A semiconductor device surface cleaning apparatus

Abstract

The utility model relates to related technical field of cleaning device discloses a kind of semiconductor device surface cleaning equipment, including box and ultrasonic cleaner, the left side of the box top is fixedly connected with water storage tank one, the right side of the box top is fixedly connected with water storage tank two, the front side of the box is provided with movable assembly, the inside of the box is provided with filter assembly, the left side inner wall of the box is fixedly connected with plasma cleaning machine, the rear side of the ultrasonic cleaner is fixedly connected with water injection plate, water injection port one and water injection port two are respectively set in the middle of the water injection plate two sides, the right end of the front side of the water injection plate is fixedly connected with megasonic cleaner, the bottom of the ultrasonic cleaner and megasonic cleaner is fixedly connected with multiple support columns.In the utility model, the synergies of megasonic cleaner, ultrasonic cleaner and plasma cleaning machine are utilized, combined with dry-wet cleaning technology, to thoroughly clean semiconductor equipment and improve the pass rate of cleaning.

Description

Technical Field

[0001] This utility model relates to the technical field of cleaning devices, and in particular to a semiconductor device surface cleaning device. Background Technology

[0002] With the continuous advancement of technology, electronic devices are becoming increasingly miniaturized and high-performance, placing higher demands on semiconductor chip manufacturing processes. During semiconductor manufacturing, various contaminants are inevitably generated, such as particles, organic matter, native oxide layers, and metallic impurities. These contaminants affect chip performance, reliability, and yield. Depending on the cleaning medium, semiconductor cleaning technologies can be divided into wet cleaning and dry cleaning. Currently, wet cleaning is the mainstream technology, accounting for over 90% of the total cleaning steps. Wet cleaning uses deionized water and cleaning agents to perform non-destructive cleaning of the wafer surface to remove impurities. Dry cleaning, on the other hand, does not use chemical solvents and primarily employs techniques such as gaseous hydrofluoric acid etching.

[0003] Currently, wet cleaning equipment uses a large amount of chemical reagents, such as strong acids and alkalis, which can easily cause environmental pollution and safety hazards. Dry cleaning equipment is mainly suitable for logic and memory products with technology nodes of 28nm and below. For products with larger process nodes, the advantages of dry cleaning are not obvious, and there may be problems with incomplete cleaning. In response to this technical problem, this application proposes a semiconductor device surface cleaning device that combines the two cleaning methods and reduces manual intervention in the cleaning process. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor device surface cleaning device, which aims to solve the problem of substandard cleaning quality in existing cleaning processes.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A semiconductor device surface cleaning device includes a housing and an ultrasonic cleaner. A water storage tank is fixedly connected to the top left side of the housing, and a water storage tank is fixedly connected to the top right side of the housing. A movable component is provided on the front side of the housing, and a filter component is provided inside the housing. A plasma cleaner is fixedly connected to the inner wall of the left side of the housing. A water injection plate is fixedly connected to the rear side of the ultrasonic cleaner. A water injection port is provided on both sides of the middle of the water injection plate. A mega-sonic cleaner is fixedly connected to the front right end of the water injection plate. Multiple support columns are fixedly connected to the bottom ends of the ultrasonic cleaner and the mega-sonic cleaner.

[0006] Furthermore, the movable component includes a first trapdoor, a second trapdoor, and a third trapdoor, which are rotatably connected to a housing via hinges.

[0007] Furthermore, the filtration assembly includes a filter one and a filter two, both of which are equipped with filter screens. The bottom ends of both filters one and two are fixedly connected to a water pump via pipes. A reverse osmosis filter is fixedly connected to the rear end of the water pump, and a retainer is fixedly connected to the outer wall of the reverse osmosis filter.

[0008] Furthermore, the front side of the box is provided with a movable window one and a movable window two, and two pipe grooves are opened in the middle of the top of the box.

[0009] Furthermore, both the ultrasonic cleaner and the megasonic cleaner have multiple sliding grooves inside, and each sliding groove is slidably connected to a partition.

[0010] Furthermore, the first water inlet is connected to the first water storage tank via a pipe, and the second water inlet is connected to the second water storage tank via a pipe.

[0011] Furthermore, a movable groove is provided at the top of the inside of the box, and a robotic arm is installed inside the movable groove.

[0012] Furthermore, a terminal control slot is provided on the right side of the housing, and a control terminal is installed in the terminal control slot.

[0013] This utility model has the following beneficial effects: 1. In this utility model, the synergistic effect of a megasonic cleaner, an ultrasonic cleaner, and a plasma cleaner, combined with dry and wet cleaning techniques, is used to thoroughly clean semiconductor devices, thereby improving the cleaning pass rate.

