Semiconductor light emitting module
By facing the light-emitting surface of the semiconductor light-emitting device towards the circuit board and connecting it through conductive vias and fixed pads, heat can be directly conducted to the heat sink, solving the problems of poor thermal conductivity and high manufacturing cost of semiconductor light-emitting modules, and achieving efficient heat dissipation and low-cost module design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN DADAO SEMICON CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-24
AI Technical Summary
Existing semiconductor light-emitting module structures suffer from poor thermal conductivity, making it impossible to achieve high power and high reliability. Furthermore, the complex manufacturing process and high cost of metal-based circuit boards limit the design and integration of drive and control systems.
Semiconductor light-emitting devices are fixed with the light-emitting surface facing the circuit board. Heat is dissipated through the opposite surface. Combined with conductive vias and fixed pads, the heat is directly conducted to the heat sink, simplifying the circuit board structure and improving thermal conductivity.
It increases the maximum operating power of semiconductor light-emitting devices, meeting the requirements of high power, high thermal conductivity and high reliability, while reducing manufacturing costs and simplifying design constraints.
Smart Images
Figure CN224556170U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor light-emitting technology, and in particular to a semiconductor light-emitting module. Background Technology
[0002] Semiconductor light-emitting devices are often integrated with their driving and / or control system designs to form semiconductor light-emitting modules, which not only reduces size but also facilitates installation and use, and lowers costs.
[0003] Common semiconductor light-emitting module structures such as Figure 1 As shown, it includes a semiconductor light-emitting device 11, a single-layer or multi-layer circuit board 12 for providing a driving and / or control system, and a heat sink 13. Figure 1 It is known that the heat generated by the semiconductor light-emitting device 11 must be conducted to the heat sink 13 through the circuit board 12. The circuit board 12, which is based on FR4, has very poor thermal conductivity, which greatly limits the operating power of the semiconductor light-emitting device 11. When a metal-based circuit board 12, such as aluminum or copper, is used, although the thermal conductivity is greatly improved, the complex manufacturing process, low yield, and high cost of metal-based circuit boards, especially the inability to manufacture multi-layer high-precision metal-based circuit boards, greatly limit the design scope of the drive and / or control system. In terms of structure, cost, and performance, the advantages of integrating the semiconductor light-emitting device and its drive and / or control system into a module are lost.
[0004] Therefore, due to the inherent defects and deficiencies in the above-mentioned semiconductor light-emitting module structure, it is impossible to solve the problems faced in achieving high power, high thermal conductivity, and high reliability of semiconductor light-emitting modules. Utility Model Content
[0005] The technical problem to be solved by this utility model is to provide an improved semiconductor light-emitting module.
[0006] The technical solution adopted by this utility model to solve its technical problem is: to provide a semiconductor light-emitting module, including a semiconductor light-emitting device and a circuit board; the circuit board includes a first surface and a second surface opposite to each other, the semiconductor light-emitting device includes a substrate, the substrate has a first surface and a second surface opposite to each other, at least one light-emitting area and at least one connection area are provided on the first surface of the substrate, the substrate faces the second surface of the circuit board with its first surface facing the second surface of the circuit board and is disposed on the second surface of the circuit board, the first surface of the circuit board is provided with an opening penetrating to its second surface to expose the light-emitting area;
[0007] The connection area is provided with at least one external solder pad; the first surface of the circuit board is provided with at least one conductive through hole extending to the second surface, and the conductive through hole is electrically connected to the corresponding external solder pad by soldering.
[0008] In one embodiment, the connection area is further provided with at least one fixed pad, and the second surface of the circuit board is provided with at least one fixed pad. The fixed pad is connected to the corresponding fixed pad by welding. Both the fixed pad and the fixed pad are insulated from the external pad and the conductive via.
[0009] In one embodiment, the semiconductor light-emitting module further includes a substrate disposed on the second surface of the circuit board and surrounding the outer periphery of the substrate.
[0010] In one embodiment, the surface of the liner facing away from the circuit board is flush with the second surface of the substrate.
[0011] In one embodiment, the liner is connected to the circuit board by a locking device or is fixed together by an adhesive.
[0012] In one embodiment, the second surface of the circuit board is provided with a groove, the groove being located around the opening and communicating with the opening; the substrate is embedded in the groove, and the conductive through hole is located on the bottom surface of the groove.
[0013] In one embodiment, the second surface of the substrate is flush with the second surface of the circuit board.
[0014] In one embodiment, the semiconductor light-emitting device further includes a light-emitting unit disposed in the light-emitting area of the substrate.
[0015] In one embodiment, the semiconductor light-emitting device further includes a dam disposed on a first surface of the substrate, surrounding the outer periphery of the light-emitting area.
