Display module and display device

Abstract

The present disclosure provides a display module and a display device, and relates to the technical field of display, which comprises a circuit board and a plurality of light emitting packages arranged on the circuit board. The light emitting package comprises a substrate and at least one light emitting element group arranged on the side of the substrate away from the circuit board, wherein the light emitting element group comprises at least one light emitting diode; an encapsulation layer arranged on the side of the light emitting element group away from the substrate and covering the light emitting element group; and a touch electrode layer arranged on the side of the encapsulation layer away from the substrate, wherein the touch electrode layer is a capacitive touch electrode layer. By integrating the touch electrode layer in the small-size light emitting package, it is not necessary to manufacture a large-size touch structure in a large-size display module, which is beneficial to simplify the manufacturing process. The capacitive touch function can be realized through the touch electrode layer, which is beneficial to improve the touch precision, simplify the product structure and reduce the manufacturing cost.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] In recent years, LED display touch technology has developed rapidly driven by interactive needs. Combined with innovative technologies such as infrared, it has gradually broken through the limitations of traditional large-screen display terminals that are difficult to implement touch control.

[0003] For large-size LED displays, the current mainstream touch solution is infrared touch, which locates the touch subject by blocking the infrared light emission and reception path. This method requires an external infrared touch frame to the LED display, and the infrared touch frame needs to be customized according to the size of the display, resulting in a complex structure, high cost, and susceptibility to environmental interference, leading to reduced touch accuracy. Therefore, there is an urgent need for a solution that can simplify the touch structure, improve touch accuracy, and reduce costs. Utility Model Content

[0004] To address the aforementioned technical issues, this disclosure provides a display module and display device that enables capacitive touch functionality, thereby improving touch accuracy and simplifying product structure while reducing manufacturing costs.

[0005] In a first aspect, this disclosure provides a display module, including: a circuit board and a plurality of light-emitting packages disposed on the circuit board; wherein, the light-emitting package includes: a substrate and at least one light-emitting element group disposed on the side of the substrate away from the circuit board, the light-emitting element group including at least one light-emitting diode; an encapsulation layer located on the side of the light-emitting element group away from the substrate and covering the light-emitting element group; and a touch electrode layer located on the side of the encapsulation layer away from the substrate, the touch electrode layer being a capacitive touch electrode layer.

[0006] Optionally, the touch electrode layer includes a first touch electrode layer and a second touch electrode layer, and there is a coupling capacitance between the first touch electrode layer and the second touch electrode layer.

[0007] Optionally, the first touch electrode layer and the second touch electrode layer are disposed in the same layer, and there is a first gap between the first touch electrode layer and the second touch electrode layer.

[0008] Optionally, the first touch electrode layer and the second touch electrode layer are located in different film layers, and there is a second gap between the first touch electrode layer and the second touch electrode layer in a direction parallel to the plane of the substrate; the first touch electrode layer and the second touch electrode layer do not overlap in a direction perpendicular to the plane of the substrate.

[0009] Optionally, the first touch electrode layer and the second touch electrode layer are located in different film layers, and the first touch electrode layer and the second touch electrode layer overlap along a direction perpendicular to the plane of the substrate.

[0010] Optionally, the light-emitting package includes conductive pads, which are located at least in vias on the substrate, and the vias penetrate the substrate along the thickness direction of the substrate; the light-emitting package is electrically connected to the circuit board through the conductive pads.

[0011] The conductive pads include a first touch pad and a second touch pad. The first touch electrode layer is electrically connected to the first touch pad through a first connection hole that penetrates at least through the encapsulation layer, and the second touch electrode layer is electrically connected to the second touch pad through a second connection hole that penetrates at least through the encapsulation layer.

[0012] Optionally, the circuit board includes multiple first signal lines and multiple second signal lines. The first signal lines extend along a first direction and are arranged along a second direction, and the second signal lines extend along the second direction and are arranged along the first direction, wherein the first direction is a row direction and the second direction is a column direction; or, the first direction is a column direction and the second direction is a row direction. In multiple light-emitting packages located in the same row or column along the first direction, each first touch pad is connected to the same first signal line; in multiple light-emitting packages located in the same column or row along the second direction, each second touch pad is connected to the same second signal line; wherein one of the first signal line and the second signal line is connected to an excitation signal module, and the other is connected to a sensing control module.

[0013] Optionally, the circuit board includes a scan driver chip and a data driver chip connected to the light-emitting package, wherein the scan driver chip is used to transmit scan signals to the light-emitting element group, and the data driver chip is used to transmit data signals to the light-emitting element group; one of the excitation signal module and the sensing control module is integrated in the scan driver chip, and the other is integrated in the data driver chip.

[0014] Optionally, the circuit board includes a driver chip for transmitting scanning signals to the light-emitting element group and for transmitting data signals to the light-emitting element group; the excitation signal module and the sensing control module are integrated into the driver chip.

[0015] Optionally, the light-emitting package also includes an LED driver chip, which is located between the substrate and the package layer; the LED driver chip is electrically connected to the light-emitting element group and is used to provide a driving signal to the light-emitting element group.

[0016] Optionally, both the first touch electrode layer and the second touch electrode layer are electrically connected to the LED driver chip; the LED driver chip integrates an excitation signal module and a sensing control module, one of which is electrically connected to the first touch electrode layer and the other is electrically connected to the second touch electrode layer.

[0017] Optionally, the circuit board includes a scan driver chip and a data driver chip connected to the light-emitting package, wherein the scan driver chip is used to transmit scan signals to the light-emitting element group, and the data driver chip is used to transmit data signals to the light-emitting element group; the circuit board also includes an excitation signal module and a sensing control module, wherein the excitation signal module is electrically connected to one of the first touch electrode layer and the second touch electrode layer, and the sensing control module is electrically connected to the other of the first touch electrode layer and the second touch electrode layer; one of the excitation signal module and the sensing control module is integrated in the scan driver chip, and the other is integrated in the data driver chip.

[0018] Optionally, the circuit board includes an excitation signal module and a sensing control module. The excitation signal module is electrically connected to one of the first touch electrode layer and the second touch electrode layer, and the sensing control module is electrically connected to the other of the first touch electrode layer and the second touch electrode layer. The circuit board includes a driver chip, which is used to transmit scanning signals to the light-emitting element group and to transmit data signals to the light-emitting element group. The excitation signal module and the sensing control module are integrated in the driver chip.

[0019] Optionally, a touch electrode layer corresponding to a light-emitting package includes at least one self-capacitive electrode structure; the self-capacitive electrode structure includes a third touch electrode layer and a fourth touch electrode layer, the third touch electrode layer receiving an excitation signal and a detection signal, and the fourth touch electrode layer receiving a reference voltage signal.

[0020] Optionally, the light-emitting package includes a conductive pad, which is located at least in a via on the substrate, and the via penetrates the substrate along the thickness direction of the substrate; the conductive pad includes a ground pad and a third touch pad, the third touch electrode layer is electrically connected to the third touch pad, and the fourth touch electrode layer is electrically connected to the ground pad.

[0021] Optionally, a light-emitting package includes a self-capacitive electrode structure; the circuit board includes multiple third signal lines, and the third touch pads corresponding to different light-emitting packages are electrically connected to different third signal lines; the third signal lines are connected to the same driver chip.

[0022] Optionally, a light-emitting package includes a self-capacitive electrode structure; the circuit board includes a fourth signal line and a fifth signal line, the fourth signal line extending along the row direction and the fifth signal line extending along the column direction;

[0023] The display panel includes multiple rows of light-emitting packages. In any two adjacent rows of light-emitting packages, in one row, the third touch pad corresponding to the odd-numbered light-emitting package is electrically connected to the fourth signal line, and the third touch pad corresponding to the even-numbered light-emitting package is electrically connected to the fifth signal line. In the other row, the third touch pad corresponding to the odd-numbered light-emitting package is electrically connected to the fifth signal line, and the third touch pad corresponding to the even-numbered light-emitting package is electrically connected to the fourth signal line. The fourth signal line and the fifth signal line are connected to different driver chips, or the fourth signal line and the fifth signal line are connected to the same driver chip.

[0024] Optionally, a light-emitting package includes two self-capacitive electrode structures, namely a first self-capacitive electrode structure and a second self-capacitive electrode structure. Both the first and second self-capacitive electrode structures include a third touch electrode layer and a fourth touch electrode layer. The third touch electrode layer in the first self-capacitive electrode structure receives a row excitation signal and a row detection signal; the third touch electrode layer in the second self-capacitive electrode structure receives a column excitation signal and a column detection signal.

[0025] Optionally, the circuit board includes multiple fourth signal lines and multiple fifth signal lines, with the fourth signal lines extending along the row direction and the fifth signal lines extending along the column direction; in the light-emitting packages located in the same row, the third touch electrode layer in the first self-capacitive electrode structure is connected to the same fourth signal line; in the light-emitting packages located in the same column, the third touch electrode layer in the second self-capacitive electrode structure is connected to the same fifth signal line; the fourth signal lines and fifth signal lines are respectively connected to different driver chips, or the fourth signal lines and fifth signal lines are connected to the same driver chip.

[0026] Optionally, the light-emitting package further includes an LED driver chip located between the substrate and the package layer; the LED driver chip is electrically connected to the light-emitting element group and is used to provide driving signals to the light-emitting element group; the third touch electrode layer is electrically connected to the LED driver chip, and the LED driver chip is also used to transmit excitation signals and detection signals to the third touch electrode layer.

[0027] Optionally, the light-emitting package further includes an LED driver chip located between the substrate and the package layer; the LED driver chip is electrically connected to the light-emitting element group and is used to provide driving signals to the light-emitting element group; the display module further includes a driver chip connected to the light-emitting package and is used to transmit excitation signals and detection signals to the third touch electrode layer; the circuit board includes a scan driver chip and a data driver chip connected to the light-emitting package, wherein the scan driver chip is used to transmit scan signals to the light-emitting element group, and the data driver chip is used to transmit data signals to the light-emitting element group; the driver chip is independent of the scan driver chip and the data driver chip, or the driver chip is integrated into the scan driver chip and / or the data driver chip.

[0028] Optionally, it also includes a protective layer located on the side of the light-emitting package away from the circuit board, and at least part of the protective layer fills the space between adjacent light-emitting packages.

[0029] Secondly, based on the same inventive concept, this disclosure provides a display device, including the display module provided in the first aspect of this disclosure.

