DDR memory slot maintenance device
By designing a DDR memory slot repair device, which employs upper and lower heating guns and a guide bar limiting structure, the problem of disassembling DDR5-BGA pin slots has been solved. This achieves precise heating, reduces the risk of damage to other components on the motherboard, and improves the stability and reliability of repairs.
Patent Information
- Application Number
- CN202521820495.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-25
- Publication Date
- 2026-07-28
- Estimated Expiration
- 2035-08-25
AI Technical Summary
Traditional solder melting furnaces cannot effectively disassemble and install DDR5-BGA pin memory slots, and ordinary heating equipment has difficulty in accurately controlling the temperature, which can easily lead to damage to other sensitive components of the computer motherboard, increasing repair costs and difficulty.
A DDR memory slot repair device was designed, which uses an upper heating gun and a lower heating gun facing each other. The computer motherboard is positioned and fixed by left and right guide bars and limit blocks to achieve synchronous heating of the upper and lower sides of the DDR memory slot. The hot air is guided by a trapezoidal fan shroud to precisely control the temperature and range.
It enables precise heating of DDR memory slots, avoiding localized overheating that could damage other components on the motherboard, reducing repair risks, and improving the stability and reliability of repairs.
Smart Images

Figure CN224567624U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer technology, specifically to a DDR memory slot repair device. Background Technology
[0002] In the field of computer hardware, memory modules are crucial components for data storage and transmission, and their stability and compatibility are of paramount importance. To ensure the reliable performance of the storage chips on the memory modules, rigorous testing is necessary. Currently, the common testing method involves inserting the memory modules into the memory slots on the computer motherboard and running relevant test programs to evaluate the quality of the memory modules by monitoring indicators such as the accuracy and stability of data read and write operations. However, this high-frequency insertion and removal operation causes significant wear and tear on the memory slots.
[0003] When a memory slot is damaged, it usually needs to be repaired or replaced. The traditional memory slot replacement process involves first using a soldering furnace to heat and melt solder between the motherboard and the memory slot pins, thus removing the damaged slot from the motherboard. After replacing the memory slot, the pins are then soldered again using heating. However, DDR5-BGA memory slots have a significantly different structure. DDR5-BGA uses a ball grid array (BGA) package, meaning the pins don't penetrate the motherboard for soldering; instead, they are electrically connected via solder balls at the bottom. This unique structure makes it difficult to effectively heat the slot using traditional soldering furnaces, hindering the removal and installation of the memory slot. Using ordinary heating equipment is also problematic because precise temperature and heating range control is difficult, easily leading to localized overheating and damaging other sensitive components on the motherboard. This further increases repair costs and difficulty, and the stability of the repaired motherboard is also questionable. Utility Model Content
[0004] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by providing a DDR memory slot repair device.
[0005] The purpose of this utility model is achieved through the following technical solution: a DDR memory slot repair device, including a base; the base is provided with a repair platform; the base is provided with an upper heating gun on the top of the repair platform; the base is provided with a lower heating gun at the bottom of the repair platform; the upper heating gun and the lower heating gun are arranged facing each other.
[0006] The base is provided with a left guide bar and a right guide bar; the left guide bar and the right guide bar are arranged in parallel; the left guide bar is provided with a left limiting block; the right guide bar is provided with a right limiting block.
[0007] The present invention is further configured such that a support is provided on the top of the repair table; an upper mounting bracket is provided on the top of the support; and the upper heating air gun is mounted on the upper mounting bracket.
[0008] The present invention is further configured such that the bottom of the upper heating air gun is connected to an upper trapezoidal air hood; the bracket is provided with a clearance groove; and the upper trapezoidal air hood passes through the clearance groove.
[0009] The present invention is further configured such that a lower mounting bracket is provided at the bottom of the repair table; the lower heating air gun is located on the lower mounting bracket.
