A micro speaker module

Abstract

The utility model provides a kind of micro loudspeaker module, belong to loudspeaker module technical field. Including shell, further include: buffer component, buffer component is placed in the inside of shell, buffer component includes the protective shell being set in the inside of shell, the inside of protective shell is provided with circuit board, the end of the inside of shell close to circuit board is provided with spring piece, spring piece is annular array distribution on shell;Fixed component, fixed component is placed in the inside of shell and is used to fix spring piece, fixed component includes being connected in the inside of shell close to support, the side of support close to spring piece is provided with clamping groove, spring piece is clamped with support by clamping groove;By setting buffer component, protective shell outside and annular arrangement spring piece on shell contact, when protective shell is impacted by force and generates displacement in shell and extrudes spring piece, spring piece is buffered by the deformation of itself, to protect circuit board, avoid its damage due to excessive impact force, help to improve the stability of micro loudspeaker module when using.

Description

Technical Field

[0001] This utility model relates to the field of loudspeaker module technology, and in particular to a miniature loudspeaker module. Background Technology

[0002] A miniature speaker module is a highly integrated and miniaturized audio output device that encapsulates a speaker unit with necessary auxiliary circuitry, acoustic structure, and even signal processing functions into a compact unit.

[0003] Existing miniature speaker modules are small in size and light in weight, which allows system integrators to add more sensors or use larger capacity batteries, creating conditions for realizing more functions or improving the device's battery life, and thus improving the product's practicality.

[0004] However, in practical applications, existing miniature speaker modules typically use adhesive to fix the circuit board inside the housing. Although this fixing method can form an elastic buffer layer after the adhesive solidifies, the circuit board is in contact with the housing. When the impact force on the housing is too large, the elastic buffer layer still cannot protect the circuit board, resulting in damage to the circuit board. This is not conducive to improving the stability of the miniature speaker module during use.

[0005] Therefore, this application provides a miniature speaker module to meet the requirements. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies and propose a miniature speaker module.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a miniature speaker module, including a housing, and further comprising:

[0008] A buffer assembly is located inside the outer shell. The buffer assembly includes a protective shell disposed inside the outer shell. A circuit board is disposed inside the protective shell. A spring is disposed inside the outer shell near one end of the circuit board. The springs are distributed in a ring array on the outer shell.

[0009] A fixing component is placed inside the housing and used to fix the spring piece. The fixing component includes a bracket connected to the inside of the housing. The bracket has a snap-fit ​​groove on the side near the spring piece, and the spring piece snaps into the bracket through the snap-fit ​​groove.

[0010] Furthermore, a speaker body is connected to the top of the housing.

[0011] The advantages of adopting the above-mentioned further solution are: it facilitates the improvement of the stability of the connection between the speaker body and the shell, and the use of a data cable to connect the speaker body and the circuit board ensures the connection between the speaker body and the circuit board.

[0012] Furthermore, an elastic pad is provided between the protective shell and the outer shell, and the elastic pad is connected to the outer shell.

[0013] The beneficial effect of adopting the above-mentioned further solution is that it enables the elastic soft pad to buffer the impact force from the bottom of the protective shell, which is conducive to more comprehensive protection of the circuit board.

[0014] Furthermore, a cover plate is provided on the top of the protective shell, and a snap-fit ​​post is connected to the side of the cover plate near the protective shell. The cover plate is snapped into the protective shell through the snap-fit ​​post.

[0015] The beneficial effect of adopting the above-mentioned further solution is that the cover plate is snapped onto the protective shell, which makes it easier to fix the circuit board between the cover plate and the protective shell, ensuring the stability of the circuit board installation.

[0016] Furthermore, the snap-fit ​​post is provided with an anti-slip coating.

[0017] The beneficial effect of adopting the above-mentioned further solution is that the anti-slip coating increases the friction between the snap-fit ​​post and the protective shell, making the cover plate more firmly fixed.

[0018] Furthermore, a fixing block is connected to the top of the cover plate.

[0019] The beneficial effect of adopting the above-mentioned further solution is that fixing the cover plate to the top of the protective shell further strengthens the connection between the protective shell and the cover plate, and improves the stability of the circuit board after installation.

[0020] Furthermore, cable trays are provided on the protective shell, cover plate, and fixing block.

[0021] The beneficial effect of adopting the above-mentioned further solution is that: opening a ribbon cable port allows the data cable to pass through the ribbon cable port and connect to the circuit board, thereby facilitating the connection and ribbon cable arrangement of the data cable.

