A high-efficiency heat-dissipation power module for a server
By introducing a combined heatsink and coolant tank cooling system into the server power module, the problem of excessive heat in the power module is solved, achieving efficient heat dissipation and ensuring stable operation of the power module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TIANJIN YAM EGG TECHNOLOGY CO LTD
- Filing Date
- 2025-09-12
- Publication Date
- 2026-07-24
AI Technical Summary
Existing server power modules generate excessive heat during operation, leading to performance degradation and affecting the usability of the device.
It employs a heat dissipation and cooling mechanism, including heat sinks, a coolant tank, a water pump, and heat pipes. It absorbs heat through circulating coolant and dissipates it in conjunction with the heat sinks, preventing dust from covering the ventilation holes and improving the heat dissipation effect.
It effectively reduces the internal heat of the power module, improves heat dissipation, avoids performance degradation caused by prolonged operation, and ensures the stable operation of the power module.
Smart Images
Figure CN224553743U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of server power module technology, specifically a high-efficiency heat dissipation power module for servers. Background Technology
[0002] A high-efficiency thermal power module for servers is a power module used in servers that provides efficient heat dissipation.
[0003] Based on the above, the inventors have discovered that: Currently, there are many high-efficiency power modules for servers on the market, but during operation, the heat generated on the surface of general server power modules is too high. Heat dissipation relies solely on airflow in contact with the power module, making the power module prone to overload under long-term operation, thus severely reducing the performance of the power module and the practicality of the device. Therefore, in view of this, the inventors have researched and improved the existing structure to provide a high-efficiency heat dissipation power module for servers, aiming to achieve a more practical value. Utility Model Content
[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution:
[0005] This utility model discloses a high-efficiency heat dissipation power supply module for servers, including a power module body, a plurality of ventilation holes at the top of the power module body, heat dissipation mechanisms on both sides of the power module body, and a cooling mechanism on one side of the power module body.
[0006] The heat dissipation mechanism includes:
[0007] Two heat sinks are provided, each located on one side of the power module body. Two ring plates are fixed on both sides of the two heat sinks. The inner walls of the four ring plates are threaded with studs, and one end of each stud is threaded to the inner wall of the power module body.
[0008] As a preferred embodiment of this utility model, a dustproof plate is provided at the top of the power module body, and the dustproof plate is positioned above the ventilation hole.
[0009] As a preferred technical solution of this utility model, the top of the power module body is fixed with four protrusions, and the bottom of the dustproof plate is provided with four grooves, the inner walls of the four grooves are matched with the outer walls of the protrusions.
[0010] As a preferred embodiment of this utility model, the cooling mechanism includes:
[0011] A coolant tank is located on one side of the power module body. The top of the coolant tank is equipped with a sealing cap. A water pump is fixed to the inner wall of the coolant tank. A check valve is fixed to the output end of the water pump. A heat-conducting pipe is provided on the inner wall of the check valve. The outer wall of the heat-conducting pipe is fitted with the inner wall of the coolant tank. The heat-conducting pipe is located at the top of the power module body.
[0012] As a preferred embodiment of this utility model, a block is fixed on one side of the coolant tank, and a square groove is provided on one side of the power module body, with the inner wall of the square groove matching the outer wall of the block.
[0013] As a preferred embodiment of this utility model, the cross-sectional area of the inner wall of the square groove is matched with the cross-sectional area of the outer wall of the block.
[0014] As a preferred embodiment of this utility model, the inner walls of the four protrusions are provided with inserts, and the outer walls of the four inserts are fitted onto one side of the dustproof plate.
[0015] The beneficial effects of this utility model are:
[0016] 1. This solution involves abutting one side of the coolant tank against one side of the power module body, allowing the outer wall of the fixed square block on one side of the coolant tank to engage with the inner wall of the square groove. This allows the heat-conducting pipe, fitted onto the inner wall of the coolant tank, to be installed at the top of the power module body. The heat sink abuts against one side of the power module body, and the outer wall of the stud engages with the inner wall of the ring plate until one end of the stud is threaded into the inner wall of the power module body. This allows the water pump to draw coolant from the coolant tank into the heat-conducting pipe, enabling the coolant to circulate and absorb heat at the top of the power module body before moving to the inner wall of the coolant tank. Combined with the heat sink's ability to dissipate heat from both sides of the power module body, this further improves the heat dissipation effect of the power module body, preventing excessive heat buildup inside the power module body during prolonged server operation.
