Hollow large current inductor and PCB circuit board

Abstract

The utility model provides a kind of hollow large current inductance and PCB circuit board, this hollow large current inductance includes base, magnetic core and coil, the magnetic core includes shell and magnetic column, the coil is wound the magnetic column and the shell surrounds the coil, the base includes installation platform and support column, the installation platform is used to install the shell, the support column is used to support the installation platform to make the installation platform overhang.This PCB circuit board includes PCB board and hollow large current inductance.Because shell is installed on installation platform, support column supports installation platform again, magnetic core and coil are all overhung, increase a heat dissipation surface.Finally realize the purpose of improving large current inductance heat dissipation efficiency.Embodiment of the utility model in PCB circuit board can realize a kind of PCB circuit board that can consider heat dissipation and improve electronic component integrated density.

Description

Technical Field

[0001] This utility model relates to the field of electronic components, and in particular to a hollow high-current inductor and PCB circuit board. Background Technology

[0002] Currently, the global electronics industry is at a critical juncture of transformation towards "higher efficiency, miniaturization, and lower carbon emissions." Driven by the "dual-carbon" strategy, power electronic systems are setting higher standards for power density, energy efficiency, and environmental friendliness. Gallium nitride (GaN) and silicon carbide (SiC), as representatives of third-generation semiconductor materials, are rapidly replacing traditional silicon-based devices due to their superior physical and electrical properties, propelling power systems towards higher frequencies, higher efficiency, and higher power density. However, the innovation of semiconductor technology and high-power-density designs necessitate high-density component mounting. This is gradually exposing structural and performance bottlenecks in supporting magnetic components, such as EMC issues, heat dissipation problems from densely packed high-current inductors, and insufficient PCB wiring space.

[0003] For example, in switching power supplies for railway systems, due to the significant increase in power density, multiple outputs are required. This leads to a substantial increase in the demand for high-power inductors that play a role in energy conversion and storage (up to 9 or more high-current inductors are used per unit). These high-current inductors are usually installed in a straight line or multiple rows of tightly packed layouts to save PCB installation area and increase the overall power density of the unit.

[0004] In traditional designs, high-current inductors typically employ a structure of flat coil + magnetic core + base, with the base mounted flat on the PCB. Because flat coils have lower current density (DCR) and the assembly offers higher winding space utilization, higher power density can be achieved. This design is particularly advantageous when using a single inductor or a small number of inductors, enabling continuous handling of high currents.

[0005] However, high-density mounting of multiple inductors reveals significant drawbacks. For example, with two rows or three rows arranged in a "nine-square grid," the high power output and large heat generation of each inductor, coupled with their dense mounting, lead to heat accumulation between them, raising the overall PCB temperature. Even with an air-cooling system, only the temperature of the outer inductors can be reduced; the central, enclosed area remains very hot, affecting overall system functionality. Separating the inductors, on the other hand, wastes PCB space and increases layout complexity.

[0006] In addition, while traditional high-current inductors can improve power density and save installation space, they still have certain shortcomings for more compact installation requirements. For example, in order to pursue higher power density designs, some solutions need to install other small components on the bottom of the inductor to further reduce the board size. The bottom of the traditional high-current inductor holder is installed close to the PCB, so there is no space for installation. Utility Model Content

[0007] To address the shortcomings of existing technologies, this invention provides a hollowed-out high-current inductor and PCB circuit board, thereby achieving a PCB circuit board that can balance heat dissipation and improve the integration density of electronic components.

[0008] To this end, in a first aspect, one embodiment provides a hollow high-current inductor, including a base, a magnetic core, and a coil. The magnetic core includes a housing and a magnetic post. The coil is wound around the magnetic post, and the housing surrounds the coil. The base includes a mounting platform and a support column. The mounting platform is used to mount the housing, and the support column is used to support the mounting platform so that the mounting platform is suspended.

[0009] As a further alternative to the hollowed-out high-current inductor, the housing has a first opening on the side facing the base.

[0010] As a further alternative to the hollowed-out high-current inductor, the base is also provided with a bayonet that connects to the mounting platform. The bayonet is adapted to the first opening to connect the housing and the mounting platform.

[0011] As a further alternative to the hollowed-out high-current inductor, the housing is also provided with a second opening, which is located on the side of the housing away from the base.

[0012] As a further alternative to the hollowed-out high-current inductor, the coil pins extend from the first opening, and the length of the pins extending out of the first opening is greater than the height of the base.