[0022] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0023] 1. By setting up a buffer component, the circuit board is placed inside the protective shell, and then the two are installed together into the outer shell. At this time, the outer side of the protective shell contacts the springs arranged in a ring on the outer shell. When the protective shell is impacted and displaced inside the outer shell and squeezes the springs, the springs buffer the impact through their own deformation, thereby protecting the circuit board and preventing it from being damaged due to excessive impact. This helps to improve the stability of the miniature speaker module during use.

[0024] 2. By setting a fixing component and attaching a bracket inside the shell, the bracket is used to compress the spring sheet, shortening its length. The spring sheet can then be more easily snapped into the snap-fit ​​groove. The snap-fit ​​groove can effectively fix the spring sheet, prevent it from shifting, and ensure that the spring sheet remains stable during use. This allows for a uniform and efficient cushioning effect for the protective shell. Attached Figure Description

[0025] Figure 1 This is a front view of a miniature speaker module according to the present invention;

[0026] Figure 2 This is a structural diagram of a buffer component in a miniature speaker module according to the present invention;

[0027] Figure 3 This is an exploded view of the buffer component in a miniature speaker module according to the present invention;

[0028] Figure 4 This is a cross-sectional view of the fixing component in a miniature speaker module according to the present invention;

[0029] Figure 5 This is a cross-sectional view of the buffer component in a miniature speaker module according to the present invention.

[0030] Figure Labels

[0031] 1. Outer shell;

[0032] 2. Buffer assembly; 21. Protective shell; 22. Circuit board; 23. Spring; 24. Speaker body; 25. Elastic pad; 26. Cover plate; 27. Clip-on post; 28. Anti-slip coating; 29. ​​Fixing block

[0033] 3. Fixing components; 31. Bracket; 32. Snap-fit ​​slot;

[0034] 4. Cable tray. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] like Figures 1-5 As shown, this utility model provides a technical solution: a miniature speaker module, including a housing 1, and further comprising:

[0037] like Figures 1-4As shown, the buffer assembly 2 is placed inside the outer shell 1. The buffer assembly 2 includes a protective shell 21 disposed inside the outer shell 1. A circuit board 22 is disposed inside the protective shell 21. A spring piece 23 is disposed inside the outer shell 1 near the end of the circuit board 22. The spring pieces 23 are distributed in a ring array on the outer shell 1.

[0038] like Figures 1-4 As shown, the fixing component 3 is placed inside the housing 1 and used to fix the spring piece 23. The fixing component 3 includes a bracket 31 connected to the inside of the housing 1. The bracket 31 has a snap-fit ​​groove 32 on the side near the spring piece 23. The spring piece 23 is snapped into the bracket 31 through the snap-fit ​​groove 32. By placing the circuit board 22 inside the protective shell 21 and placing it together with the protective shell 21 inside the housing 1, the outer side of the protective shell 21 contacts the spring piece 23. Since the spring piece 23 is arranged in a ring on the housing 1, when the protective shell 21 is subjected to an impact force, it causes the spring piece 23 to be in contact with the outer side of the housing 1. When displacement occurs inside the housing 1, the spring 23 buffers the impact on the protective shell 21, thereby protecting the circuit board 22. This solves the problem of damage to the circuit board 22 caused by excessive impact force and helps improve the stability of the miniature speaker module during use. Furthermore, by attaching the bracket 31 to the inside of the housing 1, the spring 23 is compressed, reducing its length. This makes it easier to snap the spring 23 into the inside of the snap-fit ​​groove 32, keeping the spring 23 stable inside the snap-fit ​​groove 32 and preventing the spring 23 from shifting. This ensures that the spring 23 can provide uniform buffering for the protective shell 21.

[0039] Furthermore, such as Figure 1 As shown, the top of the housing 1 is connected to the speaker body 24. The four corners of the speaker body 24 are fixed to the top of the housing 1 by using four bolts to improve the stability of the connection between the speaker body 24 and the housing 1. Then, a data cable is used to connect the speaker body 24 and the circuit board 22 to ensure the communication between the speaker body 24 and the circuit board 22.

[0040] Furthermore, such as Figure 3 As shown, an elastic pad 25 is provided between the protective shell 21 and the outer shell 1. The elastic pad 25 is connected to the outer shell 1. By adhering the elastic pad 25 to the bottom of the outer shell 1, when the protective shell 21 is installed inside the outer shell 1, the elastic pad 25 can buffer the impact force from the bottom of the protective shell 21, which is beneficial to more comprehensively protect the circuit board 22.

