Display module and display device

Abstract

The application provides a display module and a display device, and relates to the technical field of display, and solves the technical problem that a flexible circuit board is prone to warping. The display module comprises a display substrate, an adhesion layer, a flexible circuit board, a first end of the flexible circuit board being electrically connected to a second surface of the display substrate, a driving chip being electrically connected to a second end of the flexible circuit board and being adhered to a fourth surface of the adhesion layer, and a fixing clamp being located between the bending part and the driving chip, the fixing clamp comprising a connecting plate and a clamping plate, the connecting plate being adhered to the fourth surface of the adhesion layer, the clamping plate being located on a side of the connecting plate away from the adhesion layer and being connected to the connecting plate, a gap being formed between the connecting plate and the clamping plate and penetrating through the fixing clamp in a second direction, the second end of the flexible circuit board being partially located in the gap, and the fixing clamp being configured to limit deformation of the second end of the flexible circuit board. Through this structure, the warping degree of the second end of the flexible circuit board can be reduced, and the fixing clamp can be prevented from peeling off from the adhesion layer.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and a display device. Background Technology

[0002] Currently, due to increasingly narrow bezels, the driver chip (Integrated Circuit, IC) of rigid screen modules needs to be electrically connected to the display substrate via Chip On Flex / Chip On Film (COF) technology. The display substrate includes Thin Film Transistors (TFTs). Specifically, one end of the flexible circuit board is electrically connected to the upper surface of the display substrate. Then, the flexible circuit board needs to be bent so that the IC, electrically connected to its other end, adheres to adhesive tape on the back of the display substrate. However, the bend in the flexible circuit board has a certain degree of elasticity, which can easily cause the flexible circuit board to warp, resulting in a lower product yield. Utility Model Content

[0003] To address the aforementioned technical problems, this application is proposed. Embodiments of this application provide a display module and a display device.

[0004] In a first aspect, one embodiment of this application provides a display module, comprising: a display substrate having a first surface and a second surface disposed opposite to each other in a first direction; an adhesive layer having adhesive properties and having a third surface and a fourth surface disposed opposite to each other in the first direction, the third surface of the adhesive layer being adhered to the first surface of the display substrate; a flexible circuit board having a first end, a second end, and a bent portion between the first end and the second end, the bent portion being bent, the first end of the flexible circuit board being electrically connected to the second surface of the display substrate; a driver chip being electrically connected to the second end of the flexible circuit board and adhered to the fourth surface of the adhesive layer; and a fixing clip located between the bent portion and the driver chip, the fixing clip including a connecting plate and a clamping plate, the connecting plate being adhered to the fourth surface of the adhesive layer, the clamping plate being located on the side of the connecting plate away from the adhesive layer and being connected to the connecting plate, a gap being formed between the connecting plate and the clamping plate extending through the fixing clip in a second direction, the second direction intersecting the first direction, the second end portion of the flexible circuit board being located in the gap, and the fixing clip being configured to restrict deformation of the second end of the flexible circuit board.

[0005] In some embodiments, the dimension of the bent portion in the first direction is equal to the sum of the dimensions of the display substrate in the first direction, the adhesive layer in the first direction, and the connecting plate in the first direction.

[0006] In some embodiments, the connecting plate has two fixing parts and a connecting part, the two fixing parts are connected to the connecting part, the two fixing parts are symmetrically arranged with respect to the clamping plate, and the distance between the two fixing parts in the second direction is equal to the size of the clamping plate in the second direction.

[0007] In some embodiments, the adhesive layer includes: a first adhesive portion, which is adhered to a first surface of the display substrate and adhered to a driving chip; and a second adhesive portion, which is adhered to the first surface of the display substrate, located on the side of the first adhesive portion near the curved portion, and adhered to a fixing clip; wherein the first adhesive portion and the second adhesive portion are connected to each other or spaced apart.

[0008] In some embodiments, the second adhesive portion has a larger dimension in the second direction than the fixing clip has in the second direction, and the second adhesive portion has a larger dimension in the third direction than the fixing clip has in the third direction. The third direction intersects the first direction and the second direction.

[0009] In some embodiments, the size of the second adhesive portion in the first direction ranges from 0.03 mm to 0.1 mm.

[0010] In some embodiments, the dimension of the fixing clamp in the third direction is greater than the dimension of the flexible circuit board in the third direction, the third direction intersects with the first direction and the second direction; and / or, the maximum dimension between the fixing clamp and the bending portion in the second direction ranges from 0.6 mm to 0.8 mm.

[0011] In some embodiments, the size of the clamp in the second direction is less than or equal to the size of the fixed clamp in the second direction. Preferably, the size of the clamp in the second direction is 10% to 25% of the size of the fixed clamp in the second direction.

[0012] In some embodiments, the retaining clip is made of an elastic material; and / or, the size of the retaining clip in the first direction ranges from 0.15 mm to 0.2 mm.

