Multifunctional inverter brick

Abstract

The utility model relates to a kind of multifunctional inverter brick, it includes: metal shell (1), the metal shell has top wall (11), side wall and the accommodating cavity (10) defined by the top wall and the side wall;Thin film capacitor module (2), the thin film capacitor module is housed in the accommodating cavity (10);EMC filter (3), the EMC filter is partially housed in the accommodating cavity (10) and is electrically connected to the thin film capacitor module;And power module (4) and drive board (5) fixedly connected to the top wall of the metal shell, wherein the power module (4) is located between the top wall and the drive board.This kind of multifunctional inverter brick compact structure, reduce the overall height of product, improve the performance of power module.

Description

Technical Field

[0001] This utility model relates to the field of inverter technology, and in particular to a multifunctional inverter brick used in automotive electronic products or in fields where filters and capacitors are required. Background Technology

[0002] An inverter brick is a compact DC-AC inverter module whose main function is to convert direct current (DC) to alternating current (AC) to meet the power needs of different devices or systems. It typically integrates power conversion, power management, and protection circuits, and is widely used in photovoltaic power generation, energy storage systems, electric vehicles, and power equipment.

[0003] However, in existing inverter bricks, the inverter brick is designed separately, and customers need to design an electromagnetic compatibility filter (referred to as EMC filter in this article), an AC current sensor, and then assemble the three together to achieve filtering / inversion and current detection functions.

[0004] Existing inverter brick products suffer from drawbacks such as large size and low integration, which affect the overall power density and other performance characteristics of the controller. Furthermore, the long connection paths of the thin-film capacitor copper busbar, EMC filter, and power module result in products that are not only large in size but also have low power density and high stray inductance. Utility Model Content

[0005] To overcome at least one of the above problems, there is a need to provide a compact, multifunctional inverter brick with a reduced overall height, which not only shortens the connection path but also reduces stray inductance and improves the performance of the power module.

[0006] Therefore, this utility model provides a multifunctional inverter brick, which includes: a metal housing having a top wall, side walls, and a receiving cavity defined by the top wall and the side walls; a thin-film capacitor module housed in the receiving cavity; an EMC filter partially housed in the receiving cavity and electrically connected to the thin-film capacitor module; and a power module and a drive board fixedly connected to the top wall of the metal housing, wherein the power module is located between the top wall and the drive board.

[0007] Compared to existing inverter brick products, the EMC filter and thin-film capacitor module of the inverter brick according to this invention are housed in the same metal casing, which can significantly reduce the overall height of the inverter brick. The power module and drive board are both located outside the housing chamber.

[0008] According to a preferred embodiment of this invention, the electrical connection between the thin-film capacitor module and the power module passes through the top wall of the metal housing. This configuration not only achieves a compact and modular design for the structural wiring, but also helps to optimize the thermal management layout, improve electromagnetic compatibility and overall protection performance, thereby enhancing the reliability and ease of maintenance of the module.

[0009] In one embodiment of this utility model, the thin-film capacitor module includes multiple capacitor core components, a positive copper busbar electrically connected to the positive terminals of the multiple capacitor core components, and a negative copper busbar electrically connected to the negative terminals of the multiple capacitor core components.

[0010] In a preferred embodiment of this invention, an elongated through-hole is provided in the top wall. The positive and negative copper busbars extend through this elongated through-hole to the outside of the top wall and are electrically connected to the positive and negative terminals of the power module. For example, the elongated through-hole is preferably an elongated rectangular through-hole. By providing such an elongated through-hole in the metal housing, the positive and negative copper busbars of the thin-film capacitor module are electrically connected to the positive and negative terminals of the power module through the top wall. This significantly reduces the overall height of the inverter brick, shortens the connection path, reduces stray inductance, and improves the performance of the power module.

[0011] According to a preferred embodiment of this invention, a copper busbar sealing ring for the positive and negative copper busbars is provided in the elongated through hole. The shape of the copper busbar sealing ring is selected to fit the elongated through hole, for example, it can be designed as a rectangle. Depending on the working environment of the inverter brick, the copper busbar sealing ring can be made of, for example, silicone rubber, ethylene propylene rubber, etc.

