Eutectic device

Abstract

The utility model provides a kind of eutectic equipment, including crossbeam, first patching mechanism, second patching mechanism, first material preparation mechanism, second material preparation mechanism and heating platform, wherein: first patching mechanism and second patching mechanism are movably arranged in crossbeam, first patching mechanism includes support plate and first sliding table, first sliding table is movably arranged in crossbeam along first direction, support plate is movably arranged on first sliding table along second direction, support plate is equipped with material taking module, material taking module includes the fixed seat plate of being arranged in support plate, adjustablely being provided with movable seat plate on fixed seat plate along vertical direction, rotatably installed with rotary adjustment seat on movable seat plate, rotary adjustment seat is equipped with first suction nozzle, the center axis of rotation of rotary adjustment seat coincides with the center axis of first suction nozzle.The utility model is moved relatively in the process of patching by first suction nozzle drive chip and heat sink, makes both full adhesion, guarantees product yield.

Description

Technical Field

[0001] This utility model relates to the field of chip eutectic technology, and in particular to a eutectic device. Background Technology

[0002] Eutectic bonding, also known as eutectic die bonding, is a die bonding technology used in devices requiring enhanced heat dissipation, such as high-power amplifiers. Simply put, eutectic bonding involves placing a heat sink on a heated platform, causing the solder on the heat sink to liquefy, and then bonding the chip to the heat sink using this solder. However, the liquefied solder on the heat sink has surface tension. Since chips are small and lightweight, the bonding between the chip and the heat sink is easily affected by the surface tension of the solder, leading to a decrease in the die bonding yield. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a eutectic device that can drive the chip to translate and / or rotate as a heat sink, which is beneficial to breaking the surface tension of the liquefied solder between the chip and the heat sink.

[0004] The embodiments of this utility model are achieved through the following technical solutions:

[0005] A eutectic bonding apparatus includes a base, a crossbeam, a first die-mounting mechanism, a second die-mounting mechanism, a first material preparation mechanism, a second material preparation mechanism, and a heating stage, wherein: the crossbeam is disposed on the base and extends along a first direction; the first die-mounting mechanism and the second die-mounting mechanism are movably disposed on the crossbeam, the first die-mounting mechanism being movable along the first direction to transfer a chip, and the second die-mounting mechanism being movable along the first direction to transfer a heat sink; the heating stage is disposed on the base and is located near the center of the crossbeam; the first material preparation mechanism is used to store chips, and the second material preparation mechanism is used to store heat sinks; the first die-mounting mechanism includes a support plate and a first slide. The first slide is movably mounted on the crossbeam along the first direction, and the support plate is movably mounted on the first slide along the second direction. The support plate is equipped with a vision component and a material handling module. The material handling module includes a fixed base plate mounted on the support plate, a movable base plate adjustable along the vertical direction on the fixed base plate, a rotary adjustment seat on the movable base plate, and a first suction nozzle mounted on the rotary adjustment seat. The rotary adjustment seat is rotatably mounted on the movable base plate, and the rotation center axis of the rotary adjustment seat coincides with the center axis of the first suction nozzle. The center axis of the first suction nozzle is parallel to the vertical direction; the first direction, the second direction, and the vertical direction are all perpendicular to each other. Here, the cooperation between the first and second placement mechanisms improves material handling efficiency. The spatial movement of the first suction nozzle drives the relative movement of the chip and the heat sink during the placement process, which helps to break the surface tension of the liquefied solder, promotes full adhesion between the chip and the heat sink, and ensures product yield.

[0006] According to a preferred embodiment, the rotary adjustment seat includes a vertical plate, a deflection adjustment block is disposed on the vertical plate, a pressure sensor is disposed on the deflection adjustment block, and the first suction nozzle is assembled to the pressure sensor.

[0007] According to a preferred embodiment, the first suction nozzle is assembled to the pressure sensor via a limiting seat. The limiting seat includes a first limiting part and a second limiting part. The first limiting part is assembled to the pressure sensor, and the second limiting part is provided with an assembly hole for accommodating the first suction nozzle. An adjustment groove is formed on the second limiting part, and the adjustment groove communicates with the assembly hole. An extension plate is provided on the upright plate, and a limiting protrusion is provided on the first limiting part. The limiting protrusion is located on the lower side of the extension plate in the vertical direction.

