A heat dissipation device for reducing the cooling energy consumption of a data center server

Abstract

The utility model discloses a kind of heat dissipation devices for reducing data center server cooling energy consumption, the utility model relates to server heat dissipation technical field.The heat dissipation device for reducing data center server cooling energy consumption, comprising: substrate, for being connected with server mainboard, the bottom of substrate is movably connected with server chip;Radiating fin group, fixedly installed at the top of substrate, for increasing the contact area with air to carry out heat exchange;Heat dissipation assembly, heat dissipation assembly is installed between radiating fin group and server chip, heat dissipation assembly is used to absorb the heat of server chip, and heat is dissipated to air by radiating fin group;Through the cooperative work of radiating fin group and heat dissipation assembly, not only effectively reduce chip temperature, avoid local overheating, also reduce the dependence on high energy consumption forced air cooling equipment, reduce data center cooling energy consumption, improve server running stability and service life simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation technology, specifically a heat dissipation device for reducing the cooling energy consumption of data center servers. Background Technology

[0002] In today's global digital revolution, data centers, as the core hubs for information processing and storage, are becoming increasingly important. With the rapid development of technologies such as cloud computing, big data, and artificial intelligence, the integration and computing power of servers within data centers are constantly increasing, and the power density of individual server chips is continuously pushing the limits, with some high-end chips even exceeding 1000W / cm² in heat flux density. However, electronic components are extremely sensitive to operating temperature. When the chip temperature exceeds 85℃, performance will significantly decrease, and if it reaches above 100℃, there is a risk of permanent damage. Therefore, efficient heat dissipation has become crucial to ensuring the stable operation of servers.

[0003] Publication number CN219876720U discloses a server cooling device, including a cabinet with openings on both the front and back. A back panel is horizontally slidable along the front-to-back direction on the back of the cabinet. A cooling fan reciprocates up and down on the back panel. A cabinet door is hinged to the front of the cabinet. The cabinet has a linkage mechanism that moves the back panel backward when the door is opened. This device solves the problem in traditional server cabinet cooling fans being in fixed positions. This uneven cooling results in servers directly facing the fan cooling faster than those in other positions, leading to excessively high server temperatures and impacting server efficiency.

[0004] As shown in the above technical solution, although the device effectively solves the problem of uneven heat dissipation in the rack, the core heat dissipation method still relies on the forced air cooling of the cooling fan. When facing high power density chips, it is difficult to meet the rapid heat dissipation requirements by simply relying on airflow circulation. Especially when the server is running at full load, the fan energy consumption will increase significantly and it is easy to generate a lot of noise. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a heat dissipation device that reduces the cooling energy consumption of data center servers, solving the problem of heat dissipation difficulties for high-power chips.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation device for reducing the cooling energy consumption of data center servers, comprising: A substrate for connecting to a server motherboard, wherein the bottom of the substrate is movably connected to a server chip; The heat dissipation fins are fixedly installed on the top of the substrate to increase the contact area with air for heat exchange. The heat dissipation fins are arranged in an array, and there are channels for air circulation between adjacent fins. A heat dissipation component is installed between the heat sink fins and the server chip. The heat dissipation component is used to absorb the heat from the server chip and dissipate the heat to the air through the heat sink fins.

[0007] Preferably, the surface of the substrate that contacts the server chip is made of a thermally conductive material, which facilitates the conduction of heat from the server chip to the heat sink fins and the heat dissipation assembly.

[0008] Preferably, the heat dissipation fin assembly includes multiple low-level stepped fins, multiple first high-level stepped fins, and multiple second high-level stepped fins. The multiple low-level stepped fins are uniformly installed at the center of the front end of the top of the substrate, and a first heat dissipation channel is formed between two adjacent low-level stepped fins. The multiple first high-level stepped fins are uniformly installed at the middle of the top of the substrate, and a second heat dissipation channel is formed between two adjacent first high-level stepped fins. The multiple second high-level stepped fins are uniformly installed at the center of the rear end of the top of the substrate, and a third heat dissipation channel is formed between two adjacent first high-level stepped fins. Both the first heat dissipation channel and the third heat dissipation channel are connected to the second heat dissipation channel.

[0009] Preferably, the heat dissipation component includes a heat absorber, which is fixedly installed at the bottom of the substrate. The heat absorber surrounds the server chip and is in contact with the server chip. Multiple heat sinks are fixedly installed on the heat absorber, and the heat absorber is connected to the multiple heat sinks. Both ends of the multiple heat sinks pass through the substrate, and the multiple heat sinks are in contact with the first high-layer step rib and the second high-layer step rib, respectively.