[0013] Secondly, one embodiment of this application provides a display device, including: the display module described in any one of the first aspects above.

[0014] The display module and display device proposed in this application, when the flexible circuit board is subjected to external forces such as vibration, due to the elasticity of the clamping plate and the fact that the second end of the flexible circuit board is located in the gap between the connecting plate and the clamping plate, part of the rebound force of the flexible circuit board will cause the clamping plate to bounce away from the connecting plate. The force applied to the flexible circuit board during the deformation of the clamping plate plays a buffering role in the deformation of the flexible circuit board, reducing the degree of warping of the second end of the flexible circuit board, and reducing the rebound force transmitted from the flexible circuit board to the fixing clamp that causes the fixing clamp to detach from the adhesive layer. Thus, the adhesion of the adhesive layer is sufficient to firmly adhere to the fixing clamp. Therefore, with this structure, the degree of warping of the second end of the flexible circuit board can be reduced while ensuring that the fixing clamp will not peel off from the adhesive layer. Furthermore, fixing the fixing clamp with the adhesive layer instead of using other fixing methods such as threaded fixing can make the display module thinner, simpler in structure, easier to fix, and lower in cost. Attached Figure Description

[0015] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0016] Figure 1 The diagram shown is a structural schematic of the first type of conventional display module.

[0017] Figure 2 The diagram shows the structure of the second type of traditional display module.

[0018] Figure 3 The diagram shown is a schematic diagram of the structure of a display module provided in an exemplary embodiment of this application.

[0019] Figure 4 The diagram shown is a structural schematic of a display module provided in another exemplary embodiment of this application.

[0020] Figure 5 The image shown is a bottom view of a display module provided in an exemplary embodiment of this application.

[0021] Figure 6 The image shown is a side view of a fixing clip provided in an exemplary embodiment of this application.

[0022] Figure 7 The image shown is a bottom view of a fixing clip provided in an exemplary embodiment of this application.

[0023] Figure 8 The diagram shown is a structural schematic of a display module provided in another exemplary embodiment of this application.

[0024] Figure 9 The diagram shown is a schematic diagram of the structure of a display device provided in an exemplary embodiment of this application.

[0025] Figure label:

[0026] 100. A first conventional display module; 110. A first cover plate; 120. A first encapsulation layer; 130. A first display substrate; 140. A first adhesive layer; 150. A first driver chip; 160. A first flexible circuit board; 200. A second conventional display module; 210. A second cover plate; 220. A second encapsulation layer; 230. A second display substrate; 240. A second adhesive layer; 250. A second driver chip; 260. A second flexible circuit board; 300. A display module; 310. A display substrate; 311. A first surface; 312. A second surface 320, Adhesive layer; 321, Third surface; 322, Fourth surface; 323, First adhesive portion; 324, Second adhesive portion; 330, Flexible circuit board; 331, First end of flexible circuit board; 332, Bending portion; 333, Second end of flexible circuit board; 340, Driver chip; 350, Fixing clip; 351, Connecting plate; 3511, Fixing portion; 3512, Connecting portion; 352, Clamping plate; 353, Gap; 360, Encapsulation layer; 370, Cover plate; 380, Polarizing layer; 390, Optical adhesive layer; 400, Display device. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] Figure 1 The diagram shown is a structural schematic of the first type of conventional display module.

[0029] like Figure 1 As shown, a first conventional display module 100 includes: a first cover plate 110, a first encapsulation layer 120, a first display substrate 130, a first adhesive layer 140, a first driver chip 150, and a first flexible circuit board 160. The first flexible circuit board 160 is bent, with one end electrically connected to the upper surface of the first display substrate 130 and the other end electrically connected to the first driver chip 150. The first driver chip 150 is adhered to the first adhesive layer 140. Due to the rebound force at the bend of the first flexible circuit board 160, the first flexible circuit board 160 can easily bend up, as shown in area A within the dashed box.

[0030] Figure 2 The diagram shows the structure of the second type of traditional display module.

[0031] like Figure 2 As shown, the second conventional display module 200 includes: a second cover plate 210, a second encapsulation layer 220, a second display substrate 230, a second adhesive layer 240, a second driver chip 250, and a second flexible circuit board 260. The second flexible circuit board 260 is bent, with one end electrically connected to the upper surface of the second display substrate 230, and the other end electrically connected to the second driver chip 250 and partially adhered to the second adhesive layer 240. The second driver chip 250 is adhered to the second adhesive layer 240. That is, in order to fix the other end of the second flexible circuit board 260, the second conventional display module 200 extends the second adhesive layer 240 compared to the first adhesive layer 140 to adhere the other end of the second flexible circuit board 260. Because the rebound force at the bend of the second flexible circuit board 260 is relatively large, if the second flexible circuit board 260 is subjected to external forces such as vibration, the rebound force that causes the second flexible circuit board 260 to detach from the second adhesive layer 240 will be further increased. Therefore, the adhesive force of the second adhesive layer 240 will be insufficient to fix the other end of the second flexible circuit board 260. Figure 2 As shown in region B, the portion of the second flexible circuit board 260 that should be adhered to the second adhesive layer 240 is easily peeled off from the second adhesive layer 240, thus lifting up.

