A silicon wafer film bubble defect visual detection device

Abstract

The utility model provides a kind of silicon wafer film bubble defect visual inspection equipment, belong to visual inspection equipment technical field, including base and its bottom are connected with footing, base top is connected with transmission component, transmission component is connected with handling component, the combination of transmission component and handling component is used to realize the effect of handling movement to silicon wafer, handling component is connected with connecting component, for visual inspection to silicon wafer, base bottom is connected with rotating component, for driving silicon wafer rotation, base top is slidably connected with shielding component, driving motor output end is connected with threaded rod, base top is slidably connected with threaded support, threaded support is connected with threaded rod, for the problem that traditional device is not complete to silicon wafer surface detection, the utility model is complete visual inspection to circular silicon wafer by the combination mode of rotation and linear sliding, so as to ensure the detection accuracy of the device.

Description

Technical Field

[0001] This utility model relates to the field of visual inspection equipment technology, specifically to a visual inspection equipment for bubble defects in silicon wafer coating. Background Technology

[0002] Silicone lamination is a process that uses a prototype to create a silicone mold under vacuum. Materials such as ABS, transparent PC, silicone, and soft rubber are then used for casting to clone a product identical to the original prototype. This technology is low-cost, quick, and suitable for appearance, assembly, and functional verification. The production process of silicone film requires careful selection of raw materials, temperature and time control, and surface treatment to obtain silicone film with excellent performance and stable quality. The lamination process includes steps such as process preparation, installing plastic film rollers, applying adhesive, drying, setting process parameters, trial lamination, sampling inspection, formal lamination, rewinding or shaping and slitting, etc.

[0003] Chinese patent CN221612744U discloses a visual inspection device for circuit board processing defects, used for visual inspection.

[0004] However, the above-mentioned publicly available solutions have the following shortcomings: In actual use, the above solutions perform linear visual inspection on square structures, but when used on round materials such as silicon wafers, there is a problem that the edge positions cannot be detected properly, resulting in a decrease in detection accuracy.

[0005] This invention proposes a visual inspection device for silicon wafer coating bubble defects to solve the problem. Utility Model Content

[0006] The purpose of this invention is to achieve the detection accuracy of the device through the combination structure of the rotating component and the transmission component, thereby ensuring the visual detection accuracy of the device and overcoming the problems in the background art.

[0007] Based on the above technical concept, the technical solution adopted by this utility model is as follows:

[0008] A visual inspection device for bubble defects in silicon wafer coating includes a base and feet connected to its bottom, a transmission component connected to the top of the base, a conveying component connected to the transmission component, the combination of the transmission component and the conveying component is used to achieve the effect of moving the silicon wafer, a connecting component connected to the conveying component for visual inspection of the silicon wafer, a rotating component connected to the bottom of the base for driving the silicon wafer to rotate, and a shielding component slidably connected to the top of the base for isolating external environmental interference.

[0009] Further defining the above technical solution, the transmission component includes a motor bracket connected to the side of the base, a drive motor connected to the motor bracket, a threaded rod connected to the output end of the drive motor, a threaded bracket slidably connected to the top of the base, the threaded bracket and the threaded rod being threadedly connected, the side of the base being U-shaped, and a limiting groove provided on the top of the base, the limiting groove being slidably connected to the bottom of the threaded bracket, the limiting groove being able to limit the sliding stroke of the sliding bracket and the threaded bracket, thereby preventing the threaded bracket and the sliding bracket from sliding excessively.

[0010] Further defining the above technical solution, a rotating bracket is connected to the top of the base, and the rotating bracket is rotatably connected to the end of the threaded rod away from the drive motor. A sliding rod is connected to the side of the base away from the drive motor, and the sliding rod is slidably connected to the sliding bracket. The top of the limiting groove is slidably connected to the bottom of the sliding bracket. Sliding blocking elements are provided at both ends of the sliding rod, and the sliding blocking elements contact the side of the sliding bracket. The sliding blocking elements can prevent rigid collisions between parts of the device. The use of the sliding bracket and the threaded bracket together can ensure the stability of the linear transmission of the device and prevent the connecting plate from tilting.