[0013] As a further alternative to the hollowed-out high-current inductor, the mounting platform also includes a limiting groove, in which the pins of the coil are located.

[0014] As a further alternative to the hollowed-out high-current inductor, the mounting platform is square-shaped, and the support columns are located at the four corners of the mounting platform.

[0015] As a further alternative to the hollowed-out high-current inductor, the connection between the mounting platform and the support column has an arc-shaped chamfer.

[0016] As a further alternative to the hollowed-out high-current inductor, the magnetic core includes a first magnetic core and a second magnetic core, the first magnetic core and the second magnetic core including part of the housing and part of the magnetic pillar, the first magnetic core and the second magnetic core combined to form the complete housing and the magnetic pillar.

[0017] In a second aspect, one embodiment provides a PCB circuit board, including a PCB board and a hollowed-out high-current inductor as described in any of the first aspects.

[0018] Implementing the embodiments of this utility model will have the following beneficial effects:

[0019] Based on the hollowed-out high-current inductor in the above embodiments, the coil is wound on a magnetic pillar, and the housing encloses the coil. The coil is used to achieve electrical connection with the PCB circuit board. Since the housing is mounted on a mounting platform, and the support pillar supports the mounting platform, both the magnetic core and the coil are suspended, increasing the heat dissipation surface and thus improving the heat dissipation efficiency of the high-current inductor. Alternatively, other electronic components can be installed in the suspended area, thereby increasing the integration density of electronic components.

[0020] According to the PCB circuit board in the above embodiments, due to the use of the hollowed-out high-current inductor of the first aspect, there is a gap between the PCB board and the inductor. This gap can increase the heat dissipation channel and can also be used to install other electronic components. Implementing the PCB circuit board of this utility model can realize a PCB circuit board that can take into account both heat dissipation and improve the integration density of electronic components. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] in:

[0023] Figure 1 A schematic diagram of the overall structure of the hollow high-current inductor provided according to an embodiment of the present invention is shown;

[0024] Figure 2 This shows a schematic diagram of the overall structure of the hollow high-current inductor provided according to an embodiment of the present invention from another angle;

[0025] Figure 3 An exploded view of the hollow high-current inductor provided according to an embodiment of the present invention is shown;

[0026] Figure 4A schematic diagram of the overall structure of the base provided according to an embodiment of the present utility model is shown;

[0027] Figure 5 A schematic diagram of the overall structure of the magnetic core provided according to an embodiment of the present invention is shown.

[0028] Explanation of key component symbols:

[0029] Base-10; Magnetic core-20; Coil-30; Housing-210; Magnetic column-220; First magnetic core-230; Second magnetic core-240; Pin-310; Mounting platform-110; Support column-120; First opening-250; Bayonet-1110; Limiting groove-1120; Chamfered corner-130; Second opening-260. Detailed Implementation

[0030] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] Firstly, this utility model provides a hollowed-out high-current inductor; please refer to [reference needed]. Figures 1-5 The hollow high-current inductor includes a base 10, a magnetic core 20, and a coil 30. The magnetic core 20 includes a housing 210 and a magnetic post 220. The coil 30 includes two leads 310. The coil 30 is wound around the magnetic post 220 and the housing 210 surrounds the coil 30. The base 10 includes a mounting platform 110 and a support post 120. The mounting platform 110 is used to mount the housing 210, and the support post 120 is used to support the mounting platform 110 so that the mounting platform 110 is suspended.

[0034] Based on the hollowed-out high-current inductor in the above embodiments, the coil 30 is wound on the magnetic post 220, and the housing 210 encloses the coil 30. The two pins 310 of the coil 30 are used for electrical connection with the PCB circuit board. Since the housing 210 is mounted on the mounting platform 110, and the support post 120 supports the mounting platform 110, both the magnetic core 20 and the coil 30 are suspended, increasing the heat dissipation surface and thus improving the heat dissipation efficiency of the high-current inductor. Alternatively, other electronic components can be installed in the suspended area, thereby increasing the integration density of electronic components.

[0035] In the process of air-cooled heat dissipation, the venturi effect is generated by the hollowed-out narrow slit structure, which accelerates the local airflow speed and improves the convective heat transfer coefficient.

[0036] Through innovative design of the base 10 structure, the problems of severe heat accumulation, low air-cooling efficiency, and difficulty in airflow through the inductor, which are common in traditional high-current inductor products, are solved. Even when multiple inductors are installed together, effective heat dissipation is achieved. With improved heat dissipation, the inductor can handle higher power densities, achieving high efficiency and miniaturization.