[0032] In view of this, this application proposes a display module and display device. When the flexible circuit board is subjected to external forces such as vibration, due to the elasticity of the clamping plate and the fact that the second end of the flexible circuit board is located in the gap between the connecting plate and the clamping plate, part of the rebound force of the flexible circuit board will cause the clamping plate to bounce away from the connecting plate. The force applied to the flexible circuit board during the deformation of the clamping plate plays a buffering role in the deformation of the flexible circuit board, reducing the degree of warping of the second end of the flexible circuit board, and reducing the rebound force transmitted from the flexible circuit board to the fixing clamp that causes the fixing clamp to detach from the adhesive layer. Thus, the adhesion of the adhesive layer is sufficient to firmly adhere to the fixing clamp. Therefore, with this structure, the degree of warping of the second end of the flexible circuit board can be reduced while ensuring that the fixing clamp will not peel off from the adhesive layer. Furthermore, fixing the fixing clamp with the adhesive layer instead of using other fixing methods such as threaded fixing can make the display module thinner, simpler in structure, easier to fix, and lower in cost.

[0033] Figure 3 The diagram shown is a schematic representation of the structure of a display module provided in an exemplary embodiment of this application. Figure 4 The diagram shown is a structural schematic of a display module provided in another exemplary embodiment of this application. Figure 5The image shown is a bottom view of a display module provided in an exemplary embodiment of this application. Figure 6 The image shown is a side view of a fixing clip provided in an exemplary embodiment of this application. Figure 7 The image shown is a bottom view of a fixing clip provided in an exemplary embodiment of this application.

[0034] like Figures 3-7 As shown, the display module 300 includes: a display substrate 310, an adhesive layer 320 (TAPE), a flexible circuit board 330, a driver chip 340 (Integrated Circuit, IC), and a fixing clip 350. The display substrate 310 has a first surface 311 and a second surface 312 disposed opposite to each other in a first direction (Y direction in the figure). The adhesive layer 320 is adhesive and has a third surface 321 and a fourth surface 322 disposed opposite to each other in the first direction. The third surface 321 of the adhesive layer 320 is adhered to the first surface 311 of the display substrate 310. The flexible circuit board 330 has a first end 331, a second end 333, and a bent portion 332 between the first end 331 and the second end 333. The bent portion 332 is bent. The first end 331 of the flexible circuit board 330 is electrically connected to the second surface 312 of the display substrate 310. The driver chip 340 is electrically connected to the second end 333 of the flexible circuit board 330 and is adhered to the fourth surface 322 of the adhesive layer 320. The fixing clip 350 is located between the bent portion 332 and the driver chip 340. The fixing clip 350 includes a connecting plate 351 and a clamping plate 352. The connecting plate 351 is adhered to the fourth surface 322 of the adhesion layer 320. The clamping plate 352 is located on the side of the connecting plate 351 away from the adhesion layer 320 and is connected to the connecting plate 351. A gap 353 can be formed between the connecting plate 351 and the clamping plate 352, which runs through the fixing clip 350 along a second direction (such as the X direction in the figure). The second direction intersects (such as perpendicular to) the first direction. The second end 333 of the flexible circuit board 330 is located in the gap 353. The fixing clip 350 is configured to restrict the deformation of the second end 333 of the flexible circuit board 330.

[0035] For example, the display module 300 is an organic light-emitting diode (OLED) module.

[0036] For example, the display substrate 310 includes a thin film transistor (TFT).

[0037] For example, the flexible circuit board 330 is made of polyimide (PI).

[0038] For example, the adhesive layer 320 is an adhesive tape, such as double-sided tape.

[0039] For example, the adhesion layer 320 may include anisotropic conductive film (ACF) and / or non-conductive film (NCF).

[0040] For example, the fixing clip 350 is located near the edge region of the display substrate 310 and the bend 332 in the second direction.

[0041] For example, the connecting plate 351 and the clamping plate 352 may be integrally formed, or the connecting plate 351 and the clamping plate 352 may be welded, or the connecting plate 351 and the clamping plate 352 may be connected by fasteners such as screws or bolts.

[0042] For example, the connecting plate 351 has a receiving space, and the clamping plate 352 is located in the receiving space and connected to the connecting plate 351.