[0010] The present invention is further configured such that a lower trapezoidal shroud is connected to the top of the heating air gun.
[0011] The present invention is further configured such that the upper trapezoidal wind hood and the lower trapezoidal wind hood are positioned opposite each other between the left guide strip and the right guide strip.
[0012] The present invention is further configured such that the bracket has a display window.
[0013] The present invention is further configured such that both the left guide bar and the right guide bar are provided with slide rails along the length direction.
[0014] The present invention is further configured such that the left limiting block is slidably disposed on the left guide bar; and the right limiting block is slidably disposed on the right guide bar.
[0015] The present invention is further configured such that the left guide strip and the right guide strip are provided with a plurality of first fixing holes along the length direction; the left limiting block and the right limiting block are provided with second fixing holes that cooperate with the first fixing holes; and a screw is provided between the first fixing holes and the second fixing holes.
[0016] The beneficial effects of this utility model are as follows: This utility model addresses the characteristics of the ball grid array packaging of DDR memory slots by setting the upper and lower heating guns facing each other, thereby achieving synchronous heating of the upper and lower sides of the DDR memory slot and solving the problem that traditional solder melting furnaces cannot be adapted to this structure. In addition, the temperature and range of the upper and lower heating guns can be precisely controlled, avoiding local overheating that could damage other sensitive components of the computer motherboard and reducing the risk of repair. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of this utility model in conjunction with a computer motherboard;
[0018] Figure 2 This is a schematic diagram of the structure of this utility model in conjunction with a computer motherboard;
[0019] Figure 3 This is a schematic diagram of the structure of this utility model;
[0020] Figure 4 This is a schematic diagram of the structure of the concealed base of this utility model;
[0021] The components include: 1. Computer motherboard; 11. DDR memory slot; 2. Stand; 21. Repair table; 31. Left guide bar; 32. Right guide bar; 33. Slide rail; 34. First fixing hole; 41. Left limit block; 42. Right limit block; 43. Screw; 5. Bracket; 51. Clearance groove; 52. Display window; 6. Upper mounting bracket; 61. Upper heating gun; 62. Upper trapezoidal fan cover; 7. Lower mounting bracket; 71. Lower heating gun; 72. Lower trapezoidal fan cover. Detailed Implementation
[0022] The present invention will be further described in conjunction with the following embodiments.
[0023] Depend on Figures 1 to 4 As can be seen, the DDR memory slot repair device described in this embodiment includes a base 2; the base 2 is provided with a repair table 21; the base 2 is provided with an upper heating air gun 61 on the top of the repair table 21; the base 2 is provided with a lower heating air gun 71 at the bottom of the repair table 21; the upper heating air gun 61 and the lower heating air gun 71 are arranged facing each other.
[0024] The base 2 is provided with a left guide bar 31 and a right guide bar 32; the left guide bar 31 and the right guide bar 32 are arranged in parallel; the left guide bar 31 is provided with a left limiting block 41; the right guide bar 32 is provided with a right limiting block 42.
[0025] Specifically, in this embodiment, the DDR memory slot repair device is used by first placing the computer motherboard 1 between the left guide bar 31 and the right guide bar 32, and then pushing the computer motherboard 1 along the left guide bar 31 and the right guide bar 32 until the left and right ends of the computer motherboard 1 are respectively against the left limit block 41 and the right limit block 42, so that the upper heating gun 61 is located directly above the DDR memory slot 11 of the computer motherboard 1 and the lower heating gun 71 is located directly below the DDR memory slot 11 of the computer motherboard 1. Then, the upper heating gun 61 and the lower heating gun 71 are activated, so that the pins of the DDR memory slot 11 can be heated to melt the solder.
