A kind of gluing device for chip gold wire

Abstract

The utility model relates to the field of semiconductor manufacturing and packaging technology discloses a kind of for chip gold line's gluing device, and the novel device is realized the stable fixation and height adjustment of chip by the collaborative work of the lifting platform of clamping assembly and cylinder, ensure that gluing head can accurately aim at chip surface.Flexible clamping piece in clamping block inside effectively protects chip from injury, improves the stability and reliability of gluing process, in addition, the X-axis and Y-axis moving system of gluing assembly are driven by motor and screw rod, realize the high-precision movement of glue spraying head, ensure the accuracy of gluing path.This design not only improves gluing efficiency, but also reduces human operation error through automation control, improves overall production quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing and packaging technology, specifically to a coating device for gold wires in chips. Background Technology

[0002] In modern electronics manufacturing, the coating process for chips is a crucial step in ensuring chip performance and reliability. Coating is typically used to apply a protective adhesive to gold wires or other critical areas of the chip to prevent oxidation, contamination, and mechanical damage. However, existing coating equipment has some limitations in practical applications.

[0003] A search revealed existing technology (application number: CN222490841U), which describes "a chip coating device". This utility model achieves vertical movement and horizontal removal of the coated chip through a lowering component and a translation component, which is convenient to operate and avoids chip damage; at the same time, the cross support frame and slide groove design of the feeding component can stably support chips of various sizes and specifications to meet different coating needs.

[0004] However, the clamping and positioning accuracy in the existing technology is insufficient. When high-precision operation is required, only the cross support frame and slide are mentioned to place the chip, which may result in insufficient fixation of the chip. The glue application movement only has simple downward and horizontal components, which cannot provide complex and precise two-dimensional X and Y axis glue application path control. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a coating device for gold wires on chips.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a coating device for gold wires of chips, comprising a support frame, a bottom platform disposed inside the support frame, and a top platform disposed on the top of the support frame; a clamping assembly disposed on the top of the bottom platform; a second cylinder disposed on the bottom of the bottom platform; and a coating module disposed on the bottom of the top platform.

[0007] As a further description of the above technical solution:

[0008] The clamping assembly includes: a lifting platform, which is lifted and positioned on top of a bottom platform; a first cylinder, which is positioned inside the lifting platform; two sets of clamping blocks, which slide on top of the lifting platform; sliders, which are positioned on both sides of the clamping blocks and slide inside the lifting platform; two sets of racks, which are positioned at the bottom of the clamping blocks and slide inside the lifting platform; a gear, which is rotatably positioned inside the lifting platform and meshes with the two sets of racks; and a chip placement stage, which is positioned on top of the lifting platform and located between the two sets of clamping blocks.

[0009] As a further description of the above technical solution:

[0010] The second cylinder includes: a first guide post, two sets of which are located on the top of the bottom platform and pass through both sides of the lifting platform, and the lifting platform slides on the first guide post.

[0011] As a further description of the above technical solution:

[0012] The adhesive application module includes: an X-axis moving component located at the bottom of the top platform; a Y-axis moving component located at the bottom of the top platform; an adhesive storage tank located at the top of the top platform; a small pressure pump located on one side of the bottom of the top platform and at the bottom of the adhesive storage tank; a telescopic tube located at the bottom of the top platform, with one end connected to the inside of the adhesive storage tank and passing through the small pressure pump; and an adhesive spray head located at the bottom of the top platform and connected to the end of the telescopic tube away from the small pressure pump.

[0013] As a further description of the above technical solution:

[0014] The X-axis moving assembly includes: a drive motor, located on one side of the bottom of the top platform; a first screw, rotating on the bottom of the top platform, with one end bolted to the output end of the drive motor; a sliding block, sliding on the bottom of the top platform, with the first screw passing through the middle and threadedly engaged; and two sets of second guide posts, located at the bottom of the top platform, passing through both sides of the sliding block, with the sliding block sliding on the second guide posts.