[0012] According to a preferred embodiment of the present invention, the portions of the thin-film capacitor module and the EMC filter housed in the housing chamber are encapsulated in the housing chamber by insulating and thermally conductive epoxy resin, and the epoxy resin fills the gaps between multiple capacitor core components.

[0013] In one embodiment of this invention, the sidewalls include opposing first and second sidewalls; and the EMC filter is arranged close to the first sidewall, while the thin-film capacitor module is arranged close to the second sidewall.

[0014] According to one embodiment of this invention, the EMC filter includes a busbar copper bus, a magnetic ring, and X / Y capacitors. The magnetic ring is disposed on the outer side of the first sidewall of the metal housing, and the X / Y capacitors are arranged in a receiving cavity against the inner side of the first sidewall. This configuration of the EMC filter allows the metal housing to function as a shield to suppress electromagnetic interference.

[0015] In one embodiment of this invention, the multifunctional inverter brick further includes multiple AC current sensors fixedly connected to the drive board, and these multiple AC current sensors are electromagnetically connected to multiple AC terminals of the power module. The AC current sensors are used to measure AC current, ensuring precise control of power conversion and providing functions such as overcurrent protection and feedback control.

[0016] According to a preferred embodiment of the present invention, the power module has a heat sink, and a groove is provided in the top wall of the metal housing. The power module is sealed to the top wall and covers the groove via the heat sink, and the heat sink is arranged such that there is a gap between it and the bottom surface of the groove. For example, the groove can be constructed as a rectangular groove, wherein the shape and size of the groove are adapted to the shape and size of the heat sink, and the heat sink can be constructed accordingly as a rectangular plate. In one example, the heat sink has multiple heat dissipation fins extending into the groove for more efficient heat dissipation.

[0017] In a preferred embodiment of this invention, the sidewall further includes opposing third and fourth sidewalls. The metal housing also has a first fluid channel located in the third sidewall and a second fluid channel located in the fourth sidewall. The first fluid channel is in fluid communication with the gap space and extends in the third sidewall to a first port located at the bottom of the third sidewall. The second fluid channel is in fluid communication with the gap space and extends in the fourth sidewall to a second port located at the bottom of the fourth sidewall. Thus, the first fluid channel, the gap space, and the second fluid channel form a cooling medium channel extending between the first port and the second port. By providing such a cooling medium channel, the cooling medium flows through both the heat sink and the metal housing simultaneously, enabling more efficient simultaneous heat dissipation of the thin-film capacitor module, EMC filter, and power module.

[0018] According to a preferred embodiment of this utility model, an insulating film is provided between the thin-film capacitor module and the inner surface of the metal housing. By providing this insulating film, electrical contact between the thin-film capacitor module and the metal housing can be effectively prevented, thereby improving the electrical safety of the overall device, avoiding electrical short circuits, leakage, and electrical breakdown, and further enhancing the insulation protection performance and operational reliability of the system.

[0019] Contact is maintained to prevent dielectric breakdown or increased leakage current, which could affect the safety of the inverter brick.

[0020] Due to the adoption of the above technical solution, this utility model can produce at least one of the following beneficial technical effects: Since the thin-film capacitor module and the EMC filter share the same metal housing, the overall height of the multifunctional inverter brick is significantly reduced, making the structure of the multifunctional inverter brick highly compact; the positive and negative copper busbars of the thin-film capacitor module pass through the top wall of the metal housing, and through laser welding, for example, the bottom EMC busbar copper busbar and the top power module are simultaneously connected in a very short electrical path, thereby achieving a significant reduction in height, shortening the connection path, reducing stray inductance, and thus improving the performance of the power module. Attached Figure Description

[0021] Referring to the accompanying drawings and reading the following detailed description, further features and advantages of this utility model will become clearer:

[0022] Figure 1 A perspective view from top of a multifunctional inverter brick according to an embodiment of the present invention is shown;

[0023] Figure 2 for Figure 1 A 3D view of the multi-functional inverter brick from the bottom, with the potting compound removed;

[0024] Figure 3 for Figure 1 An exploded view of the multifunctional inverter brick shown.