[0030] The technical solution provided in this disclosure has the following advantages compared with the prior art:

[0031] The display module and display device provided in this disclosure integrate a touch electrode layer within a small-sized light-emitting package, eliminating the need for a large-sized touch structure in a large-sized display module. This simplifies the manufacturing process. Each light-emitting package possesses touch sensing capabilities, eliminating the need for significantly increased hardware costs (number of infrared photocells) required for large-sized displays, unlike infrared touch. This reduces the cost of large-sized displays. Furthermore, the light-emitting package in this disclosure is applicable to display modules of different sizes and resolutions, broadening its applicability. By integrating the touch electrode layer into the light-emitting package, this disclosure identifies touch points by detecting capacitance changes caused by touch. It is insensitive to infrared wavelengths in ambient light, effectively avoiding the accidental touches and drift problems caused by strong light in existing infrared touch solutions. This significantly improves the display module's resistance to ambient light interference. Additionally, capacitive touch technology typically offers higher precision than infrared touch, allowing for higher touch resolution through more precise electrode design, making it more suitable for fine-tuning operations. Furthermore, in this disclosure, since the touch electrode layer is encapsulated inside or on the surface of the light-emitting package, the possibility of dust and water droplets directly obscuring the touch sensor is greatly reduced, significantly improving its anti-fouling capability and thus effectively enhancing the reliability and stability of touch control. In addition, this disclosure integrates the touch function inside the light-emitting package, avoiding the problem of easy damage to external touch frames, and improving the overall mechanical strength and reliability of the display module, with particularly significant advantages in transportation and frequent movement scenarios. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0033] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 The image shown is a schematic diagram of a structure of an LED display screen in related technologies;

[0035] Figure 2 The figure shown is a planar structural diagram of a display module provided in an embodiment of this disclosure;

[0036] Figure 3 As shown Figure 2 A cross-sectional view of the display module along the AA direction;

[0037] Figure 4 As shown Figure 2 A planar structural diagram of a single light-emitting package;

[0038] Figure 5 As shown Figure 4 A BB-direction cross-sectional view of a light-emitting package;

[0039] Figure 6 As shown Figure 2 Another planar structure diagram of a single light-emitting package;

[0040] Figure 7 As shown Figure 6 A C-axis cross-sectional view of a light-emitting package;

[0041] Figure 8 As shown Figure 2 Another planar structure diagram of a single light-emitting package;

[0042] Figure 9 As shown Figure 8 A DD-axis cross-sectional view of a light-emitting package;

[0043] Figure 10 The diagram shows a connection between the touch electrode in the light-emitting package and the circuit board in a display module.

[0044] Figure 11 The diagram shows a connection between the light-emitting package and the scan signal lines and data signal lines in the circuit board.

[0045] Figure 12 As shown Figure 2 A planar structural diagram of a single light-emitting package;

[0046] Figure 13 As shown Figure 12 A cross-sectional view of a light-emitting package in the EE direction;

[0047] Figure 14 As shown Figure 2 Another planar structure diagram of a single light-emitting package;

[0048] Figure 15 As shown Figure 14 A GG cross-sectional view of a light-emitting encapsulator;

[0049] Figure 16 As shown Figure 2 Another planar structure diagram of a single light-emitting package;

[0050] Figure 17 As shown Figure 16 A cross-sectional view of a light-emitting package in the LL direction;

[0051] Figure 18 The diagram shown is a schematic diagram of the connection between the self-capacitive electrode structure and the driving chip in the display module provided in this embodiment of the present disclosure;

[0052] Figure 19 The diagram shown is another connection diagram between the self-capacitive electrode structure and the driver chip in the display module provided in this embodiment of the present disclosure.

[0053] Figure 20 As shown Figure 2 A planar structural diagram of a single light-emitting package;

[0054] Figure 21 As shown Figure 20 A cross-sectional view of a light-emitting package in the HH direction;

[0055] Figure 22 The diagram shows a connection between the first self-capacitive electrode structure, the second self-capacitive electrode structure, and the driver chip.

[0056] Figure 23 As shown Figure 2 Another planar structure diagram of a single light-emitting package;

[0057] Figure 24 As shown Figure 23 A cross-sectional view of a light-emitting package in the II direction;

[0058] Figure 25 As shown Figure 2 Another planar structure diagram of a single light-emitting package;

[0059] Figure 26 As shown Figure 2 Another planar structure diagram of a single light-emitting package;

[0060] Figure 27 As shown Figure 26 A cross-sectional view of a light-emitting package in the FF direction;

[0061] Figure 28 As shown Figure 2 Another AA-axis cross-sectional view of the display module;

[0062] Figure 29 The diagram shown is a structural schematic of a display device provided in an embodiment of this disclosure. Detailed Implementation

[0063] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0064] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0065] Figure 1 The diagram shows a structural schematic of an LED display screen 300, which is composed of multiple LED display modules 301. To achieve touch functionality, a custom infrared touch module is needed around the LED display screen as its bezel. Specifically, infrared emitters and receivers are used to form an XY-axis intersecting infrared matrix. The emitters emit infrared light of a specific wavelength (e.g., 850nm or 940nm). Row and column gating signals control the scanning order of the infrared pairs to acquire infrared signals. Typically, the infrared emitters and receivers are distributed on the bezel, appearing in pairs, such as... Figure 1 As shown, the infrared transmitter sends infrared light to the receiver on the other side. By statistically analyzing the coordinates of the signals received at the receiver in the X and Y directions, the X and Y coordinates of the touch point can be determined. The PC system then displays the corresponding interactive content on these coordinates, or through an algorithm that maps the coordinates.

[0066] However, infrared touch control relies on an infrared matrix to detect touch position. Strong light sources like sunlight and incandescent bulbs can interfere with the receiver signal, leading to accidental touches or positional drift. Dust or water droplets on the touch frame surface can obstruct the infrared path, causing sluggish touch response or even malfunction. Since the infrared touch frame is located around the screen, its transmitter and receiver are exposed, making them susceptible to damage during handling or impacts, especially in scenarios involving frequent transport or movement. In infrared touch solutions, actual touch accuracy is limited by the density of infrared photocells; some low-end products can have errors as low as ±2mm, making them unsuitable for precise operation. Larger displays require a greater number of infrared photocells, significantly increasing hardware costs.

[0067] Therefore, this disclosure provides a display module and a display device to solve or at least partially solve the aforementioned problems. The content of this disclosure will be described below with reference to the accompanying drawings and specific embodiments.

[0068] Figure 2 The figure shown is a planar structural diagram of a display module provided in an embodiment of this disclosure. Figure 3 As shown Figure 2 A cross-sectional view of the display module along the AA direction is shown below. It should be noted that this embodiment is only illustrated using a rectangular display module as an example, but it is not limited thereto. The display module can also be configured with other shapes as needed. Furthermore, this disclosure does not limit the number or arrangement of the light-emitting encapsulated bodies actually included in the display module.

[0069] Figure 4 As shown Figure 2 A planar structural diagram of a single light-emitting package 10. Figure 5 As shown Figure 4 A cross-sectional view of the light-emitting package 10 along the BB direction. Figure 4 and Figure 5 The embodiments illustrate a detailed structure of the light-emitting package 10. This disclosure uses a rectangular light-emitting package as an example for illustration, but does not limit the actual shape of the light-emitting package. In some other embodiments of this disclosure, the planar structure of the light-emitting package can also be other feasible shapes such as circles, triangles, and polygons. Figure 4 This embodiment illustrates the use of a single light-emitting package 10 containing one light-emitting element group 12, where each light-emitting element group 12 includes three light-emitting diodes (LEDs). The three LEDs emit different colors, for example, red, green, and blue LEDs. However, this disclosure is not limited to this. In other embodiments, a package may contain two or more light-emitting element groups 12, each group may contain two or more LEDs, or it may contain only one LED. In other words, the touch control in this invention can be integrated into a single LED package or into multiple LED packages, such as those using a MIP (Multi-In-Package) LED package.

[0070] Please refer to Figures 2 to 5 The display module provided in this embodiment includes: a circuit board 00 and a plurality of light-emitting packages 10 disposed on the circuit board 00; wherein, the light-emitting package 10 includes:

[0071] The substrate 11 and at least one light-emitting element group 12 disposed on the side of the substrate 11 away from the circuit board 00, the light-emitting element group 12 including at least one light-emitting diode (LED); that is, the display module mentioned in the embodiments of this disclosure is an LED display module.

[0072] The encapsulation layer 13 is located on the side of the light-emitting element group 12 away from the substrate 11 and covers the light-emitting element group 12.

[0073] The touch electrode layer 50 is located on the side of the encapsulation layer 13 away from the substrate 11.

[0074] This disclosure provides a display module 100 that integrates a touch electrode layer 50 into an LED light-emitting package 10. Specifically, this disclosure integrates touch functionality into each light-emitting package 10, that is, integrates touch functionality into each LED. Each light-emitting package 10 not only includes an LED light-emitting element group 12 for display, but also integrates a touch electrode layer 50 on the side of the packaged LED light-emitting element group 12 facing away from the circuit board 00. In actual manufacturing process, after forming multiple light-emitting packages 10, the light-emitting packages 10 can be transferred to the side of the circuit board 00 to form an electrical connection between the light-emitting packages 10 and the circuit board 00. That is, during the manufacturing process of the light-emitting package 10, at least two light-emitting diodes (LEDs) for display and the touch electrode layer 50 for implementing touch functionality are integrated into the light-emitting package 10. The method of integrating the touch electrode layer 50 in a small-sized light-emitting package 10 eliminates the need to set a touch structure on the surface of a large-sized display module, which helps to simplify the manufacturing process. Moreover, the light-emitting package 10 in this embodiment is applicable to display modules of different sizes and resolutions, thus having a wider range of applications.

[0075] This disclosure integrates the touch electrode layer 50 into the light-emitting package 10. The touch electrode layer 50 can be, for example, a capacitive touch electrode layer, which can identify the touch point by detecting the capacitance change caused by touch. It is not sensitive to the infrared band in ambient light, which can effectively avoid the problems of accidental touch and drift caused by strong light in existing infrared touch solutions. Therefore, it effectively improves the display module's resistance to ambient light interference. At the same time, the accuracy of capacitive touch technology is usually higher than that of infrared touch, and higher touch resolution can be achieved through more precise electrode design, making it more suitable for fine operation.

[0076] Furthermore, in this disclosure, since the touch electrode layer 50 is encapsulated inside or on the surface of the light-emitting package 10, the possibility of dust and water droplets directly obscuring the touch electrode layer 50 is greatly reduced, significantly improving its anti-fouling capability and thus effectively enhancing the reliability and stability of touch control. In addition, this disclosure integrates the touch function inside the light-emitting package 10, avoiding the problem of easy damage to external touch frames and improving the overall mechanical strength and reliability of the display module, with particularly significant advantages in transportation and frequent movement scenarios.

[0077] Meanwhile, this disclosure integrates the touch electrode layer 50 into the light-emitting package 10, and each light-emitting package 10 has touch sensing capability. For large-size displays, there is no need to significantly increase the additional hardware cost (number of infrared photocells) as with infrared touch, thus helping to reduce the cost of large-size displays.

[0078] The touch electrode layer mentioned in the embodiments of this disclosure can be a mutual capacitive touch electrode layer or a self-capacitive touch electrode layer. The following will first describe the scheme in which the touch electrode layer is a mutual capacitive touch electrode layer 14.

[0079] Please continue to refer to this. Figure 4 and Figure 5 The touch electrode layer 50 includes a first touch electrode layer 14-1 and a second touch electrode layer 14-2, and there is a coupling capacitance between the first touch electrode layer 14-1 and the second touch electrode layer 14-2.

[0080] This embodiment provides a detailed description of the structure of the mutual capacitance touch electrode layer 14. Optionally, the first touch electrode layer 14-1 is a receiving electrode, and the second touch electrode layer 14-2 is a transmitting electrode. When the transmitting electrode receives an excitation signal, the receiving electrode can sense the signal from the transmitting electrode, and the intensity of this sensed signal is proportional to the mutual capacitance between the two. When no touch subject (e.g., finger, stylus, etc.) is present, a coupling capacitance, i.e., mutual capacitance, is formed between the first touch electrode layer 14-1 and the second touch electrode layer 14-2. When a touch subject touches the screen, it affects the electric field lines near the touch point. The conductivity of the human body conducts some of the electric field lines to the ground, thereby weakening the electric field coupling between the transmitting and receiving electrodes. This weakening of electric field coupling leads to a decrease in the mutual capacitance value corresponding to the touch point. The signal intensity sensed by the receiving electrode also weakens accordingly. By detecting the weakening of the received signal at a specific location (i.e., the decrease in mutual capacitance), the location of the touch can be determined. Since each light-emitting package 10 integrates a first touch electrode layer 14-1 and a second touch electrode layer 14-2, the coordinates of one or more touch points can be determined by scanning the first touch electrode layer 14-1 and the second touch electrode layer 14-2 corresponding to the light-emitting package 10 in the entire display module.