[0016] In one embodiment, the semiconductor light-emitting device further includes a light-transmitting layer that fills within the dam and covers part or all of the light-emitting units.
[0017] In one embodiment, the substrate is provided with a first conductive circuit, and the light-emitting unit and the external pad are electrically connected to each other through the first conductive circuit.
[0018] In one embodiment, the first conductive circuit is disposed on a first surface of the substrate; or, the first conductive circuit is partially disposed on the first surface of the substrate and partially disposed on a second surface of the substrate to form a second conductive circuit, wherein the first conductive circuit on the first surface of the substrate is conductively connected to the second conductive circuit on the second surface of the substrate through a conductive channel penetrating the substrate.
[0019] In one embodiment, when the second conductive circuit is provided on the second surface of the substrate, an insulating layer is provided on the second conductive circuit.
[0020] In one embodiment, at least one electronic component is disposed on the first surface of the circuit board; a first conductive line is also disposed on the first surface of the circuit board; the electronic component and the conductive via are electrically connected to each other through the first conductive line.
[0021] In one embodiment, the semiconductor light-emitting module further includes a heat sink, the circuit board having its second surface facing the heat sink and being fixed to the heat sink, and the second surface of the substrate being in close contact with the surface of the heat sink or welded to the surface of the heat sink.
[0022] In one embodiment, a thermally conductive paste or metal solder is provided between the surface of the heat sink and the second surface of the substrate.
[0023] The beneficial effects of this utility model are as follows: the semiconductor light-emitting device is fixed on the circuit board with the light-emitting surface facing the circuit board, and the heat generated by the semiconductor light-emitting device is dissipated through the other side opposite to the circuit board without passing through the circuit board, which improves the heat dissipation efficiency and helps to increase the maximum working power of the semiconductor light-emitting device, thus meeting the requirements of high power, high thermal conductivity and high reliability of semiconductor light-emitting modules. Attached Figure Description
[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:
[0025] Figure 1 This is a schematic diagram of the structure of a semiconductor light-emitting module in the prior art;
[0026] Figure 2 This is a schematic diagram of the structure of a semiconductor light-emitting module according to an embodiment of the present invention;
[0027] Figure 3 This is a schematic diagram of the structure of a semiconductor light-emitting module according to another embodiment of the present invention. Detailed Implementation
[0028] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.
[0029] like Figure 2 and Figure 3As shown, the semiconductor light-emitting module of this utility model includes a semiconductor light-emitting device 20, a circuit board 30, and optionally a heat sink 40. The semiconductor light-emitting device 20 is disposed on and electrically connected to the circuit board 30. The heat generated by the semiconductor light-emitting device 20 during operation is dissipated through its opposite side to the circuit board 30, without needing to be conducted through the circuit board 30. When the semiconductor light-emitting module includes a heat sink 40, the circuit board 30 and the semiconductor light-emitting device 20 are disposed in close contact with the heat sink 40, thereby allowing the heat generated by the semiconductor light-emitting device 20 to be directly conducted to the heat sink 40 without needing to be conducted through the circuit board 30, improving heat conduction efficiency.
[0030] The semiconductor light-emitting device 20 includes a substrate 21 with opposing first and second surfaces. The first surface of the substrate 21 has at least one light-emitting region and at least one connection region. The light-emitting region is used to house light-emitting units 22, and the surface where the light-emitting region is located also forms the light-emitting surface of the semiconductor light-emitting device 20. The connection region is used to connect to a circuit board 30. The circuit board 30 includes opposing first and second surfaces, with the substrate 21 facing the second surface of the circuit board 30 and disposed on the second surface of the circuit board 30. The first surface of the circuit board 30 has an opening 300 extending to the second surface, exposing the light-emitting region on the first surface of the substrate 21, so that light emitted by the semiconductor light-emitting device 20 is emitted outward from the opening 300.
[0031] The first surface of the substrate 21 has at least one external pad 23 on its connection area, and the first surface of the circuit board 30 has at least one conductive via 31 extending to the second surface. The conductive via 31 and the corresponding external pad 23 are electrically connected by soldering. In this way, the substrate 21 and the circuit board 30 are not only electrically connected, but also fixedly connected together.
[0032] To enhance the connection between the substrate 21 and the circuit board 30, the connection area of the substrate 21 may be provided with at least one fixed pad 24, and the second surface of the circuit board 30 may be provided with at least one fixed pad 32; the fixed pad 32 is connected to the corresponding fixed pad 24 by soldering. Both the fixed pad 24 and the fixed pad 32 are insulated from the external pad 23 and the conductive via 31.