[0011] Further defining the above technical solution, the conveying component includes a connecting plate connected to the sides of the sliding bracket and the threaded bracket. An electric telescopic rod is connected to the top of the connecting plate, and a lifting plate is connected to the bottom telescopic end of the electric telescopic rod. Four suction cups are connected around the bottom of the lifting plate, and a vacuum pump is connected to the center of the bottom of the lifting plate. The vacuum pump is controlled to connect to the four suction cups. The lowest point of the vacuum pump is higher than the lowest point of the suction cups. The vacuum pump is equipped with a vacuum tube, and the other end of the vacuum tube is connected to the four suction cups. The suction cups distributed at the four corners can stably pick up the silicon wafer, and the suction cup conveying method avoids scratching or squeezing the surface of the silicon wafer.

[0012] Further specifying the above technical solution, the connecting component includes a connecting rod connected to the connecting plate, the other end of the connecting rod being connected to a detection plate, a camera being connected to the bottom of the detection plate, the bottom of the camera penetrating the detection plate, the bottom of the camera facing the base, a central control module being connected to the bottom of the detection plate, the central control module being communicatively connected to the camera, the central control module being able to analyze the video information collected by the camera to achieve visual inspection effect, the camera being able to take pictures and store the locations on the silicon wafer surface that are visually unqualified, thereby facilitating subsequent repair processing of the silicon wafer.

[0013] Further defining the above technical solution, the rotating component includes a motor connecting bracket connected to the bottom of the base, a rotating motor connected to the connecting bracket, a turntable connected to the top output end of the rotating motor through the base, a rotating groove on the base, a rotating groove on the turntable, an anti-slip layer on the top of the turntable, and the turntable can drive the silicon wafer to rotate so that the silicon wafer can rotate to the position below the camera from any position.

[0014] Further defining the above technical solution, the shielding component includes a spring bracket connected to the top of the base, and a spring connected to the side of the spring bracket. The combination of the spring and the spring bracket enables the shielding shell to slide elastically and linearly, thereby avoiding the shielding shell from obstructing the silicon wafer handling process while also blocking external ambient light during testing.

[0015] Further defining the above technical solution, the other end of the spring is connected to a shielding shell, and the top of the base is provided with a sliding groove. The inner wall of the sliding groove is slidably connected to the bottom of the shielding shell. The sliding groove can limit the sliding stroke of the shielding shell, thereby avoiding the situation where the spring is over-compressed and cannot rebound due to excessive sliding of the shielding shell, thus improving the stability of the fit between the parts of this device.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. High degree of automation: The structure of the handling components enables this device to accurately handle silicon wafers;

[0018] 2. High detection completeness: The rotating component drives the silicon wafer to rotate while the connecting component drives the camera to slide laterally, thereby achieving the effect of complete detection by this device;

[0019] 3. Protecting the silicon wafer surface: This device uses a suction cup to move the silicon wafer, ensuring that the silicon wafer surface will not be damaged or scratched during the testing process. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the base structure in a visual inspection device for bubble defects in silicon wafer coating according to this utility model;

[0022] Figure 2This is a schematic diagram of the connecting plate in a visual inspection device for bubble defects in silicon wafer coating according to this utility model;

[0023] Figure 3 This is a schematic diagram of the threaded rod in a visual inspection device for bubble defects in silicon wafer coating according to this utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the electric telescopic rod in a visual inspection device for bubble defects in silicon wafer coating according to this utility model.

[0025] The components include: 1. Base; 2. Feet; 3. Transmission components; 301. Motor bracket; 302. Drive motor; 303. Threaded rod; 304. Rotating bracket; 305. Threaded bracket; 306. Sliding bracket; 307. Sliding rod; 4. Handling components; 401. Connecting plate; 402. Electric telescopic rod; 403. Lifting plate; 404. Suction cup; 405. Vacuum pump; 5. Connecting components; 501. Connecting rod; 502. Detection plate; 503. Camera; 6. Rotating components; 601. Rotating groove; 602. Turntable; 603. Rotating motor; 604. Motor connecting bracket; 7. Shielding components; 701. Spring bracket; 702. Sliding groove; 703. Spring; 704. Shielding shell. Detailed Implementation

[0026] The following is in conjunction with the appendix Figures 1-4 The present invention will be described in further detail below.

[0027] Example 1: This example provides a visual inspection device for bubble defects in silicon wafer coating, such as... Figures 1-4 As shown, the device includes a base 1 and feet 2 connected to its bottom. A transmission component 3 is connected to the top of the base 1. A conveying component 4 is connected to the transmission component 3. The combination of the transmission component 3 and the conveying component 4 is used to achieve the effect of moving the silicon wafer. A connecting component 5 is connected to the conveying component 4 for visual inspection of the silicon wafer. A rotating component 6 is connected to the bottom of the base 1 to drive the silicon wafer to rotate. A shielding component 7 is slidably connected to the top of the base 1 to isolate external environmental interference.