[0081] Considering that when the mutual capacitance touch electrode layer 14 is integrated into a small light-emitting package 10, in order to maximize the area of ​​the first touch electrode layer 14-1 and the second touch electrode layer 14-2 in the mutual capacitance touch electrode layer 14, this embodiment, for example, please refer to Figure 4At least one of the first control electrode layer 14-1 and the second touch electrode layer 14-2 partially or completely overlaps with the light-emitting element group 12 in the light-emitting package 10, enabling a larger touch-sensing area within a limited planar space. For example, the touch electrodes can be designed to cover multiple adjacent light-emitting elements, forming a larger touch-sensing area. A larger touch-sensing area typically means a larger capacitance change, which helps to increase the strength of the touch signal, thereby improving touch sensitivity and signal-to-noise ratio, allowing even the slightest touch to be accurately recognized.

[0082] To minimize the impact of the mutual capacitance touch electrode layer 14 on the light emission of the light-emitting element group 12, in this embodiment, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 in the mutual capacitance touch electrode layer 14 can be made of transparent conductive materials, such as ITO (indium tin oxide), silver nanowires, graphene, etc. Of course, when the touch electrode layer is a self-capacitive touch electrode layer, similar transparent conductive materials can also be used.

[0083] It should be noted that in the light-emitting encapsulation body 10, the encapsulation layer 13 can be made of transparent resin material, and an insulating layer can be used to isolate the encapsulation layer 13 from the touch electrode layer 50. An insulating layer can also be introduced on the side of the touch electrode layer 50 facing away from the substrate 11 to protect the touch electrode layer 50. The materials of these insulating layers can also be transparent materials, such as PET (polyethylene terephthalate), OCA (Optically Clear Adhesive), etc. The insulating layer itself can be formed by a single layer of material or by multiple layers of different materials. This disclosure does not specifically limit this.

[0084] Please continue to refer to this. Figure 4 and Figure 5 In one optional embodiment of this disclosure, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are disposed in the same layer, and there is a first interval G1 between the first touch electrode layer 14-1 and the second touch electrode layer 14-2.

[0085] This embodiment details a feasible film structure for the first touch electrode layer 14-1 and the second touch electrode layer 14-2 in the light-emitting package 10. The first touch electrode layer 14-1 and the second touch electrode layer 14-2 are located on the same thin film, and there is a certain physical distance between the two electrodes, i.e., a first gap G1, which is used to form a coupling capacitor. This co-layer arrangement, compared to solutions requiring multiple layers, reduces the number of thin film deposition and photolithography steps, thus reducing the number of film layers and simplifying the manufacturing process and lowering costs. Furthermore, since the touch electrodes are typically made of transparent conductive materials, the co-layer structure avoids the impact of multiple layers of transparent conductive films on the light emission of the LED, thus contributing to higher overall light transmittance and improving display brightness.

[0086] Please continue to refer to this. Figure 4 In one optional embodiment of this disclosure, the edge of the first touch electrode layer 14-1 facing the second touch electrode layer 14-2 is the first edge BY1, and the edge of the second touch electrode layer 14-2 facing the first touch electrode layer 14-1 is the second edge BY2. The first edge BY1 and the second edge BY2 are parallel.

[0087] Please combine Figure 4 When the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are disposed in the same layer, under the premise of ensuring that there is a first gap G1 between the first touch electrode layer 14-1 and the second touch electrode layer 14-2, the first edge BY1 and the second edge BY2 can be parallel. In this way, the coverage area of ​​the first touch electrode layer 14-1 and the second touch electrode layer 14-2 can be as large as possible, so as to maximize the touch area of ​​the first touch electrode layer 14-1 and the second touch electrode layer 14-2, improve the strength of the touch signal, and thus improve the touch sensitivity and signal-to-noise ratio. Figure 4 The illustrated embodiment uses a rectangular top view of the light-emitting package 10, with both the first touch electrode layer 14-1 and the second touch electrode layer 14-2 being triangular, as an example for illustration. However, this disclosure is not limited to this. In some other embodiments of this disclosure, the shapes of the first touch electrode layer 14-1 and the second touch electrode layer 14-2 can also be other than those shown in the references provided. Figure 6 , Figure 6 As shown Figure 2Another planar structural diagram of a single light-emitting package 10 is shown. In this embodiment, one of the first touch electrode layer 14-1 and the second touch electrode layer 14-2 is a rectangular structure, and the other is a concave structure. The concave structure at least partially surrounds the rectangular structure, and the two are separated by a second gap G2. The first edge BY1 and the second edge BY2 are also parallel structures, and can also form coupling capacitors. It should be noted that when the top view structure of the light-emitting package 10 is circular or other shapes, the shapes of the first touch electrode layer 14-1 and the second touch electrode layer 14-2 can be adaptively adjusted.

[0088] Figure 4 The embodiment describes a scheme in which the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are disposed in the same layer. In some other embodiments of this disclosure, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 may also be located in different film layers, for example, please refer to Figure 6 and Figure 7 , Figure 7 As shown Figure 6 A cross-sectional view of the light-emitting package 10 along the CC direction. In an optional embodiment of this disclosure, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are located in different film layers. Along the direction parallel to the plane where the substrate 11 is located, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 have a second interval G2. Along the direction perpendicular to the plane where the substrate 11 is located, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 do not overlap.

[0089] It should be noted that when the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are located in different film layers, the top view of the first touch electrode layer 14-1 and the second touch electrode layer 14-2 can be represented as follows: Figure 4 The structure shown can also be represented as Figure 6 The structure shown. When the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are located in the same film layer, the top view of the first touch electrode layer 14-1 and the second touch electrode layer 14-2 can also be represented as follows. Figure 4 The structure shown, or embodied in Figure 6 The structure shown is not limited in this disclosure.

[0090] Please refer to Figure 6 and Figure 7In this embodiment, when the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are disposed in different film layers, they can be isolated from each other by an insulating layer. In the direction parallel to the plane of the substrate 11, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are isolated by a second gap G2. The coupling capacitance between the first touch electrode layer 14-1 and the second touch electrode layer 14-2 is mainly formed through the edge field effect. At this time, in the direction perpendicular to the plane of the substrate 11, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 do not overlap, which can minimize the direct occlusion of the display area below and help improve the brightness and uniformity of the display.

[0091] When the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are disposed in different layers, under the premise that there is a second gap G2 between the first touch electrode layer 14-1 and the second touch electrode layer 14-2 in the horizontal direction and the first touch electrode layer 14-1 and the second touch electrode layer 14-2 do not overlap in the vertical direction, the coverage area of ​​the first touch electrode layer 14-1 and the second touch electrode layer 14-2 should be as large as possible, so as to maximize the touch area of ​​the first touch electrode layer 14-1 and the second touch electrode layer 14-2, improve the strength of the touch signal, and thus improve the touch sensitivity and signal-to-noise ratio.

[0092] Of course, in some other embodiments of this disclosure, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 in the mutual capacitance touch electrode layer 14 may also overlap in the vertical direction, for example, please refer to Figure 8 and Figure 9 ,in, Figure 8 As shown Figure 2 Another planar structure diagram of a single light-emitting package 10. Figure 9 As shown Figure 8 A DD-direction cross-sectional view of the light-emitting package 10.

[0093] Please refer to Figure 8 and Figure 9In one optional embodiment of this disclosure, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are located in different film layers and overlap along a direction perpendicular to the plane of the substrate 11. This embodiment illustrates a scheme in which the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are disposed in different film layers and isolated from each other by an insulating layer. In a direction perpendicular to the plane of the substrate 11, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 at least partially cover each other. This means that their projections in the horizontal direction overlap. Thus, a capacitor structure will be formed at the location corresponding to the overlapping area. The larger the overlap area, the larger the mutual capacitance value will be. A larger capacitance value means a stronger signal, which is beneficial to significantly improve the touch sensitivity and signal-to-noise ratio, enabling the display module to detect more subtle touches. The structure of the first touch electrode layer 14-1 and the second touch electrode layer 14-2 being disposed in different layers and vertically overlapping enables more efficient electric field coupling. When a finger or other conductive object touches the display module, it more easily affects the electric field lines between the driving and sensing electrodes, resulting in more significant capacitance changes and thus improving touch reliability. Furthermore, the stronger signal and more concentrated electric field make touch position determination more accurate, contributing to higher touch precision. Simultaneously, the greater signal strength makes the touch electrode units in the display module more resistant to noise interference, providing more stable touch performance.

[0094] Please continue to refer to 8 and... Figure 9 The first touch electrode layer 14-1 is located on the side of the second touch electrode layer 14-2 facing away from the substrate 11, and covers the light-emitting surface of the light-emitting package 10. Since the first touch electrode layer 14-1 is located above the second touch electrode layer 14-2, its area can be set to be relatively large, covering the entire light-emitting surface of the light-emitting package 10. This increases the overlap area between the first touch electrode layer 14-1 and the second touch electrode layer 14-2. A larger overlap area results in a larger mutual capacitance value, which in turn means a stronger signal. This significantly improves touch sensitivity and signal-to-noise ratio, enabling the display module to detect even slight touches.

[0095] Please continue to refer to 8 and... Figure 9In one optional embodiment of this disclosure, the light-emitting package 10 includes conductive pads 15, which are located at least in vias on the substrate 11, extending through the substrate 11 along its thickness direction. The light-emitting package 10 is electrically connected to the circuit board 00 via conductive pads 12. The conductive pads 15 include a first touch pad RX and a second touch pad TX. A first touch electrode layer 14-1 is electrically connected to the first touch pad RX via a first connection hole K1 that extends at least through the package layer 13, and a second touch electrode layer 14-2 is electrically connected to the second touch pad TX via a second connection hole K2 that extends at least through the package layer 13. In practical applications, after forming vias on the substrate, the first touch pad RX and the second touch pad TX can be formed by filling the vias with metal material.

[0096] Please combine Figure 2 , Figure 8 and Figure 9 When a mutual capacitance touch electrode layer 14 is integrated above the encapsulation layer 13 for encapsulating the light-emitting element group 12 in the light-emitting package 10, in order to realize the conduction of touch signals, in this embodiment of the present disclosure, a through hole is formed on the substrate 11 of the light-emitting package 10, and a first touch pad RX and a second touch pad TX are formed in the through hole. Optionally, the first touch pad RX and the second touch pad TX are flush with the lower surface of the substrate 11 or protrude from the lower surface of the substrate 11 to facilitate electrical connection with the circuit board 00. The first touch pad RX is electrically connected to the first touch electrode layer 14-1 in the light-emitting package 10 through the first connection hole K1, and can also form an electrical connection with the circuit board 00, thereby making the first touch electrode layer 14-1 electrically connected to the circuit board 00. The first connection hole K1 penetrates the film layer between the first touch electrode layer 14-1 and the first touch pad RX. In the actual manufacturing process, while forming the first touch electrode layer 14-1, the first connection hole K1 is filled with the same material as the first touch electrode layer 14-1, thereby achieving electrical connection between the first touch electrode 14-1 and the first touch pad RX. Similarly, the second touch pad TX is electrically connected to the second touch electrode layer 14-2 in the light-emitting package 10 through the second connection hole K2, and can also form an electrical connection with the circuit board 00, thereby enabling the second touch electrode layer 14-2 to form an electrical connection with the circuit board 00. The first connection hole K2 penetrates the film layer between the first touch electrode layer 14-1 and the substrate 11, and the second connection hole K2 penetrates the film layer between the second touch electrode layer 14-2 and the substrate 11. The second connection hole K2 penetrates the film layer between the second touch electrode layer 14-2 and the second touch pad TX. In the actual process, while forming the second touch electrode layer 14-2, the second connection hole K2 will be filled with the same material as the second touch electrode layer 14-2, thereby realizing the electrical connection between the second touch electrode 14-2 and the second touch pad TX.