[0033] exist Figure 2 In the illustrated embodiment, a groove 310 is provided on the second surface of the circuit board 30. The groove 310 is located around the opening 300 and communicates with the opening 300. The groove 310 is provided so that the conductive via 31 extends from the first surface of the circuit board 30 to the bottom surface of the groove 310. The substrate 21 of the semiconductor light-emitting device 20 is embedded in the groove 310, and the connection area of the substrate 21 mates with the bottom surface of the groove 310, so that the external pad 23 on the connection area is electrically connected to the conductive via 31 on the bottom surface of the groove 310 by soldering.
[0034] The second surface of substrate 21 faces away from the groove 310 and has the same orientation as the second surface of circuit board 30. Preferably, the second surface of substrate 21 is flush with the second surface of circuit board 30. When connected to heat sink 40, circuit board 30 is fixed to heat sink 40 with its second surface facing it, and the second surface of substrate 21 is tightly attached to heat sink 40. To achieve good thermal conductivity, a thermally conductive paste can be applied between the second surface of substrate 21 and the surface of heat sink 40. The second surface of substrate 21 can also be fixed to the surface of heat sink 40 by soldering. Specifically, a metal solder is applied between the second surface of substrate 21 and the surface of heat sink 40, and the second surface of substrate 21 is fixedly connected to the surface of heat sink 40 by soldering.
[0035] exist Figure 3 In the illustrated embodiment, the semiconductor light-emitting module further includes a backing plate 50, which is disposed on the second surface of the circuit board 30 and surrounds the outer periphery of the substrate 21 of the semiconductor light-emitting device 20. The backing plate 50 and the circuit board 30 can be connected together by a locking member, or fixed together by an adhesive, or a combination of both.
[0036] The surface of the backing plate 50 facing away from the circuit board 30 is flush with the second surface of the substrate 21. When connected to the heat sink 40, the backing plate 50 can be fixed to the heat sink 40 by locking means (such as screws) and / or welding, so that the second surface of the substrate 21 is tightly attached to the heat sink 40. To achieve good thermal conductivity, a thermally conductive paste can be applied between the second surface of the substrate 21 and the surface of the heat sink 40. The second surface of the substrate 21 can also be fixed to the surface of the heat sink 40 by welding. Specifically, a metal solder is applied between the second surface of the substrate 21 and the surface of the heat sink 40, and the second surface of the substrate 21 is fixedly connected to the surface of the heat sink 40 by welding.
[0037] Figure 3 The illustrated embodiment is compared to Figure 2 In the illustrated embodiment, no grooves are provided on the circuit board 30, simplifying the structure and fabrication process. By providing the backing plate 50 on the second surface side of the circuit board 30 and surrounding the semiconductor light-emitting device 20, the design and fabrication difficulty of the circuit board 30 can be reduced, further lowering costs.
[0038] Specifically, see Figures 2 to 3 The semiconductor light-emitting device 20 also includes a light-emitting unit 22, which is disposed in the light-emitting area on the first surface of the substrate 21. The light-emitting unit may be composed of one or more combinations of various types of LEDs, NCSPs, CSPs, and light-emitting chips.
[0039] The semiconductor light-emitting device 20 also includes a dam 25 disposed on the first surface of the substrate 21. The dam 25 surrounds the outer periphery of the light-emitting area, defining the light-emitting area within the inner circle region enclosed by the dam 25. The dam 25 is also filled with a light-transmitting layer 26, which simultaneously covers part or all of the light-emitting units 22, protecting the light-emitting units 22 without affecting the emission of light.
[0040] The light-transmitting layer 26 can be a transparent silicone layer or epoxy resin layer, which may also contain at least one phosphor and / or at least one photoluminescent powder as needed. The light-transmitting layer 26 can also be formed of glass, quartz, fluorescent glass, fluorescent ceramic, etc.
[0041] The semiconductor light-emitting device 20 also includes a first conductive circuit 27 disposed on the substrate 21. The light-emitting unit 22 and the external bonding pad 23 are electrically connected to each other through the first conductive circuit 27.
[0042] Alternatively, the first conductive circuit 27 is disposed on a first surface of the substrate 21. Alternatively, the first conductive circuit 27 is partially disposed on the first surface of the substrate 21 and partially disposed on a second surface of the substrate 21. The portion of the first conductive circuit disposed on the second surface of the substrate 21 forms a second conductive circuit 271. The substrate 21 is provided with a conductive channel 28 penetrating both its first and second surfaces, through which the first conductive circuit 27 on the first surface of the substrate 21 is electrically connected to the second conductive circuit 271 on the second surface of the substrate 21 via the conductive channel 28.
[0043] When a second conductive circuit 271 is provided on the second surface of the substrate 21, in order to avoid a short circuit when connected to the heat sink 40, an insulating layer 29 is provided on the second conductive circuit 271, and the insulating layer 29 is disposed between the second conductive circuit 271 and the heat sink 40. The insulating layer 29 may be formed using, but is not limited to, green oil.