[0025] Figure 4 for Figure 1 Another exploded view of the multifunctional inverter brick shown;

[0026] Figure 5 A perspective view of the copper busbar sealing ring according to this utility model;

[0027] Figure 6 for Figure 1 A top view of the multifunctional inverter brick shown;

[0028] Figure 7 for Figure 6 A cross-sectional view of the multifunctional inverter brick shown in Figure AA;

[0029] Figure 8 for Figure 6 The BB cross-sectional perspective view of the multi-functional inverter brick shown has the drive board removed;

[0030] Figure 9 for Figure 8 A magnified view of a portion of the multifunctional inverter brick shown. Detailed Implementation

[0031] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The descriptions of orientations used in the following description, such as "upper," "lower," "inner," and "outer," are for convenience only unless explicitly stated otherwise and are not intended to limit the technical solution of the present invention. Furthermore, terms such as "first" and "second" are used below to describe elements of this application; these terms are only used to distinguish individual elements and are not intended to limit the nature, sequence, order, or number of these elements. Additionally, it should be noted that in this specification, the same technical features are represented by the same or similar reference numerals.

[0032] The terms "top" and "bottom" are used to describe the relational positioning of the features of this utility model. These terms should be understood as referring to... Figure 1 and Figure 2 The product shown is positioned accordingly. In this invention, the "inverter brick" is part of an inverter system and is a modular inverter, typically a small, highly integrated power conversion unit. The multifunctional inverter brick according to this application is mainly used in inverter systems for automotive electronic products, or in fields requiring filters and capacitors.

[0033] Figure 1 and Figure 2 An embodiment of a multifunctional inverter brick 100 according to the present invention is shown. In this embodiment, the multifunctional inverter brick 100 includes a metal housing 1, a thin-film capacitor module 2, an EMC filter 3, a power module 4, and a drive board 5. The top of the metal housing 1 is closed, and the bottom is open. The thin-film capacitor module 2 and at least a portion of the EMC filter 3 are located within a receiving cavity defined by the metal housing 1. The power module 4 and the drive board 5 are fixedly mounted to the top outer side of the metal housing, and the power module is located between the drive board 5 and the metal housing 1. The thin-film capacitor module 2 is electrically connected to the power module 4 and the EMC filter 3. Advantageously, the electrical connection between the thin-film capacitor module 2 and the power module 4 passes through the top wall 11 of the metal housing.

[0034] In this invention, the drive board 5 is a key component of the inverter system, used to control the power module 4 to achieve efficient DC-AC conversion. It plays a crucial role in the performance, efficiency, and reliability of the inverter. The multi-functional inverter also includes multiple AC current sensors 7 fixedly connected to the drive board 5, three of which are shown in the figure. The AC current sensors 7 are, for example, AC ringless sensors, which are sensors used to measure alternating current. They do not require a traditional magnetic ring (iron core) structure, but instead achieve current detection through advanced current sensing technologies (such as Hall effect, magnetoresistive effect, shunt, etc.). The AC current sensors 7 are fixedly connected to the drive board 5, for example, their pins are press-fitted to the drive board 5. Furthermore, the multiple AC current sensors 7 are electromagnetically connected to multiple AC terminals 45 of the power module 4, for example, the sensing portion of the AC current sensor 7 is placed in an opening on the AC terminal 45 to detect the current flowing through the AC terminal 45.

[0035] Figure 3 and Figure 4 An exploded view of the aforementioned multifunctional inverter brick 100 is shown. As can be seen from the figure, the metal housing 1 is generally cuboid in shape, having a top wall 11, a first side wall 13 and a second side wall 14 along its length, and a third side wall 15 and a fourth side wall 16 along its width, which define the receiving chamber 10. In the embodiment shown, the power module 4 also includes a heat sink 40. Advantageously, the top wall 11 has, for example, a rectangular groove 111, the size of which is chosen to fit the size of the heat sink. The power module 4 is hermetically connected to the top wall via the heat sink and covers the groove 111, and the heat sink is arranged such that there is a gap between it and the bottom surface of the groove. In this embodiment, the groove 111 is preferably a stepped groove defining a circumferential edge / side. The metal housing 1 can be made of, for example, aluminum alloy, a material that not only meets process requirements but is also low in cost and lightweight. It should be understood that the metal housing can also be made of other metallic materials, such as stainless steel.