[0008] According to a preferred embodiment, the rotary adjustment seat is rotatably mounted on the movable seat plate via an arcuate slide.

[0009] According to a preferred embodiment, the first material preparation mechanism includes a lower mounting base plate, an extension block, and an upper mounting base plate. The lower mounting plate is adjustablely disposed on the base plate along a first direction, the extension block is adjustablely disposed on the lower mounting plate along a second direction, and the upper mounting plate is assembled on the extension block. At least one rotating seat is rotatably mounted on the upper mounting plate, and a tray for placing chips is disposed on the rotating seat.

[0010] According to a preferred embodiment, the eutectic device further includes a calibration module, which is respectively disposed between the first material preparation mechanism and the heating stage, and between the second material preparation mechanism and the heating stage; the calibration module includes a first worktable disposed on the base, a second worktable adjustablely disposed on the first worktable along a second direction, a third worktable adjustablely disposed on the second worktable along a first direction, and a suction nozzle platform rotatably disposed on the third worktable, the suction nozzle platform being provided with a negative pressure hole. Attached Figure Description

[0011] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 A three-dimensional structural schematic diagram of the eutectic device provided in this embodiment of the utility model;

[0013] Figure 2 A first three-dimensional structural schematic diagram of the first patch mechanism provided in an embodiment of this utility model;

[0014] Figure 3 A second three-dimensional structural schematic diagram of the first patch mechanism provided in an embodiment of this utility model;

[0015] Figure 4 A three-dimensional structural diagram of the material handling module provided in an embodiment of this utility model;

[0016] Figure 5 A first three-dimensional structural schematic diagram of the pressure sensor and first suction nozzle mounting structure provided in an embodiment of this utility model;

[0017] Figure 6 A second three-dimensional structural diagram of the pressure sensor and first suction nozzle mounting structure provided in an embodiment of this utility model;

[0018] Figure 7 A three-dimensional structural diagram of the first material preparation mechanism provided for an embodiment of this utility model;

[0019] Figure 8 This is a three-dimensional structural diagram of the calibration module provided in an embodiment of the present invention.

[0020] Icons: 1. Base; 2. Crossbeam; 3. First patching mechanism; 31. First slide; 311. Assembly block; 32. Support plate; 33. Vision component; 34. Material handling module; 341. Fixed base plate; 3411. Top plate; 3412. Voice coil motor; 3413. Magnetic spring; 342. Movable base plate; 343. Rotary adjustment base; 3431. Vertical plate; 3432. Deflection adjustment block; 34321. Pressure sensor; 344. Curved slide; 345. First suction nozzle; 346. Limiting seat; 3461. First limiting part; 34611. Limiting protrusion 3462, Second limiting part; 34621, Adjustment groove; 347, Extension plate; 3471, Limiting plate; 4, Second patching mechanism; 5, First material preparation mechanism; 51, Lower mounting base plate; 52, Extension block; 53, Upper mounting base plate; 531, Rotary seat; 5311, Tray; 54, Synchronous belt; 6, Second material preparation mechanism; 7, Heating table; 8, Calibration module; 81, First worktable; 82, Second worktable; 83, Third worktable; 84, Nozzle platform; 85, Automatic rotary slide; X, First direction; Y, Second direction; Z, Vertical direction. Detailed Implementation

