Chip transport transfer device

Abstract

The utility model provides a kind of transfer device for chip transportation, it is related to the technical field of semiconductor packaging, including loading mechanism, the loading mechanism includes carrier one, the carrier one is provided with fixed ring outside, the fixed ring one side is provided with fixed column two, the both ends of the carrier one are equipped with baffle one, the carrier one includes clamping plate one, the one side of the clamping plate one is connected with clamping plate two, the utility model is suspended in the central box by the pulling rope between fixed ring and box inner fixed column and makes loading mechanism whole, effectively attenuate the vibration caused by bumping and collision in transportation, carrier is composed of multiple layers of flexible clamping plate superposition, and multiple layers of flexible clamping plate are composed of honeycomb, impact is absorbed by its material and structural characteristics, each layer of clamping groove is embedded with carrier two with limiting baffle, inhibit internal component displacement, to realize the buffer protection and accurate positioning to chip.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a transfer device for chip transportation. Background Technology

[0002] The core function of transfer devices for chip transportation is to ensure the safety and integrity of precision chips during the transfer process. Through anti-static materials, customized cushioning liners and robust shells, they effectively isolate external physical shocks, vibrations and temperature and humidity changes. At the same time, their strict sealing design can prevent chemical contaminants and moisture from corroding, thereby protecting the chip's sensitive microcircuit structure from damage and maintaining its electrical performance and reliability. It is an indispensable part of the supply chain.

[0003] Existing chip transport and transfer devices have significant shortcomings in shock protection. Road bumps and vehicle vibrations during transportation can easily be transmitted to the internal components. Existing cushioning materials are unable to effectively absorb high-frequency vibrations and instantaneous impacts, leading to stress damage to the internal microstructure of the chip or microcracks in the solder joints. This damage is usually insidious and accumulates with harsh transportation conditions, seriously affecting the reliability and lifespan of the chip and causing potential economic losses. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a transfer device for chip transportation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a transfer device for chip transportation, comprising a loading mechanism, the loading mechanism comprising a carrier one, a fixing ring disposed outside the carrier one, a fixing post two disposed on one side of the fixing ring, baffles one disposed at both ends of the carrier one, the carrier one comprising a clamping plate one, a clamping plate two connected to one side of the clamping plate one, a clamping plate three connected to the side of the clamping plate two away from the clamping plate one, both the clamping plate two and the clamping plate three having a clamping groove two, the clamping groove two being connected to the carrier two, both ends of the carrier two being provided with baffles two, and the carrier two having a clamping groove three.

[0006] In a preferred embodiment, the second fixed post is connected to a pull rope, and a first fixed post is provided at the end of the pull rope away from the second fixed post. The end of the first fixed post away from the pull rope is connected to a box body, and a box cover is connected to one end of the box body. The box body and the box cover are connected by a hinge.

[0007] In a preferred embodiment, a slot is provided on the inner side of the fixing ring, and a block is provided on the side of the baffle near the carrier.

[0008] In one preferred embodiment, the second and third card plates are provided in multiple sets, and each set has a card slot 2.

[0009] In one preferred embodiment, the first fixed post and the pull rope connected to the first fixed post are provided in four sets, each set being connected to the second fixed post.

[0010] In one preferred embodiment, after the card slot 2 in the card plate 3 is connected to the carrier 2, the card plate 2 is set above the card plate 3. After multiple sets of carrier 2 are set in the card slot 2 of the card plate 2, the card plate 1 is connected to the card plate 2.

[0011] In a preferred embodiment, the first, second, and third card plates are all made of flexible materials.

[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows: This utility model suspends the entire loading mechanism in the center of the box by means of a traction rope between the fixed ring and the fixed column inside the box, effectively attenuating the vibration caused by bumps and collisions during transportation. The carrier is composed of multiple layers of flexible card plates stacked together, and the multiple layers of flexible card plates form a honeycomb shape. By utilizing its material and structural characteristics, it absorbs the impact. Each card slot is embedded with a carrier second with a limit baffle to suppress the displacement of internal components, thereby achieving buffer protection and precise positioning of the chip. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of a chip transport device provided by this utility model.

[0014] Figure 2 This is a schematic diagram of the internal structure of a chip transport device provided by this utility model.

[0015] Figure 3 A schematic diagram of the loading mechanism of a transfer device for transporting chips provided by this utility model.

[0016] Figure 4 This is a disassembly diagram of the loading mechanism of a transfer device for transporting chips, provided by this utility model.

[0017] Figure 5 This is a schematic diagram of the internal structure of the loading mechanism of a transfer device for transporting chips, provided by this utility model.

[0018] Figure 6 A schematic diagram of the carrier structure of a chip transport device provided by this utility model.

[0019] Figure 7 This is a disassembled diagram of the internal structure of the loading mechanism of a chip transport transfer device provided by this utility model.