[0026] This embodiment addresses the ball grid array packaging characteristics of the DDR memory slot 11 by setting the upper heating gun 61 and the lower heating gun 71 opposite each other, thereby achieving synchronous heating of the upper and lower sides of the DDR memory slot 11. This solves the problem that traditional solder melting furnaces cannot be adapted to this structure. In addition, the temperature and range of the upper heating gun 61 and the lower heating gun 71 can be precisely controlled, avoiding local overheating that could damage other sensitive components of the computer motherboard 1 and reducing maintenance risks.
[0027] This embodiment describes a DDR memory slot repair device. The repair platform 21 has a support 5 on its top; the support 5 has an upper mounting bracket 6 on its top; and an upper heating gun 61 is mounted on the upper mounting bracket 6. This embodiment, through the fixing structure of the support 5 and the upper mounting bracket 6, provides a stable mounting base for the upper heating gun 61, preventing the heating position from shifting due to shaking of the upper heating gun 61 during heating, ensuring precise heating of the DDR memory slot 11, and improving the stability of the repair operation.
[0028] This embodiment describes a DDR memory slot repair device. The bottom of the upper heating gun 61 is connected to an upper trapezoidal fan shroud 62. A clearance groove 51 is provided through the support 5. The upper trapezoidal fan shroud 62 passes through the clearance groove 51. This embodiment uses the upper trapezoidal fan shroud 62 to gather and guide hot air, expanding the heating coverage area and making the DDR memory slot 11 heated more evenly. Furthermore, the clearance groove 51 provides a channel for the upper trapezoidal fan shroud 62 to pass through the support 5, preventing the support 5 from blocking the hot air and ensuring that the hot air can directly act on the DDR memory slot 11, thus improving heating efficiency.
[0029] This embodiment describes a DDR memory slot repair device, in which a lower mounting bracket 7 is provided at the bottom of the repair platform 21; the lower heating gun 71 is mounted on the lower mounting bracket 7. This embodiment provides stable support for the lower heating gun 71 by setting the lower mounting bracket 7, ensuring that the lower heating gun 71 and the upper heating gun 61 are in a directly opposite position, guaranteeing the synergy of upper and lower heating, preventing the heating effect from being affected by the displacement of the lower heating gun 71, and enhancing the overall reliability of the device structure.
[0030] The DDR memory slot repair device described in this embodiment has a lower trapezoidal fan shroud 72 connected to the top of the lower heating air gun 71. In this embodiment, the lower trapezoidal fan shroud 72 cooperates with the upper trapezoidal fan shroud 62 to guide hot air to the DDR memory slot 11 from below, further expanding the heating range and making the upper and lower sides of the DDR memory slot 11 more evenly heated, reducing local temperature differences.
[0031] This embodiment describes a DDR memory slot repair device, in which the upper trapezoidal fan shroud 62 and the lower trapezoidal fan shroud 72 are positioned opposite each other between the left guide bar 31 and the right guide bar 32. By positioning these two shrouds opposite each other between the left guide bar 31 and the right guide bar 32, this embodiment can precisely focus the heating area on the DDR memory slot 11 of the computer motherboard 1, which is placed between the left guide bar 31 and the right guide bar 32. This ensures that the hot air is concentrated on the target location, reducing the diffusion of heat to other areas of the computer motherboard 1 and minimizing the impact on surrounding sensitive components.
[0032] The DDR memory slot repair device described in this embodiment has a display window 52 on the bracket 5. The display window 52 allows repair personnel to observe the heating status of the DDR memory slot 11 in real time, such as the degree of solder melting and whether there are any abnormalities, so as to adjust the heating parameters in a timely manner, avoid overheating or underheating, and improve the controllability and safety of the repair operation.
[0033] In this embodiment, a DDR memory slot repair device is described, wherein both the left guide bar 31 and the right guide bar 32 are provided with slide rails 33 along their length. The slide rails 33 provide a smooth sliding path for the computer motherboard 1 to be repaired, facilitating the quick and precise positioning of the computer motherboard 1 into the heating area, reducing frictional damage to the computer motherboard 1 during the pushing process, and improving the ease of positioning the computer motherboard 1.