[0021] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0022] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0024] Please refer to Figures 1 to 8A eutectic bonding apparatus includes a base 1, a crossbeam 2, a first chip mounting mechanism 3, a second chip mounting mechanism 4, a first material preparation mechanism 5, a second material preparation mechanism 6, and a heating stage 7. The crossbeam 2 is disposed on the base 1 and extends along a first direction X. Both the first chip mounting mechanism 3 and the second chip mounting mechanism 4 are movably disposed on the crossbeam 2. The first chip mounting mechanism 3 is movable along the first direction X to transfer chips, and the second chip mounting mechanism 4 is movable along the first direction X to transfer heat sinks. The heating stage 7 is disposed on the base 1 and is positioned near the center of the crossbeam 2. The first material preparation mechanism 5 is used to store chips, and the second material preparation mechanism 6 is used to store heat sinks. The first chip mounting mechanism 3 includes a support plate 32 and a first slide 31, which is movable along the first direction X. A support plate 32 is movably mounted on a first slide table 31 along the second direction Y, and a vision component 33 and a material picking module 34 are configured on the support plate 32. The material picking module 34 includes a fixed base plate 341 mounted on the support plate 32, a movable base plate 342 adjustable along the vertical direction Z on the fixed base plate 341, a rotary adjustment seat 343 mounted on the movable base plate 342, and a first suction nozzle 345 mounted on the rotary adjustment seat 343. The rotary adjustment seat 343 is rotatably mounted on the movable base plate 342, and the rotation center axis of the rotary adjustment seat 343 coincides with the center axis of the first suction nozzle 345. The center axis of the first suction nozzle 345 is parallel to the vertical direction Z. The first direction X, the second direction Y, and the vertical direction Z are all perpendicular to each other.

[0025] like Figure 1 As shown, the second placement mechanism 4 transfers the heat sink from the second preparation mechanism 6 to the heating stage 7. After heating the heat sink until the solder liquefies, the first placement mechanism 3 transfers the chip from the first preparation mechanism 5 to the heating stage 7 and attaches it to the heat sink. The heat sink and the chip are then soldered together using solder. In this embodiment, the first suction nozzle 345 is mounted on the rotary adjustment seat 343. The rotary adjustment seat 343 can move in the first direction X, the second direction Y, and the vertical direction Z with the cooperation of the first slide 31, the support plate 32, and the movable seat plate 342. The rotary adjustment seat 343 itself can rotate around the central axis of the first suction nozzle 345 to a certain extent, which allows the first suction nozzle 345 to move in the first direction X, the second direction Y, and the vertical direction Z. At the same time, the first suction nozzle 345 can rotate on its own axis. Therefore, when the chip is picked up by the first suction nozzle 345 and bonded to the liquefied solder, by controlling the first suction nozzle 345 to reciprocate in the vertical direction Z with a small amplitude, the lower surface of the chip can come into contact with the solder during the reciprocating motion. During this process, the lower surface of the chip can pick up some solder, thereby effectively breaking the surface tension of the solder when the chip and the solder are bonded. This is beneficial for the lower side of the chip to fully bond with the solder, avoiding gaps between the chip and the heat sink, which would affect the yield.

[0026] Furthermore, after the reciprocating motion in the vertical direction Z is completed, the chip is maintained at a certain height in the vertical direction Z. In this state, the lower surface of the chip is required to contact the solder. As the solder tension is broken at the instant, the chip and the heat sink are connected through the liquid bridge formed by the solder. The solder between the chip and the heat sink forms a new stable state under the action of tension. At this time, the chip is driven to rotate and / or translate in a plane parallel to the upper surface of the heat sink by the first nozzle 345 to further break the solder tension, so that the solder can fully spread to all areas of the lower surface of the chip. Then, the chip is pressed down to maintain an appropriate distance from the heat sink until the solder cools and solidifies. After that, the chip is unloaded by the first mounting mechanism 3. In this way, the surface tension of the liquefied solder can be effectively broken during the chip-heat sink bonding process, which is conducive to the removal of gas between the chip and the heat sink to avoid gaps between the heat sink and the chip, thus ensuring the eutectic yield of the chip.

[0027] In this embodiment, optionally, the first patch assembly 3 and the second patch assembly 4 have the same structure, and the first material preparation mechanism 5 and the second material preparation mechanism 6 have the same structure. This embodiment will be described using the first patch assembly structure and the second patch assembly 4 as examples. Figure 1 As shown, the first slide table 31 is slidably mounted on the top of the crossbeam 2 along the first direction X via a slide rail slider assembly. A linear motor for driving the first slide table 31 is configured on the crossbeam 2, and the first slide table 31 is mounted on the mover of the linear motor.

[0028] like Figure 2 and Figure 3 As shown, an assembly block 311 is disposed on the first slide table 31, and the support plate 32 is slidably connected to the assembly block 311 through a slide rail slider assembly, that is, the support plate 32 is indirectly connected to the first slide table 31 through the assembly block 311. A linear motor for driving the support plate 32 to move is disposed on the assembly block 311, and the support plate 32 is assembled to the mover of the linear motor.