[0044] At least one electronic component 33 and a first conductive line 32 may be disposed on the first surface of the circuit board 30. The electronic component 33 is electrically connected to the conductive via 31 through the first conductive line 32.
[0045] In summary, the semiconductor light-emitting module of this invention allows the heat generated by the semiconductor light-emitting device 20 to be directly conducted to the heat sink 40, achieving the shortest heat conduction path and better heat conduction performance. This significantly increases the maximum power of the semiconductor light-emitting device 20. At the same time, the complexity and number of layers of the circuit board 30 do not affect the heat conduction performance, providing a better design environment for the drive and / or control system design. It has advantages such as high operating power, simple structure, convenient manufacturing, few design limitations, and low cost.
[0046] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A semiconductor light-emitting module, characterized in that, The invention includes a semiconductor light-emitting device and a circuit board; the circuit board includes a first surface and a second surface opposite to each other, the semiconductor light-emitting device includes a substrate, the substrate has a first surface and a second surface opposite to each other, at least one light-emitting area and at least one connection area are provided on the first surface of the substrate, the substrate faces the second surface of the circuit board with its first surface facing the second surface of the circuit board and is disposed on the second surface of the circuit board, and the first surface of the circuit board is provided with an opening extending through to its second surface to expose the light-emitting area. The connection area is provided with at least one external solder pad; the first surface of the circuit board is provided with at least one conductive through hole extending to the second surface, and the conductive through hole is electrically connected to the corresponding external solder pad by soldering.
2. The semiconductor light-emitting module according to claim 1, characterized in that, The connection area is also provided with at least one fixed pad, and the second surface of the circuit board is provided with at least one fixed pad, and the fixed pad is connected to the corresponding fixed pad by welding. Both the fixed pad and the fixed pad are insulated from the external pad and the conductive via.
3. The semiconductor light-emitting module according to claim 1, characterized in that, The semiconductor light-emitting module also includes a backing plate, which is disposed on the second surface of the circuit board and surrounds the outer periphery of the substrate.
4. The semiconductor light-emitting module according to claim 3, characterized in that, The surface of the liner facing away from the circuit board is flush with the second surface of the substrate.
5. The semiconductor light-emitting module according to claim 3, characterized in that, The liner is connected to the circuit board by a locking device or is fixed together by an adhesive.
6. The semiconductor light-emitting module according to claim 1, characterized in that, The second surface of the circuit board is provided with a groove, which is located around the opening and communicates with the opening; The substrate is embedded in the groove, and the conductive via is located on the bottom surface of the groove.
7. The semiconductor light-emitting module according to claim 6, characterized in that, The second surface of the substrate is flush with the second surface of the circuit board.
8. The semiconductor light-emitting module according to any one of claims 1-7, characterized in that, The semiconductor light-emitting device further includes a light-emitting unit, which is disposed in the light-emitting area of the substrate.
9. The semiconductor light-emitting module according to claim 8, characterized in that, The semiconductor light-emitting device further includes a dam, which is disposed on the first surface of the substrate and surrounds the outer periphery of the light-emitting area.
10. The semiconductor light-emitting module according to claim 9, characterized in that, The semiconductor light-emitting device further includes a light-transmitting layer, which fills the enclosure and covers part or all of the light-emitting units.
11. The semiconductor light-emitting module according to claim 8, characterized in that, The substrate is provided with a first conductive circuit, and the light-emitting unit and the external solder pad are electrically connected to each other through the first conductive circuit.
12. The semiconductor light-emitting module according to claim 11, characterized in that, The first conductive circuit is disposed on the first surface of the substrate; or, the first conductive circuit is partially disposed on the first surface of the substrate and partially disposed on the second surface of the substrate to form a second conductive circuit, wherein the first conductive circuit on the first surface of the substrate is conductively connected to the second conductive circuit on the second surface of the substrate through a conductive channel penetrating the substrate.
13. The semiconductor light-emitting module according to claim 12, characterized in that, When the second conductive circuit is provided on the second surface of the substrate, an insulating layer is provided on the second conductive circuit.
14. The semiconductor light-emitting module according to any one of claims 1-7, characterized in that, At least one electronic component is disposed on the first surface of the circuit board; a first conductive line is also disposed on the first surface of the circuit board; the electronic component and the conductive via are electrically connected to each other through the first conductive line.
15. The semiconductor light-emitting module according to any one of claims 1-7, characterized in that, The semiconductor light-emitting module also includes a heat sink, with the circuit board having its second surface facing the heat sink and fixed to the heat sink, and the second surface of the substrate being tightly attached to the surface of the heat sink or welded to the surface of the heat sink.
16. The semiconductor light-emitting module according to claim 15, characterized in that, A thermally conductive paste or metal solder is provided between the surface of the heat sink and the second surface of the substrate.