[0010] Preferably, the substrate has a through groove inside, and multiple arc-shaped heat dissipation strips are evenly installed in the through groove, forming a fourth heat dissipation channel for airflow between two adjacent arc-shaped heat dissipation strips.

[0011] Preferably, a cooling fan is provided at the front end of the substrate, and the air outlet direction of the cooling fan matches the heat dissipation direction of the first heat dissipation channel, the second heat dissipation channel, the third heat dissipation channel and the fourth heat dissipation channel.

[0012] Preferably, the substrate has a plurality of mounting holes that match the server motherboard evenly distributed on it.

[0013] Beneficial effects This invention provides a heat dissipation device for reducing the cooling energy consumption of data center servers. Compared with the prior art, it has the following advantages: 1. This heat dissipation device for reducing the cooling energy consumption of data center servers works in concert with the heat dissipation fins and heat dissipation components. The heat dissipation fins provide an efficient heat dissipation environment for the heat dissipation components, while the heat dissipation components ensure that the heat from the chip is quickly dissipated. This not only effectively reduces the chip temperature and avoids local overheating, but also reduces the reliance on high-energy-consuming forced air cooling equipment, thereby reducing the cooling energy consumption of the data center and improving the stability and lifespan of the server.

[0014] 2. This heat dissipation device for reducing the cooling energy consumption of data center servers significantly improves the heat dissipation capacity of the substrate through the design of the fourth heat dissipation channel and the arc heat dissipation strip. By increasing the airflow contact area and guiding the airflow, the substrate temperature is effectively reduced, thereby assisting the heat conduction of the chip. With the coordinated work of the cooling fan, heat dissipation fins and heat dissipation components, the overall heat dissipation efficiency is significantly improved compared to the original device. It can quickly reduce the chip operating temperature and reduce the risk of server performance degradation or failure due to high temperature. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ; Figure 3 This is a partial structural diagram of the present invention. Figure 1 ; Figure 4 This is a partial structural diagram of the present invention. Figure 2 ; Figure 5 This utility model Figure 3 A magnified view of a portion of point A in the middle.

[0016] In the diagram: 1. Substrate; 2. Heat dissipation fin assembly; 21. Low-level stepped rib; 22. First high-level stepped rib; 23. Second high-level stepped rib; 24. First heat dissipation channel; 25. Second heat dissipation channel; 26. Third heat dissipation channel; 3. Heat dissipation component; 31. Heat absorber; 32. Heat pipe; 4. Server chip; 5. Through slot; 6. Arc-shaped heat sink; 7. Fourth heat dissipation channel; 8. Cooling fan; 9. Mounting hole. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] See Figures 1-5 This utility model provides the following two technical solutions: First implementation: A heat dissipation device for reducing the cooling energy consumption of data center servers, comprising: Substrate 1 is used to connect to the server motherboard, and the bottom of substrate 1 is movably connected to server chip 4. The heat dissipation fin assembly 2 is fixedly installed on the top of the substrate 1. The heat dissipation fin assembly 2 includes multiple low-level stepped fins 21, multiple first high-level stepped fins 22, and multiple second high-level stepped fins 23. The multiple low-level stepped fins 21 are evenly installed at the center of the front end of the top of the substrate 1, and a first heat dissipation channel 24 is formed between two adjacent low-level stepped fins 21. The multiple first high-level stepped fins 22 are evenly installed at the middle of the top of the substrate 1, and a second heat dissipation channel 25 is formed between two adjacent first high-level stepped fins 22. The multiple second high-level stepped fins 23 are evenly installed at the center of the rear end of the top of the substrate 1, and a third heat dissipation channel 26 is formed between two adjacent first high-level stepped fins 22. The first heat dissipation channel 24 and the third heat dissipation channel 26 are both connected to the second heat dissipation channel 25. The heat dissipation fin assembly 2 is used to increase the contact area with the air for heat exchange. The heat dissipation assembly 3 is installed between the heat dissipation fin assembly 2 and the server chip 4. The heat dissipation assembly 3 includes a heat absorber 31, which is fixedly installed on the bottom of the substrate 1. The heat absorber 31 surrounds the server chip 4 and is in contact with the server chip 4. Multiple heat pipes 32 are fixedly installed on the heat absorber 31 and are connected to the multiple heat pipes 32. Both ends of the multiple heat pipes 32 pass through the substrate 1 and are in contact with the first high-level step rib 22 and the second high-level step rib 23, respectively. The heat dissipation assembly 3 is used to absorb the heat of the server chip 4 and dissipate the heat into the air through the heat dissipation fin assembly 2.

[0019] The surface of the substrate 1 that contacts the server chip 4 is made of a thermally conductive material, which facilitates the conduction of heat from the server chip 4 to the heat sink fin group 2 and the heat dissipation component 3.