[0029] like Figure 4 As shown, a top plate 3411 is disposed on the top of the fixed base plate 341. A voice coil motor 3412 and a magnetic spring 3413 are disposed on the top plate 3411. Both the voice coil motor 3412 and the magnetic spring 3413 are connected to the movable base plate 342. The movable base plate 342 is slidably connected to the fixed base plate 341 in the vertical direction Z by a cross roller guide. The voice coil motor 3412 is used to drive the movable base plate 342 to move in the vertical direction Z, and the magnetic spring 3413 is used to balance the weight of the movable base plate 342 and the structure assembled on the movable base plate 342.

[0030] Furthermore, the rotary adjustment seat 343 includes a vertical plate 3431, on which a deflection adjustment block 3432 is disposed, and on which a pressure sensor 34321 is disposed, and the first suction nozzle 345 is mounted on the pressure sensor 34321. The vertical plate 3431, i.e., the rotary adjustment seat 343, is rotatably mounted on the movable seat plate 342 via an arc-shaped slide 344. Here, the pressure sensor 34321 is used to detect the force applied to the chip by the first suction nozzle 345 during the process of the first suction nozzle 345 abutting against the chip. When the force exceeds a threshold, the voice coil motor 3412 drives the first suction nozzle 345 to move upward in the vertical direction Z to transfer the chip. It should be noted that the reciprocating motion of the chip in the vertical direction Z mentioned above is also achieved by driving the voice coil motor 3412 here.

[0031] like Figure 5 and Figure 6 As shown, the first suction nozzle 345 is mounted on the pressure sensor 34321 via a limiting seat 346. The limiting seat 346 includes a first limiting part 3461 and a second limiting part 3462. The first limiting part 3461 is mounted on the pressure sensor 34321, and the second limiting part 3462 is provided with a mounting hole for accommodating the first suction nozzle 345. An adjustment groove 34621 is provided on the second limiting part 3462, which communicates with the mounting hole. An extension plate 347 is disposed on the upright plate 3431, and a limiting protrusion 34611 is disposed on the first limiting part 3461. The limiting protrusion 34611 is located on the lower side of the extension plate 347 in the vertical direction Z. In this embodiment, there is a gap between the limiting protrusion 34611 and the extension plate 347, which provides space for the pressure sensor 34321 to deform under pressure, and at the same time limits the upward deformation of the pressure sensor 34321. The tightness of the first suction nozzle 345 assembly is adjusted by bolts (not shown in the figure) and adjusting groove 34621 on the second limiting part 3462.

[0032] Furthermore, a limiting plate 3471 is disposed on the extension plate 347. The limiting plate 3471 is an L-shaped plate, and the pressure sensor 34321 is located between the extension plate 347 and the limiting plate 3471. Here, the limiting plate 3471 is located below the pressure sensor 34321 and is used to limit the deformation distance of the pressure sensor 34321 in the vertical direction Z.

[0033] like Figure 7As shown, the first material preparation mechanism 5 includes a lower mounting base plate 51, an extension block 52, and an upper mounting base plate 53. The lower mounting plate is adjustablely disposed on the base 1 along a first direction X, and the extension block 52 is adjustablely disposed on the lower mounting plate along a second direction Y. The upper mounting plate is assembled on the extension block 52. At least one rotating seat 531 is rotatably mounted on the upper mounting plate, and a tray 5311 for placing chips is disposed on the rotating seat 531. In this embodiment, the rotating seat 531 is rotatably mounted to the upper mounting base plate 53 via bearings. A pulley is sleeved on the rotating seat 531, and a motor is mounted on the extension block 52. The motor drives the rotating seat 531 to rotate via a synchronous belt 54 to adjust the spatial position of the tray 5311. Here, the tray 5311 can be a waffle box. Specifically, the lower mounting base plate 51 is slidably mounted on the base 1 via a slide rail slider assembly and is driven to move along the first direction X by a linear module set on the base 1. The extension block 52 is slidably mounted on the lower mounting base plate 51 via a slide rail slider assembly and is driven to move along the second direction Y by a linear module set on the lower mounting base plate 51.