[0020] Legend: 1. Box body; 11. Box lid; 12. Hinges; 13. Fixing post one; 14. Pull rope; 2. Loading mechanism; 21. Fixing ring; 211. Fixing post two; 212. Slot one; 22. Baffle one; 221. Locking block; 23. Carrier one; 231. Locking plate one; 232. Locking plate two; 233. Locking plate three; 234. Slot two; 24. Carrier two; 241. Slot three; 242. Baffle two. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example 1 like Figure 1 - Figure 7 As shown, this utility model provides a technical solution: a transfer device for transporting chips, including a loading mechanism 2. The loading mechanism 2 includes a carrier 23, with a fixing ring 21 on the outside of the carrier 23 to fix the carrier 23 as a whole. A fixing post 211 is provided on one side of the fixing ring 21. The fixing post 211 is connected to the fixing post 13 located inside the box 1 by a pull rope 14, which is used to suspend the fixing ring 21, the baffle 22, and the entire carrier 23 in the center of the box 1, so as to reduce the impact on the chip when the entire device encounters bumps or slight collisions during movement. Baffles 22 are provided at both ends of the carrier 23 to fix the position of the carrier 24, so that the carrier 24 will not move inside the carrier 23. 23 includes a first card plate 231, a second card plate 232 connected to one side of the first card plate 231, and a third card plate 233 connected to the side of the second card plate 232 away from the first card plate 231. Both the second card plate 232 and the third card plate 233 have a second card slot 234. After the carrier 24 is placed in the second card slot 234 in the third card plate 233, the second card plate 232 is set above the third card plate 233. The carrier 24 is set in the second card slot 234 of the second card plate 232. After multiple sets are set, the first card plate 231 and the second card plate 232 are connected to form the external structure of the carrier 23. Then, the whole structure is fixed by the fixing ring 21. The second card slot 234 is connected to the carrier 24. Both ends of the carrier 24 are provided with a second baffle 242. The carrier 24 has a third card slot 241.

[0023] In this embodiment, carrier 23 is the core, and a fixing ring 21 is assembled on its exterior to fix carrier 23 as a whole. A fixing post 211 is provided on one side of the fixing ring 21. The fixing post 211 is connected to the fixing post 13 inside the housing 1 by the pull rope 14, so that the fixing ring 21, baffle 22 and the entire carrier 23 are suspended in the center of the housing 1. This suspension structure can effectively alleviate the vibration caused by bumps or slight collisions during the movement of the device and reduce the potential impact on the chip. Baffles 22 are installed at both ends of carrier 23 to limit carrier 24 and prevent it from moving inside carrier 23. Carrier 23 is composed of clamping plate 231, clamping plate 232 and clamping plate 233. 1. Connected to one side of card plate 232, and the other side of card plate 232 is connected to card plate 3 233. Both card plate 232 and card plate 3 233 have card slot 234 for holding carrier 24. In specific assembly, carrier 24 is first placed in card slot 234 of card plate 3 233, and then card plate 232 is placed on top of it. Carrier 24 is also placed in the corresponding card slot 234 of card plate 232. After repeating the multi-layer stacking, card plate 1 231 is finally connected to card plate 232 to form the overall external frame of carrier 1 23. The whole is then fixed by fixing ring 21. Carrier 24 is embedded in card slot 234. Both ends of carrier 2242 are equipped with baffles 242. Carrier 24 itself has card slot 341 for chip support and positioning.

[0024] Example 2 like Figure 1 - Figure 7 As shown, a second fixing post 211 is connected to a pull rope 14. A first fixing post 13 is located at the end of the pull rope 14 furthest from the second fixing post 211. The end of the first fixing post 13 furthest from the pull rope 14 is connected to a housing 1. The first fixing post 13 is located inside the housing 1. A lid 11 is connected to one end of the housing 1. The housing 1 and the lid 11 are connected by a hinge 12. A slot 212 is provided on the inner side of the fixing ring 21. The slot 212 fits into the outer side of the carrier 23. A block 221 is provided on the side of the baffle 22 near the carrier 23. The block 221 is used to seal both ends of the carrier 23, and the block 221 fits into the outer side of the carrier 23. 23 are interlocked. Multiple sets of card plates 232 and 233 are provided, each set having a card slot 234. Four sets of fixed posts 13 and pull ropes 14 connected to fixed posts 13 are provided, each set corresponding to fixed posts 211. After the card slot 234 in card plate 333 is connected to carrier 24, card plate 232 is set above card plate 333. Carrier 224 is set in the card slot 234 of card plate 232. After multiple sets are set, card plate 1231 is connected to card plate 2232. Card plate 1231, card plate 232 and card plate 333 are all made of flexible materials.

[0025] In this embodiment, a box body 1 is provided, with a box cover 11 connected to one end of the box body 1. The box body 1 and the box cover 11 are connected by a hinge 12. A first fixing post 13 is located inside the box body 1. A pull rope 14 is connected to the first fixing post 13. There are four sets of the first fixing post 13 and the pull rope 14 connected to the first fixing post 13. Each set is connected to the second fixing post 211. After the second card slot 234 in the third card plate 233 is connected to the second carrier 24, a second card plate 232 is provided above the third card plate 233. The second carrier 24 is placed in the second card slot 234 of the second card plate 232. After multiple sets are provided, the first card plate 231 is connected to the second card plate 232. The first card plate 231, the second card plate 232 and the third card plate 233 are all made of flexible material.