[0097] It should be noted that when the first touch electrode layer 14-1 and the second touch electrode layer 14-2 overlap, the area of ​​the first touch electrode layer 14-1 and the second touch electrode layer 14-2 can be increased as much as possible while avoiding interference with the connection hole, thereby increasing the touch area, improving the strength of the touch signal, and thus improving the touch sensitivity and signal-to-noise ratio.

[0098] In the display module provided in this embodiment, after integrating the light-emitting element group 12 and the mutual capacitance touch electrode layer 14 in the light-emitting package 10, the connection points of the touch electrode layer 50 are led to the touch pads in the substrate 11, making the connection with the circuit board 00 more direct and convenient, and simplifying the design and connection process of the circuit board 00. Furthermore, integrating the first touch electrode layer 14-1, the second touch electrode layer 14-2, and the corresponding first connection hole K1 and second connection hole K2 all in the light-emitting package 10 helps reduce the connection path of the touch signal. A shorter connection path can reduce signal attenuation and interference, thus improving touch accuracy and reliability.

[0099] Figure 10 The diagram shown illustrates one connection between the touch electrode in the light-emitting package 10 and the circuit board 00 in the display module. Please refer to the diagram. Figure 10 In one optional embodiment of this disclosure, the circuit board 00 includes a plurality of first signal lines 21 and a plurality of second signal lines 22. The first signal lines 21 extend along a first direction D1 and are arranged along a second direction D2, and the second signal lines 22 extend along the second direction D2 and are arranged along the first direction D1. The first direction D1 is a column direction and the second direction D2 is a row direction; or, the first direction D1 is a row direction and the second direction D2 is a column direction.

[0100] In a plurality of light-emitting packages 10 located in the same column or row along the first direction D1, each first touch pad RX is connected to the same first signal line 21. This means that the first touch pads RX corresponding to these light-emitting packages 10 can share a single first signal line 21 to receive or transmit signals, without the need to set different first signal lines 21 for the first touch pads RX of the plurality of light-emitting packages 10, thereby simplifying the wiring design of the circuit board 00.

[0101] In a plurality of light-emitting packages 10 located in the same row or column along the second direction D2, each second touch pad TX is connected to the same second signal line 22. This means that the second touch pads TX corresponding to these light-emitting packages 10 can share a single second signal line 22 to send or receive signals, without the need to set different second signal lines 22 for the second touch pads TX of the plurality of light-emitting packages 10, thereby simplifying the wiring design of the circuit board 00.

[0102] In this configuration, one of the first signal line 21 and the second signal line 22 is connected to the excitation signal module, and the other is connected to the sensing control module. It should be noted that this disclosure does not limit the nature of the first touch electrode layer 14-1 and the second touch electrode layer 14-2. In practical applications, the electrode layer connected to the excitation signal module is the transmitting electrode, and the electrode layer connected to the sensing control module is the receiving electrode.

[0103] This embodiment only illustrates the example of the first signal line 21 being connected to the sensing control module and the second signal line 22 being connected to the excitation signal module. The first touch electrode layer 14-1 is a receiving electrode, and the second touch electrode layer 14-2 is a transmitting electrode. When the first signal line 21 is connected to the sensing control module and the second signal line 22 is connected to the excitation signal module, the second signal line 22 is used to send an excitation signal to the second touch electrode layer 14-2, and the first signal line 21 is used to receive the coupling capacitance signal transmitted from the first touch electrode layer 14-1, such as a signal indicating a change caused by touch. In some other embodiments of this disclosure, the first signal line 21 may also be connected to the excitation signal module, and the second signal line 22 may also be connected to the sensing control module; this disclosure does not specifically limit this.

[0104] This embodiment employs the aforementioned matrix wiring method to achieve multi-touch. When multiple points are touched, the excitation signal and sensing signal change at multiple intersection points. By scanning the entire signal line network, the coordinates of multiple touch points can be identified. The excitation signal can be applied row by row (or column by column), while the sensing control module synchronously reads the signal changes on the column (or row), thereby scanning the entire touch area one by one. Compared to the requirement of independent signal lines for each mutual capacitance touch electrode layer 14 in each light-emitting package 10, the matrix wiring in this embodiment significantly reduces the number of signal lines required. If a display area has m×n mutual capacitance touch electrode units (each light-emitting package can be considered to contain one mutual capacitance touch electrode unit), only m+n signal lines are needed for addressing, instead of m×n lines, thus greatly simplifying the design and connection of the circuit board 00. Furthermore, the reduction in the number of signal lines also directly reduces the complexity and manufacturing cost of the circuit board 00.

[0105] It should be noted that the matrix wiring structure in this embodiment can be applied to various touch electrode structures mentioned in the foregoing embodiments. For example, structures in which the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are disposed in the same layer, structures in which the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are disposed in different layers and do not overlap, or structures in which they overlap, are all applicable to the matrix wiring structure in this embodiment.

[0106] Please refer to this appropriately. Figure 10In one optional embodiment of this disclosure, the circuit board 00 includes a scan driver chip and a data driver chip connected to the light-emitting package 10; wherein, the scan driver chip is used to transmit scan signals to the light-emitting element group 12, and the data driver chip is used to transmit data signals to the light-emitting element group 12; one of the excitation signal module and the sensing control module is integrated in the scan driver chip, and the other is integrated in the data driver chip.

[0107] The scan driver chip and data driver chip can be viewed as structures that control the light-emitting elements in the light-emitting package to emit light. These chips are mounted on a circuit board. Specifically, the scan driver chip on circuit board 00 generates and transmits scan signals to select groups of light-emitting elements in the light-emitting package 10 row by row or column by column for illumination. The data driver chip generates and transmits data signals based on image data to control the brightness of the selected groups of light-emitting elements. It should be noted that the process by which the scan driver chip and data driver chip emit light from the groups of light-emitting elements in the light-emitting package is not limited by the type of touch electrode layer. That is, regardless of whether the touch electrode layer is a mutual capacitance structure or a self-capacitive electrode structure, the principle by which the scan driver chip and data driver chip emit light from the groups of light-emitting elements in the light-emitting package is the same.

[0108] When the touch electrode layer has a mutual capacitance structure, one feasible implementation of this disclosure is to integrate the excitation signal module into the scan driver chip and the sensing control module into the data driver chip. Another feasible implementation is to integrate the excitation signal module into the data driver chip and the sensing control module into the scan driver chip. In the embodiments of this disclosure, integrating the core circuitry of the touch function into the display driver chip can significantly improve the integration of the entire touch display module, reduce the number of external components, and simplify system design. The integrated solution can reduce the number of chips and the need for external components, thereby reducing the material and manufacturing costs of the entire system. Moreover, since the independent touch control chip and related external components are reduced, the overall size and thickness of the touch display module can be effectively reduced, which is very advantageous for portable devices that pursue thinness and lightness.

[0109] In some other embodiments of this disclosure, the circuit board includes a driver chip for transmitting scan signals to the light-emitting element group and for transmitting data signals to the light-emitting element group; Figure 10 The excitation signal module and the sensing control module shown in the diagram can both be integrated into the same driver chip, thus achieving a high degree of integration of control functions.

[0110] Please refer to Figures 4 to 9In one optional embodiment of this disclosure, the light-emitting package 10 further includes an LED driver chip IC-0, which is located between the substrate 11 and the package layer 13. The LED driver chip IC-0 is electrically connected to the light-emitting element group 12 and is used to provide a driving signal to the light-emitting element group 12.

[0111] This embodiment describes a scheme in which the LED driver chip IC-0 is integrated inside the light-emitting package 10. The LED driver chip IC-0 provides driving signals to the LEDs in the light-emitting element group 12, causing the LEDs to emit light. When both the LED driver chip IC-0 and the light-emitting element group 12 are integrated into the light-emitting package 10, there is no need for an external LED driver circuit, reducing the number of external components and wiring complexity, making the overall display module design simpler and more compact. Furthermore, integrating the LED driver chip IC-0 and the light-emitting element group 12 into the light-emitting package 10 reduces external connection points, lowering the risk of failure due to poor connections. In this integrated configuration, the LED driver chip IC-0 is closer to the LEDs, reducing signal transmission loss and interference, thereby improving system stability. In addition, for each light-emitting package 10, the LED driver chip IC-0 directly controls the LEDs within the package, enabling more precise current and voltage control, thereby improving luminous efficiency, color consistency, and extending the lifespan of the LEDs.

[0112] Considering that the present embodiment integrates a mutual capacitance touch electrode layer 14 on the side of the encapsulation layer 13 away from the substrate 11, it is equivalent to integrating both touch function and display control function into the light-emitting package 10. The highly integrated approach is more conducive to reducing external components, simplifying the overall structure of the display module, and at the same time, it is conducive to realizing fine touch control of the display module.

[0113] The following describes one connection method between the light-emitting package 20 and the circuit board 00 when the LED driver chip IC-0 is integrated into the light-emitting package. Figure 11 The diagram shows a connection schematic of the light-emitting package 10 with the scan signal line 31 and data signal line 32 in the circuit board 00. Please refer to the diagram. Figure 11 In one optional embodiment of this disclosure, the circuit board 00 includes multiple scan signal lines 31 and multiple data signal lines 32. The scan signal lines 31 extend along the second direction D2 and are arranged along the first direction D1, and the data signal lines 32 extend along the first direction D1 and are arranged along the second direction D2. The first direction D1 is the column direction and the second direction D2 is the row direction, or the first direction D1 is the row direction and the second direction D2 is the column direction.

[0114] In a plurality of light-emitting packages 10 located in the same row or column along the first direction D1, each LED driver chip IC-0 is connected to the same data signal line 32; specifically, it is connected to the data signal line 32 through the first pad DI in the conductive pad. In a plurality of light-emitting packages 10 located in the same column or row along the second direction D2, each LED driver chip IC-0 is connected to the same scan signal line 31; specifically, it is connected to the scan signal line 31 through the second pad CK in the conductive pad; wherein, the scan signal line 31 is connected to the scan driver chip, which in this embodiment is manifested as connecting to the signal terminals CK1 to CK6 of the scan driver chip. The data signal line 32 is connected to the data driver chip. It should be noted that this embodiment is described using a circuit board including multiple scan driver chips and multiple data driver chips as an example. In some other embodiments of this disclosure, multiple scan driver chips can also be integrated into a larger scan driver chip, and multiple data driver chips can also be integrated into a larger data driver chip. This disclosure does not specifically limit this.

[0115] Figure 11 The embodiments shown are only examples of the scheme in which the scan signal line 31 extends along the row direction and is arranged along the column direction, and the data signal line 32 extends along the column direction and is arranged along the row direction. However, they are not limited to this. In some other embodiments of this disclosure, the scan signal line 31 may also extend along the column direction and be arranged along the row direction, and the data signal line 32 may also extend along the row direction and be arranged along the column direction.

