Semiconductor device stress testing apparatus

Abstract

This utility model discloses a semiconductor component stress testing device, including a base and a stand. A liftable detection device is mounted on the top of the stand, comprising a telescopic rod, a detection head, and a pressure sensor between them. A limiting rod is provided on the base, and a detachable circuit board is mounted on the limiting rod. Clamping components on both sides of the base limit the circuit board. A terminal block is provided on the circuit board, and the bottom of the semiconductor component has a pin-type crimp terminal corresponding to the terminal block for easy insertion and removal during testing. A detection unit on the circuit board communicates with the terminal block. The detection unit includes an indicator module, and the semiconductor component communicates with the indicator module through the terminal block. The on / off state of the indicator module visually indicates whether the stress test of the semiconductor component has reached the threshold. This utility model belongs to the field of semiconductor testing technology, specifically providing a solution to the problems of strong reliance on manual operation, insufficient positioning accuracy, and lack of real-time feedback mechanisms in existing technologies.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor testing technology, specifically referring to a semiconductor element stress testing device. Background Technology

[0002] Current stress testing methods for semiconductor devices have significant drawbacks in traditional testing approaches:

[0003] The manual pressing test resulted in uneven pressure, leading to poor repeatability of the test results.

[0004] The circuit board is easily unstable and may shift during testing, affecting the reliability of the contact between semiconductor components and the connector.

[0005] It cannot simultaneously monitor pressure values ​​and electrical connectivity, requiring additional instruments for verification, which is inefficient. Utility Model Content

[0006] The technical problem this invention aims to solve is the issues of high dependence on manual operation, insufficient positioning accuracy, and lack of real-time feedback mechanism in the existing technology.

[0007] To solve the above problems, the technical solution adopted by this utility model is as follows:

[0008] The present invention provides a semiconductor element stress testing device, comprising a base and a stand vertically disposed above the base;

[0009] The top of the support frame is equipped with a liftable detection device, which includes a telescopic rod at the top of the support frame and a detection head at the bottom of the telescopic rod. A pressure sensor is provided at the connection between the telescopic rod and the detection head.

[0010] The base is also provided with a limiting rod, and the limiting rod is provided with a detachable circuit board. The base is provided with clamping components on both sides for limiting the two sides of the circuit board. The circuit board is provided with a terminal block. The bottom of the semiconductor element is provided with a pin-type crimp terminal corresponding to the terminal block for easy insertion and removal during testing.

[0011] The circuit board is equipped with a detection unit that is connected to a terminal block. The detection unit includes an indicator module. The semiconductor element is connected to the indicator module through the terminal block. The on / off state of the indicator module is used to visually determine whether the stress test of the semiconductor element has reached the threshold.

[0012] Preferably, the base has support platforms on both sides, the limiting rod is located between the support platforms on both sides, the limiting rod has a fixed end with a pyramidal structure, the circuit board has a socket that matches the fixed end, and the terminal block is located directly below the detection head.

[0013] Preferably, the clamping assembly includes a fixed seat on a support platform, an adjusting member rotatably disposed within the fixed seat, and a pressure plate slidably disposed above the fixed seat and movably connected to the adjusting member. The fixed seat has a sliding groove, one end of the adjusting member has a rotating shaft that matches the sliding groove, and a limiting hook is provided above the rotating shaft. The pressure plate has a vertically penetrating limiting hole that matches the limiting hook. The pressure plate is fitted and pressed tightly against both sides of the circuit board.

[0014] Preferably, the detection unit further includes a controller and a bridge module and a comparison module connected thereto. The pressure sensor is connected to the bridge module for acquiring pressure signals. The comparison module is connected to the bridge module for outputting a level signal based on the pressure signal. The indicator module is connected to the controller and, based on the controller's output, indicates whether the stress detection of the semiconductor element has reached a threshold.

[0015] Preferably, the indicator module includes a resistor and a light-emitting diode connected thereto. Under the pressure of the detection head, the light-emitting diode remains lit until the threshold is reached, and turns off when the threshold is reached.

[0016] The beneficial effects of this utility model by adopting the above structure are as follows:

[0017] 1. By integrating a pressure sensor into the telescopic rod and using it in conjunction with a bridge module, pressure signals can be acquired in real time, thus solving the problem of inaccurate pressure control.

[0018] 2. By using the combination of the pyramidal fixing end and the clamping component, the circuit board is locked in both directions, which can prevent the circuit board from shifting. At the same time, the terminal block is integrated on the circuit board, and the pin-type crimp terminals of the semiconductor components can be used to facilitate disassembly and assembly.

[0019] 3. Design a detection unit that connects to semiconductor components, compare the pressure threshold dynamically with the comparison module, trigger the indicator light to respond instantly, realize real-time feedback of the test status, and make intuitive judgments. Attached Figure Description

[0020] Figure 1 A schematic diagram of the overall structure of a semiconductor element stress testing device provided in this application;

[0021] Figure 2 A partial structural schematic diagram of a semiconductor device stress testing apparatus provided in this application;

[0022] Figure 3 This is a schematic diagram of the internal structure of the clamping component;

[0023] Figure 4 This is a schematic diagram of the detection unit in this application;

[0024] Figure 5 This is a circuit diagram of the detection unit provided in this embodiment.