[0036] See especially Figure 3 To fit the groove 111, the radiator 40 is also constructed as a rectangular plate. In a preferred embodiment, the radiator 40 is also made of aluminum alloy. Therefore, the rectangular plate-shaped radiator 40 can be sealed to the top wall 11 of the metal housing 1 by, for example, friction stir welding, specifically, sealed and fixed to the circumferential edge of the groove 111. After assembly, there is a gap between the surface of the radiator 40 and the bottom surface of the groove 111, which is suitable for the flow of the cooling medium. In addition, to obtain better heat dissipation efficiency, the first surface of the radiator facing the metal housing 1 is provided with a plurality of heat dissipation fins that extend into the groove 111. The length of the heat dissipation fins can be selected to contact the bottom surface or be spaced apart from the bottom surface.

[0037] In this utility model, see especially Figure 4 Advantageously, a cooling medium channel is formed in the metal housing 1. Specifically, the metal housing 1 also has a first fluid channel located in the third sidewall 15 and a second fluid channel located in the fourth sidewall 16. The first fluid channel is in fluid communication with the gap space and extends in the third sidewall 15 to a first port 152 located at the bottom of the third sidewall. The second fluid channel is in fluid communication with the gap space and extends in the fourth sidewall 16 to a second port 162 located at the bottom of the fourth sidewall. Thus, the first fluid channel, the gap space, and the second fluid channel form a cooling medium channel extending between the first port and the second port. The above configuration of the cooling medium channel is merely exemplary. Any fluid channel in a layout that is formed in the sidewall of the metal housing 1 and can be in fluid communication with the gap space is covered within the scope of this application. Due to the above configuration of the multifunctional inverter brick, the power module 4, the thin-film capacitor module 2, and the EMC filter share the same heat dissipation housing (metal housing 1) and the same cooling medium channel, so as to better achieve heat dissipation of the power module, the thin-film capacitor module, and the EMC filter. Advantageously, the multi-functional inverter brick 100 is also provided with a groove sealing ring 112 for cooling medium that mates with the inner peripheral wall of the groove 111 (see Figure 3 ).

[0038] According to a preferred embodiment of the present invention, the EMC filter 3 is arranged near the first sidewall 13, and the thin-film capacitor module 2 is arranged near the second sidewall 14. The thin-film capacitor module 2 includes a plurality of capacitor cores 20, a positive copper busbar 21, and a negative copper busbar 22, wherein these capacitor cores 20, the positive copper busbar 21, and the negative copper busbar 22 are encapsulated in the receiving chamber 10 through an open bottom opening of the metal housing 1 using insulating and thermally conductive epoxy resin. The positive copper busbar 21 is electrically connected to the positive electrode of each capacitor core 20, and the negative copper busbar 22 is electrically connected to the negative electrode of each capacitor core 20. The top wall 11 of the metal housing 1 is also provided with, for example, a rectangular elongated through hole 6, which is located near the groove 111 and between the groove and the first sidewall 13. The elongated through hole 6 is preferably parallel to the groove.

[0039] According to a preferred embodiment of the present invention, the EMC filter 3 includes a busbar copper bus 31, a magnetic ring 32, and an X / Y capacitor 33. The magnetic ring 32 is disposed on the outer side of the first sidewall 13 of the metal housing, and the X / Y capacitor 33 is arranged in the receiving chamber 10 against the inner side of the first sidewall. This configuration allows the first sidewall of the metal housing 1 to function as a shield for the EMC filter. The arrangement of the X / Y capacitor 33 against the first sidewall improves heat dissipation. The X / Y capacitor 33 arranged in the receiving chamber 10 is encapsulated together with the thin-film capacitor module 2 within the receiving chamber 10. Since the thermal conductivity of the encapsulation material is generally higher than that of air, this facilitates heat dissipation of the X / Y capacitor. Advantageously, the EMC filter 3 also includes a component disposed above the magnetic ring 32 (with...). Figure 2 or Figure 4 (Viewed from the perspective of the view direction) a metal shield 34 for suppressing electromagnetic interference. This can further reduce electromagnetic radiation and interference propagation, meeting more stringent EMC requirements. In this application, the magnetic ring can be referred to as an EMC filter core, which includes a magnetic ring housing and a magnetic core housed within the magnetic ring housing. The magnetic ring housing is made of plastic material, and the magnetic core and the magnetic ring housing are integrally formed by injection molding.