[0116] In this embodiment, the LED driver chips IC-0 of the LED packages 10 in the same row are connected to the same scan signal line 31, thus eliminating the need to introduce different scan signal lines 31 for different LED packages 10, which helps to reduce the number of scan signal lines 31 on the circuit board 00 and the wiring difficulty. Similarly, the LED driver chips IC-0 in the LED packages 10 in the same column are connected to the same data signal line 32, thus eliminating the need to introduce different data signal lines 32 for different LED packages 10, which helps to reduce the number of data signal lines 32 on the circuit board 00 and the wiring difficulty.

[0117] In this embodiment, the scanning driver chip controls the scanning signal line 31 to activate the light-emitting package 10 row by row or column by column. Simultaneously, the data driver chip sends data signals to the activated light-emitting packages 10 in the activated row or column via the data signal line 32 to control their brightness or color. Thus, the brightness of each light-emitting package 10 can be independently controlled, enabling the display of fine images or patterns. The row-by-row or column-by-column scanning method achieves a high refresh rate, suitable for applications requiring dynamic display. Since each light-emitting package 10 integrates an LED driver chip IC-0, the external scanning driver chip and data driver chip only need to provide control signals, rather than directly providing drive current to each LED, simplifying the design of the external drive circuit. Furthermore, integrating the LED driver chip IC-0 into the light-emitting package 10 allows for more precise control of the LED current, which is beneficial for improving luminous efficiency. Furthermore, since the light-emitting package 10 integrates both touch functionality and light-emitting driving functionality, display modules of different sizes and resolutions can be constructed by changing the number of the light-emitting package 10, the scan signal line 31, and the data signal line 32, thus meeting the display requirements of display modules of different sizes and resolutions.

[0118] It should be noted that, please refer to Figure 8 In addition to the first touch pad RX and the second touch pad TX, the first pad DI and the second pad CK, the conductive pad 15 may also include a power pad VCC and a ground pad GND. The power pad VCC is electrically connected to the light-emitting element group 12. When the light-emitting package integrates an LED driver chip IC-0, the power pad VCC can also be electrically connected to the LED driver chip IC-0. The ground pad GND is used for electrical connection to the LED driver chip IC-0. It should also be noted that... Figure 8 This description uses only an example of a light-emitting package containing six conductive pads, but it is not limited to this. In some other embodiments of this disclosure, some conductive pads can be reused. For example, the first touch pad RX and the second touch pad TX can be time-division multiplexed with the first pad DI and the second pad CK. In this case, the actual number of conductive pads contained in the light-emitting package can be reduced. Figure 12 As shown.

[0119] Please refer to Figure 8 and Figure 9Regardless of whether the LED driver chip IC-0 is integrated in the light-emitting package 10, the first touch electrode layer 14-1 and the second touch electrode layer 14-2 in the mutual capacitance touch electrode layer 14 can be electrically connected to the first touch pad RX and the second touch pad TX in the light-emitting package 10, respectively. The first touch pad RX and the second touch pad TX are further electrically connected to the excitation signal module and the sensing control module on the circuit board 00, thereby realizing the conduction of touch signals. It should be noted that when the LED driver chip IC-0 is integrated in the light-emitting package 10, the functions of the excitation signal module and the sensing control module can also be integrated into the LED driver chip IC-0, so that the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are directly connected to the LED driver chip IC-0 to realize the conduction of touch signals. For example, please refer to Figure 12 and Figure 13 , Figure 12 As shown Figure 2 A planar structural diagram of a single light-emitting package 10. Figure 13 As shown Figure 12 A cross-sectional view of the light-emitting package 10 along the EE direction is shown. In an optional embodiment of this disclosure, the touch electrode layer 50 includes a first touch electrode layer 14-1 and a second touch electrode layer 14-2, both of which are electrically connected to the lamp driver chip IC-0.

[0120] This embodiment illustrates a scheme where, when the LED driver chip IC-0 is integrated into the light-emitting package 10, both the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are directly electrically connected to the LED driver chip IC-0 within the package. The conductive pads of the light-emitting package do not require further first and second touch pads directly connected to the circuit board. This further improves the integration of the light-emitting package 10, integrating display driving and touch control functions into a single chip, reducing the number of external touch chips, thereby lowering system costs, and contributing to a smaller overall size and simplified external circuitry. With this integration method, the touch signal does not need to be separately connected to an external touch controller, eliminating the wiring structure of the original first touch pad RX and second touch pad TX on the circuit board, reducing the complexity of external wiring. In the light-emitting package 10, the direct connection between the LED driver chip IC-0 and the touch electrodes enables faster signal transmission and response, thereby improving touch sensitivity and real-time performance. Furthermore, the determination of whether a touch event has occurred is entirely integrated within a single light-emitting package, independent of other light-emitting packages, reducing interference coupling between different LED driver chips. Furthermore, in this disclosure, the LED driver chip IC-0 with touch control function and the mutual capacitance touch electrode layer 14 are simultaneously integrated in the light-emitting package 10, which is equivalent to reducing the distance between the LED driver chip IC-0 with touch control function and the touch electrode, thus helping to reduce external electromagnetic interference and effectively improve touch reliability.

[0121] Optionally, in actual touch applications, the scan driver chip uses the second pad CK and the first pad DI to send a proprietary protocol to the LED driver chip IC-0 (where the first pad DI acts as an input pad for the LED driver chip IC-0), causing the LED driver chip IC-0 to send high-frequency pulses to the second touch electrode layer 14-2. The scan signal is output by the scan driver chip, and the data signal is output by the data driver chip. The LED driver chip monitors the amplitude of the high-frequency pulse signal from the first touch electrode layer 14-1. If the amplitude attenuates, it indicates a touch event has occurred, and the value of its internal proprietary touch register is set to 1. The scan driver chip and the data driver chip send the proprietary protocol to the LED driver chip through the second pad CK and the first pad DI (where the first pad DI acts as an input pad for the LED driver chip IC-0), read the value of the aforementioned proprietary touch register, and return it to the data driver chip from the first pad DI (where the first pad DI acts as an output pad for the LED driver chip IC-0). This achieves the reading of the touch signal.

[0122] When both the first touch electrode layer 14-1 and the second touch electrode layer 14-2 are electrically connected to the LED driver chip IC-0, in one optional embodiment of this disclosure, the LED driver chip IC-0 may integrate an excitation signal module and a sensing control module, wherein one of the excitation signal module and the sensing control module is electrically connected to the first touch electrode layer 14-1 and the other is electrically connected to the second touch electrode layer 14-2.

[0123] This embodiment integrates the excitation signal module and the sensing control module into the LED driver chip IC-0, achieving a unified display driving and touch control function, greatly simplifying the overall system architecture. By integrating the excitation signal module and sensing control module into the LED driver chip IC-0, this embodiment eliminates the need for a separate touch chip and its associated peripheral circuitry, directly reducing the number of components and thus significantly lowering the overall system cost. By integrating the excitation signal module and sensing control module into the LED driver chip IC-0, the touch signal no longer needs to be connected to an external circuit board via a separate touch pad, eliminating complex external wiring. Simplified wiring not only reduces design and manufacturing difficulty but also reduces potential wiring errors and failure points. Furthermore, the direct electrical connection between the LED driver chip IC-0 and the touch electrode layer greatly shortens the signal transmission path. A shorter path means lower signal delay, resulting in faster touch response.

[0124] When the LED driver chip IC-0 is integrated into the LED package, the excitation signal module and the sensing control module may not be integrated into the LED driver chip IC-0. For example, please refer to... Figure 11 , Figure 6 and Figure 7 The circuit board includes a scan driver chip and a data driver chip connected to the light-emitting package 10. The scan driver chip is used to transmit scan signals to the light-emitting element group, and the data driver chip is used to transmit data signals to the light-emitting element group. The circuit board also includes an excitation signal module and a sensing control module. The excitation signal module is electrically connected to one of the first touch electrode layer 14-1 and the second touch electrode layer 14-2, and the sensing control module is electrically connected to the other of the first touch electrode layer 14-1 and the second touch electrode layer 14-2. One of the excitation signal module and the sensing control module is integrated in the scan driver chip, and the other is integrated in the data driver chip.

[0125] For example, the excitation signal module can be integrated into the scanning driver chip, and the sensing control module can be integrated into the data driver chip. Assuming the first touch electrode layer is the receiving electrode and the second touch electrode layer is the transmitting electrode, the excitation signal module is connected to the second touch electrode layer 14-2 in the light-emitting package via a signal line, and the sensing control module is connected to the first touch electrode layer 14-1 in the light-emitting package via a signal line. This eliminates the need for separate excitation signal and sensing control modules, and the integrated approach helps reduce the number of components in the display module, simplifying its structure.

[0126] Please continue to refer to this. Figure 11 , Figure 6 and Figure 7 When the LED driver chip IC-0 is integrated in the light-emitting package, and the LED driver chip IC-0 does not integrate the excitation signal module and the sensing control module, another feasible implementation of this disclosure is as follows: the circuit board includes an excitation signal module and a sensing control module. The excitation signal module is electrically connected to one of the first touch electrode layer 14-1 and the second touch electrode layer 14-2, and the sensing control module is electrically connected to the other of the first touch electrode layer 14-1 and the second touch electrode layer 14-2. The circuit board includes a driver chip, which is used to transmit scanning signals to the light-emitting element group and to transmit data signals to the light-emitting element group. The excitation signal module and the sensing control module are integrated in the driver chip. This embodiment is equivalent to integrating the scanning driver chip, the data driver chip, the excitation signal module, and the sensing control module into the same driver chip. The driver chip integrates display and touch functions, thereby further improving the overall integration of the display module and also simplifying the structure of the display module.

[0127] The above embodiments illustrate the use of a mutual capacitive structure for the touch electrode layer. The following will describe a scheme where the touch electrode layer has a self-capacitive structure.

[0128] Figure 14 As shown Figure 2 Another planar structure diagram of a single light-emitting package. Figure 15 As shown Figure 14 Please refer to the GG cross-sectional view of a light-emitting package. Figure 14 and Figure 15 Each light-emitting package 10 includes a touch electrode layer 50 comprising at least one self-capacitive electrode structure 51. The self-capacitive electrode structure 51 includes a third touch electrode layer 51-3 and a fourth touch electrode layer 51-4. The third touch electrode layer 51-3 receives excitation and detection signals, and the fourth touch electrode layer 51-4 receives a reference voltage signal. It should be noted that the reference voltage signal here is a constant voltage signal, serving as a stable reference voltage signal to provide a stable path for the electric field; for example, it could be a ground signal. Figure 14 and Figure 15 This embodiment illustrates the situation by assuming that the third touch electrode layer 51-3 and the fourth touch electrode layer 51-4 are disposed in different layers and overlap in a direction perpendicular to the substrate 11. However, this disclosure is not limited to this. In some other embodiments of this disclosure, the third touch electrode layer 51-3 and the fourth touch electrode layer 51-4 can also be disposed in the same layer, with a gap between them. Furthermore, when the third touch electrode layer 51-3 and the fourth touch electrode layer 51-4 are disposed in different layers, they may not overlap in the vertical direction, for example... Figure 16 and Figure 17 As shown. Furthermore, the shapes of the third touch electrode layer 51-3 and the fourth touch electrode layer 51-4 in self-capacitance mode can also be set according to actual conditions, for example, they can be set as follows: Figure 14 The rectangle shown, such as Figure 16 The triangle shown, or set as follows Figure 6 The combination of concave and rectangular shapes shown is not specifically limited in this disclosure. That is, the arrangement of the third touch electrode layer 51-3 and the fourth touch electrode layer 51-4 in self-capacitance mode (the film layers they reside in, their relative positions, and their shapes) is similar to the arrangement of the first touch electrode layer and the second touch electrode layer in mutual capacitance mode. For specific details, please refer to the arrangement of the first and second touch electrode layers in mutual capacitance mode; this embodiment will not repeat the details. Figure 16 As shown Figure 2 Another planar structure diagram of a single light-emitting package. Figure 17 As shown Figure 16 A cross-sectional view of a light-emitting package in the LL direction.

