A jumper structure and a semiconductor structure

Abstract

The utility model relates to the field of semiconductor manufacturing technology, especially to a jumper structure and a semiconductor structure, jumper structure includes mutually connected positive panel and connecting plate, the positive panel with the connecting plate forms the bending structure, one end of positive panel away from the connecting plate is equipped with the boss, still be equipped with the through -flow hole on the positive panel, the through -flow hole is located between the boss with the connecting plate, when carrying out plastic package, plastic package material passes through the through -flow hole and enters the gap between positive panel and chip group, carries out the filling to the gap between positive panel and chip group to extrude the gas between positive panel and chip group, avoids the bubble between positive panel and chip group, further, plastic package material passes through the through -flow hole and penetrates positive panel, and plastic package material solidifies and forms the plastic package body to make the plastic package body penetrate the positive panel of jumper structure, and then makes the plastic package body and jumper structure connection more reliable, strengthens the overall connection strength of semiconductor.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a jumper structure and a semiconductor structure. Background Technology

[0002] Current semiconductor structures generally include chips, jumpers, and metal frames. The front side of the chip is soldered to a metal frame via jumpers, and the bottom side of the chip is soldered to another metal frame. Then, a molding process is used to form a molding compound that encapsulates the chip, jumpers, and metal frames.

[0003] In industries such as semiconductors and LCDs, for example, Chinese patent CN211719588U discloses a jumper suitable for conductive modules. The connecting part is provided with a boss that connects to the chip. The boss contacts and is soldered to the chip. During plastic encapsulation, due to the presence of the boss, there is a gap between the jumper and the chip, which can easily lead to air bubbles between the jumper and the chip. This can cause delamination and bulging on the jumper surface, affecting the performance and durability of the product. Utility Model Content

[0004] The purpose of this invention is to address the problem in the prior art where gaps exist between jumpers and chips, which can easily lead to air bubbles between the jumpers and chips, resulting in delamination and bulging on the jumper surface. This invention provides a jumper structure and a semiconductor structure.

[0005] In a first aspect, the present invention provides a jumper structure, including a front panel and a connecting plate connected to each other, wherein the front panel and the connecting plate form a bent structure, and a boss is provided at the end of the front panel away from the connecting plate;

[0006] The front panel is also provided with a flow hole, which is located between the boss and the connecting plate.

[0007] The jumper structure of this application, by providing a flow hole between the boss and the connecting plate, allows the molding material to enter the gap between the front panel and the chipset during molding, thereby filling the gap and squeezing out the gas between the front panel and the chipset, preventing air bubbles from forming between the front panel and the chipset. Furthermore, the molding material penetrates the front panel through the flow hole, and after solidification, it forms a molding body that penetrates the front panel of the jumper structure, making the connection between the molding body and the jumper structure more reliable and enhancing the overall connection strength of the semiconductor.

[0008] Preferably, the connecting plate is further provided with a first stress-relieving hole.

[0009] Preferably, the end of the connecting plate away from the front panel is connected to a pin.

[0010] In a second aspect, the present invention provides a semiconductor structure, including a chipset, a first frame, a second frame, and a jumper structure as described in this application;

[0011] The boss is connected to the top surface of the chipset, the connecting plate is used to connect to the first frame, and the second frame is connected to the bottom surface of the chipset;

[0012] It also includes a molding compound that encapsulates the chipset, the first frame, the second frame, and the jumper structure;

[0013] Furthermore, the first frame and the second frame extend to the outside of the encapsulated body.

[0014] Preferably, the end of the connecting plate furthest from the front panel is connected to a pin;

[0015] The pin is connected to the first frame.

[0016] Preferably, the length of the pin is greater than the length of the first frame.

[0017] Preferably, the first frame includes a first metal plate, the first metal plate being connected to the pin member, and the first metal plate extending to the outside of the molding compound;

[0018] The first metal plate has multiple first grooves spaced apart.

[0019] Preferably, the second frame includes a second metal plate, a connecting plate, and a bottom plate connected in sequence, the bottom plate being connected to the chipset, and the second metal plate extending to the outside of the molding compound.

