reduced by 35%-45% compared with pure aluminium module, and temperature uniformity is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation module technology, specifically a superimposed aluminum-copper composite heat dissipation module. Background Technology

[0002] In the field of electronic information, the integration and power consumption of high-performance CPUs continue to increase, posing a dual challenge to traditional heat dissipation modules in terms of thermal conductivity and structural design. While existing pure aluminum heat dissipation solutions are low-cost, their low thermal conductivity makes them ill-suited for handling localized hotspots generated by high-frequency heating. Pure copper modules, despite their excellent thermal conductivity, are heavy, expensive, and difficult to manufacture, failing to meet the demands of lightweight devices. Multi-layer composite heat dissipation structures are widely used, but traditional press-fit or thermal grease connections suffer from high interfacial thermal resistance (typically >0.2K / W) and susceptibility to aging and failure over long-term service, leading to a significant decrease in heat dissipation efficiency. Furthermore, single-material fin layouts easily create airflow blind spots, limiting the improvement of convective heat transfer coefficients and making it difficult to achieve efficient heat exchange within a compact space. Utility Model Content

[0003] To overcome the shortcomings of existing technical solutions, this utility model provides a superimposed aluminum-copper composite heat dissipation module, which can effectively solve the problems mentioned in the background art.

[0004] The technical solution adopted by this utility model to solve its technical problem is: A stacked aluminum-copper composite heat dissipation module includes a base and a stacked composite heat sink. The bottom of the base is provided with a heat-conducting plane that is in contact with the CPU surface. The stacked composite heat sink is fixedly connected to the top of the base. The stacked composite heat sink is composed of at least two layers of aluminum heat dissipation layer and copper heat-conducting layer that are stacked and fixed along the height direction of the base. The bottom copper heat-conducting layer is directly fixed to the upper surface of the base, and the adjacent aluminum heat-dissipating layer and the copper heat-conducting layer, as well as the bottom copper heat-conducting layer and the base, are all mechanically connected by brazing.

[0005] As a further description of the above technical solution, the copper heat-conducting layer includes a central heat-conducting pillar and copper heat-dissipating fins extending radially outward from the central heat-conducting pillar. The aluminum heat-dissipating layer includes an annular aluminum substrate surrounding the central heat-conducting pillar and aluminum heat-dissipating fins extending radially outward and upward from the annular aluminum substrate. The copper heat-dissipating fins and the aluminum heat-dissipating fins are combined to form a stepped, staggered heat dissipation structure.

[0006] As a further description of the above technical solution, in adjacent layers, the lower surface of the aluminum heat dissipation fins in the upper layer partially overlaps with the upper surface of the copper heat dissipation fins in the lower layer and is fixedly connected by diffusion welding.

[0007] As a further description of the above technical solution, the total number of layers of the superimposed composite heat sink is 3 to 7.

[0008] As a further description of the above technical solution, the top layer is an aluminum heat dissipation layer.

[0009] As a further description of the above technical solution, it also includes an auxiliary heat dissipation cover plate disposed on the top of the superimposed composite heat sink, wherein the auxiliary heat dissipation cover plate is an aluminum plate or a copper plate.

[0010] As a further description of the above technical solution, the side of the base and the outermost side of the superimposed composite heat sink are provided with reinforced heat dissipation fins.

[0011] As a further description of the above technical solution, a heat spreader or heat pipe is embedded inside the base, and the evaporation end of the heat spreader or heat pipe is attached.

[0012] Compared with the prior art, the beneficial effects of this utility model are: The present invention discloses a stacked aluminum-copper composite heat dissipation module, which has at least one of the following beneficial effects during use: The copper thermal conductive layer rapidly dissipates the high heat from the CPU, with a significantly faster heat diffusion rate compared to pure aluminum. Combined with an aluminum heatsink layer, the heat dissipation area is increased by 50%-80% compared to a single-layer structure, forming a "rapid heat conduction - efficient heat dissipation" gradient system. Thermal resistance is reduced by 35%-45% compared to pure aluminum modules, and temperature uniformity is improved. Brazing and diffusion welding achieve metallurgical bonding, avoiding the aging problems of traditional thermal paste, significantly improving stability and adapting to harsh environments from -40℃ to 125℃. The fin layout improves airflow efficiency, and the side fins and top cover extend to form three-dimensional heat dissipation, achieving a balance between lightweight design and low cost in compact spaces (such as ITX cases) while ensuring stable high-frequency CPU operation. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of a superimposed aluminum-copper composite heat dissipation module according to the present invention. Figure 2 This is a schematic diagram of the first side structure of a superimposed aluminum-copper composite heat dissipation module according to the present invention. Figure 3 This is a schematic diagram of the second side structure of a superimposed aluminum-copper composite heat dissipation module according to the present invention.