[0129] In the self-capacitive electrode structure 51, the third touch electrode layer 51-3 is used to receive excitation and detection signals. In practical applications, when an excitation signal (usually a high-frequency AC voltage pulse or square wave) is applied to the third touch electrode layer 51-3, current flows between the third touch electrode layer 51-3 and the grounded fourth touch electrode layer 51-4, charging and discharging this reference capacitor. When a user's finger (or any conductive object) touches or approaches the third touch electrode layer 51-3, the human body, as a conductor, forms a new human body capacitance with the third touch electrode layer 51-3. This newly added human body capacitance is connected in parallel with the original reference capacitance. Therefore, the total equivalent capacitance of the third touch electrode layer 51-3 increases. The detection circuit applied to the third touch electrode layer 51-3 monitors the change in the excitation signal caused by the change in total capacitance, thereby realizing the detection of the touch position.

[0130] When a self-capacitive structure is adopted, the third touch electrode layer 51-3 simultaneously undertakes the excitation and detection functions, eliminating the need for additional independent sensing electrodes. Furthermore, the touch function is directly embedded within the light-emitting package, eliminating the need for complex external components such as traditional infrared touch frames. This not only reduces material costs but also simplifies the assembly process, facilitating large-scale production and cost control. Each light-emitting package can be produced in a standardized manner, eliminating the need to customize touch frames according to the display size.

[0131] Please continue to refer to this. Figure 14 and Figure 15 In one optional embodiment of this disclosure, the light-emitting package 10 includes a conductive pad 15, which is located at least in a via on the substrate 11, and the via penetrates the substrate 11 along the thickness direction of the substrate. The conductive pad 15 includes a ground pad GND and a third touch pad X1. The third touch electrode layer 51-3 is electrically connected to the third touch pad X1, and the fourth touch electrode layer 51-4 is electrically connected to the ground pad GND.

[0132] In this embodiment, the fourth touch electrode layer 51-4 is grounded via a ground pad GND, which provides a stable ground reference potential for the fourth touch electrode layer 51-4. The third touch electrode layer 51-3 is connected to the third touch pad X1 and can receive excitation and detection signals through the third touch pad X1. The third touch electrode layer 51-3 is disposed above the package layer 13, and the ground pad GND below the package layer 13 and the third touch pad X1 can be connected to the circuit board below the substrate 11. The pads have good conductivity and can provide a stable and reliable electrical connection. Compared with connections through thin wires, pads and vias generally provide lower resistance and better signal integrity, helping to reduce signal loss and noise.

[0133] Figure 18 The diagram shown is a schematic representation of the connection between the self-capacitive electrode structure and the driver chip in a display module provided in this embodiment. Please refer to the diagram. Figure 14 , Figure 15 and Figure 18 In one optional embodiment of this disclosure, a light-emitting package includes a self-capacitive electrode structure 51; the circuit board includes multiple third signal lines 23. (Please refer to...) Figure 15 and Figure 18 The third touch pads X1 corresponding to different light-emitting packages are electrically connected to different third signal lines 23; the third signal lines 23 are connected to the same driver chip IC.

[0134] In this embodiment, each light-emitting package integrates a self-capacitive structure 51. The third touch electrode layer 51-3 is connected to the third signal line 23 on the circuit board via the third touch pad X1. The fourth touch electrode layer 51-4 is connected to ground via the ground pad GND. The driver chip IC can control each third signal line 23 to sequentially or in groups excite and detect the light-emitting packages connected to these lines. For example, the driver chip IC can send an excitation signal to the first third signal line 23 and read its detection signal, then switch to the second line, and so on. By determining the third signal line 23 currently being excited and detected, and the physical position of the light-emitting package connected to that third signal line 23, the driver chip can accurately locate the position where the touch occurs. When the detection signal on a certain third signal line 23 changes, it indicates that a touch has occurred in the corresponding light-emitting package area. All touch signals are converged to the same driver chip, which means that unified signal amplification, filtering, noise suppression, and touch algorithm processing can be performed. This helps to ensure the consistency of touch performance across the entire display screen. It should be noted that... Figure 18 The driver chip IC in the illustrated embodiment can be a dedicated touch driver chip, or it can be integrated with other structures. For example, it can be integrated with at least one of the scan driver chip and data driver chip mentioned in the foregoing embodiments. Alternatively, when the scan driver chip and data driver chip are integrated into the same integrated chip, the aforementioned driver IC can also be integrated with that integrated chip. This will be described in detail in subsequent embodiments.

[0135] Figure 19 The diagram shown illustrates another connection between the self-capacitive electrode structure and the driver chip in the display module provided in this embodiment. Please refer to [the diagram]. Figure 14 , Figure 15 and Figure 19 In one optional embodiment of this disclosure, a light-emitting package includes a self-contained electrode structure 51; the circuit board includes a fourth signal line 24 and a fifth signal line 25, the fourth signal line 24 extending along the row direction and the fifth signal line 25 extending along the column direction. The display panel includes multiple rows of light-emitting packages 10. In any two adjacent rows of light-emitting packages 10, in one row of light-emitting packages 10, the third touch pad X1 corresponding to the odd-numbered light-emitting package 10 is electrically connected to the fourth signal line 24, and the third touch pad X1 corresponding to the even-numbered light-emitting package 10 is electrically connected to the fifth signal line 25; in the other row of light-emitting packages 10, the third touch pad X1 corresponding to the odd-numbered light-emitting package 10 is electrically connected to the fifth signal line 25, and the third touch pad X1 corresponding to the even-numbered light-emitting package 10 is electrically connected to the fourth signal line 24; the fourth signal line 24 and the fifth signal line 25 are respectively connected to different driver chips (e.g., Figure 17(The fourth signal line 24 is connected to driver chip IC-1, and the fifth signal line 25 is connected to driver chip IC-2), or the fourth signal line 24 and the fifth signal line 25 are connected to the same driver chip.

[0136] In this embodiment, by combining the fourth signal line 24 extending in the row direction and the fifth signal line 25 extending in the column direction, as well as the cross connection of odd and even rows / columns, each light-emitting package can be addressed more precisely. When a touch occurs, the driver chip can simultaneously sense the corresponding signal changes in the row and column directions, thereby accurately locking the touch point. This row / column cross combination scheme, through independent row and column signal detection, can more effectively distinguish multiple simultaneous touch points, thereby achieving more reliable multi-touch. When the fourth signal line 24 and the fifth signal line 25 are connected to different driver chips, it is beneficial to achieve stronger parallel processing capabilities. When the fourth signal line 24 and the fifth signal line 25 are connected to the same driver chip, the number of driver chips can be reduced, and production costs can be lowered.

[0137] Alternatively, please refer to Figure 11 The circuit board includes a scan driver chip and a data driver chip connected to the light-emitting package. The scan driver chip transmits scan signals to the light-emitting element group, and the data driver chip transmits data signals to the light-emitting element group. Figure 19 In the embodiment, when the fourth signal line 24 and the fifth signal line 25 are connected to different driver chips, the driver chip IC-1 connected to the fourth signal line 24 can be integrated into the scan driver chip, and the driver chip IC-2 connected to the fifth signal line 25 can be integrated into the data driver chip. In this way, there is no need to set up separate driver chips connected to the fourth signal line 24 and the fifth signal line 25. The integrated setting method helps to reduce the number of components in the display module and simplify the structure of the display module.

[0138] In some other embodiments of this disclosure, when the scanning driver chip and the data driver chip are integrated into the same driver chip, the driver chip connected to the fourth signal line 24 and the fifth signal line 25 can also be integrated into the aforementioned driver chip. That is, display function and touch function are integrated into the same driver chip, thereby further improving the overall integration of the display module and also helping to simplify the structure of the display module. Of course, in some other embodiments of this disclosure, the driver chip connected to the fourth signal line 24 and the fifth signal line 25 can also be an independently set driver chip dedicated to touch control, and this disclosure does not specifically limit this.

[0139] When the touch electrode layer is a self-capacitive electrode structure, the foregoing embodiments have described a scheme in which a light-emitting package includes one self-capacitive electrode structure 51. In another optional embodiment of this disclosure, the touch electrode layer 50 in a light-emitting package 10 includes two self-capacitive electrode structures 51. Figure 20 As shown Figure 2 A planar structural diagram of a single light-emitting package 10. Figure 21 As shown Figure 20 A cross-sectional view of the light-emitting package in the HH direction; please refer to... Figure 20 and Figure 21 The two self-capacitive electrode structures 51 are a first self-capacitive electrode structure 51-1 and a second self-capacitive electrode structure 51-2, respectively. Both the first self-capacitive electrode structure 51-1 and the second self-capacitive electrode structure 51-2 include a third touch electrode layer 51-3 and a fourth touch electrode layer 51-4. The third touch electrode layer 51-3 in the first self-capacitive electrode structure 51-1 receives row excitation signals and row detection signals; the third touch electrode layer 51-3 in the second self-capacitive electrode structure 51-2 receives column excitation signals and column detection signals. It should be noted that... Figure 20 This is one example of two self-capacitive electrode structures 51 in the touch electrode layer 50 of the light-emitting package 10. In other embodiments, the fourth touch electrode layer in the first self-capacitive electrode structure 51-1 and the fourth touch electrode layer in the second self-capacitive electrode structure 51-2 can be shared, that is, the fourth touch electrode layer GND in the first self-capacitive electrode structure 51-1 and the fourth touch electrode layer GND in the second self-capacitive electrode structure 51-2 can be shared.

[0140] In this embodiment, when two self-capacitive electrode structures are integrated within the same light-emitting package 10, the third touch electrode layer 51-3 in the first self-capacitive electrode structure 51-1 is dedicated to receiving row excitation signals and row detection signals, while the third touch electrode layer 51-3 in the second self-capacitive electrode structure 51-2 is dedicated to receiving column excitation signals and column detection signals. Thus, independent and orthogonal row and column sensing capabilities are integrated within a single light-emitting package. When a touch occurs, this light-emitting package can simultaneously and independently sense capacitance changes in both the row and column directions; that is, each light-emitting package can simultaneously acquire independent capacitance change data in both the row and column directions. This inherent two-dimensional sensing capability makes touch point positioning more direct and accurate. In traditional display modules, most capacitive touchscreens physically only support two-point touch well. The embodiments disclosed herein integrate a dual self-capacitive structure in a single light-emitting package. As long as a sufficient number of light-emitting packages are touched simultaneously, and each touched light-emitting package can independently report its touch event, the system can identify and track multiple or even dozens of simultaneous touch points, achieving a true multi-touch experience.