[0015] As a further description of the above technical solution:

[0016] The Y-axis moving assembly includes: a stepper motor, disposed on the bottom of the top platform away from the drive motor; a rotating column, rotatably disposed on the bottom of the top platform, with one end bolted to the output end of the stepper motor and passing through one side of the sliding block; a first bevel gear, rotatably disposed on one side of the sliding block and keyed to the rotating column; a second bevel gear, disposed on the side of the sliding block near the first bevel gear and meshing with the first bevel gear for rotation; a second screw, rotatably disposed inside the sliding block, with one end keyed to the second bevel gear; and a second sliding block, sliding on the bottom of the sliding block and threadedly meshing with the second screw, with a spray nozzle disposed on the bottom of the second sliding block.

[0017] As a further description of the above technical solution:

[0018] A flexible clamping element is provided on the inner side of the clamping block.

[0019] This utility model has the following beneficial effects:

[0020] 1. By setting up a synchronous clamping structure driven by gears and racks, and in conjunction with flexible clamping components, stable clamping and precise positioning of the chip are achieved, effectively avoiding chip displacement or damage caused by uneven force during clamping, and improving clamping safety and adhesive application consistency.

[0021] 2. By adopting a multi-axis moving adhesive spraying system with X and Y axis linkage, combined with a lifting platform to adjust the height, the adhesive spraying head can flexibly and accurately apply adhesive to the chip gold wires automatically, significantly improving the adhesive application accuracy and work efficiency, and is suitable for high-density, high-requirement chip packaging processes. Attached Figure Description

[0022] Figure 1 This is an overall schematic diagram of a coating device for gold wires on chips according to the present invention.

[0023] Figure 2 This is an overall side view of a coating device for gold wire bonding of chips proposed in this utility model;

[0024] Figure 3 This is a half-sectional schematic diagram of a lifting platform for a coating device for gold wires on chips, as proposed in this utility model.

[0025] Figure 4 This is a partially enlarged schematic diagram of the coating module of a coating device for chip gold wire proposed in this utility model;

[0026] Legend:

[0027] 1. Support frame; 11. Bottom platform; 12. Top platform; 2. Clamping assembly; 21. Lifting platform; 22. First cylinder; 23. Clamping block; 24. Slider; 25. Rack; 26. Gear; 27. Chip placement stage; 3. Second cylinder; 31. First guide post; 4. Glue application module; 41. X-axis moving assembly; 411. Drive motor; 412. First screw; 413. Sliding block; 414. Second guide post; 42. Y-axis moving assembly; 421. Stepper motor; 422. Rotating column; 423. First bevel gear; 424. Second bevel gear; 425. Second screw; 426. Second sliding block; 43. Glue storage tank; 44. Small pressure pump; 45. Telescopic tube; 46. Glue spray head. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Example 1:

[0032] like Figures 1 to 4 As shown, this embodiment provides a coating device for gold wires in chips, including: a support frame 1, a bottom platform 11 disposed inside the support frame 1, and a top platform 12 disposed on the top of the support frame 1; a clamping assembly 2 disposed on the top of the bottom platform 11; a second cylinder 3 disposed on the bottom of the bottom platform 11; and a coating module 4 disposed on the bottom of the top platform 12.

[0033] In this embodiment, the clamping component and the adhesive coating module 4 constitute an adhesive coating device for chip gold wires according to this application.

[0034] It should also be understood that the first cylinder 22, the second cylinder 3, the drive motor 411, the stepper motor 421, the controller and the small pressure pump 44 are all common knowledge in the field. They are used without modification, so the control method and circuit connection will not be described in detail.

[0035] It should be noted that the clamping component 2 clamps and lifts the chip through the lifting platform 21 and the first cylinder 22, and the second cylinder 3 provides lifting power. The glue application module 4 achieves precise positioning of the glue spraying head 46 through the X-axis moving component 41 and the Y-axis moving component 42. The small pressure pump 44 delivers glue from the storage tank 43 to the glue spraying head 46 for application, thereby achieving precise glue application of the chip gold wire and improving glue application efficiency and quality.

[0036] In addition, in this embodiment, the user first places the chip on top of the chip placement platform 27, and then presses the switch of the first cylinder 22 of the controller (not shown in the figure). The extension end of the first cylinder 22 drives the clamping block 23 to slide towards the chip (at the same time, the slider 24 slides inside the lifting platform 21). The rack 25 at the bottom of the clamping block 23 pushes the gear 26 to rotate. The gear 26 meshes with another set of racks 25 to slide, and the two sets of clamping blocks 23 clamp the chip in the center.