[0020] The surface of the substrate 1 that contacts the server chip 4 is made of a thermally conductive material. Utilizing the principle of solid-state heat conduction, the heat generated by the chip's operation is rapidly conducted to the heat dissipation fin group 2 at the top of the substrate 1 and the heat dissipation component 3 in the middle. The heat dissipation fin group 2 increases the contact area with the air through an array of fins: low-level stepped fins 21, first high-level stepped fins 22, and second high-level stepped fins 23. At the same time, it forms a through-flow heat dissipation channel: first heat dissipation channel 24, second heat dissipation channel 25, and third heat dissipation channel 26. The airflow carries away the heat, improving the convective heat transfer efficiency. The heat absorber 31 in the heat dissipation component 3 directly contacts the chip and absorbs heat through thermal conduction. The medium in the heat pipe 32 evaporates at the heat absorption end, transferring heat to the fin group, and then liquefies and flows back at the condensation end. Through the phase change process, efficient heat transfer is achieved, and its heat transfer efficiency is much higher than that of simple metal heat conduction.

[0021] In this embodiment, the heat sink fin assembly 2 significantly increases the heat dissipation area through an array-type stepped fin design and optimizes the airflow field by utilizing the height difference. Combined with the through-type heat dissipation channel, it guides the orderly flow of air and significantly improves the convective heat transfer efficiency. The heat absorber 31 in the heat dissipation component 3 is closely attached to the server chip 4 to quickly absorb heat. The heat pipe 32 efficiently transfers heat to the fin assembly through the evaporation and condensation phase change process of the working fluid, and its heat transfer efficiency is far superior to that of ordinary metal heat conduction. The two work together, with the heat sink fin assembly 2 providing an efficient heat dissipation environment for the heat dissipation component 3, and the heat dissipation component 3 ensuring that the chip heat is quickly discharged. This not only effectively reduces the chip temperature and avoids local overheating, but also reduces the dependence on high-energy-consuming forced air cooling equipment, reduces the cooling energy consumption of the data center, and improves the stability and service life of the server.

[0022] The second embodiment differs from the first embodiment in that: a through groove 5 is provided inside the substrate 1, and multiple arc-shaped heat dissipation strips 6 are evenly installed in the through groove 5, and a fourth heat dissipation channel 7 for airflow is formed between two adjacent arc-shaped heat dissipation strips 6.

[0023] A cooling fan 8 is provided at the front end of the substrate 1. The air outlet direction of the cooling fan 8 matches the heat dissipation direction of the first heat dissipation channel 24, the second heat dissipation channel 25, the third heat dissipation channel 26 and the fourth heat dissipation channel 7.

[0024] The substrate 1 has multiple mounting holes 9 that are evenly distributed on it to match the server motherboard.

[0025] The through-slot 5 inside the substrate 1 and the arc-shaped heat sink 6 form the fourth heat dissipation channel 7. Utilizing aerodynamic principles, when the cooling fan 8 is started, the generated airflow enters from the front end. As it passes through the fourth heat dissipation channel 7, the arc-shaped heat sink 6 guides the airflow to diffuse evenly, increasing the contact area between the airflow and the substrate 1 and enhancing heat exchange. At the same time, the fourth heat dissipation channel 7 is connected to the first, second, and third heat dissipation channels of the heat sink fin group 2, forming a three-dimensional, continuous airflow path to achieve orderly airflow. The exhaust direction of the cooling fan 8 matches each heat dissipation channel, ensuring that the airflow can efficiently pass through the entire heat dissipation device and quickly remove heat. The mounting holes 9 on the substrate 1 are based on mechanical assembly principles and are precisely fixed to the server motherboard with screws and other connectors, ensuring stable contact between the heat dissipation device and the server chip 4, providing a solid foundation for heat conduction. In this embodiment, the design of the fourth heat dissipation channel 7 and the arc-shaped heat dissipation strip 6 significantly improves the heat dissipation capacity of the substrate 1. By increasing the airflow contact area and guiding the airflow, the temperature of the substrate 1 is effectively reduced, thereby assisting in the heat conduction of the chip. With the coordinated work of the cooling fan 8, the heat dissipation fin group 2, and the heat dissipation component 3, the overall heat dissipation efficiency is significantly improved compared to the original device. It can quickly reduce the chip operating temperature and reduce the risk of server performance degradation or failure due to high temperature. In terms of installation and maintenance, the mounting holes 9 ensure that the heat dissipation device and the server motherboard are installed conveniently and stably, facilitating rapid deployment and replacement in the data center. At the same time, the stable installation also ensures the reliability of the heat dissipation effect, improves the overall operational stability and maintenance convenience of the equipment, and reduces operation and maintenance costs.