[0141] Figure 22 The diagram shown illustrates one possible connection between the first self-capacitive electrode structure 51-1, the second self-capacitive electrode structure 51-2, and the driver chip. Please refer to the diagram. Figure 20 , Figure 21 and Figure 22 In one optional embodiment of this disclosure, the circuit board includes multiple fourth signal lines 24 and multiple fifth signal lines 25. The fourth signal lines 24 extend along the row direction, and the fifth signal lines 25 extend along the column direction. In the light-emitting packages 10 located in the same row, the third touch electrode layer 51-3 in the first self-capacitive electrode structure 51-1 is connected to the same fourth signal line 24. In the light-emitting packages 10 located in the same column, the third touch electrode layer 51-3 in the second self-capacitive electrode structure 51-2 is connected to the same fifth signal line 25. The fourth signal lines 24 and fifth signal lines 25 are respectively connected to different driver chips, or the fourth signal lines and fifth signal lines are connected to the same driver chip. This embodiment uses the example of the fourth signal line 24 being connected to driver chip IC-1 and the fifth signal line 25 being connected to driver chip IC-2 for illustration. In some other embodiments of this disclosure, the fourth signal line 24 and the fifth signal line 25 may also be connected to the same driver chip.

[0142] Please combine Figure 11 and Figure 22 The circuit board includes a scan driver chip and a data driver chip connected to the light-emitting package. The scan driver chip transmits scan signals to the light-emitting element group, and the data driver chip transmits data signals to the light-emitting element group. Figure 22 In the embodiment, when the fourth signal line 24 and the fifth signal line 25 are connected to different driver chips, the driver chip IC-1 connected to the fourth signal line 24 can be integrated into the scan driver chip, and the driver chip IC-2 connected to the fifth signal line 25 can be integrated into the data driver chip. In this way, there is no need to set up separate driver chips connected to the fourth signal line 24 and the fifth signal line 25. The integrated setting method helps to reduce the number of components in the display module and simplify the structure of the display module.

[0143] In some other embodiments of this disclosure, when the scanning driver chip and the data driver chip are integrated into the same driver chip, driver chips IC1 and IC2 connected to the fourth signal line 24 and the fifth signal line 25 can also be integrated into the aforementioned driver chip. That is, display function and touch function are integrated in the same driver chip, thereby further improving the overall integration of the display module and also helping to simplify the structure of the display module. Of course, in some other embodiments of this disclosure, the driver chip connected to the fourth signal line 24 and the fifth signal line 25 can also be an independently set driver chip dedicated to touch control, and this disclosure does not specifically limit this.

[0144] In this embodiment, touch points on the screen are accurately identified through independent row and column scans. For example, when the driver chip activates a fourth signal line 24, the first self-capacitive electrode structure 51-1 of all light-emitting packages in that row is activated. Simultaneously, when the driver chip activates a fifth signal line 25, the second self-capacitive electrode structure 51-2 of all light-emitting packages in that column is activated. By monitoring feedback signals from all fourth signal lines 24 and fifth signal lines 25, the driver chip can construct a complete touch mapping structure. In this embodiment, each light-emitting package has independent row and column sensing capabilities. This means that when a touch occurs, the light-emitting package can independently report its capacitance changes in the row and column directions. The system no longer needs to "infer" the position of the touch point through the intersection of external row and column lines, but directly obtains accurate two-dimensional coordinate information from the touched light-emitting package. The system can accurately identify and track multiple simultaneously occurring touch points, achieving multi-touch.

[0145] If the fourth signal line 24 and the fifth signal line 25 are connected to different driver chips, true parallel scanning and data acquisition can be achieved. Row and column signals can be processed simultaneously, significantly accelerating touch response speed, which is crucial for large-size, high-refresh-rate displays. When the fourth signal line 24 and the fifth signal line 25 are connected to the same driver chip, the number of driver chips can be reduced, simplifying the overall structure. Even when the fourth signal line 24 and the fifth signal line 25 are connected to the same driver chip, the clear separation of signal paths (row data and column data) allows the driver chip to manage and process data more efficiently, avoiding complex interleaved scanning logic.

[0146] It should be noted that when the touch electrode layer adopts a self-capacitive touch electrode structure, the LED driver chip may or may not be integrated into the light-emitting package. The following will describe an embodiment with an integrated LED driver chip.

[0147] Figure 23 As shown Figure 2 Another planar structure diagram of a single light-emitting package. Figure 24 As shown Figure 23 Please refer to a cross-sectional view of the light-emitting package in direction II. Figure 23 and Figure 24In one optional embodiment of this disclosure, the light-emitting package 10 further includes an LED driver chip IC-0, which is located between the substrate 11 and the package layer 13. The LED driver chip IC-0 is electrically connected to the light-emitting element group and is used to provide driving signals to the light-emitting element group. The third touch electrode layer 51-3 is electrically connected to the LED driver chip IC-0, specifically through a connection hole K0. The LED driver chip IC-0 is also used to transmit excitation signals and detection signals to the third touch electrode layer 51-3.

[0148] In this embodiment, the LED driver chip IC-0 combines display driving and touch driving functions. This significantly reduces the number of chips required for a single LED package. Integrating some touch signal processing functions into the existing LED driver chip IC-0 avoids the need for additional independent touch chips, thereby maximizing the miniaturization of each LED package, which is crucial for achieving high-density, small-pixel-pitch LED displays. Furthermore, the third touch electrode layer 51-3 is directly electrically connected to the LED driver chip IC-0, shortening the signal path and resulting in extremely short transmission distances for excitation and detection signals. This simplifies the wiring complexity within the LED package, helps minimize signal attenuation and external noise interference, and ensures the original accuracy and integrity of the touch signal.

[0149] When the LED driver chip IC-0 is integrated into the LED package, the LED driver chip may not integrate touch functionality. For example, please refer to [reference needed]. Figure 14 , Figure 15 , Figure 18 , Figure 19 and Figure 22 In one optional embodiment of this disclosure, the light-emitting package 10 further includes an LED driver chip IC-0, which is located between the substrate 11 and the package layer 13. The LED driver chip IC-0 is electrically connected to the light-emitting element group and is used to provide driving signals to the light-emitting element group. The display module also includes a driver chip, which is connected to the light-emitting package and is used to transmit excitation signals and detection signals to the third touch electrode layer.

[0150] Please combine Figure 11 The circuit board 00 includes a scan driver chip and a data driver chip connected to the light-emitting package. The scan driver chip is used to transmit scan signals to the light-emitting element group, and the data driver chip is used to transmit data signals to the light-emitting element group. In this embodiment, the driver chip with touch function is independent of the scan driver chip and the data driver chip, or the driver chip with touch function is integrated into the scan driver chip and / or the data driver chip.

[0151] When the LED driver chip in the LED package does not integrate touch functionality, a driver chip with touch functionality can be placed on a circuit board surrounding the LED package. This driver chip transmits excitation and detection signals to the third touch electrode layer. The circuit board is equipped with a scanning driver chip and a data driver chip for driving the LED array in the LED package to emit light. In this case, the driver chip for touch functionality can be set independently of the scanning driver chip and the data driver chip, making display and touch physically separated at the chip level.

[0152] Of course, an integrated approach can also be used, for example, when the light-emitting encapsulation is manifested as Figure 19 or Figure 22 In the connection scheme, the touch-enabled driver chip IC-1 can be integrated into the scan driver chip, and the touch-enabled driver chip IC-2 can be integrated into the data driver chip. Integrating multiple functions into fewer chips can reduce the number of chips in the display module and lower costs. Of course, in some other embodiments of this disclosure, the scan driver chip and the data driver chip can also be integrated into the same integrated chip. In this case, driver chip IC-1 and driver chip IC-2 can be integrated into the same integrated chip as the scan driver chip and the data driver chip.

[0153] It should be noted that the foregoing embodiments only illustrate a scheme in which one light-emitting element group 12 is integrated in a light-emitting package 10. In some other embodiments of this disclosure, multiple light-emitting element groups 12 may also be integrated in the light-emitting package 10. For example, please refer to... Figure 25 , Figure 25 As shown Figure 2 Another planar structural diagram of a single light-emitting package 10 is shown in this embodiment. This example illustrates a package 10 integrating four light-emitting element groups 12, each group including three light-emitting diodes (LEDs). When a lamp driver chip IC-0 is also integrated, the LEDs in each light-emitting element group 12 can be electrically connected to the same lamp driver chip IC-0, and these LEDs are driven to emit light by the same chip. Thus, by increasing the number of light-emitting element groups carried by the lamp driver chip, the actual number of lamp driver chips included in the display module is reduced, which helps to reduce production costs. It should be noted that... Figure 25 The example shown is an illustration of the structure of the light-emitting element group in the mutual capacitance mode of the touch structure. The structure of the light-emitting element group in the self-capacitance mode is different. Figure 25 They are the same, the only difference being the touch structure. For an explanation and description of the touch structure, please refer to the aforementioned descriptions; they will not be repeated here. For example, you can... Figure 14 and Figure 16In the corresponding embodiment, the number of light-emitting element groups 12 is increased so that there are multiple light-emitting element groups 12 in the light-emitting package in self-capacitance mode. The touch driving method will not change due to the change in the number of light-emitting element groups 12.

[0154] The above embodiments illustrate a scheme in which the LED driver chip IC-0 is integrated in the light-emitting package 10. However, this disclosure is not limited to this. In some other embodiments of this disclosure, the LED driver chip IC-0 may not be integrated in the light-emitting package 10. For example, please refer to [reference needed]. Figure 26 and Figure 27 , Figure 26 As shown Figure 2 Another planar structure diagram of a single light-emitting package 10. Figure 27 As shown Figure 26 A cross-sectional view of the light-emitting package 10 along the FF direction is shown in this embodiment. This example uses a mutual capacitance structure for the touch electrode layer, but the same applies to self-capacitance structures. The light-emitting package 10 integrates a light-emitting element group 12, a package layer 13, and a touch electrode layer 50. In other words, during the fabrication of the light-emitting package 10, at least two light-emitting diodes (LEDs) for display and a touch electrode layer 50 for touch functionality are integrated into the package. This allows for the integration of the touch electrode layer within a small-sized package 10, eliminating the need to fabricate a large-sized touch structure in a large-sized display module, thus simplifying the manufacturing process. Furthermore, the light-emitting package 10 in this embodiment is applicable to display modules of different sizes and resolutions, offering a wide range of applications. In this embodiment, the conductive pads 15 also include data transmission pads R, G, and B, which are used to transmit display data signals to the three light-emitting elements D, respectively. It should be noted that the power pad VCC included in the conductive pads in this embodiment can be replaced with a ground pad GND as needed; this disclosure does not specifically limit this. It should be noted that, Figure 26 and Figure 27 This example illustrates the structure of the light-emitting package 10 in self-capacitive mode, using a touch-sensitive structure in mutual capacitance mode without an LED driver chip. Figure 26 and Figure 27 They are the same, the only difference being the touch structure. For an explanation and description of the touch structure, please refer to the aforementioned descriptions; it will not be repeated here. Furthermore, Figure 26This explanation uses only one example of a light-emitting package 10 containing one light-emitting element group 12, but this disclosure is not limited to this. Even when the light-emitting package does not integrate a lamp driver chip, it can still integrate two or more light-emitting element groups 12. Furthermore, the accompanying drawings of this disclosure illustrate one light-emitting element group 12 corresponding to three light-emitting elements, but this disclosure is not limited to this. In some other embodiments of this disclosure, one light-emitting element group 12 may also include only one light-emitting element. A light-emitting package containing only one such light-emitting element group is equivalent to a light-emitting package containing only one light-emitting element. For self-capacitive and mutual-capacitive light-emitting packages, the number of light-emitting element groups and the number of light-emitting elements contained in each group can be set according to actual conditions, and this disclosure does not limit this.