[0037] Specifically, the clamping assembly 2 includes: a lifting platform 21, which is lifted and positioned on top of the bottom platform 11; a first cylinder 22, which is positioned inside the lifting platform 21; two sets of clamping blocks 23, which slide on top of the lifting platform 21; sliders 24, which are positioned on both sides of the clamping blocks 23 and slide inside the lifting platform 21; two sets of racks 25, which are positioned at the bottom of the clamping blocks 23 and slide inside the lifting platform 21; a gear 26, which is rotatably positioned inside the lifting platform 21 and meshes with the two sets of racks 25; and a chip placement stage 27, which is positioned on top of the lifting platform 21 and located between the two sets of clamping blocks 23.

[0038] In this embodiment, the flexible clamping element inside the clamping block 23 is made of silicone, which has good flexibility and cushioning performance. It can firmly clamp the chip while avoiding surface damage. The controller is connected to the first cylinder 22 through the circuit and starts it. Its piston rod pushes forward, causing the clamping block 23 to slide along the top of the lifting platform 21. The flexible clamping element inside the clamping block 23 gradually approaches the chip. At the same time, the rack 25 at the bottom of the clamping block 23 drives the gear 26 to rotate with the movement, thereby driving the other clamping block 23 to move synchronously in the opposite direction. This realizes the automatic centering and clamping of the chip by the two clamping blocks 23, completing the clamping action. The stable clamping and lifting of the chip is achieved through mechanical linkage, preventing the chip from shifting during the coating process.

[0039] Example 2:

[0040] Based on Example 1, the user then presses the switch of the second cylinder 3 on the controller. The telescopic end of the second cylinder 3 lifts the lifting platform 21 and slides it upward. At the same time, the first guide post 31 provides guidance until the upper surface of the chip reaches the bottom of the nozzle 46. Then, the controller starts the small pressure pump 44 to pressurize the glue inside the glue storage tank 43 into the telescopic tube 45, and then it flows from the nozzle 46 to the gold wire of the chip.

[0041] Specifically, the second cylinder 3 includes: a first guide post 31, which is provided in two sets and is located on both sides of the top of the bottom platform 11 and passes through both sides of the lifting platform 21, and the lifting platform 21 slides on the first guide post 31.

[0042] As a preferred implementation, the first guide column 31 provides guidance to ensure the smooth lifting and lowering of the lifting platform 21, thereby improving the stability and reliability of the lifting platform 21.

[0043] Specifically, the glue application module 4 includes: an X-axis moving assembly 41, disposed at the bottom of the top platform 12; a Y-axis moving assembly 42, disposed at the bottom of the top platform 12; a glue storage tank 43, disposed at the top of the top platform 12; a small pressure pump 44, disposed on one side of the bottom of the top platform 12 and located at the bottom of the glue storage tank 43; a telescopic tube 45, disposed at the bottom of the top platform 12, with one end connected to the inside of the glue storage tank 43 and passing through the small pressure pump 44; and a glue spray head 46, disposed at the bottom of the top platform 12 and connected to the end of the telescopic tube 45 away from the small pressure pump 44.

[0044] In this embodiment, the user starts the small pressure pump 44 through the controller. The small pressure pump 44 starts working and applies pressure to the glue inside the glue storage tank 43, so that the glue enters the telescopic tube 45 through the pipe and is finally sprayed out from the glue outlet of the spray head 46, uniformly coating the gold wire of the chip, thereby completing the glue coating action. The X-axis moving component 41 and the Y-axis moving component 42 realize the precise positioning of the spray head 46, realize the precise delivery of glue and the precise positioning of the spray head 46, and improve the glue coating accuracy.