[0020] Preferably, the connecting plate is provided with a second stress-relieving hole.

[0021] Preferably, the second metal plate is provided with a plurality of second grooves at intervals.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] The jumper structure of this application, by providing a flow hole between the boss and the connecting plate, allows the molding material to enter the gap between the front panel and the chipset during molding, thereby filling the gap and squeezing out the gas between the front panel and the chipset, preventing air bubbles from forming between the front panel and the chipset. Furthermore, the molding material penetrates the front panel through the flow hole, and after solidification, it forms a molding body that penetrates the front panel of the jumper structure, making the connection between the molding body and the jumper structure more reliable and enhancing the overall connection strength of the semiconductor. Attached Figure Description

[0024] Figure 1 This application describes a jumper structure in three dimensions. Figure 1 .

[0025] Figure 2 This application describes a jumper structure in three dimensions. Figure 2 .

[0026] Figure 3 This is a schematic diagram of the semiconductor structure of this application (the encapsulation is omitted).

[0027] Figure 4 yes Figure 3 3D Figure 1 .

[0028] Figure 5 yes Figure 3 3D Figure 2 .

[0029] Figure 6 This is a schematic diagram of a semiconductor structure.

[0030] Marked in the image:

[0031] 1-Jumper structure,

[0032] 11-Front panel, 12-Connecting plate, 13-Pin component, 14-Boss, 15-Flow hole, 16-First stress relief hole

[0033] 2-Chipset,

[0034] 3-First Framework

[0035] 31-First metal plate, 32-First groove,

[0036] 4-Second Frame

[0037] 41-Second metal plate, 42-Connecting plate, 43-Bottom plate, 44-Second stress-relieving hole, 45-Second groove

[0038] 5-Molded body. Detailed Implementation

[0039] The present invention will be further described in detail below with reference to specific embodiments. However, it should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0040] Unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of this utility model is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the utility model solution or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on this utility model.

[0041] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," "parallel," and "coaxial" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, parallel, or coaxial. Slight tilt or deviation is permissible, as long as it does not affect the normal function of the relevant component. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," not that the structure must be perfectly horizontal; a slight tilt is acceptable. "Coaxial" means that two components are arranged as coaxially as possible, allowing them to move coaxially or approximately coaxially when their relative positions change. Alternatively, it can be simplified to mean that the corresponding device / component / element, when arranged in "horizontal," "vertical," "suspended," "parallel," or "coaxial" directions, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. For example, the deviation in the "coaxial" direction is controlled within 0.2-1mm, preferably within 0.2-0.5mm. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention.

[0042] Furthermore, the use of terms such as "first," "second," and "third" in terminology is merely for distinguishing descriptions of identical or similar components and should not be interpreted as emphasizing or implying the relative importance of a particular component.

[0043] Furthermore, in the description of the embodiments of this utility model, "several", "multiple", and "several" represent at least two. The number can be any number, such as two, three, four, five, six, seven, eight, or nine, and can even exceed nine.

[0044] Furthermore, in the description of the technical solution of this utility model, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "equipped with," "laid out," and "arranged" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components.

[0045] Example 1

[0046] like Figure 1 , Figure 2 As shown, the jumper structure 1 described in this embodiment includes a front panel 11 and a connecting plate 12 connected to each other. The front panel 11 and the connecting plate 12 form a bent structure. A boss 14 is provided at the end of the front panel 11 away from the connecting plate 12. The boss 14 is used to connect to the top surface of the chipset 2.

[0047] The front panel 11 is also provided with a flow hole 15, which is located between the boss 14 and the connecting plate 12.

[0048] In this embodiment, the jumper structure 1 has a flow hole 15 between the boss 14 and the connecting plate 12. During molding, the molding material enters the gap between the front panel 11 and the chipset 2 through the flow hole 15 to fill the gap between the front panel 11 and the chipset 2, thereby squeezing out the gas between the front panel 11 and the chipset 2 and preventing air bubbles from appearing between the front panel 11 and the chipset 2. Furthermore, the molding material penetrates the front panel 11 through the flow hole 15. After the molding material solidifies, it forms a molding body 5, which penetrates the front panel 11 of the jumper structure 1. This makes the connection between the molding body 5 and the jumper structure 1 more reliable, increases the overall connection strength of the molding, and makes the entire semiconductor structure more robust.