[0025] Among them, 1. base, 2. stand, 3. detection device, 4. circuit board, 5. clamping assembly, 6. detection unit, 7. light-emitting diode;

[0026] 11. Limiting rod; 12. Support platform; 13. Fixed end;

[0027] 31. Telescopic rod; 32. Detection head; 33. Pressure sensor;

[0028] 41. Terminal block; 42. Semiconductor component; 43. Pin-type crimp terminal; 44. Socket;

[0029] 51. Fixed base; 52. Adjusting component; 53. Pressure plate; 54. Sliding groove; 55. Rotating shaft; 56. Limiting hook; 57. Limiting hole;

[0030] 61. Indicator module; 62. Controller; 63. Bridge module; 64. Comparison module.

[0031] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0033] In this application, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Example

[0035] Please see Figure 1 As shown, the present invention proposes a semiconductor element stress testing device, including a base 1 and a stand 2 vertically disposed above the base 1. A liftable detection device 3 is installed on the top of the stand 2. The detection device 3 includes a telescopic rod 31 located at the top of the stand 2 and a detection head 32 located at the bottom of the telescopic rod 31. The detection head 32 can be a probe module in the prior art.

[0036] To achieve good fixation of semiconductor element 42, refer to Figure 2 and Figure 3 As shown, the base 1 is also provided with a limiting rod 11, and a detachable circuit board 4 is provided on the limiting rod 11. Clamping components 5 are provided on both sides of the base 1 to limit the two sides of the circuit board 4. A terminal block 41 is provided on the circuit board 4. The bottom of the semiconductor element 42 is provided with a pin-type crimp terminal 43 corresponding to the terminal block 41. The pin-type crimp terminal is fixed to the socket by crimping, ensuring the stability and reliability of the connection. In addition, the pin-type crimp terminal is designed to be pluggable, which facilitates connection and disconnection during testing, saving installation time and cost.

[0037] The above structure uses the terminal block 41 to limit and fix the semiconductor element 42. Additionally, the fixing and limiting of the circuit board 4 is as follows:

[0038] First, support platforms 12 are provided on both sides of the base 1, and the limiting rod 11 is located between the support platforms 12 on both sides. The limiting rod 11 is provided with a fixed end 13 in the form of a pyramid structure. The circuit board 4 is provided with a socket 44 that matches the fixed end 13 to prevent the circuit board 4 from shifting. The terminal block 41 is located directly below the detection head 32.

[0039] Secondly, the clamping components 5 on both sides further limit the position of the circuit board 4, facilitating maintenance and replacement of the circuit board 4. (Refer to...) Figure 3As shown, the clamping assembly 5 includes a fixed base 51 on the support platform 12, an adjusting member 52 rotatably disposed in the fixed base 51, and a pressure plate 53 slidably disposed above the fixed base 51 and movably connected to the adjusting member 52. The fixed base 51 has a sliding groove 54. One end of the adjusting member 52 has a rotating shaft 55 that matches the sliding groove 54, and a limiting hook 56 is provided above the rotating shaft 55. The pressure plate 53 has a vertically penetrating limiting hole 57 that matches the limiting hook 56. The pressure plate 53 is fitted and pressed tightly against the two sides of the circuit board 4.

[0040] In this structure, the insertion hole 44 of the circuit board 4 is fitted into the pyramidal fixing end 13 of the limiting rod 11. The adjusting member 52 rotates downward on the side away from the limiting hook 56, thereby pulling the pressure plate 53 outward, thus releasing the limiting of the circuit board 4. The reverse operation can limit the edge of the circuit board 4, driving the pressure plate 53 to press down and lock the edge of the circuit board 4. By using the pyramidal fixing end 13 in conjunction with the clamping assembly 5, the circuit board 4 is locked bidirectionally, which can prevent the circuit board 4 from shifting. At the same time, the integrated terminal block 41 on the circuit board 4 can be easily disassembled and assembled by using the pin-type crimp terminals 43 of the semiconductor element 42. Example

[0041] like Figure 1 As shown, to achieve precise pressure control, a pressure sensor 33 is installed at the connection between the telescopic rod 31 and the detection head 32. A detection unit 6 is installed on the circuit board 4 and connected to the terminal block 41. The pressure sensor 33 is connected to the detection unit 6 via cable or wirelessly. The detection unit 6 is integrated into the bottom PCB of the circuit board 4 and is connected to the pressure sensor 33 via a shielded cable. The controller 62 has a built-in DAC module, allowing users to write pressure threshold parameters via an external serial port.

[0042] The detection unit 6 includes an indicator module 61. The semiconductor element 42 is connected to the indicator module 61 via a terminal block 41. The indicator module 61's on / off status visually indicates whether the stress test of the semiconductor element 42 has reached the threshold. A pressure sensor 33 is integrated into the telescopic rod 31. Combined with the bridge module 63, this enables real-time pressure signal acquisition, resolving the problem of inaccurate pressure control.

