Wafer rotation fixing mechanism

Abstract

The utility model discloses a wafer rotation fixed establishment, including bottom plate, the bottom plate upper end surface four corners all are established with fixed hole, the bottom plate upper end surface is equipped with vacuum pump, vacuum pipe is equipped with vacuum pump upper end connection, the vacuum pipe upper end is equipped with the suction pipe that rotates, the suction pipe upper end is equipped with the suction seat, the suction seat upper end surface is equipped with the suction hole, the suction hole is equipped with a plurality, the suction seat outer end surface all is equipped with the support seat around, a plurality of support seat bottom all are embedded and are equipped with the ball, the bottom plate upper corresponds a plurality of support seat and is equipped with the guide mechanism, the bottom plate upper end surface is equipped with the drive motor, drive shaft is equipped with drive motor upper end connection, drive shaft and the suction pipe between are equipped with transmission mechanism, through the design of suction pipe and suction seat, the convenient stable installation is avoided physical clamping and leads to wafer damage, and the convenient safety adsorption.

Description

Technical Field

[0001] This utility model relates to the field of wafer technology, and more specifically, to a wafer rotation and fixing mechanism. Background Technology

[0002] A wafer, also called a substrate, is a substrate used to manufacture semiconductor transistors or integrated circuits. Wafer rotation and fixing mechanisms are key equipment in semiconductor manufacturing, optical coating, and other processes. They are used to achieve high-precision rotation, positioning, and stable clamping of wafers during processing. Existing wafer rotation and fixing mechanisms achieve wafer fixing and installation through physical clamping, which makes the wafer susceptible to damage. They lack suitable safety adsorption mechanisms, and the commonly used mounting limit mechanisms are prone to loosening during high-speed rotation. They also lack suitable stable limit mechanisms. In addition, the overall stability of the device during rotation is poor, and there is a lack of suitable reinforcing guide mechanisms. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] To address the problems existing in the prior art, this utility model provides a wafer rotation and fixing mechanism to solve the technical problems mentioned in the background art, such as the wafer being easily damaged by physical clamping and the lack of a suitable safe adsorption mechanism.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, this utility model provides the following technical solution: a wafer rotation and fixing mechanism, comprising a base plate, fixing holes at the four corners of the upper surface of the base plate, a vacuum pump on the upper surface of the base plate, a vacuum tube connected to the upper end of the vacuum pump, a suction pipe rotatably connected to the upper end of the vacuum tube, a suction seat on the upper end of the suction pipe, suction holes on the upper surface of the suction seat, and multiple suction holes, support seats on all four sides of the outer end face of the suction seat, ball bearings embedded at the bottom of the multiple support seats, a guide mechanism on the base plate corresponding to the multiple support seats, a drive motor on the upper surface of the base plate, a drive shaft connected to the upper end of the drive motor, and a transmission mechanism between the drive shaft and the suction pipe.

[0007] The present invention is further configured such that a limiting seat is detachably provided on the upper end face of the suction seat, and multiple limiting seats are provided, with different models of inner grooves in the multiple limiting seats, which facilitates the initial installation and limiting of wafers of different models.

[0008] The present invention is further configured such that each of the four corners of the lower end face of the plurality of limiting seats is provided with a positioning rod, and each of the suction seats is provided with a positioning hole corresponding to the plurality of positioning rods, thereby achieving positioning of the limiting seats during installation.

[0009] The present invention is further configured such that each of the outer end faces of the plurality of positioning rods is provided with a positioning ring, and the positioning ring and the positioning rod are threadedly connected to achieve installation and locking.

[0010] The present invention is further configured such that the guiding mechanism includes a guide seat and a connecting rod, the guide seat is provided with a plurality of support seats and ball bearings, and a plurality of connecting rods are provided, all of which are connected between the base plate and the guide seat to achieve stable guidance for the rotational support.

[0011] The present invention is further configured such that a limiting ring is provided on the support base, and limiting grooves are provided on the inner and outer sides of the guide base corresponding to the limiting ring, thereby further improving stability.

[0012] The present invention is further configured such that the transmission mechanism includes a first gear and a second gear, the first gear is mounted on the drive shaft, and the second gear is mounted on the intake pipe, the first gear and the second gear being meshed to achieve stable transmission.

[0013] (III) Beneficial Effects

[0014] Compared with the prior art, the present invention provides a wafer rotation and fixing mechanism, which has the following advantages:

[0015] 1. Through the design of the suction tube and suction base, the suction tube is rotated relative to the vacuum tube, and the suction hole on the suction base achieves vacuum adsorption of the installed wafer, which facilitates stable installation, avoids damage to the wafer caused by physical clamping, and facilitates safe adsorption.