[0043] For example, the shape of the cross section of the fixing clip 350 in the second direction and the third direction (such as the Z direction in the figure) is rectangular, circular, elliptical or other polygonal, and the third direction intersects (e.g., perpendicular to) the first direction and the second direction.

[0044] For example, the shape of the cross section of the clamp 352 in the second direction and the third direction is rectangular, circular, elliptical or other polygonal.

[0045] In practical applications, when using the fixing clamp 350 to clamp the second end 333 of the flexible circuit board 330, the clamping plate 352 can be pried open to be away from the connecting plate 351, so that a gap 353 is formed between the connecting plate 351 and the clamping plate 352. Then, the second end 333 of the flexible circuit board 330 can be passed through the gap 353, and then the clamping plate 352 can be released. The clamping plate 352 will spring back to clamp the second end 333 of the flexible circuit board 330.

[0046] In practical applications, the following steps 501 to 505 can be performed during the packaging process.

[0047] Step 501: Electrically connect (or bond) the first end 331 of the flexible circuit board 330 to the second surface 312 of the display substrate 310.

[0048] Step 502: Adhere the third surface 321 of the adhesive layer 320 to the first surface 311 of the display substrate 310.

[0049] Step 503: Attach the fixing clip 350 to the fourth surface 322 of the adhesive layer 320.

[0050] Step 504: Bend the curved portion 332 of the flexible circuit board 330 and make the second end 333 of the flexible circuit board 330 pass through the gap 353 of the fixing clamp 350, wherein the second end 333 of the flexible circuit board 330 is electrically connected to the driver chip 340.

[0051] Step 505: Adhere the driver chip 340 to the fourth surface 322 of the adhesive layer 320.

[0052] The execution order of the above steps is only an example, and the embodiments of this application do not limit the execution order of the encapsulation process.

[0053] In the above embodiments, when the flexible circuit board 330 is subjected to external forces such as vibration, since the clamping plate 352 is elastic and the second end 333 of the flexible circuit board 330 is located in the gap between the connecting plate 351 and the clamping plate 352, part of the rebound force of the flexible circuit board 330 will cause the clamping plate 352 to bounce away from the connecting plate 351. The force applied to the flexible circuit board 330 during the deformation of the clamping plate 352 plays a buffering role in the deformation of the flexible circuit board 330, reducing the degree of warping of the second end 333 of the flexible circuit board 330, and reducing the rebound force transmitted from the flexible circuit board 330 to the fixing clamp 350 that causes the fixing clamp 350 to detach from the adhesive layer 320. Thus, the adhesiveness of the adhesive layer 320 is sufficient to firmly adhere the fixing clamp 350. Therefore, with this structure, while reducing the degree of warping of the second end 333 of the flexible circuit board 330, it is possible to ensure that the fixing clamp 350 will not peel off from the adhesive layer 320. Furthermore, by fixing the fixing clip 350 with the adhesive layer 320 instead of other fixing methods such as threaded fixing, the display module 300 can be made thinner, simpler in structure, easier to fix, and lower in cost.

[0054] In some embodiments, the size of the bent portion 332 in the first direction is equal to the sum of the size of the display substrate 310 in the first direction, the size of the adhesive layer 320 in the first direction (such as the size of the second adhesive portion 324 in the first direction mentioned below), and the size of the connecting plate 351 in the first direction. That is, through the structure of the display module 300 provided in the embodiments of this application, it can be ensured that the second end 333 of the flexible circuit board 330 is flat and will not bend away from the display substrate 310.

[0055] In some embodiments, such as Figures 3-5As shown, the display module 300 also includes an encapsulation layer 360 (Encapsulation, Encap) and a cover glass 370 (Cover Glass, CG). The encapsulation layer 360 is disposed on the side of the display substrate 310 away from the adhesion layer 320, and the cover glass 370 is disposed on the side of the encapsulation layer 360 away from the display substrate 310. The encapsulation layer 360 is used to isolate water and oxygen intrusion to extend the service life of the display module 300. The cover glass 370 is a protective layer, and the cover glass 370 is usually made of high-strength glass to prevent the screen surface from being scratched, impacted, or damaged by the environment.

[0056] In some embodiments, such as Figure 7 As shown, the connecting plate 351 has two fixing parts 3511 and a connecting part 3512. The two fixing parts 3511 are connected to the connecting part 3512, and the two fixing parts 3511 are symmetrically arranged with respect to the clamping plate 352. The distance between the two fixing parts 3511 in the second direction is equal to the size of the clamping plate 352 in the second direction.

[0057] For example, the fixing part 3511 extends in a third direction and has a first end and a second end in the third direction, and the connecting part 3512 is connected to the first end of the two fixing parts 3511.

[0058] For example, the clamp 352 is connected to the connecting part 3512.

[0059] For example, when manufacturing the fixing clamp 350, raw materials (plate-like structure or block-like structure) can be obtained first, and two lines extending in a third direction can be cut on the raw materials to form the connecting plate 351 and the clamping plate 352.