[0040] Figure 6 for Figure 1 A top view of the multifunctional inverter brick shown; Figure 7 for Figure 6 The figure shows a cross-sectional view (AA) of the multi-functional inverter brick. As can be seen from the figure, the positive and negative copper busbars of the thin-film capacitor module 2 extend through the elongated through-hole 6 to the outer side of the top wall and are correspondingly electrically connected to the positive terminal 41 and the negative terminal of the power module 4. Advantageously, the elongated through-hole 6 also provides copper busbar sealing rings 60 for the positive and negative copper busbars. The copper busbar sealing rings 60 are in the form of elongated rectangles, see [reference needed]. Figure 5 .

[0041] like Figure 8 and Figure 9 As shown, the positive copper busbar 21 and the negative copper busbar 22 are insulated from each other and closely abutted to pass through the elongated through-hole 6; as Figure 7As shown, the copper busbar sealing ring 60 is located in the elongated through-hole 6 and tightly surrounds the positive and negative copper busbars 21 and 22 to seal the gap between the positive and negative copper busbars 21 and 22 and the wall of the elongated through-hole 6. Thus, during the potting process of the components within the receiving chamber 10, the copper busbar sealing ring 60 can prevent liquid potting material from flowing through the elongated through-hole 6 to the outside of the top wall 11 of the metal housing 1. By setting the copper busbar sealing ring between the positive and negative copper busbars and the elongated through-hole, the potting material can be effectively prevented from leaking to the outside of the housing, ensuring the integrity and reliability of the potting process, thereby improving the electrical insulation and environmental sealing performance of the device, reducing safety hazards, and making it suitable for applications with high reliability and high sealing requirements. On the outside of the top wall 11, the positive copper busbar 21, passing through the elongated through-hole 6, is preferably fixedly connected to the positive terminal 41 by laser welding to the positive terminal adapter 43, and the negative copper busbar 22, passing through the elongated through-hole 6, is preferably fixedly connected to the negative terminal 42 by laser welding to the negative terminal adapter copper busbar 44. Furthermore, the positive copper busbar 21 and the negative copper busbar 22 are respectively fixedly connected to the busbar 31 of the EMC filter 3 by laser welding. Because a structure suitable for the positive and negative copper busbars of the thin-film capacitor module to pass through is provided in the top wall of the metal casing—namely, a slender through-hole—ultra-short electrical connections between the thin-film capacitor module and the busbar of the EMC filter, as well as the positive and negative terminals of the top power module, can be simultaneously achieved by laser welding. This results in significant miniaturization in the height direction, shortens the connection path, reduces stray inductance, and thus improves the performance of the power module.

[0042] In a preferred embodiment of this utility model, an insulating film 8 is provided between the inner surface of the thin-film capacitor module 2 and the metal housing 1 (see...). Figure 2 and Figure 4 For example, insulating films 8 are provided between the positive copper busbar 21 and capacitor core 20 of the thin-film capacitor module 2 and the inner surfaces of the top wall 11 and side walls (e.g., the second side wall 14) of the metal housing 1, and between the negative copper busbar 22 and capacitor core 20 of the thin-film capacitor module 2 and the inner surfaces of the side walls of the metal housing 1. Providing insulating films prevents direct contact between the thin-film capacitor and the metal housing, thereby avoiding dielectric breakdown or increased leakage current, which could affect the safety of the inverter brick. For example, the insulating film can typically be made of high-voltage resistant polyester (PET), polypropylene (PP), or polyimide (PI) materials, capable of withstanding high electric field strength and preventing electrical breakdown.