[0016] 2. Through the design of the limiting seat, the positioning rod of the limiting seat is installed and positioned corresponding to the positioning hole of the suction seat. According to the processing needs, a limiting seat with an appropriate inner groove size is selected for installation, which further limits the wafer installation, facilitates stable positioning, and ensures installation safety.

[0017] 3. Through the design of the support seat, the limiting ring of the support seat and the limiting ring of the guide seat cooperate, and the support seat with ball bearings rotates relative to the guide seat, thereby guiding the overall rotation of the intake seat and improving the overall rotational stability. Attached Figure Description

[0018] Figure 1 A schematic diagram of a preferred overall structure of a wafer rotation and fixing mechanism;

[0019] Figure 2 A schematic diagram of the overall structure of a preferred wafer rotation and fixing mechanism without the installation of a finite position seat;

[0020] Figure 3 A schematic diagram of a preferred structure for a wafer rotation and fixing mechanism, including a suction pipe, suction seat, support seat, and ball bearing assembly.

[0021] Figure 4 A schematic diagram of a preferred matching structure of a limiting seat and a positioning rod for a wafer rotation and fixing mechanism;

[0022] Figure 5 This is a cross-sectional view of the internal structure of a preferred guide seat for a wafer rotation and fixing mechanism.

[0023] In the diagram: 1. Base plate; 2. Fixing hole; 3. Vacuum pump; 4. Vacuum tube; 5. Suction tube; 6. Suction seat; 7. Suction hole; 8. Support seat; 9. Ball bearing; 10. Drive motor; 11. Drive shaft; 12. Limit seat; 13. Positioning rod; 14. Positioning hole; 15. Positioning ring; 16. Guide seat; 17. Connecting rod; 18. Limiting ring; 19. Limiting groove; 20. First gear; 21. Second gear. Detailed Implementation

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0026] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0027] Please see Figures 1-3 A wafer rotation and fixing mechanism includes a base plate 1, with fixing holes 2 at the four corners of the upper surface of the base plate 1, a vacuum pump 3 on the upper surface of the base plate 1, a vacuum tube 4 connected to the upper end of the vacuum pump 3, a suction pipe 5 rotatably connected to the upper end of the vacuum tube 4, a suction seat 6 on the upper end of the suction pipe 5, suction holes 7 on the upper surface of the suction seat 6, and multiple suction holes 7. Support seats 8 are provided around the outer surface of the suction seat 6, and ball bearings 9 are embedded at the bottom of the multiple support seats 8. A guide mechanism is provided on the base plate 1 corresponding to the multiple support seats 8. A drive motor 10 is provided on the upper surface of the base plate 1, and a drive shaft 11 is connected to the upper end of the drive motor 10. A transmission mechanism is provided between the drive shaft 11 and the suction pipe 5.

[0028] In this embodiment, the wafer to be processed is installed in the suction seat 6. The control device has its own control system. The vacuum pump 3 is started. The vacuum pump 3 works in conjunction with the vacuum tube 4 and the suction tube 5 to achieve vacuum adsorption of the wafer installed in the suction seat 6 through the suction hole 7 on the suction seat 6.

[0029] More specifically, the control device has its own control system. When the drive motor 10 is started, the drive motor 10 drives the drive shaft 11 to rotate. The drive shaft 11 and the air intake pipe 5 cooperate through a transmission mechanism to realize the overall rotation of the air intake pipe 5 and the air intake seat 6. The support seat 8 with ball bearings 9 rotates relative to the guide mechanism to achieve rotational support.

[0030] Please see Figures 1-4 As one implementation method for installation limitation: the upper end face of the suction seat 6 is detachably provided with a limiting seat 12, and multiple limiting seats 12 are provided. The inner grooves of the multiple limiting seats 12 are of different types. The four corners of the lower end face of the multiple limiting seats 12 are provided with positioning rods 13. The suction seat 6 is provided with positioning holes 14 corresponding to the multiple positioning rods 13. The outer end face of the multiple positioning rods 13 is provided with positioning rings 15. The positioning rings 15 and the positioning rods 13 are threadedly connected.

[0031] Specifically, before wafer mounting, a suitable inner slot limit seat 12 is selected and installed according to the wafer model. The positioning rod 13 of the limit seat 12 is installed and positioned corresponding to the positioning hole 14 of the suction seat 6. The positioning ring 15 and the positioning rod 13 are threaded together.

[0032] Please see Figures 1-3 and Figure 5 As one implementation method for support and guidance: the guide mechanism includes a guide seat 16 and a connecting rod 17. The guide seat 16 is provided with multiple support seats 8 and ball bearings 9. Multiple connecting rods 17 are provided. All multiple connecting rods 17 are connected and provided between the base plate 1 and the guide seat 16. The support seat 8 is provided with a limiting ring 18. The inner walls of both the inner and outer sides of the guide seat 16 are provided with limiting grooves 19 corresponding to the limiting ring 18.