[0060] In the above embodiments, by symmetrically arranging the two fixing parts 3511 relative to the clamping plate 352, the second end 333 of the flexible circuit board 330 clamped by the fixing clamp 350 can extend as far as possible along the second direction, reducing the possibility of the second end 333 of the flexible circuit board 330 being skewed. Moreover, the fixing clamp 350 with this structure is simple and easy to manufacture.

[0061] In some embodiments, the connecting plate 351 has two fixing portions 3511 and two connecting portions 3512. The fixing portions 3511 extend along a third direction and have a first end and a second end in the third direction. One connecting portion 3512 is connected to the first end of the two fixing portions 3511, and the other connecting portion 3512 is connected to the second end of the two fixing portions 3511. That is, the cross section of the connecting plate 351 in the second direction and the third direction is annular (such as a square ring or a circular ring). The clamping plate 352 is disposed in the receiving space enclosed by the two fixing portions 3511 and the two connecting portions 3512. The clamping plate 352 has a first end and a second end in the third direction, and the first end of the clamping plate 352 is connected to a connecting portion 3512.

[0062] For example, the two fixing parts 3511 are symmetrically arranged relative to the clamping plate 352.

[0063] In the above embodiments, the fixing clamp 350 with this structure is simple and easy to manufacture. If the two fixing parts 3511 are symmetrically arranged relative to the clamping plate 352, the second end 333 of the flexible circuit board 330 clamped by the fixing clamp 350 can extend as far as possible along the second direction, reducing the possibility of the second end 333 of the flexible circuit board 330 being skewed.

[0064] In some embodiments, the connecting plate 351 has a fixing portion 3511 and a connecting portion 3512. The fixing portion 3511 extends along a third direction and has a first end and a second end in the third direction. The first end of the fixing portion 3511 is connected to the connecting portion 3512. The clamping plate 352 is connected to the connecting portion 3512 and is disposed adjacent to the fixing portion 3511.

[0065] For example, when manufacturing the fixing clamp 350, raw materials (plate-shaped structure or block-shaped structure) can be obtained first, and a line can be cut along a third direction on the raw materials to form the connecting plate 351 and the clamping plate 352.

[0066] In the above embodiments, the fixing clip 350 with this structure is simple and easy to manufacture.

[0067] In some embodiments, both the connecting plate 351 and the clamping plate 352 extend along a third direction. The connecting plate 351 has a first end and a second end in the third direction, and the clamping plate 352 has a first end and a second end in the third direction. The clamping plate 352 is disposed on the side of the connecting plate 351 away from the adhesive layer 320, and the first end of the connecting plate 351 is connected to the first end of the clamping plate 352.

[0068] For example, the connecting plate 351 is a plate-like structure or a block-like structure.

[0069] For example, the clamp 352 is a plate-like structure or a block-like structure.

[0070] In the above embodiments, the fixing clip 350 with this structure is simple and easy to manufacture.

[0071] In some embodiments, such as Figure 3 and Figure 4As shown, the adhesion layer 320 includes a first adhesion portion 323 and a second adhesion portion 324. The first adhesion portion 323 adheres to the first surface 311 of the display substrate 310 and is also adhered to the driving chip 340. The second adhesion portion 324 adheres to the first surface 311 of the display substrate 310, is located on the side of the first adhesion portion 323 near the bent portion 332, and is also adhered to the fixing clip 350. The first adhesion portion 323 and the second adhesion portion 324 are either connected to each other or spaced apart.

[0072] The surfaces of the first adhesive portion 323 and the second adhesive portion 324 that are close to the display substrate 310 are both third surfaces 321, and the surfaces of the first adhesive portion 323 and the second adhesive portion 324 that are far from the display substrate 310 are both fourth surfaces 322.

[0073] For example, the material of the first adhesive portion 323 and the material of the second adhesive portion 324 may be the same or different.

[0074] For example, the dimensions of the first adhesive portion 323 in the first direction and the dimensions of the second adhesive portion 324 in the first direction may be the same or different.

[0075] In practical applications, if the first adhesive portion 323 and the second adhesive portion 324 are spaced apart, during the encapsulation process, when adhering the fixing clip 350, the second adhesive portion 324 can be adhered to the fixing clip 350 first, and then the second adhesive portion 324 can be adhered to the first surface 311 of the display substrate 310, or the second adhesive portion 324 can be adhered to the first surface 311 of the display substrate 310 first, and then the fixing clip 350 can be adhered to the second adhesive portion 324. During the encapsulation process, when adhering the driver chip 340, the first adhesive portion 323 can be adhered to the first surface 311 of the display substrate 310 first, and then the driver chip 340 can be adhered to the first adhesive portion 323, or the driver chip 340 can be adhered to the first adhesive portion 323 first, and then the first adhesive portion 323 can be adhered to the first surface 311 of the display substrate 310.