[0028] The transmission component 3 includes a motor bracket 301 connected to the side of the base 1. The motor bracket 301 is connected to a drive motor 302. The output end of the drive motor 302 is connected to a threaded rod 303. A threaded bracket 305 is slidably connected to the top of the base 1. The threaded bracket 305 is threadedly connected to the threaded rod 303. A rotating bracket 304 is connected to the top of the base 1. The rotating bracket 304 is rotatably connected to the end of the threaded rod 303 away from the drive motor 302. A sliding rod 307 is connected to the side of the base 1 away from the drive motor 302. A sliding bracket 306 is slidably connected to the sliding rod 307. Two sets of sliding brackets 306 and threaded brackets 305 are provided respectively. The two sets of sliding brackets 306 and threaded brackets 305 are symmetrically distributed on both sides of the connecting plate 401.

[0029] The handling component 4 includes a connecting plate 401 connected to the sides of the sliding bracket 306 and the threaded bracket 305. An electric telescopic rod 402 is connected to the top of the connecting plate 401. A lifting plate 403 is connected to the bottom telescopic end of the electric telescopic rod 402. Four suction cups 404 are connected around the bottom of the lifting plate 403. A vacuum pump 405 is connected to the center of the bottom of the lifting plate 403. The vacuum pump 405 is controlled to connect to the four suction cups 404. A storage groove is provided at the top center of the base 1. The storage groove is located directly below the lifting plate 403. The storage groove has the same inner diameter as the rotating groove 601 and is used to store and fix the silicon wafer to be tested.

[0030] The connecting component 5 includes a connecting rod 501 connected to the connecting plate 401, and a detection plate 502 connected to the other end of the connecting rod 501. A camera 503 is connected to the bottom of the detection plate 502.

[0031] The rotating component 6 includes a motor connecting bracket 604 connected to the bottom of the base 1, a rotating motor 603 connected to the motor connecting bracket 604, and a turntable 602 connected to the top output end of the rotating motor 603 through the base 1. The base 1 is provided with a rotating groove 601, and the turntable 602 is rotatably connected to the inner arc surface of the rotating groove 601. The height of the turntable 602 is lower than the height of the rotating groove 601, and there is a gap between the outer arc surface of the turntable 602 and the inner arc surface of the rotating groove 601.

[0032] The specific working principle is as follows: This device can achieve accurate visual inspection of silicon wafers. When using this device, the silicon wafer to be inspected is placed inside the storage groove. At this time, the drive motor 302 drives the threaded rod 303 to rotate, thereby achieving the linear sliding effect of the threaded bracket 305, which in turn achieves the linear sliding effect of the connecting plate 401. The sliding of the connecting plate 401 moves the lifting plate 403 to a position directly above the storage groove. At this time, the electric telescopic rod 402 drives the lifting plate 403 to descend, so that the suction cup 404 contacts the top of the silicon wafer. At this time, the vacuum pump 405 generates negative pressure inside the suction cup 404, thereby achieving the suction effect of the silicon wafer. Then, the electric telescopic rod 402 drives the lifting plate 403 to rise, and the combination of the drive motor 302 and the threaded rod 303 drives the connecting plate 401 to move. During the movement of plate 401, it contacts the side opening of shielding housing 704 through connecting rod 501, realizing the pushing effect of connecting rod 501 on shielding housing 704. At this time, spring 703 is compressed. When lifting plate 403 moves to the top of rotating groove 601, reverse transport operation places silicon wafer on top of turntable 602. At this time, connecting plate 401 moves in the reverse direction, so that detection plate 502 is above turntable 602. When connecting plate 401 slides in the reverse direction, spring 703 drives shielding housing 704 to slide elastically, so that shielding housing 704 returns to the position above rotating groove 601. At this time, rotating motor 603 drives turntable 602 to rotate, while driving motor 302 and threaded rod 303 to drive detection plate 502 to slide laterally linearly, thereby realizing the complete detection effect of camera 503 on the top of silicon wafer.

