Layered heat dissipation 5G mainboard

Abstract

The utility model discloses a layered heat dissipation's 5G mainboard relates to 5G mainboard technical field, including mainboard structure fixed plate, the fixed plate is fixedly connected with a plurality of fixed plates in mainboard structure fixed plate lower surface all around, the heat dissipation subassembly is provided in mainboard structure fixed plate inside, and the filter component is provided with on both sides of mainboard structure fixed plate, the filter component includes dustproof box, and the dustproof box is fixedly connected with the sealing plate in dustproof box with mainboard structure fixed plate adjacent one side, and the through -hole is seted up in dustproof box other side, and the dustproof box is provided with a plurality of sliding slots, and the sliding slot inside is provided with activated carbon filter screen, electrostatic filter screen and metal filter screen in proper order, the utility model discloses the filter component that sets up, sets up the filtering effect of outside in the outside of mainboard structure, can guarantee the cleaning effect inside mainboard on one hand, can be convenient for installation and disassembly on the other hand.

Description

Technical Field

[0001] This utility model relates to the field of 5G motherboard technology, specifically a layered heat dissipation 5G motherboard. Background Technology

[0002] Fifth-generation mobile communication technology is a new generation of broadband mobile communication technology with high speed, low latency and massive connectivity. 5G communication facilities are the network infrastructure for realizing the interconnection of people, machines and things. The rapid development of 5G communication requires corresponding mature terminal equipment as carriers. Various communication motherboards are electrically installed inside various 5G terminal equipment. At present, the motherboards inside some large terminal equipment consume a lot of power and generate a lot of heat, so targeted heat dissipation treatment is required for the motherboards.

[0003] Currently, mainstream heat dissipation solutions mainly include metal heat sinks, heat pipes, and forced air cooling. While these solutions can reduce motherboard temperature to some extent, they have some problems in practical applications: First, open heat dissipation structures are prone to dust accumulation, and the gaps between heat sink fins and fan air inlets will gradually become clogged with dust, seriously affecting heat dissipation efficiency. Second, dust accumulation will obstruct airflow, increasing the fan load, generating more noise, and shortening the fan's lifespan. Third, some designs using filters are difficult to maintain, requiring frequent disassembly and cleaning, increasing maintenance costs. At the same time, conductive particles in the dust may cause short circuits, affecting equipment reliability.

[0004] Based on this, a layered heat dissipation 5G motherboard is now provided, which can eliminate the drawbacks of existing devices. Utility Model Content

[0005] The purpose of this invention is to provide a 5G motherboard with layered heat dissipation to solve the problems in the background technology.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A layered heat dissipation 5G motherboard includes a motherboard structure fixing plate, with several fixing plates fixedly connected around the lower surface of the motherboard structure fixing plate, a heat dissipation component inside the motherboard structure fixing plate, and filter components on both sides of the motherboard structure fixing plate. The filter assembly includes a dustproof box, with a sealing plate fixedly connected to one side of the dustproof box adjacent to the main board structure fixing plate. A through hole is opened on the other side of the dustproof box. The dustproof box is provided with several sliding grooves, and activated carbon filter, electrostatic filter and metal filter are arranged sequentially inside the sliding grooves. Connecting components are provided on both sides of the dustproof box and are connected to the main board structure fixing plate through the connecting components. The connecting components include a mounting box, with several springs installed inside the mounting box. One end of each spring is fixedly connected to a mounting plate, and a push plate is fixedly connected to the upper end of the mounting plate. The upper end of the push plate is slidably connected to the upper surface of the mounting box.

[0007] Based on the above technical solutions, this utility model also provides the following optional technical solutions: In one alternative embodiment: the connecting assembly further includes two protruding plates, which are symmetrically arranged on both sides of the mounting box. One end of each protruding plate is fixedly connected to one side of the adjacent main board structure fixing plate. The protruding plate has a mounting groove on the side adjacent to the mounting box, and the mounting groove is slidably connected to the adjacent protruding plate.

[0008] In one alternative: sealing grooves are provided on both sides of the main board structure fixing plate, and the sealing grooves are slidably connected to the adjacent sealing plates respectively.

[0009] In one alternative: air inlets are provided on both sides of the motherboard structure fixing plate.

[0010] In one alternative: the activated carbon filter is made of activated carbon and non-woven fabric substrate, the electrostatic filter is made of electret polypropylene, and the metal filter is made of aluminum alloy.

[0011] In one alternative embodiment: the heat dissipation component includes a thermally conductive interlayer, which is disposed on the upper part of the motherboard structure fixing plate, and a heat dissipation layer is disposed on the lower surface of the thermally conductive interlayer, and a plurality of heat dissipation fins are fixedly connected to the heat dissipation layer.

[0012] In one alternative: a cooling fan is fixedly connected to one side of the motherboard structure fixing plate.

[0013] In one alternative: the thermally conductive interlayer is composed of a graphene thermally conductive sheet and a copper heat spreader.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention provides an external filtration effect by incorporating a filter component on the outside of the motherboard structure. This ensures the cleanliness of the motherboard's internal components while facilitating easy installation and removal. The connecting components allow for quick assembly and disassembly, enabling rapid cleaning of the filter component and improving its cleaning effectiveness. This, in turn, enhances the motherboard's heat dissipation and overall usability. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the connecting component structure of this utility model.