[0034] like Figure 8 As shown, the eutectic equipment also includes a calibration module 8, which is respectively disposed between the first material preparation mechanism 5 and the heating stage 7, and between the second material preparation mechanism 6 and the heating stage 7. The calibration module 8 includes a first worktable 81 disposed on the base 1, a second worktable 82 adjustable along the second direction Y on the first worktable 81, a third worktable 83 adjustable along the first direction X on the second worktable 82, and a suction platform 84 rotatably disposed on the third worktable 83, with a negative pressure hole disposed on the suction platform 84. In this embodiment, the second worktable 82 is slidably mounted on the first worktable 81 via a slide rail slider assembly and is driven to move along the second direction Y by a linear motor disposed on the first worktable 81; the third worktable 83 is slidably mounted on the second worktable 82 via a slide rail slider assembly and is driven to move along the first direction X by a linear motor disposed on the second worktable 82, thus realizing the position adjustment of the suction platform 84. In this embodiment, an automatic rotating slide 85 is provided on the third worktable 83, and the nozzle platform 84 is rotatably mounted on the third worktable 83 via the automatic rotating slide 85. In some embodiments, the posture of the heat sink and the chip on the material preparation mechanism is identified by the vision component 33. The chip is transferred to the adjacent calibration module 8 for angle adjustment via the first placement mechanism 3, and the heat sink is transferred to the adjacent calibration module 8 for angle adjustment via the second placement mechanism 4. Then, it is transferred to the heating stage 7 via the first placement mechanism 3 and the second placement mechanism 4 respectively to improve the placement accuracy.

[0035] This embodiment also provides a eutectic process applied to the aforementioned eutectic equipment, comprising the following steps:

[0036] Step S1: Transfer the heat sink to the heating stage 7 and heat it until the solder liquefies;

[0037] Step S2: Transfer the chip to the heating stage 7 area and drive the chip to reciprocate in the vertical direction Z to contact or detach from the liquefied solder;

[0038] Step S3: Attach the chip to the heat sink and wait for the solder to cool and solidify.

[0039] It should be noted that the heating stage 7 is equipped with negative pressure holes for fixing the heat sink under negative pressure. The heating stage 7 is a ceramic plate heated by resistance. During operation, when the chip picked up by the first suction nozzle 345 is bonded to the liquefied solder, the first suction nozzle 345 is controlled to reciprocate in a small amplitude in the vertical Z direction, so that the lower surface of the chip can contact the solder during the reciprocating motion. During this process, the lower surface of the chip can pick up some solder, thereby effectively breaking the surface tension of the solder when the chip and solder are bonded. This is conducive to the full bonding between the lower side of the chip and the solder, avoiding gaps between the chip and the heat sink, and ensuring product yield. Here, the solder picked up on the chip has the same composition as the solder on the heat sink. When they come into contact, they can quickly break the surface tension and form a liquid bridge, which helps to reduce the influence of the solder tension between the chip and the heat sink when they are bonded. In some embodiments, the reciprocating frequency of the chip in the vertical Z direction can resonate with the liquefied solder, thereby breaking the surface tension constraint of the liquefied solder through resonance, which is more conducive to the successful picking up of solder on the lower surface of the chip.

[0040] Furthermore, in step S2, when the chip moves downwards in the vertical direction Z, the lower surface of the chip adheres to the liquefied solder, while remaining non-adherent to the heat sink in the vertical direction Z; when the chip moves upwards in the vertical direction Z, the lower surface of the chip detaches from the liquefied solder. This periodic contact and detachment from the solder causes the liquefied solder to vibrate or even resonate. This process, ensuring the chip remains non-adherent to the heat sink, prevents excessive pressure from causing solder overflow.

[0041] In this embodiment, the following steps are included between step S2 and step S3:

[0042] Step S21: Maintain the chip at a certain height in the vertical Z direction, with the lower surface of the chip abutting against the liquefied solder. This step allows time for the solder on the chip and the solder on the heat sink to form a liquid bridge and fully fuse.