[0034] In this embodiment of the DDR memory slot repair device, the left limiting block 41 is slidably disposed on the left guide bar 31; the right limiting block 42 is slidably disposed on the right guide bar 32. In this embodiment of the DDR memory slot repair device, both the left guide bar 31 and the right guide bar 32 are provided with multiple first fixing holes 34 along their length; both the left limiting block 41 and the right limiting block 42 are provided with second fixing holes that mate with the first fixing holes 34; a screw 43 is provided between the first fixing holes 34 and the second fixing holes; the second fixing holes are not shown in the figure.
[0035] Specifically, the DDR memory slot repair device described in this embodiment, by sliding the left limiting block 41 and the right limiting block 42, can flexibly adjust their positions according to different sizes of computer motherboards 1, ensuring accurate contact with the edge of the computer motherboard 1, achieving positioning adaptation for computer motherboards 1 of different specifications, and improving the versatility of the device. Furthermore, by locking the first fixing hole 34 and the second fixing hole with screws 43, the slid-out left limiting block 41 and the right limiting block 42 can be firmly fixed, preventing displacement of the left limiting block 41 and the right limiting block 42 due to vibration during repair, ensuring the stability of the computer motherboard 1's positioning, ensuring the heating position remains accurate, and further improving the reliability of repair quality.
[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.
Claims
1. A DDR memory slot repair device, characterized by: Includes a base (2); the base (2) is provided with a maintenance platform (21); the base (2) is provided with an upper heating air gun (61) on the top of the maintenance platform (21); the base (2) is provided with a lower heating air gun (71) at the bottom of the maintenance platform (21); the upper heating air gun (61) and the lower heating air gun (71) are arranged facing each other; The base (2) is provided with a left guide bar (31) and a right guide bar (32); the left guide bar (31) and the right guide bar (32) are arranged in parallel; the left guide bar (31) is provided with a left limiting block (41); the right guide bar (32) is provided with a right limiting block (42).
2. The DDR memory slot repair device according to claim 1, characterized in that: The top of the repair table (21) is provided with a bracket (5); the top of the bracket (5) is provided with an upper mounting bracket (6); the upper heating air gun (61) is located on the upper mounting bracket (6).
3. The DDR memory slot repair device according to claim 2, characterized in that: The bottom of the upper heating air gun (61) is connected to an upper trapezoidal air hood (62); the bracket (5) is provided with a relief groove (51); the upper trapezoidal air hood (62) passes through the relief groove (51).
4. A DDR memory slot repair device according to claim 3, characterized in that: The bottom of the maintenance platform (21) is provided with a lower mounting bracket (7); the lower heating air gun (71) is located on the lower mounting bracket (7).
5. A DDR memory slot repair device according to claim 4, characterized in that: The top of the lower heating air gun (71) is connected to a lower trapezoidal air hood (72).
6. A DDR memory slot repair device according to claim 5, characterized in that: The upper trapezoidal hood (62) and the lower trapezoidal hood (72) are positioned opposite each other between the left guide bar (31) and the right guide bar (32).
7. A DDR memory slot repair device according to claim 2, characterized in that: The bracket (5) has a display window (52).
8. A DDR memory slot repair device according to claim 1, characterized in that: Both the left guide bar (31) and the right guide bar (32) are provided with slide rails (33) along their length.
9. A DDR memory slot repair device according to claim 1, characterized in that: The left limiting block (41) is slidably disposed on the left guide bar (31); the right limiting block (42) is slidably disposed on the right guide bar (32).
10. A DDR memory slot repair device according to claim 9, characterized in that: The left guide bar (31) and the right guide bar (32) are each provided with a plurality of first fixing holes (34) along the length direction; the left limiting block (41) and the right limiting block (42) are each provided with a second fixing hole that mates with the first fixing hole (34); a screw (43) is provided between the first fixing hole (34) and the second fixing hole.