[0014] Numbering on the map: 1. Stacked composite heat sink; 101. Auxiliary heat dissipation cover plate; 102. Aluminum heat dissipation layer; 103. Copper heat conduction layer; 104. Central heat conduction column; 105. Copper heat dissipation fins; 106. Annular aluminum substrate; 107. Aluminum heat dissipation fins; 2. Base; 201. Reinforced heat dissipation fins; 202. Heat conduction plane. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] like Figure 1-3 As shown, this utility model provides a stacked aluminum-copper composite heat dissipation module, including a base 2 and a stacked composite heat sink 1. The bottom of the base 2 is provided with a heat-conducting plane 202 that is in contact with the CPU surface. The stacked composite heat sink 1 is fixedly connected to the top of the base 2. The stacked composite heat sink 1 is composed of at least two layers of aluminum heat dissipation layer 102 and copper heat-conducting layer 103 stacked and fixed along the height direction of the base 2.

[0017] In this embodiment, the base 2 (bottom thermally conductive plane 202) directly contacts the CPU heat source, absorbs heat, and then rapidly transfers it upwards through the high thermal conductivity copper layer (bottom layer). The heat travels from base 2 → bottom copper thermally conductive layer → upper aluminum heat dissipation layer → next copper layer, forming a stepped vertical conduction path. The copper layer acts as a "heat flow acceleration channel," and the aluminum layer acts as a "heat dissipation area expansion unit," working together to improve heat diffusion efficiency.

[0018] The bottom copper heat-conducting layer 103 is directly fixed to the upper surface of the base 2. The adjacent aluminum heat dissipation layer 102 and the copper heat-conducting layer 103, as well as the bottom copper heat-conducting layer 103 and the base 2, are all mechanically connected by brazing.

[0019] In this embodiment, the heat-conducting plane 202 at the bottom of the base 2 directly contacts the CPU surface, forming a first-level heat conduction interface. According to the law of thermal conduction, a flat contact surface can effectively reduce contact thermal resistance, ensuring that the heat generated by the CPU (approximately 80%-90% is conducted through the contact surface) is quickly transferred to the base 2. If a heat spreader or heat pipe is embedded inside the base 2, its evaporation end is in close contact with the heat-conducting plane 202. Utilizing the principle of phase change heat transfer (evaporation absorbs heat - condensation releases heat), the concentrated point heat source can be converted into a surface heat source, which is then evenly diffused into the interior of the base 2, avoiding the formation of local hot spots.

[0020] The heat spreader / heat pipes work together with the multi-layer stepped structure to reduce the surface temperature difference of the heat dissipation module from 15-20℃ in traditional structures to 5-8℃, avoiding processor throttling caused by local overheating and ensuring that the CPU runs stably at high frequency for a long time.

[0021] Furthermore, the copper heat-conducting layer 103 includes a central heat-conducting pillar 104 and copper heat dissipation fins 105 extending radially outward from the central heat-conducting pillar 104. The aluminum heat dissipation layer 102 includes an annular aluminum substrate 106 surrounding the central heat-conducting pillar 104 and aluminum heat dissipation fins 107 extending radially outward and upward from the annular aluminum substrate 106. The copper heat dissipation fins 105 and the aluminum heat dissipation fins 107 are combined to form a stepped, staggered heat dissipation structure.

[0022] Copper fins extend radially from the central heat-conducting pillar 104, responsible for rapidly dissipating heat from the core area. Aluminum fins extend outwards / upwards from the annular aluminum substrate 106, covering the gaps between the copper fins to form a three-dimensional heat dissipation network.

[0023] The bottom copper heat-conducting layer 103 is fixed to the base 2 by brazing. Copper's high thermal conductivity makes it an ideal heat diffusion medium. The central heat-conducting pillar 104 acts as the core conduction hub, radially guiding the heat transferred from the base 2 into the copper heat dissipation fins 105, forming a radial heat diffusion path. Compared to a pure aluminum structure, the heat diffusion rate of the copper layer is increased by approximately 30%-50%, which can effectively suppress temperature spikes, especially in high-frequency CPU instantaneous heat dissipation scenarios.

[0024] Furthermore, in adjacent layers, the lower surface of the upper aluminum heat dissipation fin 107 partially overlaps with the upper surface of the lower copper heat dissipation fin 105 and is fixed together by diffusion welding.

[0025] The heat from the lower copper fins is directly conducted to the upper aluminum fins through the overlapping welding interface (brazing / diffusion welding). The aluminum fins take advantage of their lightweight nature to significantly increase the fin density and height, compensating for the high cost and difficult processing of copper.