[0017] 2. In this solution, the dustproof plate is installed on the top of the power module body, and the inner wall of the groove at the bottom of the dustproof plate engages with the outer wall of the protrusion. The outer wall of the plug is then fitted onto one side of the dustproof plate until one end of the plug matches the inner wall of the protrusion. This ensures that the dustproof plate is securely installed on the top of the power module body, allowing the heat dissipation components to better dissipate heat from the power module body and preventing external dust from covering the heat pipes and ventilation holes, thus avoiding interference with the normal heat dissipation of the device. Attached Figure Description
[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:
[0019] Figure 1 This is a schematic diagram of the structure of a high-efficiency heat dissipation power supply module for servers according to this utility model;
[0020] Figure 2 This is a schematic diagram of the separation structure of the power module body and the dustproof plate of a high-efficiency heat dissipation power module for servers according to this utility model.
[0021] Figure 3 This is a schematic diagram of the cooling mechanism of a high-efficiency heat dissipation power supply module for servers according to this utility model.
[0022] Figure 4 This is a schematic diagram of the separate structure of the coolant tank and the main body of the power module for a high-efficiency heat dissipation power module for a server according to this utility model.
[0023] Figure 5 This is a schematic diagram of the dustproof plate and protrusion separation structure of a high-efficiency heat dissipation power supply module for servers according to this utility model.
[0024] In the diagram: 1. Power module body; 2. Ventilation hole; 3. Heat dissipation mechanism; 31. Heat sink; 32. Ring plate; 33. Stud; 4. Cooling mechanism; 41. Coolant tank; 42. Sealing cover; 43. Water pump; 44. Check valve; 45. Heat pipe; 46. Block; 47. Square groove; 5. Dustproof plate; 6. Protrusion; 7. Groove; 8. Insert. Detailed Implementation
[0025] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.
[0026] Example: Figures 1-5 As shown, this utility model provides a high-efficiency heat dissipation power supply module for servers, including a power module body 1, a plurality of ventilation holes 2 on the top of the power module body 1, heat dissipation mechanisms 3 on both sides of the power module body 1, and a cooling mechanism 4 on one side of the power module body 1.
[0027] The heat dissipation mechanism 3 includes;
[0028] Two heat sinks 31 are provided on one side of the power module body 1. Two ring plates 32 are fixed on both sides of the two heat sinks 31. The inner walls of the four ring plates 32 are threaded with studs 33. One end of each stud is threaded to the inner wall of the power module body 1.
[0029] As attached Figure 1 , Figure 2 and Figure 5As shown, a dustproof plate 5 is provided at the top of the power module body 1. The dustproof plate 5 is positioned above the ventilation hole 2. Four protrusions 6 are fixed at the top of the power module body 1. Four grooves 7 are provided at the bottom of the dustproof plate 5. The inner walls of the four grooves 7 are matched with the outer walls of the protrusions 6. The inner walls of the four protrusions 6 are provided with insertion posts 8. The outer walls of the four insertion posts 8 are fitted onto one side of the dustproof plate 5 to prevent external dust from covering the heat pipe 45 and the ventilation hole 2, so as not to interfere with the normal heat dissipation of the device.
[0030] As attached Figure 1 , Figure 3 and Figure 4 As shown, the cooling mechanism 4 includes:
[0031] A coolant tank 41 is located on one side of the power module body 1. A sealing cap 42 is provided at the top of the coolant tank 41. A water pump 43 is fixed to the inner wall of the coolant tank 41. A check valve 44 is fixed to the output end of the water pump 43. A heat conduction pipe 45 is provided on the inner wall of the check valve 44. The outer wall of the heat conduction pipe 45 is fitted with the inner wall of the coolant tank 41. The heat conduction pipe 45 is located at the top of the power module body 1. A block 46 is fixed to one side of the coolant tank 41. A square groove 47 is opened on one side of the power module body 1. The inner wall of the square groove 47 matches the outer wall of the block 46. The cross-sectional area of the inner wall of the square groove 47 matches the cross-sectional area of the outer wall of the block 46. In combination with the heat sink 31, heat is dissipated from both sides of the power module body 1, further improving the heat dissipation effect of the power module body 1 and preventing the internal heat of the power module body 1 from becoming too high due to long-term operation of the server.