[0045] Example 3:

[0046] Based on Example 2, the user then controls the output of the drive motor 411 to rotate by activating the drive motor 411 switch on the controller. The first screw 412 rotates accordingly, and the sliding block 413 engages with the first screw 412 while sliding along the X-axis through the second guide post 414. One side of the sliding block 413 slides on the rotating post 422, adjusting the glue application direction of the spray head 46 along the X-axis. At the same time, the user activates the stepper motor 421 switch on the controller. The output of the stepper motor 421 drives the rotating post 422 to rotate, which in turn drives the first bevel gear 423 to rotate. The first bevel gear 423 engages with the second bevel gear 424 to rotate, which in turn drives the second screw 425 to rotate, adjusting the Y-axis position of the second sliding block 426, thereby controlling the glue application direction of the spray head 46 along the Y-axis.

[0047] Specifically, the X-axis moving assembly 41 includes: a drive motor 411, disposed on one side of the bottom of the top platform 12; a first screw 412, rotating on the bottom of the top platform 12, with one end bolted to the output end of the drive motor 411; a sliding block 413, sliding on the bottom of the top platform 12, with the first screw 412 passing through the middle and threadedly engaged; and two sets of second guide posts 414, located at the bottom of the top platform 12, passing through both sides of the sliding block 413, with the sliding block 413 sliding on the second guide posts 414.

[0048] With this setup, when adhesive needs to be applied to the chip's gold wires, the user first issues a command through the controller to start the drive motor 411. The output of the drive motor 411 is connected to and drives the first screw 412 to rotate. The sliding block 413 has a threaded hole inside that matches the first screw 412, and guide holes on both sides of the sliding block 413, allowing it to slide smoothly along the two second guide posts 414 located at the bottom of the top platform. As the first screw 412 rotates, the sliding block 413 moves linearly in the X-axis direction. Since the adhesive spray head 46 is mounted on the second sliding block 426 below the sliding block 413, the adhesive spray head 46 can move along with the sliding block 413 in the X-axis direction, achieving precise positioning and adhesive application.

[0049] Specifically, the Y-axis moving assembly 42 includes: a stepper motor 421, disposed on the bottom of the top platform 12 away from the drive motor 411; a rotating column 422, rotatably disposed on the bottom of the top platform 12, with one end bolted to the output end of the stepper motor 421 and passing through one side of the sliding block 413; a first bevel gear 423, rotatably disposed on one side of the sliding block 413 and keyed to the rotating column 422; a second bevel gear 424, disposed on the side of the sliding block 413 near the first bevel gear 423 and meshing with the first bevel gear 423 to rotate; a second screw 425, rotatably disposed inside the sliding block 413 and keyed to the second bevel gear 424 at one end; a second sliding block 426, sliding on the bottom of the sliding block 413 and threadedly meshing with the second screw 425, and a spray nozzle 46 disposed on the bottom of the second sliding block 426.

[0050] When adhesive needs to be applied to the gold wires of the chip, the user issues a command through the controller to start the stepper motor 421. The output of the stepper motor 421 is connected to and drives the rotating column 422 to rotate. One end of the rotating column 422 is provided with a first bevel gear 423, which meshes with a second bevel gear 424 installed on one side of the sliding block 413. As the rotating column 422 rotates, the first bevel gear 423 drives the second bevel gear 424 to rotate, and the second bevel gear 424 in turn drives the second screw 425 to rotate. Since the second sliding block 426 has a threaded hole that matches the second screw 425 and can slide smoothly at the bottom of the sliding block 413, the second sliding block 426 will move along the second screw 425 in the Y-axis direction. The adhesive spray head 46 is fixed below the second sliding block 426, so the adhesive spray head 46 can move together with the second sliding block 426 in the Y-axis direction to achieve precise positioning and adhesive application.