[0076] In the above embodiments, by spacing the first adhesive portion 323 and the second adhesive portion 324 apart, the material of the adhesive layer 320 can be saved.

[0077] In some embodiments, the second adhesive portion 324 is larger in size in the second direction than the fixing clip 350 in the second direction, and the second adhesive portion 324 is larger in size in the third direction than the fixing clip 350 in the third direction. The third direction intersects (e.g., is perpendicular to) the first and second directions.

[0078] For example, the second adhesive portion 324 is 5 mm larger in the second direction than the fixing clip 350 in the second direction, and the second adhesive portion 324 is 5 mm larger in the third direction than the fixing clip 350 in the third direction.

[0079] In the above embodiments, this structure allows for a large adhesion area between the second adhesion portion 324 and the display substrate 310, which can avoid localized adhesion concentration between the second adhesion portion 324 and the display substrate 310 and reduce the risk of the second adhesion portion 324 falling off the display substrate 310.

[0080] In some embodiments, the second adhesive portion 324 has a size ranging from 0.03 mm to 0.1 mm in the first direction.

[0081] The dimension of the second adhesive portion 324 in the first direction is the thickness of the second adhesive portion 324. The thickness of the second adhesive portion 324 determines its adhesiveness. If the second adhesive portion 324 is too thin, the fixing clip 350 is likely to fall off the second adhesive portion 324. If the second adhesive portion 324 is too thick, it will increase the thickness of the display module 300, thereby causing the display device 400 to be too thick. Therefore, in the above embodiment, by making the dimension of the second adhesive portion 324 in the first direction range from 0.03 mm to 0.1 mm, the second adhesive portion 324 can have sufficient adhesiveness to adhere the fixing clip 350 while also giving the display module 300 an appropriate thickness.

[0082] In some embodiments, the second adhesive portion 324 is smaller in size in the second direction than the fixing clip 350 in the second direction, and the second adhesive portion 324 is smaller in size in the third direction than the fixing clip 350 in the third direction.

[0083] For example, the second adhesive portion 324 has a dimension of 8 mm in the second direction, the fixing clip 350 has a dimension of 10 mm in the second direction, the second adhesive portion 324 has a dimension of 18 mm in the third direction, and the fixing clip 350 has a dimension of 20 mm in the third direction.

[0084] By providing the second adhesive portion 324 with the dimensions described in the above embodiment, the material of the second adhesive portion 324 can be saved, thereby reducing costs.

[0085] In some embodiments, the dimension of the second adhesive portion 324 in the second direction is less than or equal to (the dimension of the fixing clip 350 in the second direction - 1 mm), and the dimension of the second adhesive portion 324 in the third direction is less than or equal to (the dimension of the fixing clip 350 in the third direction - 1 mm).

[0086] For example, the second adhesive portion 324 has a dimension of 6 mm in the second direction, the fixing clip 350 has a dimension of 9 mm in the second direction, the second adhesive portion 324 has a dimension of 15 mm in the third direction, and the fixing clip 350 has a dimension of 18 mm in the third direction.

[0087] By providing the second adhesive portion 324 with the dimensions described in the above embodiment, the material of the second adhesive portion 324 can be saved, thereby reducing costs.

[0088] In some embodiments, the shape of the cross-section of the second adhesive portion 324 in the second direction and the third direction is rectangular, circular, elliptical or other polygonal.

[0089] In some embodiments, the dimension of the retaining clip 350 in the third direction is larger than the dimension of the flexible circuit board 330 in the third direction, and the third direction intersects (e.g., is perpendicular to) the first direction and the second direction.

[0090] For example, the retaining clip 350 has a dimension of 20 mm in the third-party direction, and the flexible circuit board 330 has a dimension of 14 mm in the third-party direction.

[0091] In the above embodiments, since the size of the fixing clip 350 in the third direction is larger than the size of the flexible circuit board 330 in the third direction, the fixing clip 350 and the adhesive layer 320 have a larger adhesion area than the second end 333 of the flexible circuit board 330 is directly adhered to the adhesive layer 320. This allows the fixing clip 350 to be adhered more firmly and prevents the fixing clip 350 from peeling off from the adhesive layer 320.

[0092] In some embodiments, the distance between the edge of the retaining clip 350 extending in the second direction and the edge of the adjacent display substrate 310 extending in the second direction is greater than 1 mm.

[0093] For example, the distance between the edge of the fixing clip 350 extending in the second direction and the edge of the adjacent display substrate 310 extending in the second direction is 2 mm.

[0094] In some embodiments, the maximum dimension between the fixing clip 350 and the bending portion 332 in the second direction is 0.6 mm to 0.8 mm, that is, the dimension between the fixing clip 350 and the bending portion 332 in the second direction at the farthest point from the display substrate 310 is 0.6 mm to 0.8 mm.