[0014] 2. In this utility model, wastewater is filtered in two layers using a filter and a reverse osmosis filter, which can effectively remove impurities and harmful substances from the wastewater, ensuring that the discharged wastewater meets environmental protection standards, while saving water resources and improving the environmental performance and practicality of the equipment. Attached Figure Description

[0015] Figure 1 This is a perspective view of a semiconductor device surface cleaning device proposed in this utility model; Figure 2 This is a schematic diagram of the housing structure of a semiconductor device surface cleaning device proposed in this utility model; Figure 3 This is a schematic diagram of the structure of an ultrasonic cleaner for a semiconductor device surface cleaning device proposed in this utility model; Figure 4 This is a schematic diagram of the reverse osmosis filter structure of a semiconductor device surface cleaning equipment proposed in this utility model.

[0016] Legend: 1. Water tank one; 2. Water tank two; 3. Sliding window one; 4. Sliding window two; 5. Trapdoor one; 6. Trapdoor two; 7. Trapdoor three; 8. Control terminal; 9. Cabinet; 10. Robotic arm; 11. Plasma cleaner; 12. Ultrasonic cleaner; 13. Megasonic cleaner; 14. Filter one; 15. Filter two; 16. Water inlet one; 17. Water inlet two; 18. Partition; 19. Filter screen; 20. Water pump; 21. Reverse osmosis filter; 22. Retainer. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Reference Figures 1-3 This utility model provides an embodiment of a semiconductor device surface cleaning device, comprising a housing 9 and an ultrasonic cleaner 12. A water storage tank 1 is fixedly connected to the top left of the housing 9, and a water storage tank 2 is fixedly connected to the top right of the housing 9. A movable component is provided on the front side of the housing 9, and a filter component is provided inside the housing 9. A plasma cleaner 11 is fixedly connected to the inner left wall of the housing 9. A water injection plate is fixedly connected to the rear side of the ultrasonic cleaner 12. A water injection port 16 and a water injection port 17 are respectively opened on both sides of the middle of the water injection plate. A mega-sonic cleaner 13 is fixedly connected to the front right end of the water injection plate. Multiple support columns are fixedly connected to the bottom ends of the ultrasonic cleaner 12 and the mega-sonic cleaner 13. A movable slot is opened at the top of the interior of the housing 9, and a robotic arm 10 is arranged inside the movable slot. A terminal control slot is opened on the right side of the housing 9, and a control terminal 8 is arranged inside the terminal control slot. Open the mobile window 13 and place the equipment to be cleaned into the megasonic cleaner 13. Control the equipment to start through the control terminal 8. After cleaning through the megasonic cleaner 13, control the robotic arm 10 to transport the equipment to the ultrasonic cleaner 12. After cleaning through the ultrasonic cleaner 12, transport it to the plasma cleaner 11 through the robotic arm 10. The cleaning process is completed after dry cleaning through the plasma cleaner 11.

[0019] Reference Figure 1 , Figure 2 and Figure 4The movable components include trapdoor 5, trapdoor 6, and trapdoor 7, which are connected to the housing 9 via hinges. The filtration components include filter 14 and filter 25, both of which have filter screens 19 inside. A water pump 20 is fixedly connected to the bottom of both filters 14 and 25 via pipes. A reverse osmosis filter 21 is fixedly connected to the rear end of the water pump 20, and a retainer 22 is fixedly connected to the outer wall of the reverse osmosis filter 21. After cleaning, the ultrasonic cleaner 12 and the mega-sonic cleaner 13 discharge wastewater to filters 14 and 25. After pretreatment by filters 14 and 25, the water pump 20 is controlled by the control terminal 8 to send the wastewater into the reverse osmosis filter 21 for deep treatment. The front of the housing 9 has movable windows 3 and 4, and two pipe grooves are opened in the middle of the top of the housing 9. Both the ultrasonic cleaner 12 and the megasonic cleaner 13 have multiple sliding grooves inside, and partitions 18 are slidably connected inside each groove. By removing the partitions 18, the internal space of the ultrasonic cleaner 12 and the megasonic cleaner 13 can be changed to accommodate different equipment sizes. Water inlet 16 is connected to water tank 11 via a pipe, and water inlet 17 is connected to water tank 2 via a pipe. The control terminal 8 controls the injection of high-purity water from water tank 11 into water tank 2, and the injection of cleaning agent from water tank 2 into the megasonic cleaner 13.