[0049] In optional implementations, such as Figure 1 As shown, the connecting plate 12 is also provided with a first stress-relieving hole 16. Through the first stress-relieving hole 16, the concentrated stress is dispersed to the surrounding area of ​​the hole to avoid excessive local stress. The first stress-relieving hole 16 is preferably a circular hole.

[0050] In optional implementations, such as Figure 1 As shown, the end of the connecting plate 12 away from the front panel 11 is connected to a pin 13, which connects the connecting plate 12 to the first frame 3.

[0051] In an optional configuration, the angle between the front panel 11 and the connecting plate 12 is 90° to 150°.

[0052] In the optional configuration, the jumper structure 1 is a one-piece molded component, that is, the front panel 11, the connecting plate 12 and the pin 13 are molded as one piece.

[0053] Example 2

[0054] like Figures 2-6 As shown, based on Embodiment 1, the semiconductor structure described in this embodiment includes a chipset 2, a first frame 3, a second frame 4, and a jumper structure 1 as described in Embodiment 1;

[0055] The boss 14 is soldered to the top surface of the chipset 2, the connecting plate 12 is used to connect with the first frame 3, and the second frame 4 is connected to the bottom surface of the chipset 2.

[0056] It also includes a molding compound 5, which encapsulates the chipset 2, the first frame 3, the second frame 4, and the jumper structure 1;

[0057] Furthermore, the first frame 3 and the second frame 4 extend to the outside of the encapsulated body 5.

[0058] The semiconductor structure of this embodiment includes a chipset 2, a first frame 3, a second frame 4, and a jumper structure 1 as described in Embodiment 1. Since the front panel 11 of the jumper structure 1 is provided with a flow hole 15, after the semiconductor assembly is completed, during the molding process, the molding material enters the gap between the front panel 11 and the chipset 2 through the flow hole 15 to fill the gap between the front panel 11 and the chipset 2, thereby squeezing out the gas between the front panel 11 and the chipset 2 and preventing air bubbles from appearing between the front panel 11 and the chipset 2. Furthermore, the molding material penetrates the front panel 11 through the flow hole 15. After the molding material solidifies, it forms a molding body 5, which penetrates the front panel 11 of the jumper structure 1. The molded molding body 5 forms a dumbbell-like shape on both sides of the front panel 11, making the connection between the molding body 5 and the jumper structure 1 more reliable, increasing the overall connection strength of the molding, and thus making the entire semiconductor structure more robust.

[0059] In this embodiment, when fabricating the semiconductor structure, the jumper structure 1, the chipset 2, the first frame 3 and the second frame 4 are assembled together and placed into a designated mold. Then, the mold is filled with encapsulating material for encapsulation. The encapsulating material enters the gap between the front panel 11 and the chipset 2 through the flow hole 15 to fill the gap between the front panel 11 and the chipset 2. After the encapsulating material solidifies, it forms the encapsulated body 5.

[0060] In one or more implementations, such as Figure 2 As shown, the end of the connecting plate 12 away from the front panel 11 is connected to a pin 13;

[0061] Pin 13 is connected to the first frame 3.

[0062] The pin 13 is welded to the first frame 3.

[0063] Furthermore, such as Figure 4 As shown, the length of the pin 13 is greater than the length of the first frame 3. Since the length of the pin 13 is greater than the length of the first frame 3, before molding, external tooling is used to abut against both ends of the pin 13 to limit the displacement of the pin 13 and prevent the jumper structure 1 from moving during the molding process.

[0064] In one or more implementations, such as Figure 4 As shown, the first frame 3 includes a first metal plate 31, which is connected to the pin 13 and extends to the outside of the molding compound 5.

[0065] Multiple first grooves 32 are provided at intervals on the first metal plate 31.