[0032] Working principle: In use, one side of the coolant tank 41 is abutted against one side of the power module body 1, so that the outer wall of the block 46 fixed on one side of the coolant tank 41 engages with the inner wall of the square groove 47. This allows the heat pipe 45, which is fitted onto the inner wall of the coolant tank 41, to be installed at the top of the power module body 1. One side of the heat sink 31 abuts against one side of the power module body 1, while the outer wall of the stud 33 is threaded onto the inner wall of the ring plate 32 until one end of the stud 33 is threaded onto the inner wall of the power module body 1. This allows the water pump 43 to draw coolant from the coolant tank 41 into the heat pipe 45, enabling the coolant to circulate and absorb heat at the top of the power module body 1 before moving back to the coolant tank. The inner wall of 41, combined with the heat sink 31, dissipates heat on both sides of the power module body 1, further improving the heat dissipation effect of the power module body 1 and preventing excessive heat inside the power module body 1 caused by long-term server operation. The dustproof plate 5 is installed on the top of the power module body 1, so that the inner wall of the groove 7 opened at the bottom of the dustproof plate 5 engages with the outer wall of the protrusion 6. The outer wall of the plug 8 is fitted with one side of the dustproof plate 5 until one end of the plug 8 matches the inner wall of the protrusion 6, thus making the dustproof plate 5 securely installed on the top of the power module body 1, so that the heat dissipation components can better dissipate heat from the power module body 1 and prevent external dust from covering the heat pipe 45 and the ventilation hole 2, so as not to interfere with the normal heat dissipation of the device.
[0033] Finally, it should be noted that in the description of this utility model, the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0034] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0035] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high-efficiency heat dissipation power supply module for servers, comprising a power supply module body (1), wherein the top of the power supply module body (1) is provided with a plurality of ventilation holes (2), characterized in that, The power module body (1) is provided with heat dissipation mechanisms (3) on both sides and a cooling mechanism (4) on one side; The heat dissipation mechanism (3) includes: Two heat sinks (31) are provided on one side of the power module body (1). Both sides of the two heat sinks (31) are fixed with ring plates (32). The inner walls of the four ring plates (32) are threaded with studs (33). One end of the four studs (33) is threaded with the inner wall of the power module body (1).
2. The high-efficiency heat dissipation power supply module for servers according to claim 1, characterized in that, The top of the power module body (1) is provided with a dustproof plate (5), which is located above the ventilation hole (2).
3. The high-efficiency heat dissipation power supply module for servers according to claim 2, characterized in that, The top of the power module body (1) is fixed with four protrusions (6), and the bottom of the dustproof plate (5) is provided with four grooves (7). The inner walls of the four grooves (7) are matched with the outer walls of the protrusions (6).
4. The high-efficiency heat dissipation power supply module for servers according to claim 1, characterized in that, The cooling mechanism (4) includes: A coolant tank (41) is located on one side of the power module body (1). The top of the coolant tank (41) is provided with a sealing cap (42). A water pump (43) is fixed on the inner wall of the coolant tank (41). A check valve (44) is fixed at the output end of the water pump (43). A heat-conducting pipe (45) is provided on the inner wall of the check valve (44). The outer wall of the heat-conducting pipe (45) is sleeved with the inner wall of the coolant tank (41). The heat-conducting pipe (45) is located at the top of the power module body (1).
5. A high-efficiency heat dissipation power supply module for servers according to claim 4, characterized in that, A block (46) is fixed on one side of the coolant tank (41), and a square groove (47) is provided on one side of the power module body (1). The inner wall of the square groove (47) matches the outer wall of the block (46).
6. A high-efficiency heat dissipation power supply module for servers according to claim 5, characterized in that, The size of the inner wall cross-sectional area of the square groove (47) is matched with the size of the outer wall cross-sectional area of the square block (46).
7. A high-efficiency heat dissipation power supply module for servers according to claim 3, characterized in that, The inner walls of the four protrusions (6) are provided with inserts (8), and the outer walls of the four inserts (8) are fitted onto one side of the dustproof plate (5).