A shock absorbing cushion circuit board

Abstract

The utility model belongs to the field of electronic engineering especially relates to a shock attenuation buffer circuit board, including bottom plate, frame and circuit board body, bottom plate fixedly connected in the lower part of frame, its bottom surface keeps flush with frame, circuit board body is placed in the inside of frame and slides, the many corners of bottom plate and circuit board body all are equipped with an installation groove, and the installation groove on circuit board body and the installation groove on bottom plate are vertically aligned. Through the buffer structure that contact plate, fin group and damper constitute, the external vibration energy is effectively absorbed, the stability and service life of circuit board body under high vibration environment are significantly improved, at the same time, through the cooperation of limiting frame, guide rod, sliding plate, press plate and return spring, the compression fixed of circuit board mounting bolt is realized, prevents the loosening or falling of bolt due to vibration, thereby improves the reliability and security of overall structure.

Description

Technical Field

[0001] This utility model belongs to the field of electronic engineering, and in particular relates to a shock-absorbing and buffering circuit board. Background Technology

[0002] With the continuous development of electronic technology, circuit boards have become an indispensable basic component in modern electronic devices. They not only provide mechanical support for various electronic components, but also realize the electrical connection between components through conductive paths on their surface or inside, playing an important role in many fields such as communications, computers, industrial control, and automotive electronics.

[0003] However, in current circuit board applications, most circuit boards are usually directly fixed inside the equipment during installation and use. When the equipment is in a high-vibration working environment for a long time, the circuit board is prone to problems such as solder joint cracking, circuit breakage, and component detachment due to mechanical stress. These problems not only reduce the working stability of the circuit board, but may also shorten its service life. In severe cases, they may even cause circuit system failure, resulting in abnormal equipment operation and bringing unpredictable safety risks and economic losses.

[0004] Therefore, a shock-absorbing circuit board is particularly needed to solve the above problems. Utility Model Content

[0005] In order to overcome the disadvantage that circuit boards are prone to structural damage and system failure due to vibration, this utility model provides a shock-absorbing circuit board.

[0006] This utility model is achieved through the following technical means: a shock-absorbing and buffering circuit board, including a base plate, a frame, and a circuit board body. The base plate is fixed to the lower inner part of the frame, and its bottom surface is flush with the frame. The circuit board body is slidably placed inside the frame. Multiple corners of the base plate and the circuit board body are provided with mounting grooves, and the mounting grooves on the circuit board body are vertically aligned with the mounting grooves on the base plate. It also includes a contact plate, a heat sink assembly, a damper, a limit bracket, a guide rod, a sliding plate, a pressure plate, and a return spring. The contact plate is also slidably placed inside the frame and located below the circuit board body for heat dissipation. The heat sink assembly is fixed to the bottom of the contact plate. Multiple dampers are arranged in a U-shape between the heat sink assembly and the base plate. The fixed end of each damper is fixedly connected to the base plate, and the movable end is fixedly connected to the heat sink assembly. The limit frame is installed on the upper part of the frame. Two guide rods are fixedly connected inside the frame. Two sliding plates are slidably arranged between the two guide rods. A pressure plate is slidably arranged on each sliding plate. The bottom surface of the pressure plate is higher than the mounting groove of the circuit board body. A return spring is sleeved at both ends of each pressure plate. The two ends of the return spring are fixedly connected to the corresponding pressure plate and the corresponding sliding plate, respectively.

[0007] Optionally, it also includes a buffer airbag and connecting pipes. The buffer airbag is fixed to the top of the base plate, multiple dampers are distributed around the buffer airbag, the heat sink assembly is located above the buffer airbag, and two connecting pipes are fixed to one side of the buffer airbag and arranged side by side. The two connecting pipes pass through the frame, and one of the connecting pipes is a one-way air intake pipe and the other connecting pipe is a one-way exhaust pipe.

[0008] Optionally, it also includes a limiting frame, which is fixed to the top of the base plate and located inside the frame, and the total area of ​​the bottom of the heat sink assembly is consistent with the area of ​​the inner cavity of the limiting frame.

[0009] Optionally, it also includes a pull rod, with one pull rod fixed to the top of each sliding plate.

[0010] Optionally, multiple heat dissipation holes are reserved on all four sides of the frame, and the heat sink assembly is at the same height as the heat dissipation holes.

[0011] Optionally, the guide rod is a damping rod.

[0012] Beneficial effects: 1. The buffer structure composed of contact plate, heat sink assembly and damper effectively absorbs external vibration energy, significantly improving the stability and service life of the circuit board body in high vibration environment. At the same time, through the coordinated cooperation of limit frame, guide rod, sliding plate, pressure plate and return spring, the circuit board mounting bolts are tightened and fixed, preventing the bolts from loosening or falling off due to vibration, thereby improving the reliability and safety of the overall structure.

[0013] 2. The air pressure buffer system, consisting of a buffer airbag and a connecting pipe, allows the heat sink assembly to press down on the buffer airbag when the circuit board is subjected to vibration. This causes the gas inside the buffer airbag to be discharged through the connecting pipe on the right side, achieving secondary buffering and further enhancing the shock absorption effect. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0015] Figure 2 This is a three-dimensional structural diagram of the frame, circuit board body, and mounting groove of this utility model.