[0043] In this embodiment, the following steps are included between step S21 and step 3:

[0044] Step S211: Drive the chip to rotate and / or translate in a plane parallel to the upper surface of the heat sink.

[0045] After step S21, the liquefied solder between the chip and the heat sink fuses and returns to an equilibrium state. It is understood that the lower surface of the chip is difficult to completely cover the solder during the aforementioned process. Therefore, by driving the chip to rotate and / or translate in a plane parallel to the upper surface of the heat sink, the tension of the liquefied solder can be further broken, allowing the solder to fully spread to all areas of the lower surface of the chip. Then, the chip is pressed down to maintain an appropriate distance from the heat sink until the solder cools and solidifies. After that, the chip is then unloaded through the first mounting mechanism 3.

[0046] The aforementioned steps significantly reduce the impact of liquefied solder tension during the chip and heat sink bonding process, enabling the chip and heat sink to bond fully and improving the yield of chip eutectic bonding.

[0047] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A eutectic device, characterized in that, It includes a base, a crossbeam, a first patching mechanism, a second patching mechanism, a first material preparation mechanism, a second material preparation mechanism, and a heating table, wherein: The crossbeam is disposed on the base and extends along a first direction; both the first and second placement mechanisms are movably disposed on the crossbeam, the first placement mechanism being able to move along the first direction to transfer the chip, and the second placement mechanism being able to move along the first direction to transfer the heat sink; the heating stage is disposed on the base and is located near the center of the crossbeam; the first material preparation mechanism is used to store the chip, and the second material preparation mechanism is used to store the heat sink. The first patching mechanism includes a support plate and a first slide. The first slide is movably disposed on the crossbeam along a first direction. The support plate is movably disposed on the first slide along a second direction. The support plate is equipped with a vision component and a material picking module. The material picking module includes a fixed base plate disposed on the support plate. A movable base plate is adjustablely disposed on the fixed base plate along the vertical direction. A rotary adjustment seat is disposed on the movable base plate. A first suction nozzle is disposed on the rotary adjustment seat. The rotary adjustment seat is rotatably mounted on the movable base plate. The rotation center axis of the rotary adjustment seat coincides with the center axis of the first suction nozzle. The center axis of the first suction nozzle is parallel to the vertical direction. The first direction, the second direction, and the vertical direction are all perpendicular to each other.

2. The eutectic apparatus according to claim 1, characterized in that, The rotary adjustment seat includes a vertical plate, on which a deflection adjustment block is disposed, and a pressure sensor is disposed on the deflection adjustment block. The first suction nozzle is assembled to the pressure sensor.

3. The eutectic apparatus according to claim 2, characterized in that, The first suction nozzle is mounted on the pressure sensor via a limiting seat. The limiting seat includes a first limiting part and a second limiting part. The first limiting part is mounted on the pressure sensor. The second limiting part is provided with an assembly hole for accommodating the first suction nozzle. An adjustment groove is provided on the second limiting part, and the adjustment groove is connected to the assembly hole. An extension plate is provided on the upright plate, and a limiting protrusion is provided on the first limiting part. The limiting protrusion is located on the lower side of the extension plate in the vertical direction.

4. The eutectic apparatus according to claim 1, characterized in that, The rotary adjustment seat is rotatably mounted on the movable seat plate via an arc-shaped slide.

5. The eutectic apparatus according to claim 1, characterized in that, The first material preparation mechanism includes a lower mounting base plate, an extension block, and an upper mounting base plate. The lower mounting base plate is adjustablely disposed on the base in a first direction, the extension block is adjustablely disposed on the lower mounting base plate in a second direction, and the upper mounting base plate is assembled on the extension block. At least one rotating base is rotatably mounted on the upper mounting plate, and the rotating base is provided with a tray for placing the chip.

6. The eutectic apparatus according to claim 1, characterized in that, The eutectic equipment also includes a calibration module, which is respectively disposed between the first material preparation mechanism and the heating table, and between the second material preparation mechanism and the heating table; The calibration module includes a first workbench disposed on the base, a second workbench adjustable along a second direction on the first workbench, a third workbench adjustable along a first direction on the second workbench, a suction nozzle platform rotatably disposed on the third workbench, and a negative pressure hole disposed on the suction nozzle platform.

Images