[0041] Furthermore, such as Figure 3As shown, a cover plate 26 is provided on the top of the protective shell 21. A snap-fit ​​post 27 is connected to the side of the cover plate 26 near the protective shell 21. The cover plate 26 is snapped onto the protective shell 21 through the snap-fit ​​post 27. By opening a snap-fit ​​groove 32 on the protective shell 21 that matches the snap-fit ​​post 27, the snap-fit ​​post 27 is inserted into the snap-fit ​​groove 32, and the cover plate 26 is snapped onto the protective shell 21. This facilitates the fixing of the circuit board 22 between the cover plate 26 and the protective shell 21, ensuring the stable installation of the circuit board 22.

[0042] Furthermore, such as Figure 5 As shown, the snap-fit ​​post 27 is provided with an anti-slip coating 28. By spraying the anti-slip coating 28 onto the snap-fit ​​post 27, when the snap-fit ​​post 27 is inserted into the snap-fit ​​groove 32, the anti-slip coating 28 increases the friction between the snap-fit ​​post 27 and the protective shell 21, making the cover plate 26 more firmly fixed.

[0043] Furthermore, such as Figure 5 As shown, a fixing block 29 is connected to the top of the cover plate 26. By attaching the fixing block 29 to the top of the cover plate 26, when the fixing block 29 fills the gap between the cover plate 26 and the speaker body 24, the cover plate 26 is fixed to the top of the protective shell 21, thereby further strengthening the connection between the protective shell 21 and the cover plate 26 and improving the stability of the circuit board 22 after installation.

[0044] Furthermore, such as Figure 5 As shown, the protective shell 21, cover plate 26 and fixing block 29 are all provided with cable routing ports 4. By providing cable routing ports 4, the data cable passes through the cable routing ports 4 and is connected to the circuit board 22, thereby facilitating the connection and routing of the data cable.

[0045] Working principle: such as Figures 1-5As shown, first place the circuit board 22 inside the protective shell 21, then place the cover plate 26 on top of the protective shell 21, so that the snap-fit ​​post 27 snaps into the snap-fit ​​groove 32 on the protective shell 21. The anti-slip coating 28 increases the friction between the snap-fit ​​post 27 and the protective shell 21, thus initially fixing the cover plate 26. Connect the circuit board 22 and the speaker body 24 with the data cable and run the cable through the cable tray 4. Place the protective shell 21 on the elastic pad 25 at the bottom of the outer shell 1. At this time, the protective shell 21 is in contact with the spring piece 23. Then, install the speaker body 24 on top of the outer shell 1. In the speaker module, the speaker body 24 is pressed against the cover plate 26 by the fixing block 29, and the cover plate 26 is completely fixed to the protective shell 21. When the protective shell 21 is subjected to an accidental impact during use, the elastic soft pad 25 initially buffers the impact force transmitted to the protective shell 21. When the impact force hits the outer shell 1 from the side, the protective shell 21 is forced to move the circuit board 22 inside the outer shell 1 and squeeze the spring piece 23. At this time, the spring piece 23 buffers the impact force on the protective shell 21 through its own deformation, thereby protecting the circuit board 22 and improving the stability of the miniature speaker module during use.

[0046] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A miniature speaker module, comprising a housing (1), characterized in that, Also includes: A buffer assembly (2) is placed inside the outer shell (1). The buffer assembly (2) includes a protective shell (21) disposed inside the outer shell (1). A circuit board (22) is disposed inside the protective shell (21). A spring piece (23) is disposed inside the outer shell (1) near the circuit board (22). The spring pieces (23) are arranged in a ring array on the outer shell (1). A fixing component (3) is placed inside the housing (1) and used to fix the spring piece (23). The fixing component (3) includes a bracket (31) connected to the inside of the housing (1). The bracket (31) has a snap-fit ​​groove (32) on the side near the spring piece (23). The spring piece (23) is snapped into the bracket (31) through the snap-fit ​​groove (32).

2. A miniature speaker module according to claim 1, characterized in that, The top of the housing (1) is connected to the speaker body (24).

3. A miniature speaker module according to claim 1, characterized in that, An elastic pad (25) is provided between the protective shell (21) and the outer shell (1), and the elastic pad (25) is connected to the outer shell (1).

4. A miniature speaker module according to claim 1, characterized in that, The top of the protective shell (21) is provided with a cover plate (26), and a snap-fit ​​post (27) is connected to the side of the cover plate (26) near the protective shell (21). The cover plate (26) is snapped to the protective shell (21) through the snap-fit ​​post (27).

5. A miniature speaker module according to claim 4, characterized in that, The snap-fit ​​post (27) is provided with an anti-slip coating (28).

6. A miniature speaker module according to claim 4, characterized in that, A fixing block (29) is connected to the top of the cover plate (26).

7. A miniature speaker module according to claim 1, characterized in that, Cable trays (4) are provided on the protective shell (21), cover plate (26) and fixing block (29).

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