[0033] Specifically, the support seat 8 with ball bearings 9 rotates relative to the guide seat 16 for adjustment, and the limiting ring 18 and the limiting groove 19 cooperate to limit the rotation and ensure the overall rotational stability.

[0034] Please see Figure 1 and Figure 2 As one embodiment of the transmission mechanism: the transmission mechanism includes a first gear 20 and a second gear 21. The first gear 20 is mounted on the drive shaft 11, and the second gear 21 is mounted on the intake pipe 5. The first gear 20 and the second gear 21 are meshed together.

[0035] Specifically, the first gear 20 on the drive shaft 11 and the second gear 21 on the intake pipe 5 mesh together to achieve stable transmission.

[0036] In summary, the overall equipment is in use:

[0037] When adjusting the state before use, select the appropriate inner groove model limit seat 12 according to the model of the wafer to be processed and install it corresponding to the suction seat 6. The positioning rod 13 and the positioning hole 14 are installed and positioned, and the positioning ring 15 and the positioning rod 13 are threadedly locked to realize the installation and locking of the limit seat 12, and the wafer installation is initially limited.

[0038] When in the installation and adsorption state, the wafer is installed in the inner groove of the limiting seat 12. The control device has a built-in control system and starts the vacuum pump 3. The vacuum pump 3 works in conjunction with the vacuum tube 4, the suction tube 5, the suction seat 6 and the suction hole 7 to achieve vacuum adsorption of the wafer placed on the suction seat 6, avoiding damage caused by physical clamping.

[0039] When rotating, the control device has its own control system, which starts the drive motor 10. The drive motor 10 drives the drive shaft 11 and the first gear 20 to rotate. The first gear 20 and the second gear 21 mesh together, so that the air intake pipe 5 with the second gear 21 and the air intake seat 6 rotate as a whole. The support seat 8 with the ball bearing 9 rotates relative to the guide seat 16 for adjustment. The limit ring 18 and the limit groove 19 cooperate to limit the rotation, so as to achieve stable rotation of the whole device.

[0040] Of all the solutions mentioned above, those involving the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer rotation and fixing mechanism, comprising a base plate (1), wherein fixing holes (2) are provided at the four corners of the upper end face of the base plate (1), characterized in that: A vacuum pump (3) is provided on the upper surface of the base plate (1). A vacuum tube (4) is connected to the upper end of the vacuum pump (3). A suction pipe (5) is rotatably provided on the upper end of the vacuum tube (4). A suction seat (6) is provided on the upper end of the suction pipe (5). A suction hole (7) is opened on the upper surface of the suction seat (6). Multiple suction holes (7) are provided. Support seats (8) are provided around the outer end of the suction seat (6). Ball bearings (9) are embedded at the bottom of multiple support seats (8). A guide mechanism is provided on the base plate (1) corresponding to multiple support seats (8). A drive motor (10) is provided on the upper surface of the base plate (1). A drive shaft (11) is connected to the upper end of the drive motor (10). A transmission mechanism is provided between the drive shaft (11) and the suction pipe (5).

2. The wafer rotation and fixing mechanism according to claim 1, characterized in that: The upper surface of the suction seat (6) is detachably provided with a limiting seat (12), and multiple limiting seats (12) are provided, with different models of the inner grooves of the multiple limiting seats (12).

3. The wafer rotation and fixing mechanism according to claim 2, characterized in that: Each of the four corners of the lower end face of the multiple limiting seats (12) is provided with a positioning rod (13), and the suction seat (6) is provided with a positioning hole (14) corresponding to the multiple positioning rods (13).

4. The wafer rotation and fixing mechanism according to claim 3, characterized in that: Each of the multiple positioning rods (13) has a positioning ring (15) on its outer end face, and the positioning ring (15) and the positioning rod (13) are threaded together.

5. A wafer rotation and fixing mechanism according to claim 1, characterized in that: The guiding mechanism includes a guide seat (16) and a connecting rod (17). The guide seat (16) is provided for a plurality of support seats (8) and balls (9). A plurality of connecting rods (17) are provided, and the plurality of connecting rods (17) are connected between the base plate (1) and the guide seat (16).

6. A wafer rotation and fixing mechanism according to claim 5, characterized in that: The support base (8) is provided with a limiting ring (18), and the inner walls of the guide base (16) on both the inner and outer sides are provided with limiting grooves (19) corresponding to the limiting ring (18).

7. A wafer rotation and fixing mechanism according to claim 1, characterized in that: The transmission mechanism includes a first gear (20) and a second gear (21). The first gear (20) is mounted on the drive shaft (11), and the second gear (21) is mounted on the intake pipe (5). The first gear (20) and the second gear (21) are meshed together.

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