[0017] Figure 3 This is a schematic diagram of the heat dissipation component structure of this utility model.

[0018] Figure 4 This is a schematic diagram of the filter assembly structure of this utility model.

[0019] Figure label annotations: 1. Main board structure; 2. Fixing plate; 3. Protruding plate; 4. Dustproof box; 5. Mounting slot; 6. Air inlet; 7. Sealing slot; 8. Thermal conductive layer; 9. Heat dissipation layer; 10. Heat dissipation fins; 11. Mounting box; 12. Mounting plate; 13. Push plate; 14. Spring; 15. Through hole; 16. Activated carbon filter; 17. Electrostatic filter; 18. Metal filter; 19. Sealing plate; 20. Cooling fan. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0021] In one embodiment, such as Figures 1-4 As shown, a layered heat dissipation 5G motherboard includes a motherboard structure fixing plate 1, a plurality of fixing plates 2 are fixedly connected around the lower surface of the motherboard structure fixing plate 1, a heat dissipation component is provided inside the motherboard structure fixing plate 1, and a filter component is provided on both sides of the motherboard structure fixing plate 1. The filter assembly includes a dustproof box 4. A sealing plate 19 is fixedly connected to the side of the dustproof box 4 adjacent to the main board structure fixing plate 1. A through hole 15 is opened on the other side of the dustproof box 4. The dustproof box 4 is provided with several sliding grooves. An activated carbon filter 16, an electrostatic filter 17, and a metal filter 18 are arranged in sequence inside the sliding grooves. Connecting components are provided on both sides of the dustproof box 4 and are connected to the main board structure fixing plate 1 through the connecting components. The connecting components include a mounting box 11. Several springs 14 are provided inside the mounting box 11. A mounting plate 12 is fixedly connected to one end of the spring 14. A push plate 13 is fixedly connected to the upper end of the mounting plate 12. The upper end of the push plate 13 is slidably connected to the upper surface of the mounting box 11. In this embodiment, when the cooling fan 20 is started, external air enters from the air inlet 6 and passes through the metal filter 18 in the dustproof box 4 to intercept large particles of debris, the electrostatic filter 17 to adsorb fine dust, and the activated carbon filter 16 to remove harmful gases. The filtered clean air flows through the heat dissipation fins 10 to carry away heat. The spring 14 of the connecting component continuously applies elastic force, and the mounting plate 12 and the push plate 13 ensure that the dustproof box 4 is tightly attached to the motherboard structure fixing plate 1.

[0022] In one embodiment, such as Figure 4 As shown, the connecting assembly also includes a protruding plate 3. There are two protruding plates 3, which are symmetrically arranged on both sides of the mounting box 11. One end of each protruding plate 3 is fixedly connected to one side of the adjacent main board structure fixing plate 1. The protruding plate 3 is provided with a mounting groove 5 on the side adjacent to the mounting box 11. The mounting groove 5 is slidably connected to the adjacent mounting plate 12. The protruding plate 3 forms a sliding fit with the mounting plate 12 through the mounting groove 5. Under the action of the spring 14, the mounting plate 12 can move longitudinally along the mounting groove 5, which ensures the tight fit between the sealing plate 19 and the sealing groove 7, and allows for dimensional changes caused by thermal expansion and contraction.

[0023] In one embodiment, such as Figure 2 As shown, sealing grooves 7 are provided on both sides of the motherboard structure fixing plate 1. The sealing grooves 7 are slidably connected to the adjacent sealing plates 19 respectively. The sealing plates 19 are embedded in the sealing grooves 7 to a depth of ≥5mm, forming a labyrinth-type sealing structure, which effectively prevents unfiltered air from directly entering the interior of the motherboard structure fixing plate 1.

[0024] In one embodiment, such as Figure 2 As shown, air inlets 6 are provided on both sides of the motherboard structure fixing plate 1. The tilt angle of the air inlets 6 is designed to be 30°, which ensures the air intake while preventing rainwater from splashing in directly. The opening area is matched with the air volume of the cooling fan 20.

[0025] In one embodiment, such as Figure 4 As shown, the activated carbon filter 16 is made of activated carbon and non-woven fabric substrate, the electrostatic filter 17 is made of electret polypropylene, and the metal filter 18 is made of aluminum alloy. The activated carbon filter 16 has a thickness of 3mm, the fiber density of the electrostatic filter 17 is 200g / m², and the mesh density of the metal filter 18 is 80 mesh. The three form a gradient filtration system.

[0026] In one embodiment, such as Figure 3As shown, the heat dissipation component includes a thermally conductive interlayer 8, which is disposed on the upper part of the motherboard structure fixing plate 1. A heat dissipation layer 9 is disposed on the lower surface of the thermally conductive interlayer 8, and a plurality of heat dissipation fins 10 are fixedly connected to the heat dissipation layer 9. The thermally conductive interlayer 8 quickly conducts heat from the motherboard to the heat dissipation layer 9. The spacing between the heat dissipation fins 10 is 2mm and the height is 15mm, maximizing the heat dissipation area within a limited space.