[0037] The base 10 can be made of engineering plastics such as LCP, bakelite, and nylon, or it can be made of metal.

[0038] Pin 310, also known as the PIN, is the start and end point of coil 30 and the only way for the inductor to communicate with external circuits. It is usually soldered onto PCB pads. Its surface is treated with paint removal and tin plating to prevent oxidation and ensure easier soldering during the soldering process.

[0039] In the inductor, the magnetic core 20 can concentrate and guide the magnetic lines of force, significantly enhancing the magnetic field strength and increasing the permeability. This allows for the use of fewer coil turns 30 to achieve the required inductance, thereby reducing the size of the inductor and increasing the energy density of the product.

[0040] In some specific embodiments, the side of the housing 210 facing the base 10 has a first opening 250.

[0041] For high-current inductors, the heat generated is mainly due to the current flowing through coil 30, which in turn generates heat. The first opening 250 allows the heat generated by coil 30 to be dissipated quickly. Electronic devices are typically equipped with air cooling. Air can pass through the gap between the magnetic core 20 and the PCB board, which increases the inductor's internal and external heat exchange capabilities.

[0042] In some specific embodiments, the base 10 is also provided with a bayonet 1110, which is connected to the mounting platform 110. The bayonet 1110 is adapted to the first opening 250 to connect the housing 210 and the mounting platform 110.

[0043] The bayonet 1110 is engaged at the first opening 250. The bayonet 1110 and the magnetic core 20 have a simple mechanical interlock design, which effectively improves the assembly efficiency of the product and reduces the risk of the magnetic core 20 disengaging from the base 10 due to vibration during equipment operation.

[0044] It should be noted that, in order to further strengthen the connection between the base 10 and the housing 210, the base 10 and the housing 210 will also be bonded together with glue.

[0045] In some specific embodiments, the housing 210 is further provided with a second opening 260, which is located on the side of the housing 210 away from the base 10.

[0046] In this embodiment, the second opening 260 is located at the top, thereby increasing the convection efficiency between the inductor and the air. Typically, existing inductors have side openings. However, if the inductor array is arranged, the side openings can be blocked by other inductors, resulting in a loss of heat dissipation efficiency. In this embodiment, the second opening 260 is located at the top, and the first opening 250 is located at the bottom; arranging multiple inductors together does not affect air convection for heat dissipation.

[0047] In some specific embodiments, pin 310 extends from the first opening 250, and the length of pin 310 extending from the first opening 250 is greater than the height of the base 10.

[0048] The PCB board usually has pre-set solder holes. The pin 310 can be inserted into the solder holes, and then the pin 310 is fixed to the PCB board with solder. The length of the pin 310 extending out of the first opening 250 exceeds the height of the base 10 to prevent the inductor from being unstable in its connection with the circuit board.

[0049] In some specific embodiments, the mounting platform 110 also includes a limiting groove 1120, and the pin 310 is disposed in the limiting groove 1120.

[0050] Pin 310 is inserted into the limiting slot 1120. Since the position of the limiting slot 1120 on the mounting platform 110 is fixed, the position of pin 310 is also fixed. This ensures the consistency of the manufactured inductors, thus facilitating the connection and alignment of the hollowed-out high-current inductor with the PCB board. The mechanical constraint of the limiting slot 1120 eliminates pin 310 misalignment caused by human or equipment errors, reducing the cost of manual intervention during product assembly and improving the consistency of the finished PCB board.

[0051] It should be noted that the limiting groove 1120 is generally equipped with a guide design, which can prevent mechanical stress during assembly from damaging the paint film of the pin 310.

[0052] In some specific embodiments, the mounting platform 110 is in the shape of a square frame, and the support columns 120 are located at the four corners of the mounting platform 110.

[0053] The mounting platform 110 is rectangular, with support columns 120 positioned at its four corners. This arrangement creates airflow channels in all directions on a plane parallel to the PCB board, eliminating the need to restrict the orientation of the electronic cooling fan.

[0054] Furthermore, the four support columns have a large load-bearing capacity of 120, which enhances the stability of the hollowed-out high-current inductor mounted on the PCB. Even in environments with significant vibration, the hollowed-out high-current inductor is less prone to wobbling.

[0055] In some specific embodiments, the connection between the mounting platform 110 and the support column 120 has an arc-shaped chamfer 130.

[0056] From an engineering mechanics perspective, the 130° chamfer design reduces stress concentration and improves the structural strength of the base 10. For the base 10, the lateral load-bearing area is increased, thus increasing its bending stiffness.