[0026] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0027] In use, place the heat dissipation device substrate 1 above the server motherboard, ensuring that the multiple mounting holes 9 on substrate 1 are precisely aligned with the corresponding screw holes on the motherboard. Use the appropriate screws to pass through the mounting holes 9 and tighten them securely to connect the heat dissipation device to the server motherboard, ensuring that the bottom of substrate 1 is in close contact with the server chip 4 to form a good thermal conductive connection. Turn on the server power, and the cooling fan 8 will start, generating airflow in a preset direction. The airflow enters from the front end of substrate 1 and, within the fourth heat dissipation channel 7, is guided by the arc-shaped heat sink 6 to diffuse evenly, fully exchanging heat with substrate 1. Simultaneously, the airflow sequentially passes through the first heat dissipation channel 24, the second... The second heat dissipation channel 25 and the third heat dissipation channel 26, within the heat dissipation fin assembly 2, further remove heat through large-area contact with the multi-layer stepped fins. The heat generated by the server chip 4 during operation is rapidly conducted to the heat absorber 31 through the heat-conducting surface of the substrate 1 and the surface of the heat absorber 31 in contact with it. After absorbing the heat, the heat absorber 31 causes the working fluid inside the heat pipe 32 to evaporate. The gaseous working fluid carries the heat upward and liquefies at the condensation end of the heat pipe 32, which is in contact with the first high-layer stepped fin 22 and the second high-layer stepped fin 23, transferring the heat to the heat dissipation fin assembly 2, thus completing the efficient transfer of heat from the server chip 4 to the heat dissipation fin assembly 2.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for reducing cooling energy consumption of data center servers, characterized in that, include: A substrate for connecting to a server motherboard, wherein the bottom of the substrate is movably connected to a server chip; The heat dissipation fins are fixedly installed on the top of the substrate to increase the contact area with air for heat exchange. The heat dissipation fins are arranged in an array, and there are channels for air circulation between adjacent fins. A heat dissipation component is installed between the heat sink fin assembly and the server chip. The heat dissipation component is used to absorb the heat from the server chip and dissipate the heat to the air through the heat sink fin assembly.

2. The heat dissipation device for reducing cooling energy consumption of data center servers according to claim 1, characterized in that: The surface of the substrate that contacts the server chip is made of a thermally conductive material, which facilitates the conduction of heat from the server chip to the heat sink fins and the heat dissipation components.

3. The heat dissipation device for reducing cooling energy consumption of data center servers according to claim 2, characterized in that: The heat dissipation fin assembly includes multiple low-level stepped fins, multiple first high-level stepped fins, and multiple second high-level stepped fins. The multiple low-level stepped fins are uniformly installed at the center of the front end of the top of the substrate, and a first heat dissipation channel is formed between two adjacent low-level stepped fins. The multiple first high-level stepped fins are uniformly installed at the middle of the top of the substrate, and a second heat dissipation channel is formed between two adjacent first high-level stepped fins. The multiple second high-level stepped fins are uniformly installed at the center of the rear end of the top of the substrate, and a third heat dissipation channel is formed between two adjacent first high-level stepped fins. Both the first heat dissipation channel and the third heat dissipation channel are connected to the second heat dissipation channel.

4. The heat dissipation device for reducing cooling energy consumption of data center servers according to claim 3, characterized in that: The heat dissipation assembly includes a heat absorber, which is fixedly installed on the bottom of the substrate. The heat absorber surrounds the server chip and is in contact with the server chip. Multiple heat sinks are fixedly installed on the heat absorber and are connected to the multiple heat sinks. Both ends of the multiple heat sinks pass through the substrate and are in contact with the first high-layer step rib and the second high-layer step rib, respectively.

5. A heat dissipation device for reducing cooling energy consumption of data center servers according to claim 4, characterized in that: The substrate has a through groove inside, and multiple arc-shaped heat dissipation strips are evenly installed in the through groove. A fourth heat dissipation channel for airflow is formed between two adjacent arc-shaped heat dissipation strips.

6. A heat dissipation device for reducing cooling energy consumption of data center servers according to claim 5, characterized in that: A cooling fan is provided at the front end of the substrate, and the air outlet direction of the cooling fan matches the heat dissipation direction of the first heat dissipation channel, the second heat dissipation channel, the third heat dissipation channel and the fourth heat dissipation channel.

7. A heat dissipation device for reducing cooling energy consumption of data center servers according to claim 6, characterized in that: The substrate has multiple mounting holes that are uniformly formed on it, which are compatible with the server motherboard.

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