[0026] Working principle: like Figure 1 - Figure 7As shown, a chip transport transfer device includes a loading mechanism 2. The loading mechanism 2 includes a carrier 23, with a fixing ring 21 on the outside of the carrier 23 to fix the carrier 23 as a whole. A fixing post 211 is provided on one side of the fixing ring 21. The fixing post 211 is connected to a fixing post 13 located inside the box 1 by a pull rope 14. This is used to suspend the fixing ring 21, baffle 22, and the entire carrier 23 in the center of the box 1, so as to reduce the impact on the chip when the entire device encounters bumps or slight collisions during movement. Baffles 22 are provided at both ends of the carrier 23 to fix the position of the carrier 24, so that the carrier 24 will not be affected. The carrier 23 moves within the carrier 1. The carrier 23 includes a first clamping plate 231. A second clamping plate 232 is connected to one side of the first clamping plate 231, and a third clamping plate 233 is connected to the side of the second clamping plate 232 away from the first clamping plate 231. Both the second clamping plate 232 and the third clamping plate 233 have a second clamping slot 234. After the carrier 24 is placed in the second clamping slot 234 in the third clamping plate 233, the second clamping plate 232 is set above the third clamping plate 233. The carrier 24 is then placed in the second clamping slot 234 of the second clamping plate 232. After multiple sets are set, the first clamping plate 231 and the second clamping plate 232 are connected to form the external structure of the carrier 23. The entire structure is then fixed by a fixing ring 21. The second clamping slot 234 is connected to the carrier 233. The second carrier 24 has baffles 242 at both ends. The carrier 24 has slots 241. A pulling rope 14 is connected to a fixing post 211. A fixing post 13 is located at the end of the pulling rope 14 away from the fixing post 211. The end of the fixing post 13 away from the pulling rope 14 is connected to a box body 1, which is located inside the box body 1. A box cover 11 is connected to one end of the box body 1, and the box body 1 and the box cover 11 are connected by a hinge 12. A slot 212 is located on the inner side of the fixing ring 21, and the slot 212 fits into the outer side of the carrier 23. A locking block 221 is located on the side of the baffle 22 near the carrier 23, and the locking block 221 is used to hold the carrier 23 in place. Both ends of 23 are sealed, and the card block 221 is interlocked with the carrier 23. There are multiple sets of card plate 232 and card plate 33, each set has a card slot 234. There are four sets of fixing post 13 and pull rope 14 connected to fixing post 13, each set is connected to fixing post 211. After the card slot 234 in card plate 333 is connected to the carrier 24, card plate 232 is set above card plate 333. After the carrier 24 is set in the card slot 234 of card plate 232, card plate 1231 is connected to card plate 232. Card plate 1231, card plate 232 and card plate 333 are all made of flexible material.

[0027] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. A transfer device for transporting chips, characterized in that, include: The loading mechanism (2) includes a carrier (23), a fixing ring (21) is provided on the outside of the carrier (23), a fixing post (211) is provided on one side of the fixing ring (21), a baffle (22) is provided at both ends of the carrier (23), the carrier (23) includes a clamping plate (231), a clamping plate (232) is connected to one side of the clamping plate (231), a clamping plate (233) is connected to the side of the clamping plate (232) away from the clamping plate (231), a clamping plate (234) is provided on both the clamping plate (232) and the clamping plate (233), a clamping groove (234) is provided on both the clamping plate (234), a carrier (24) is connected to the clamping groove (234), a baffle (242) is provided at both ends of the carrier (24), and a clamping groove (241) is provided on the carrier (24).

2. The transfer device for chip transportation according to claim 1, characterized in that: The second fixed post (211) is connected to a pull rope (14). The end of the pull rope (14) away from the second fixed post (211) is provided with a first fixed post (13). The end of the first fixed post (13) away from the pull rope (14) is connected to a box body (1). The end of the box body (1) is connected to a box cover (11). The box body (1) and the box cover (11) are connected by a hinge (12).

3. The transfer device for chip transportation according to claim 1, characterized in that: The inner side of the fixing ring (21) is provided with a slot (212), and the side of the baffle (22) near the carrier (23) is provided with a block (221).

4. The transfer device for chip transportation according to claim 1, characterized in that: The card plate two (232) and card plate three (233) are provided in multiple sets, and each set has a card slot two (234).

5. A transfer device for transporting chips according to claim 2, characterized in that: The first fixed post (13) and the pull rope (14) connected to the first fixed post (13) are provided in four sets, and each set is connected to the second fixed post (211).

6. The transfer device for chip transportation according to claim 1, characterized in that: After the card slot 2 (234) opened in the card plate 3 (233) is connected to the carrier 2 (24), the card plate 2 (232) is set above the card plate 3 (233). After setting the carrier 2 (24) in the card slot 2 (234) of the card plate 2 (232) and setting multiple sets, the card plate 1 (231) is connected to the card plate 2 (232).

7. A transfer device for chip transportation according to claim 1, characterized in that: The first card (231), the second card (232), and the third card (233) are all made of flexible materials.

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