[0057] In some specific embodiments, the magnetic core 20 includes a first magnetic core 230 and a second magnetic core 240. The first magnetic core 230 and the second magnetic core 240 include a partial housing 210 and a partial magnetic pillar 220. The first magnetic core 230 and the second magnetic core 240 are combined to form a complete housing 210 and magnetic pillar 220.

[0058] The first magnetic core 230 and the second magnetic core 240 are generally symmetrical. The wound coil 30 can be placed between the first magnetic core 230 and the second magnetic core 240 first. Then, the first magnetic core 230 and the second magnetic core 240 are joined together, thus completing the magnetic post 220 and the housing 210. At this point, the coil 30 is also fixed by the magnetic core 20. The fixing between the first magnetic core 230 and the second magnetic core 240 can be achieved by adhesive bonding or by sintering.

[0059] The first magnetic core 230 and the second magnetic core 240 can be called EQ type magnetic cores. The EQ type magnetic core is composed of two symmetrical left and right parts, resembling a combination of the letters "E" and "Q". The central column has a large cross-sectional area, and the side columns are symmetrically distributed. After the first magnetic core 230 and the second magnetic core 240 are assembled, they form a closed magnetic circuit.

[0060] Secondly, this utility model provides a PCB circuit board, including a PCB board and any of the hollowed-out high-current inductors in the first aspect.

[0061] According to the PCB circuit board in the above embodiments, due to the use of the hollowed-out high-current inductor of the first aspect, there is a gap between the PCB board and the inductor. This gap can increase the heat dissipation channel and can also be used to install other electronic components. Implementing the PCB circuit board of this utility model can realize a PCB circuit board that can take into account both heat dissipation and improve the integration density of electronic components.

[0062] In some specific embodiments, there are multiple hollow high-current inductors, and multiple hollow high-current inductors are arranged in an array.

[0063] Multiple hollowed-out high-current inductor arrays are arranged so that airflow in electronic devices can flow on both the top and bottom surfaces of the hollowed-out high-current inductors, thereby achieving higher power density of the inductors without reducing the heat dissipation capacity of the entire PCB board.

[0064] In this embodiment, while improving the heat dissipation capacity of the inductors, multiple inductors can be installed closer together (e.g., in a nine-square grid arrangement), achieving a high-density layout, effectively improving the utilization rate of PCB board layout space, and reducing layout complexity and cost. Through the structural design of the base 10, the utilization rate of the PCB board mounting area can be greatly improved, and the hollowed-out area at the bottom of the inductor also supports the installation of small-volume components, further increasing the PCB board layout density.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A hollow-type high-current inductor, characterized in that, The device includes a base, a magnetic core, and a coil. The magnetic core includes a housing and a magnetic column. The coil is wound around the magnetic column and the housing surrounds the coil. The base includes a mounting platform and a support column. The mounting platform is used to mount the housing, and the support column is used to support the mounting platform so that the mounting platform is suspended.

2. The hollowed-out high-current inductor as described in claim 1, characterized in that, The housing has a first opening on the side facing the base.

3. The hollowed-out high-current inductor as described in claim 2, characterized in that, The base is also provided with a bayonet, which is connected to the mounting platform. The bayonet is adapted to the first opening to connect the housing and the mounting platform.

4. The hollowed-out high-current inductor as described in claim 1, characterized in that, The housing also has a second opening, which is located on the side of the housing away from the base.

5. The hollowed-out high-current inductor as described in claim 2, characterized in that, The coil pins extend from the first opening, and the length of the pins extending out of the first opening is greater than the height of the base.

6. The hollowed-out high-current inductor as described in claim 1, characterized in that, The mounting platform also includes a limiting groove, and the pins of the coil are located in the limiting groove.

7. The hollowed-out high-current inductor as described in claim 1, characterized in that, The mounting platform is square in shape, and the support columns are located at the four corners of the mounting platform.

8. The hollowed-out high-current inductor as described in claim 7, characterized in that, The connection between the mounting platform and the support column has a rounded chamfer.

9. The hollowed-out high-current inductor as described in claim 1, characterized in that, The magnetic core includes a first magnetic core and a second magnetic core. The first magnetic core and the second magnetic core include a portion of the housing and a portion of the magnetic column. The first magnetic core and the second magnetic core are combined to form the complete housing and the magnetic column.

10. A PCB circuit board, characterized in that, Includes a PCB board and a hollowed-out high-current inductor as described in any one of claims 1-8.

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