[0095] By setting the fixing clip 350 at the position described in the above embodiment, the position where the second end 333 of the flexible circuit board 330 is most likely to lift can be fixed, thereby better preventing the second end 333 of the flexible circuit board 330 from lifting.

[0096] In some embodiments, the distance between the edge of the second adhesive portion 324 extending in the second direction and the edge of the adjacent fixing clip 350 extending in the second direction is greater than 0.5 mm.

[0097] For example, the distance between the edge of the second adhesive portion 324 extending in the second direction and the edge of the adjacent fixing clip 350 extending in the second direction is 1 mm.

[0098] In some embodiments, the fixing clip 350 is made of metal or plastic, preferably of metal.

[0099] Specifically, when selecting the material for the fixing clip 350, it is necessary to select a material with a large elastic modulus so that the fixing clip 350 is not easily deformed under external force and can return to its original shape after the external force is removed. Therefore, metal materials are preferred.

[0100] For example, the metallic material can be iron, aluminum, steel, etc.

[0101] In some embodiments, the retaining clip 350 is made of steel.

[0102] For example, the material of the retaining clip 350 is an elastic material (Steel Use Stainless, SUS).

[0103] In the above embodiments, since steel has a large elastic modulus and good elastic recovery ability, steel is selected as the material of the fixing clip 350 so that the fixing clip 350 can have sufficient structural strength to prevent the second end 333 of the flexible circuit board 330 from deforming and warping.

[0104] In some embodiments, the size of the retaining clip 350 in the first direction ranges from 0.15 mm to 0.2 mm. The larger the size of the retaining clip 350 in the first direction (i.e., the thicker it is), the stronger the mechanical strength of the retaining clip 350, thereby preventing the second end 333 of the flexible circuit board 330 from warping.

[0105] For example, the fixing clip 350 has a dimension of 0.17 mm in the first direction.

[0106] For example, the dimensions of the connecting plate 351 in the first direction range from 0.15 mm to 0.2 mm.

[0107] For example, the connecting plate 351 has a dimension of 0.18 mm in the first direction.

[0108] For example, the size of the clamp 352 in the first direction ranges from 0.15 mm to 0.2 mm.

[0109] For example, the clamp 352 has a dimension of 0.2 mm in the first direction.

[0110] For example, the dimensions of the clamping plate 352 in the first direction are equal to the dimensions of the connecting plate 351 in the first direction.

[0111] In the above embodiments, by making the size range of the fixing clip 350 in the first direction from 0.15 mm to 0.2 mm, it is ensured that the fixing clip 350 has sufficient structural strength to prevent the second end 333 of the flexible circuit board 330 from deforming and warping, while also avoiding the fixing clip 350 being too thick, which would make the display module 300 too thick and thus cause the display device 300 to be too thick.

[0112] In some embodiments, the dimension of the clamp 352 in the second direction is less than or equal to the dimension of the fixing clamp 350 in the second direction.

[0113] For example, if the dimension of the fixing clip 350 in the second direction is 9 mm, the dimension of the clamp 352 in the second direction is 2.5 mm.

[0114] Preferably, the size of the clamp 352 in the second direction is 10% to 25% of the size of the fixing clamp 350 in the second direction.

[0115] For example, if the dimension of the fixing clip 350 in the second direction is 10 mm, the dimension of the clamp 352 in the second direction is 2 mm.

[0116] By setting the clamping plate 352 to the above dimensions, the clamping plate 352 can have good elasticity, thereby enabling the clamping plate 352 to play a better buffering role against the deformation of the second end 333 of the flexible circuit board 330.

[0117] Figure 8 The diagram shown is a structural schematic of a display module provided in another exemplary embodiment of this application.

[0118] In some embodiments, such as Figure 8 As shown, the display module 300 further includes a polarizing layer 380 and an optical adhesive layer 390. The polarizing layer 380 is disposed between the cover plate 370 and the encapsulation layer 360, and the optical adhesive layer 390 is disposed between the polarizer 380 and the cover plate 370. The polarizing layer 380 includes at least one polarizer. The optical adhesive layer 390 includes optically clear adhesive (OCA).

[0119] In practical applications, the following steps 601 to 609 can be performed to encapsulate the display module 300.

[0120] Step 601: Obtain the display panel, which includes an encapsulation layer 360 and a display substrate 310.

[0121] Step 602: Adhere the polarizing layer 380 to the side of the encapsulation layer 360 away from the display substrate 310.

[0122] Step 603: Electrically connect (or bond) the first end 331 of the flexible circuit board 330 to the second surface 312 of the display substrate 310.

[0123] Step 604: Adhere the optical adhesive layer 390 to the side of the polarizing layer 380 away from the encapsulation layer 360.