[0066] The lead 13 is soldered to the first metal plate 31, and the first metal plate 31 extends to the outside of the molding compound 5, so that the first metal plate 31 serves as a conductive electrode of the semiconductor.

[0067] A first groove 32 is provided on the first metal plate 31. The first groove 32 serves as a waterproof line to prevent water between the first metal plate 31 and the encapsulated body 5 from seeping into the interior of the encapsulated body 5.

[0068] Furthermore, such as Figure 4 As shown, the first metal plate 31 is provided with a plurality of first grooves 32, and adjacent first grooves 32 are spaced apart.

[0069] In one or more implementations, such as Figure 5 As shown, the second frame 4 includes a second metal plate 41, a connecting plate 42 and a bottom panel 43 connected in sequence. The bottom panel 43 is connected to the chipset 2, and the second metal plate 41 extends to the outside of the molding compound 5.

[0070] The bottom panel 43 is soldered to the bottom surface of the chipset 2, and the second metal plate 41 extends to the outside of the molding compound 5, so that the second metal plate 41 serves as a conductive electrode of the semiconductor.

[0071] Furthermore, the connecting plate 42 is provided with a second stress-relieving hole 44.

[0072] Furthermore, such as Figure 5 As shown, the second metal plate 41 has multiple second grooves 45 spaced apart.

[0073] A second groove 45 is provided on the second metal plate 41. The second groove 45 serves as a waterproof line to prevent water between the second metal plate 41 and the encapsulated body 5 from seeping into the interior of the encapsulated body 5.

[0074] Furthermore, the second metal plate 41 is provided with a plurality of second grooves 45, with adjacent second grooves 45 spaced apart.

[0075] In an optional embodiment, the first metal plate 31 and the second metal plate 41 are located in the same horizontal plane, and the chipset 2 is parallel to the first metal plate 31 and the second metal plate 41.

[0076] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A jumper structure, characterized in that, It includes a front panel (11) and a connecting plate (12) that are connected to each other. The front panel (11) and the connecting plate (12) form a bent structure. A boss (14) is provided at one end of the front panel (11) away from the connecting plate (12). The front panel (11) is also provided with a flow hole (15), which is located between the boss (14) and the connecting plate (12).

2. The jumper structure according to claim 1, characterized in that, The connecting plate (12) is also provided with a first stress-relieving hole (16).

3. The jumper structure according to claim 1, characterized in that, The connecting plate (12) has a pin (13) connected to one end away from the front panel (11).

4. A semiconductor structure, characterized in that, It includes a chipset (2), a first frame (3), a second frame (4), and a jumper structure (1) as described in any one of claims 1-3; The boss (14) is connected to the top surface of the chipset (2), the connecting plate (12) is used to connect to the first frame (3), and the second frame (4) is connected to the bottom surface of the chipset (2); It also includes a molding compound (5) that encapsulates the chipset (2), the first frame (3), the second frame (4), and the jumper structure (1); Furthermore, the first frame (3) and the second frame (4) extend to the outside of the encapsulated body (5).

5. A semiconductor structure according to claim 4, characterized in that, The end of the connecting plate (12) away from the front panel (11) is connected to a pin (13); The pin (13) is connected to the first frame (3).

6. A semiconductor structure according to claim 5, characterized in that, The length of the pin (13) is greater than the length of the first frame (3).

7. A semiconductor structure according to claim 5, characterized in that, The first frame (3) includes a first metal plate (31) connected to the pin (13) and the first metal plate (31) extends to the outside of the encapsulation (5); The first metal plate (31) has multiple first grooves (32) spaced apart.

8. A semiconductor structure according to claim 4, characterized in that, The second frame (4) includes a second metal plate (41), a connecting plate (42) and a bottom panel (43) connected in sequence. The bottom panel (43) is connected to the chipset (2), and the second metal plate (41) extends to the outside of the molding compound (5).

9. A semiconductor structure according to claim 8, characterized in that, The connecting plate (42) is provided with a second stress-relieving hole (44).

10. A semiconductor structure according to claim 8, characterized in that, The second metal plate (41) has multiple second grooves (45) spaced apart.

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