[0020] Working principle: During cleaning, open the movable window 3 and place the equipment to be cleaned into the megahertz ultrasonic cleaner 13. Start the equipment via the control terminal 8. The megahertz ultrasonic cleaner 13 utilizes megahertz frequencies (typically 0.8 - 1 MHz). High-frequency ultrasound (3MHz) forms a standing wave field in the cleaning fluid. This high-frequency vibration causes the cleaning fluid molecules to move violently, generating strong shearing force, thereby removing tiny particles and contaminants from the object's surface. After cleaning by the mega-sonic cleaner 13, the control terminal 8 controls the robotic arm 10 to start and pick up the equipment, transporting it to the ultrasonic cleaner 12. The transducer converts high-frequency electrical energy into mechanical vibration, generating ultrasound above 20kHz. Countless tiny bubbles are formed in the high-purity water. These bubbles grow and close rapidly under the action of ultrasound, generating strong impact force and micro-jet, impacting the object's surface and causing dirt, grease, impurities, etc., to fall off. After cleaning by the ultrasonic cleaner 12, the robotic arm 10 transports the equipment to the plasma cleaner 11. The radio frequency power supply excites the reactive gas to form plasma. The high-energy particles in the plasma undergo physical and chemical reactions with the contaminants on the object's surface, decomposing, vaporizing, or converting the contaminants into volatile substances, thereby achieving the purpose of cleaning and surface modification. After dry cleaning by the plasma cleaner 11, the equipment can be removed through the movable door 5. After cleaning is completed, the control... The ultrasonic cleaner 12 and the mega-sonic cleaner 13 discharge wastewater to filters 14 and 25. After pretreatment by filters 14 and 25, the water is pumped into the reverse osmosis filter 21 for further treatment via the control terminal 8. The reverse osmosis filter 21 utilizes the properties of a semi-permeable membrane; under pressure higher than the osmotic pressure of the solution, only water can pass through the membrane, while dissolved salts, colloids, bacteria, viruses, and other impurities are trapped on the other side, thus achieving water separation and purification. The ultrasonic cleaner 12 and... The drainage device of the megasonic cleaner 13 controls the injection of high-purity water from water tank 1 to water tank 2 via the control terminal 8. The cleaning agent in water tank 2 is injected into the megasonic cleaner 13. The filter screens 19 in filter 14 and filter 25 can be replaced by opening the trapdoor 26 and trapdoor 37. Tempered glass is fixedly connected to both movable windows 13 and 24, allowing for observation of the cleaning progress at any time. The internal space of the ultrasonic cleaner 12 and megasonic cleaner 13 can be changed by removing the partition 18, which can be used to accommodate different sizes of equipment.

[0021] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor device surface cleaning device, characterized in that, The device includes a housing (9) and an ultrasonic cleaner (12). A water tank (1) is fixedly connected to the top left of the housing (9), and a water tank (2) is fixedly connected to the top right of the housing (9). A movable component is provided on the front side of the housing (9). A filter component is provided inside the housing (9). A plasma cleaner (11) is fixedly connected to the inner wall of the left side of the housing (9). A water injection plate is fixedly connected to the rear side of the ultrasonic cleaner (12). A water injection port (16) and a water injection port (17) are respectively opened on both sides of the middle part of the water injection plate. A mega-sonic cleaner (13) is fixedly connected to the front right end of the water injection plate. Multiple support columns are fixedly connected to the bottom ends of the ultrasonic cleaner (12) and the mega-sonic cleaner (13).

2. The semiconductor device surface cleaning apparatus according to claim 1, wherein: The movable components include a first trapdoor (5), a second trapdoor (6), and a third trapdoor (7), which are connected to a housing (9) via hinges.

3. The semiconductor device surface cleaning apparatus according to claim 1, wherein: The filter assembly includes a filter one (14) and a filter two (15). Both the filter one (14) and the filter two (15) are equipped with filter screens (19). The bottom ends of the filter one (14) and the filter two (15) are fixedly connected to a water pump (20) through pipes. The rear end of the water pump (20) is fixedly connected to a reverse osmosis filter (21). The outer wall of the reverse osmosis filter (21) is fixedly connected to a retainer (22).

4. The semiconductor device surface cleaning apparatus according to claim 1, wherein: The front side of the box (9) is provided with a movable window one (3) and a movable window two (4), and two pipe grooves are opened in the middle of the top of the box (9).

5. The semiconductor device surface cleaning apparatus according to claim 1, wherein: Both the ultrasonic cleaner (12) and the mega-sonic cleaner (13) have multiple sliding grooves inside, and each sliding groove is slidably connected to a partition (18).

6. The semiconductor device surface cleaning apparatus according to claim 1, wherein: The first water inlet (16) is connected to the first water storage tank (1) via a pipe, and the second water inlet (17) is connected to the second water storage tank (2) via a pipe.

7. The semiconductor device surface cleaning apparatus according to claim 1, wherein: The top of the box (9) is provided with a moving slot, and a robotic arm (10) is provided inside the moving slot.

8. The semiconductor device surface cleaning apparatus according to claim 1, wherein: A terminal control slot is provided on the right side of the housing (9), and a control terminal (8) is provided in the terminal control slot.

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