[0026] The annular aluminum substrate 106 of the aluminum heat dissipation layer 102 surrounds the central heat-conducting pillar 104, receiving heat conducted by the copper layer and extending outwards. Aluminum heat dissipation fins 107 extend upwards and radially, forming a stepped, staggered structure with the copper fins. When external airflow (such as forced convection from a fan or natural cooling) passes through, the stepped structure generates a turbulence effect, increasing air residence time by approximately 20%-30% and improving the convective heat transfer coefficient. The upper aluminum fins and lower copper fins overlap via diffusion welding, forming a cross-layer thermal bridge, reducing interlayer contact thermal resistance and ensuring seamless heat transfer to each layer.

[0027] Furthermore, the total number of layers in the superimposed composite heat sink 1 is 3 to 7. The staggered arrangement of copper / aluminum fins forms a turbulent airflow channel, increasing air turbulence by 20% and improving the convective heat transfer coefficient by 15%.

[0028] To further clarify, the top layer is an aluminum heat dissipation layer 102.

[0029] The bottom copper layer (high thermal conductivity) quickly dissipates the CPU's instantaneous high heat flux density (>200W / cm²), preventing heat buildup. The upper aluminum layer (low density, high specific surface area) increases the air contact area through fin arrays, improving heat dissipation efficiency compared to pure copper modules.

[0030] Furthermore, it also includes an auxiliary heat dissipation cover plate 101 disposed on the top of the superimposed composite heat sink 1, wherein the auxiliary heat dissipation cover plate 101 is an aluminum plate or a copper plate.

[0031] The bottom copper layer is responsible for rapid heat absorption and initial diffusion, the middle copper and aluminum layers alternate to achieve layered heat transfer, and the top aluminum layer utilizes its large surface area (50%-80% larger than a single-layer structure) for final efficient heat dissipation. The auxiliary heat dissipation cover 101, as an extension of the top-layer heat dissipation, can further intercept the upward escaping hot airflow, forming a vertical heat dissipation closed loop.

[0032] Furthermore, the sides of the base 2 and the outermost side of the stacked composite heat sink 1 are provided with reinforced heat dissipation fins 201. The side fins increase the heat dissipation area by 15%, specifically addressing the heat dissipation problem in the dead corners of the chassis airflow.

[0033] Furthermore, the base 2 has an embedded heat spreader or heat pipe, with the evaporation end of the heat spreader or heat pipe in contact with the surface. The embedded heat spreader in the base 2 evenly diffuses the CPU hotspot temperature to the entire copper layer.

[0034] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A stacked aluminum-copper composite heat dissipation module, characterized in that: The device includes a base and a stacked composite heat sink. The bottom of the base is provided with a heat-conducting plane that is in contact with the CPU surface. The stacked composite heat sink is fixedly connected to the top of the base. The stacked composite heat sink is composed of at least two layers of aluminum heat dissipation layer and copper heat-conducting layer that are stacked and fixed along the height direction of the base. The bottom copper heat-conducting layer is directly fixed to the upper surface of the base, and the adjacent aluminum heat dissipation layer and the copper heat-conducting layer, as well as the bottom copper heat-conducting layer and the base, are all connected by high-strength mechanical brazing. The copper heat-conducting layer includes a central heat-conducting pillar and copper heat-dissipating fins extending radially outward from the central heat-conducting pillar. The aluminum heat-dissipating layer includes an annular aluminum substrate surrounding the central heat-conducting pillar and aluminum heat-dissipating fins extending radially outward and upward from the annular aluminum substrate. The copper heat-dissipating fins and the aluminum heat-dissipating fins are combined to form a stepped, staggered heat dissipation structure.

2. The superimposed aluminum-copper composite heat dissipation module according to claim 1, characterized in that: In adjacent layers, the lower surface of the aluminum heat dissipation fins in the upper layer partially overlaps with the upper surface of the copper heat dissipation fins in the lower layer and is fixed together by diffusion welding.

3. A stacked aluminum-copper composite heat dissipation module according to any one of claims 1-2, characterized in that: The total number of layers in the superimposed composite heat sink is 3 to 7.

4. The superimposed aluminum-copper composite heat dissipation module according to claim 3, characterized in that: The top layer is an aluminum heat dissipation layer.

5. The superimposed aluminum-copper composite heat dissipation module according to claim 1, characterized in that: It also includes an auxiliary heat dissipation cover plate disposed on the top of the superimposed composite heat sink, the auxiliary heat dissipation cover plate being an aluminum plate or a copper plate.

6. The superimposed aluminum-copper composite heat dissipation module according to claim 1, characterized in that: The sides of the base and the outermost side of the superimposed composite heat sink are provided with reinforced heat dissipation fins.

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