[0155] When the LED driver chip IC-0 is not integrated in the light-emitting package 10, the light-emitting diodes (LEDs) in the light-emitting package 10 can be driven to emit light by the scanning driver chip and the data driver chip. For specific driving methods, please refer to relevant technologies. This disclosure does not make specific limitations on this.

[0156] Figure 28 As shown Figure 2 Please refer to another AA-axis cross-sectional view of the display module. Figure 28 In one optional embodiment of this disclosure, the display module further includes a protective layer 40, which is located on the side of the light-emitting package 10 away from the circuit board 00, and at least a portion of the protective layer 40 fills the space between adjacent light-emitting packages 10.

[0157] The display module in this embodiment includes multiple light-emitting packages 10. When a protective layer 40 is introduced on the side of the light-emitting package 10 facing away from the circuit board 00, the protective layer 40 can form a flattened surface on the display surface of the display module, reducing the roughness caused by the edges and gaps of the discrete light-emitting packages 10 directly perceived by the finger when touching, thereby improving the smoothness and uniformity of the touch experience. Moreover, the protective layer 40 can provide additional physical protection for the light-emitting packages 10, preventing direct damage from scratches, dust, moisture, etc. The protective layer 40 can be made of transparent materials such as epoxy resin and silicone, and integrated into the display module through processes such as coating. The protective layer 40 filled between the light-emitting packages 10 can enhance the structural strength and stability of the entire display module. Optionally, the protective layer 40 can be doped with diffuse reflection particles, so that the protective layer 40 has diffuse reflection characteristics, which can help mix the light emitted by adjacent light-emitting packages 10, reduce the black border effect between pixels, and improve the overall display uniformity and visual comfort.

[0158] Based on the same inventive concept, this disclosure also provides a display device. Figure 29The diagram shown is a structural schematic of a display device 200 provided in an embodiment of this disclosure. Please refer to it. Figure 29 The display device 200 includes at least two display modules 100 as mentioned in any of the foregoing embodiments. Thus, by combining display modules of different numbers and sizes, display devices of various sizes and shapes can be constructed, offering high flexibility and scalability to meet the needs of different application scenarios. Each display module 100 can be considered an independent unit, facilitating production, transportation, installation, and maintenance. A failure in a single display module will not cause the entire display device to malfunction, and replacement is relatively convenient. For ultra-large display devices, modular splicing may be more economical and efficient than manufacturing a single large panel, especially in terms of yield control and transportation.

[0159] The display device provided in this disclosure also has the same or corresponding technical effects as the display module mentioned in the foregoing embodiments, and this disclosure will not repeat them here.

[0160] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0161] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that, include: A circuit board and a plurality of light-emitting packages disposed on the circuit board; wherein the light-emitting packages include: A substrate and at least one light-emitting element group disposed on the side of the substrate opposite to the circuit board, the light-emitting element group including at least one light-emitting diode; An encapsulation layer is located on the side of the light-emitting element group that faces away from the substrate and covers the light-emitting element group; The touch electrode layer is located on the side of the encapsulation layer opposite to the substrate, and the touch electrode layer is a capacitive touch electrode layer.

2. The display module according to claim 1, characterized in that, The touch electrode layer includes a first touch electrode layer and a second touch electrode layer, and there is a coupling capacitance between the first touch electrode layer and the second touch electrode layer.

3. The display module according to claim 2, characterized in that, The first touch electrode layer and the second touch electrode layer are disposed in the same layer, and there is a first gap between the first touch electrode layer and the second touch electrode layer.

4. The display module according to claim 2, characterized in that, The first touch electrode layer and the second touch electrode layer are located in different film layers. Along the direction parallel to the plane where the substrate is located, the first touch electrode layer and the second touch electrode layer have a second gap. Along the direction perpendicular to the plane where the substrate is located, the first touch electrode layer and the second touch electrode layer do not overlap.

5. The display module according to claim 2, characterized in that, The first touch electrode layer and the second touch electrode layer are located in different film layers and overlap along a direction perpendicular to the plane of the substrate.

6. The display module according to claim 2, characterized in that, The light-emitting package includes conductive pads, which are located at least in vias on the substrate and penetrate the substrate along its thickness direction; the light-emitting package is electrically connected to the circuit board via the conductive pads. The conductive pads include a first touch pad and a second touch pad. The first touch electrode layer is electrically connected to the first touch pad through a first connection hole that penetrates at least through the encapsulation layer. The second touch electrode layer is electrically connected to the second touch pad through a second connection hole that penetrates at least through the encapsulation layer.

7. The display module according to claim 6, characterized in that, The circuit board includes multiple first signal lines and multiple second signal lines. The first signal lines extend along a first direction and are arranged along a second direction, and the second signal lines extend along a second direction and are arranged along a first direction. The first direction is a row direction and the second direction is a column direction; or the first direction is a column direction and the second direction is a row direction. In a plurality of light-emitting packages located in the same row or column along a first direction, each of the first touch pads is connected to the same first signal line; In a plurality of light-emitting packages located in the same column or row along the second direction, each of the second touch pads is connected to the same second signal line; One of the first signal line and the second signal line is connected to the excitation signal module, and the other is connected to the sensing control module.

8. The display module according to claim 7, characterized in that, The circuit board includes a scan driver chip and a data driver chip connected to the light-emitting package, wherein the scan driver chip is used to transmit scan signals to the light-emitting element group, and the data driver chip is used to transmit data signals to the light-emitting element group; One of the excitation signal module and the sensing control module is integrated into the scanning driver chip, and the other is integrated into the data driver chip.

9. The display module according to claim 7, characterized in that, The circuit board includes a driver chip, which is used to transmit scanning signals to the light-emitting element group and to transmit data signals to the light-emitting element group; the excitation signal module and the sensing control module are integrated in the driver chip.

10. The display module according to claim 2, characterized in that, The light-emitting package also includes an LED driver chip, which is located between the substrate and the packaging layer; the LED driver chip is electrically connected to the light-emitting element group and is used to provide a driving signal to the light-emitting element group.

11. The display module according to claim 10, characterized in that, Both the first touch electrode layer and the second touch electrode layer are electrically connected to the LED driver chip. The LED driver chip integrates an excitation signal module and a sensing control module. One of the excitation signal module and the sensing control module is electrically connected to the first touch electrode layer, and the other is electrically connected to the second touch electrode layer.

12. The display module according to claim 10, characterized in that, The circuit board includes a scan driver chip and a data driver chip connected to the light-emitting package, wherein the scan driver chip is used to transmit scan signals to the light-emitting element group, and the data driver chip is used to transmit data signals to the light-emitting element group; The circuit board further includes an excitation signal module and a sensing control module. The excitation signal module is electrically connected to one of the first touch electrode layer and the second touch electrode layer, and the sensing control module is electrically connected to the other of the first touch electrode layer and the second touch electrode layer. One of the excitation signal module and the sensing control module is integrated into the scanning driver chip, and the other is integrated into the data driver chip.

13. The display module according to claim 10, characterized in that, The circuit board includes an excitation signal module and a sensing control module. The excitation signal module is electrically connected to one of the first touch electrode layer and the second touch electrode layer, and the sensing control module is electrically connected to the other of the first touch electrode layer and the second touch electrode layer. The circuit board includes a driver chip, which is used to transmit scanning signals to the light-emitting element group and to transmit data signals to the light-emitting element group; the excitation signal module and the sensing control module are integrated in the driver chip.

14. The display module according to claim 1, characterized in that, The touch electrode layer corresponding to one of the light-emitting packages includes at least one self-capacitive electrode structure; The self-capacitive electrode structure includes a third touch electrode layer and a fourth touch electrode layer. The third touch electrode layer receives an excitation signal and a detection signal, and the fourth touch electrode layer receives a reference voltage signal.

15. The display module according to claim 14, characterized in that, The light-emitting package includes conductive pads, which are located at least in vias on the substrate and penetrate the substrate along its thickness direction. The conductive pads include a ground pad and a third touch pad. The third touch electrode layer is electrically connected to the third touch pad, and the fourth touch electrode layer is electrically connected to the ground pad.

16. The display module according to claim 15, characterized in that, One of the light-emitting packages includes one of the self-contained electrode structures; The circuit board includes multiple third signal lines, and the third touch pads corresponding to different light-emitting packages are electrically connected to different third signal lines; the third signal lines are connected to the same driver chip.

17. The display module according to claim 15, characterized in that, One of the light-emitting packages includes one of the self-contained electrode structures; The circuit board includes a fourth signal line and a fifth signal line, the fourth signal line extending along the row direction and the fifth signal line extending along the column direction; The display panel includes multiple rows of the aforementioned light-emitting packages. In any two adjacent rows of light-emitting packages, within one row, the third touch pad corresponding to the odd-numbered light-emitting package is electrically connected to the fourth signal line, and the third touch pad corresponding to the even-numbered light-emitting package is electrically connected to the fifth signal line; within the other row of light-emitting packages, the third touch pad corresponding to the odd-numbered light-emitting package is electrically connected to the fifth signal line, and the third touch pad corresponding to the even-numbered light-emitting package is electrically connected to the fourth signal line. The fourth signal line and the fifth signal line are respectively connected to different driver chips, or the fourth signal line and the fifth signal line are connected to the same driver chip.

18. The display module according to claim 15, characterized in that, A light-emitting package includes two self-capacitive electrode structures, which are a first self-capacitive electrode structure and a second self-capacitive electrode structure, wherein both the first self-capacitive electrode structure and the second self-capacitive electrode structure include the third touch electrode layer and the fourth touch electrode layer. The third touch electrode layer in the first self-capacitive electrode structure receives a row excitation signal and a row detection signal; the third touch electrode layer in the second self-capacitive electrode structure receives a column excitation signal and a column detection signal.

19. The display module according to claim 18, characterized in that, The circuit board includes multiple fourth signal lines and multiple fifth signal lines, wherein the fourth signal lines extend along the row direction and the fifth signal lines extend along the column direction; In the light-emitting packages located in the same row, the third touch electrode layer in the first self-capacitive electrode structure is connected to the same fourth signal line; in the light-emitting packages located in the same column, the third touch electrode layer in the second self-capacitive electrode structure is connected to the same fifth signal line. The fourth signal line and the fifth signal line are respectively connected to different driver chips, or the fourth signal line and the fifth signal line are connected to the same driver chip.

20. The display module according to claim 14, characterized in that, The light-emitting package further includes an LED driver chip, which is located between the substrate and the packaging layer; the LED driver chip is electrically connected to the light-emitting element group and is used to provide a driving signal to the light-emitting element group; The third touch electrode layer is electrically connected to the lamp driver chip, and the lamp driver chip is also used to transmit excitation signals and detection signals to the third touch electrode layer.

21. The display module according to claim 14, characterized in that, The light-emitting package further includes an LED driver chip, which is located between the substrate and the packaging layer; the LED driver chip is electrically connected to the light-emitting element group and is used to provide a driving signal to the light-emitting element group; The display module also includes a driver chip, which is connected to the light-emitting package and is used to transmit excitation signals and detection signals to the third touch electrode layer. The circuit board includes a scan driver chip and a data driver chip connected to the light-emitting package, wherein the scan driver chip is used to transmit scan signals to the light-emitting element group, and the data driver chip is used to transmit data signals to the light-emitting element group; The driver chip is independent of the scan driver chip and the data driver chip, or the driver chip is integrated into the scan driver chip and / or the data driver chip.

22. A display device, characterized in that, It includes at least two display modules as described in any one of claims 1 to 21.

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