[0027] In one embodiment, such as Figure 3 As shown, a cooling fan 20 is fixedly connected to one side of the motherboard structure fixing plate 1, and the cooling fan 20 is used for heat dissipation.

[0028] In one embodiment, such as Figure 3 As shown, the thermally conductive interlayer 8 is composed of a graphene thermally conductive sheet and a copper heat spreader. The graphene thermally conductive sheet has a thickness of 0.5 mm, and the copper heat spreader has a thickness of 2 mm. The two are combined through a hot-pressing process to form the thermally conductive interlayer 8.

[0029] The above embodiment discloses a layered heat dissipation 5G motherboard. When the device is running, the cooling fan 20 starts to generate airflow. External air first enters the dust chamber 4 from the air inlet 6 at a 30° angle, passing sequentially through an 80-mesh metal filter 18 to intercept large particles, a 200g / m² density electrostatic filter 17 to adsorb fine dust particles larger than 0.3μm, and a 3mm thick activated carbon filter 16 to remove harmful gases. The filtered clean air, driven by the cooling fan 20, flows through the heat dissipation layer 9, carrying away the heat conducted by the thermally conductive interlayer 8. The thermal interlayer 8 is composed of a 0.5mm graphene thermal conductive sheet and a 2mm copper heat spreader, which can quickly balance the heat of the motherboard. The spring 14 of the connecting component continuously applies a 5N elastic force, which pushes the push plate 13 through the mounting plate 12, so that the sealing plate 19 of the dust box 4 and the sealing groove 7 of the motherboard structure fixing plate 1 are tightly fitted with ≥5mm, forming a labyrinth seal. The sliding fit between the mounting groove 5 of the convex plate 3 and the mounting plate 12 allows for ±2mm thermal deformation displacement. The 15mm high heat dissipation fins 10 are arranged at a 2mm spacing to achieve the maximum heat dissipation area in a limited space.

[0030] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A layered heat dissipation 5G motherboard, comprising a motherboard structure fixing plate (1), wherein a plurality of fixing plates (2) are fixedly connected around the lower surface of the motherboard structure fixing plate (1), a heat dissipation component is provided inside the motherboard structure fixing plate (1), and a filter component is provided on both sides of the motherboard structure fixing plate (1). Its features are, The filter assembly includes a dustproof box (4), and a sealing plate (19) is fixedly connected to the side of the dustproof box (4) adjacent to the main board structure fixing plate (1). A through hole (15) is opened on the other side of the dustproof box (4). The dustproof box (4) is provided with several sliding grooves. Activated carbon filter (16), electrostatic filter (17) and metal filter (18) are arranged in sequence inside the sliding grooves. Connecting components are provided on both sides of the dustproof box (4) and connected to the main board structure fixing plate (1) through the connecting components. The connecting components include a mounting box (11). Several springs (14) are provided inside the mounting box (11). A mounting plate (12) is fixedly connected to one end of the spring (14). A push plate (13) is fixedly connected to the upper end of the mounting plate (12). The upper end of the push plate (13) is slidably connected to the upper surface of the mounting box (11).

2. The 5G motherboard with layered heat dissipation according to claim 1, characterized in that, The connecting assembly also includes a convex plate (3). There are two convex plates (3) and they are symmetrically arranged on both sides of the mounting box (11). One end of each convex plate (3) is fixedly connected to one side of the adjacent main board structure fixing plate (1). The convex plate (3) is provided with a mounting groove (5) on the side adjacent to the mounting box (11). The mounting groove (5) is slidably connected to the adjacent mounting plate (12).

3. A 5G motherboard with layered heat dissipation according to claim 1, characterized in that, The main board structure fixing plate (1) has sealing grooves (7) on both sides, and the sealing grooves (7) are slidably connected to the adjacent sealing plates (19).

4. A 5G motherboard with layered heat dissipation according to claim 1, characterized in that, Air inlets (6) are provided on both sides of the main board structure fixing plate (1).

5. A 5G motherboard with layered heat dissipation according to claim 1, characterized in that, The activated carbon filter (16) is made of activated carbon and non-woven fabric substrate, the electrostatic filter (17) is made of electret polypropylene, and the metal filter (18) is made of aluminum alloy.

6. A 5G motherboard with layered heat dissipation according to claim 1, characterized in that, The heat dissipation component includes a heat-conducting interlayer (8), which is disposed on the upper part of the motherboard structure fixing plate (1). A heat dissipation layer (9) is disposed on the lower surface of the heat-conducting interlayer (8), and a plurality of heat dissipation fins (10) are fixedly connected to the heat dissipation layer (9).

7. A 5G motherboard with layered heat dissipation according to claim 1, characterized in that, A cooling fan (20) is fixedly connected to one side of the motherboard structure fixing plate (1).

8. A 5G motherboard with layered heat dissipation according to claim 6, characterized in that, The thermally conductive interlayer (8) is composed of a graphene thermally conductive sheet and a copper heat spreader.

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