[0043] Although the present invention has been disclosed above with reference to preferred embodiments, it is not limited thereto. Any combinations, changes, and modifications made by those skilled in the art without departing from the spirit and scope of the present invention should be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope defined in the claims.

Claims

1. A multifunctional inverter brick, characterized in that, The multifunctional inverter brick (100) includes: A metal housing (1) having a top wall (11), side walls, and a receiving chamber (10) defined by the top wall and the side walls; A thin-film capacitor module (2) is housed in the receiving chamber (10); An EMC filter (3), which is partially housed in the housing chamber (10) and electrically connected to the thin-film capacitor module; and A power module (4) and a drive plate (5) are fixedly connected to the top wall of the metal housing, wherein the power module (4) is located between the top wall and the drive plate.

2. The multifunctional inverter brick according to claim 1, characterized in that, The electrical connection between the thin-film capacitor module (2) and the power module (4) passes through the top wall (11) of the metal housing.

3. The multifunctional inverter brick according to claim 1 or 2, characterized in that, The thin-film capacitor module (2) includes a plurality of capacitor core components (20), a positive copper busbar (21) electrically connected to the positive electrode of the plurality of capacitor core components, and a negative copper busbar (22) electrically connected to the negative electrode of the plurality of capacitor core components.

4. The multifunctional inverter brick according to claim 3, characterized in that, The top wall (11) has an elongated through hole (6), through which the positive and negative copper busbars extend to the outside of the top wall and are electrically connected to the positive terminal (41) and negative terminal (42) of the power module (4).

5. The multifunctional inverter brick according to claim 4, characterized in that, A copper busbar sealing ring (60) for the positive and negative copper busbars is provided in the elongated through hole (6).

6. The multifunctional inverter brick according to claim 1 or 2, characterized in that, The portions of the thin-film capacitor module (2) and the EMC filter (3) housed in the housing chamber (10) are encapsulated in the housing chamber by insulating and thermally conductive epoxy resin.

7. The multifunctional inverter brick according to claim 6, characterized in that, The sidewalls include opposing first sidewalls (13) and second sidewalls (14); and The EMC filter (3) is arranged close to the first sidewall (13), and the thin film capacitor module (2) is arranged close to the second sidewall (14).

8. The multifunctional inverter brick according to claim 7, characterized in that, The EMC filter (3) includes a busbar (31), a magnetic ring (32), and an X / Y capacitor (33), wherein the magnetic ring (32) is disposed on the outside of the first sidewall (13) of the metal housing, and the X / Y capacitor (33) is disposed in the receiving chamber against the inside of the first sidewall.

9. The multifunctional inverter brick according to claim 1 or 2, characterized in that, The multifunctional inverter brick also includes a plurality of AC current sensors (7) fixedly connected to the drive board (5), and the plurality of AC current sensors are respectively electromagnetically connected to a plurality of AC terminals (45) of the power module (4).

10. The multifunctional inverter brick according to claim 7, characterized in that, The power module (4) has a heat sink (40), and the top wall (11) has a groove (111), wherein the power module (4) is sealed to the top wall and covers the groove (111) through the heat sink, and the heat sink is arranged such that there is a gap space between it and the bottom surface of the groove.

11. The multifunctional inverter brick according to claim 10, characterized in that, The sidewalls include opposing third sidewalls (15) and fourth sidewalls (16), and the metal housing (1) further has a first fluid channel in the third sidewall (15) and a second fluid channel in the fourth sidewall (16), wherein the first fluid channel is in fluid communication with the gap space and extends in the third sidewall (15) to a first port (152) at the bottom of the third sidewall, and the second fluid channel is in fluid communication with the gap space and extends in the fourth sidewall (16) to a second port (162) at the bottom of the fourth sidewall, thereby forming a cooling medium channel extending between the first port and the second port.

12. The multifunctional inverter brick according to claim 1 or 2, characterized in that, An insulating film (8) is provided between the inner surface of the thin film capacitor module (2) and the metal housing (1).

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