[0124] Step 605: Attach the cover plate 370 to the side of the optical adhesive layer 390 away from the polarizing layer 380.

[0125] Step 606: Adhere the first adhesive portion 323 to the first surface 311 of the display substrate 310.

[0126] Step 607: Adhere the second adhesive part 324 to the first surface 311 of the display substrate 310, wherein the second adhesive part 324 is adhered to the fixing clip 350.

[0127] Step 608: Bend the curved portion 332 of the flexible circuit board 330 and make the second end 333 of the flexible circuit board 330 pass through the gap of the fixing clamp 350, wherein the second end 333 of the flexible circuit board 330 is electrically connected to the driver chip 340.

[0128] Step 609: Adhere the driver chip 340 to the first adhesion part 323.

[0129] The execution order of the above steps is only an example, and the embodiments of this application do not limit the execution order of the encapsulation process.

[0130] Figure 9 The diagram shown is a schematic diagram of the structure of a display device provided in an exemplary embodiment of this application.

[0131] Based on the same concept, such as Figure 9 As shown, this application embodiment also provides a display device 400, which includes the display module 300 in the above embodiment.

[0132] For example, the display device 400 may be a smartphone, tablet, smartwatch, monitor, etc.

[0133] Since the display device 400 includes the display module 300, all the technical features and effects of the display module 300 are included in the display device 400 and will not be described in detail here.

[0134] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0135] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0136] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0137] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0138] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display module, characterized in that, include: The display substrate has a first surface and a second surface disposed opposite to each other in a first direction; An adhesive layer having adhesive properties, the adhesive layer having a third surface and a fourth surface disposed opposite to each other in the first direction, the third surface of the adhesive layer being adhered to the first surface of the display substrate; A flexible circuit board has a first end, a second end, and a bent portion between the first end and the second end, the bent portion being bent, and the first end of the flexible circuit board being electrically connected to the second surface of the display substrate. The driver chip is electrically connected to the second end of the flexible circuit board and is adhered to the fourth surface of the adhesive layer; A fixing clip is located between the bent portion and the driving chip. The fixing clip includes a connecting plate and a clamping plate. The connecting plate is adhered to the fourth surface of the adhesive layer. The clamping plate is located on the side of the connecting plate away from the adhesive layer and is connected to the connecting plate. A gap can be formed between the connecting plate and the clamping plate, penetrating the fixing clip in a second direction. The second direction intersects the first direction. A second end portion of the flexible circuit board is located in the gap. The fixing clip is configured to restrict the deformation of the second end of the flexible circuit board.

2. The display module according to claim 1, characterized in that, The dimension of the curved portion in the first direction is equal to the sum of the dimensions of the display substrate in the first direction, the dimensions of the adhesive layer in the first direction, and the dimensions of the connecting plate in the first direction.

3. The display module according to claim 1 or 2, characterized in that, The connecting plate has two fixing parts and a connecting part. The two fixing parts are connected to the connecting part. The two fixing parts are symmetrically arranged with respect to the clamping plate. The distance between the two fixing parts in the second direction is equal to the size of the clamping plate in the second direction.

4. The display module according to claim 1 or 2, characterized in that, The adhesion layer includes: The first adhesive portion adheres to the first surface of the display substrate and is also adhered to the driving chip; The second adhesive portion adheres to the first surface of the display substrate, is located on the side of the first adhesive portion near the bent portion, and adheres to the fixing clip; The first adhesive portion and the second adhesive portion are connected to each other or spaced apart.

5. The display module according to claim 4, characterized in that, The second adhesive portion has a larger dimension in the second direction than the fixing clip has a larger dimension in the second direction, and the second adhesive portion has a larger dimension in the third direction than the fixing clip has a larger dimension in the third direction, which intersects the first direction and the second direction.

6. The display module according to claim 4, characterized in that, The second adhesive portion has a size ranging from 0.03 mm to 0.1 mm in the first direction.

7. The display module according to claim 1 or 2, characterized in that, The dimension of the fixing clamp in the third direction is larger than the dimension of the flexible circuit board in the third direction, and the third direction intersects the first direction and the second direction; And / or, the maximum dimension between the fixing clip and the bending portion in the second direction is 0.6 mm to 0.8 mm.

8. The display module according to claim 1 or 2, characterized in that, The dimension of the clamp in the second direction is less than or equal to the dimension of the fixing clamp in the second direction. .

9. The display module according to claim 1 or 2, characterized in that, The size of the clamp in the second direction is 10% to 25% of the size of the fixing clamp in the second direction.

10. The display module according to claim 1 or 2, characterized in that, The fixing clip is made of an elastic material; And / or, the size of the fixing clip in the first direction ranges from 0.15 mm to 0.2 mm.

11. A display device, characterized in that, include: The display module according to any one of claims 1 to 10 above.

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