[0033] Example 2: This example provides a visual inspection device for bubble defects in silicon wafer coating, such as... Figures 1-4 As shown, the shielding component 7 includes a spring bracket 701 connected to the top of the base 1, a spring 703 connected to the side of the spring bracket 701, and a shielding housing 704 connected to the other end of the spring 703. The top of the base 1 is provided with a sliding groove 702, the inner wall of the sliding groove 702 is slidably connected to the bottom of the shielding housing 704, the side of the shielding housing 704 is provided with an opening, and the connecting rod 501 is provided with a bent part, the bending direction is towards the connecting plate 401, and the top of the shielding housing 704 is at the same height as the bent part of the connecting rod 501.

[0034] The specific working principle is as follows: the elastic sliding shielding shell 704 structure enables the connecting rod 501 to push the shielding shell 704 to slide laterally during the silicon wafer handling process, thereby exposing the top of the rotating groove 601, which facilitates the suction cup 404 structure to handle the silicon wafer structure. When silicon wafer testing is required, the shielding shell 704 rebounds and slides above the rotating groove 601 under the action of the spring 703, blocking the ambient light and avoiding the influence of the external environment on the test results of this device.

[0035] The above description is a further detailed explanation of the present invention in conjunction with specific preferred embodiments, which is intended to enable those skilled in the art to understand and apply the present invention. However, it should not be assumed that the specific implementation of the present invention is limited to these descriptions.

Claims

1. A visual inspection device for bubble defects in silicon wafer coating, comprising a base (1) and feet (2) connected to its bottom, characterized in that, The base (1) is connected to a transmission component (3) at the top, and the transmission component (3) is connected to a transport component (4). The combination of the transmission component (3) and the transport component (4) is used to achieve the effect of transporting and moving the silicon wafer. The transport component (4) is connected to a connecting component (5) for visual inspection of the silicon wafer. The base (1) is connected to a rotating component (6) at the bottom for driving the silicon wafer to rotate. The base (1) is slidably connected to a shielding component (7) at the top for isolating external environmental interference.

2. The visual inspection equipment for bubble defects in silicon wafer coating according to claim 1, characterized in that, The transmission component (3) includes a motor bracket (301) connected to the side of the base (1), a drive motor (302) connected to the motor bracket (301), a threaded rod (303) connected to the output end of the drive motor (302), a threaded bracket (305) slidably connected to the top of the base (1), and the threaded bracket (305) and the threaded rod (303) are threadedly connected.

3. The visual inspection equipment for silicon wafer coating bubble defects according to claim 2, characterized in that, The base (1) is connected to a rotating bracket (304) at the top. The rotating bracket (304) is rotatably connected to the end of the threaded rod (303) away from the drive motor (302). The base (1) is connected to a sliding rod (307) on the side away from the drive motor (302). The sliding rod (307) is slidably connected to a sliding bracket (306).

4. The visual inspection equipment for bubble defects in silicon wafer coating according to claim 3, characterized in that, The transport component (4) includes a connecting plate (401) connected to the side of the sliding bracket (306) and the threaded bracket (305). An electric telescopic rod (402) is connected to the top of the connecting plate (401). A lifting plate (403) is connected to the bottom telescopic end of the electric telescopic rod (402). Four suction cups (404) are connected around the bottom of the lifting plate (403). A vacuum pump (405) is connected to the center of the bottom of the lifting plate (403). The vacuum pump (405) is controlled to be connected to the four suction cups (404).

5. The visual inspection equipment for bubble defects in silicon wafer coating according to claim 4, characterized in that, The connecting component (5) includes a connecting rod (501) connected to the connecting plate (401), and a detection plate (502) is connected to the other end of the connecting rod (501). A camera (503) is connected to the bottom of the detection plate (502).

6. The visual inspection equipment for bubble defects in silicon wafer coating according to claim 5, characterized in that, The rotating component (6) includes a motor connecting bracket (604) connected to the bottom of the base (1), a rotating motor (603) connected to the motor connecting bracket (604), a turntable (602) connected to the top output end of the rotating motor (603) through the base (1), and a rotating groove (601) provided on the base (1). The turntable (602) is rotatably connected to the inner arc surface of the rotating groove (601).

7. The visual inspection equipment for bubble defects in silicon wafer coating according to claim 6, characterized in that, The shielding component (7) includes a spring bracket (701) connected to the top of the base (1), and a spring (703) connected to the side of the spring bracket (701).

8. The visual inspection equipment for bubble defects in silicon wafer coating according to claim 7, characterized in that, The other end of the spring (703) is connected to the shielding shell (704), and the top of the base (1) is provided with a sliding groove (702), the inner wall of the sliding groove (702) is slidably connected to the bottom of the shielding shell (704).

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