[0051] In actual use, the user first places the chip on top of the chip placement platform 27, then presses the switch of the first cylinder 22 on the controller. The telescopic end of the first cylinder 22 drives the clamping block 23 to slide towards the chip (at the same time, the slider 24 slides inside the lifting platform 21). The rack 25 at the bottom of the clamping block 23 pushes the gear 26 to rotate. The gear 26 meshes with another set of racks 25 to slide, and the two sets of clamping blocks 23 center and clamp the chip. Then the user presses the switch of the second cylinder 3 on the controller. The telescopic end of the second cylinder 3 lifts the lifting platform 21 and slides upward. At the same time, the first guide post 31 provides guidance until the upper surface of the chip reaches the bottom of the nozzle 46. Then, the small pressure pump 44 is started by the controller to pressurize the glue inside the glue storage tank 43 into the telescopic tube 45, and then it flows from the nozzle 46 to the gold wire of the chip. Then, the user controls the output of the drive motor 411 to rotate by activating the switch on the controller. The first screw 412 rotates accordingly, and the sliding block 413 engages with the first screw 412 while sliding along the X-axis through the second guide post 414. One side of the sliding block 413 slides on the rotating post 422, adjusting the glue application direction of the spray head 46 along the X-axis. At the same time, the user activates the stepper motor 421 switch on the controller. The output of the stepper motor 421 drives the rotating post 422 to rotate, which in turn drives the first bevel gear 423 to rotate. The first bevel gear 423 engages with the second bevel gear 424 to rotate, which in turn drives the second screw 425 to rotate, adjusting the position of the second sliding block 426 along the Y-axis, thereby controlling the glue application direction of the spray head 46 along the Y-axis.

[0052] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0053] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A coating apparatus for gold wires in chips, characterized in that: It includes a support frame (1), a bottom platform (11) is provided inside the support frame (1), and a top platform (12) is provided on the top of the support frame (1). Clamping assembly (2) is set on top of bottom platform (11); The second cylinder (3) is located at the bottom of the bottom platform (11); The glue application module (4) is located at the bottom of the top platform (12) and includes an X-axis moving assembly (41) and a drive motor (411) located on one side of the bottom of the top platform (12). The first screw (412) rotates at the bottom of the top platform (12), and one end is bolted to the output end of the drive motor (411); The sliding block (413) slides on the bottom of the top platform (12), and the first screw (412) passes through the middle and engages with the thread; Two sets of second guide posts (414) are provided and located at the bottom of the top platform (12), passing through both sides of the sliding block (413), and the sliding block (413) slides on the second guide posts (414); The Y-axis moving assembly (42) is located at the bottom of the top platform (12) and includes a stepper motor (421) located at the bottom of the top platform (12) on the side away from the drive motor (411); The rotating column (422) is rotatably set at the bottom of the top platform (12), and one end is bolted to the output end of the stepper motor (421), and passes through one side of the sliding block (413); The first bevel gear (423) is rotatably mounted on one side of the sliding block (413) and is key-connected to the rotating column (422); The second bevel gear (424) is located on the side of the sliding block (413) close to the first bevel gear (423) and meshes with the first bevel gear (423) to rotate; The second screw (425) is rotatably disposed inside the sliding block (413), and one end is keyed to the second bevel gear (424). A glue storage box (43) is set on top of the top platform (12); A small pressure pump (44) is located on one side of the bottom of the top platform (12) and at the bottom of the glue storage tank (43); The telescopic tube (45) is set at the bottom of the top platform (12), with one end of the tube connected to the inside of the glue storage tank (43) and passing through the small pressure pump (44). The spray nozzle (46) is located at the bottom of the top platform (12) and is connected to the end of the telescopic tube (45) away from the small pressure pump (44).

2. The coating apparatus for gold wire bonding of chips according to claim 1, characterized in that: The clamping assembly (2) includes: a lifting platform (21), which is lifted and positioned on top of the bottom platform (11); The first cylinder (22) is located inside the lifting platform (21); Two sets of clamping blocks (23) are provided and slide on the top of the lifting platform (21); The slider (24) is located on both sides of the clamping block (23) and slides inside the lifting platform (21); Two sets of racks (25) are provided and are located at the bottom of the clamping block (23) and slide inside the lifting platform (21); The gear (26) is rotatably installed inside the lifting platform (21) and meshes with two sets of racks (25). The chip placement stage (27) is located on top of the lifting platform (21) and between the two sets of clamping blocks (23).

3. The coating apparatus for gold wire bonding of chips according to claim 1, characterized in that: The second cylinder (3) includes: a first guide post (31), two sets of which are located on the top sides of the bottom platform (11) and pass through both sides of the lifting platform (21), and the lifting platform (21) slides on the first guide post (31).

4. The coating apparatus for gold wire bonding of chips according to claim 2, characterized in that: The clamping block (23) has a flexible clamping element on its inner side.

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