[0043] Combination Figure 1 , Figure 4 and Figure 5As shown, the detection unit 6 also includes a controller 62 and a bridge module 63 and a comparison module 64 connected thereto. The pressure sensor 33 is connected to the bridge module 63 for acquiring pressure signals. The comparison module 64 is connected to the bridge module 63 for outputting a level signal based on the pressure signal. The indicator module 61 is connected to the controller 62 and, based on the output of the controller 62, indicates whether the stress detection of the semiconductor element 42 has reached the threshold.

[0044] The indicator module 61 includes a resistor and a light-emitting diode 7 connected thereto. When the semiconductor element 42 is under the pressure of the detection head 32, the light-emitting diode 7 remains on until the threshold is reached, and then turns off when the threshold is reached.

[0045] In this structure, the control telescopic rod 31 moves downward, and the detection head 32 presses the semiconductor element 42 to a set stroke. A detection unit 6 connected to the semiconductor element 42 is designed. A comparison module 64 dynamically compares the pressure threshold. When the pressure does not reach the preset threshold (e.g., 10N), the LED 7 remains constantly lit. The moment the pressure reaches the threshold, the comparison module 64 outputs a high level, and the controller 62 cuts off the current to the indicator module 61, causing the LED 7 to turn off. In this structure, the trigger indicator light responds instantly, achieving real-time feedback of the test status, allowing for intuitive judgment. The pressure-displacement curve is recorded by the pressure sensor 33, and the component's pressure resistance is determined by combining this with the indicator light status.

[0046] It should be noted that the threshold can be adjusted via the interface of controller 62, and the bridge can be as follows: Figure 5 The Wheatstone full-bridge circuit shown has its differential output connected to the positive input of the operational amplifier in comparator module 64 to improve signal sensitivity.

[0047] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A semiconductor device stress testing apparatus, comprising a base (1) and a stand (2) vertically disposed above the base (1), characterized in that: The top of the support frame (2) is equipped with a liftable detection device (3). The detection device (3) includes a telescopic rod (31) located at the top of the support frame (2) and a detection head (32) located at the bottom of the telescopic rod (31). A pressure sensor (33) is provided at the connection between the telescopic rod (31) and the detection head (32). The base (1) is also provided with a limiting rod (11), and the limiting rod (11) is provided with a detachable circuit board (4). The base (1) is provided with clamping components (5) on both sides for limiting the two sides of the circuit board (4). The circuit board (4) is provided with a terminal block (41). The bottom of the semiconductor element (42) is provided with a pin-type crimp terminal (43) corresponding to the terminal block (41) for testing and easy plugging and unplugging. The circuit board (4) is provided with a detection unit (6) connected to a terminal block (41). The detection unit (6) includes an indicator module (61). The semiconductor element (42) is connected to the indicator module (61) through the terminal block (41). The indicator module (61) can be used to visually determine whether the stress test of the semiconductor element (42) has reached the threshold.

2. The semiconductor device stress testing apparatus according to claim 1, characterized in that: The detection unit (6) also includes a controller (62) and a bridge module (63) and a comparison module (64) connected thereto. The pressure sensor (33) is connected to the bridge module (63) for collecting pressure signals. The comparison module (64) is connected to the bridge module (63) for outputting a level signal according to the pressure signal. The indicator module (61) is connected to the controller (62) and, according to the output of the controller (62), indicates whether the stress detection of the semiconductor element (42) has reached the threshold.

3. The semiconductor element stress testing device according to claim 2, characterized in that: The indicator module (61) includes a resistor and a light-emitting diode (7) connected thereto. When the semiconductor element (42) is under the pressure of the detection head (32), the light-emitting diode (7) is constantly lit before the threshold is reached, and the light-emitting diode (7) is turned off when the threshold is reached.

4. The semiconductor element stress testing device according to claim 1, characterized in that: The base (1) has support platforms (12) on both sides, and the limiting rod (11) is located between the support platforms (12) on both sides. The limiting rod (11) has a fixed end (13) with a pyramidal structure. The circuit board (4) has a socket (44) that matches the fixed end (13). The terminal block (41) is located directly below the detection head (32).

5. A semiconductor element stress testing device according to claim 4, characterized in that: The clamping assembly (5) includes a fixed seat (51) on a support platform (12), an adjusting member (52) rotatably disposed in the fixed seat (51), and a pressure plate (53) slidably disposed above the fixed seat (51) and movably connected to the adjusting member (52). The fixed seat (51) is provided with a sliding groove (54). One end of the adjusting member (52) is provided with a rotating shaft (55) that matches the sliding groove (54), and a limiting hook (56) is provided above the rotating shaft (55). The pressure plate (53) is provided with a vertically penetrating limiting hole (57) that matches the limiting hook (56). The pressure plate (53) is fitted and pressed against the two sides of the circuit board (4).

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