[0016] Figure 3 This is a three-dimensional structural diagram of the components of this utility model, including the limiting frame, guide rod, and sliding plate.

[0017] Figure 4 This is a first partial sectional view of the frame component of this utility model.

[0018] Figure 5 This is a second partial sectional view of the frame component of this utility model.

[0019] Figure 6This is a third partial sectional view of the frame component of this utility model.

[0020] Figure 7 This is a three-dimensional structural diagram of the base plate, heat sink assembly, and damper components of this utility model.

[0021] The markings in the attached diagram are: 1. Base plate, 2. Frame, 3. Circuit board body, 4. Mounting slot, 5. Contact plate, 6. Heat sink assembly, 7. Damper, 8. Limiting frame, 9. Buffer airbag, 10. Connecting pipe, 11. Limiting bracket, 12. Guide rod, 13. Sliding plate, 14. Pressure plate, 15. Return spring, 16. Pull rod. Detailed Implementation

[0022] Example: A shock-absorbing and buffering circuit board, such as Figures 1-7 As shown, the system includes a base plate 1, a frame 2, and a circuit board body 3. The base plate 1 is fixedly connected to the lower inner part of the frame 2, and its bottom surface is flush with the frame 2. The circuit board body 3 is slidably placed inside the frame 2. A mounting slot 4 is provided on each of the four corners of the base plate 1 and the circuit board body 3, and the mounting slots 4 on the circuit board body 3 are vertically aligned with the mounting slots 4 on the base plate 1. The system also includes a contact plate 5, a heat sink assembly 6, a damper 7, a limit bracket 11, a guide rod 12, a sliding plate 13, a pressure plate 14, a return spring 15, and a pull rod 16. The contact plate 5 is also slidably placed inside the frame 2 and located below the circuit board body 3. The heat sink assembly 6 is fixedly connected to the bottom of the contact plate 5. Multiple heat dissipation holes are reserved on the four sides of the frame 2. The heat sink assembly 6 is at the same height as the heat dissipation holes to ensure that the heat generated by the circuit board body 3 during operation can be efficiently dissipated. A U-shaped distribution of heat sinks is provided between the heat sink assembly 6 and the base plate 1. Four dampers 7 are provided. The fixed end of each damper 7 is fixedly connected to the base plate 1, and the movable end is fixedly connected to the heat sink assembly 6. The limit frame 11 is bolted to the upper part of the frame 2. Two guide rods 12 are fixedly connected inside the frame 2. Two sliding plates 13 are slidably arranged between the two guide rods 12. A pressure plate 14 is slidably arranged on each sliding plate 13. The bottom surface of the pressure plate 14 is higher than the mounting groove 4 of the circuit board body 3. The guide rods 12 are damping rods with a certain sliding resistance, which can further improve the stability of the sliding plate 13 during the sliding process and prevent the sliding plate 13 from being displaced by the pressure plate 14 due to external force. A return spring 15 is sleeved on both the left and right ends of each pressure plate 14. The upper and lower ends of the return spring 15 are fixedly connected to the corresponding pressure plate 14 and the corresponding sliding plate 13, respectively, to provide a reset force for the pressure plate 14. A pull rod 16 is fixedly connected at the center of the top of each sliding plate 13.

[0023] like Figure 1 , Figure 4 , Figure 5 and Figure 6As shown, it also includes a limiting frame 8, a buffer airbag 9, and a connecting pipe 10. The buffer airbag 9 is fixedly connected to the top of the base plate 1. Four dampers 7 are distributed around the buffer airbag 9. The heat sink assembly 6 is located above the buffer airbag 9. Two connecting pipes 10 are fixedly connected to the front of the buffer airbag 9 and are arranged side by side. The two connecting pipes 10 pass through the frame 2. The left connecting pipe 10 is a one-way air inlet pipe, and the right connecting pipe 10 is a one-way exhaust pipe. When the heat sink assembly 6 is vibrated and pressed down, the air pressure inside the buffer airbag 9 increases, and the gas is discharged through the right connecting pipe 10 to achieve the buffering effect. When the vibration weakens and the buffer airbag 9 recovers its deformation, it draws in external air through the left connecting pipe 10 to complete the buffering cycle. The limiting frame 8 is fixedly connected to the top of the base plate 1 and is located inside the frame 2. The total area of ​​the bottom of the heat sink assembly 6 is consistent with the inner cavity area of ​​the limiting frame 8 to ensure that the heat sink assembly 6 can accurately slide into the limiting frame 8 during the downward movement and make close contact with the buffer airbag 9.

[0024] When the circuit board is needed, the operator first places the circuit board in the installation position of the equipment, and then screws the bolts into the mounting groove 4 between the circuit board body 3 and the base plate 1 in sequence. The bolts will install the frame 2 on the equipment through the mounting groove 4 on the base plate 1, thus realizing the installation of the circuit board.

[0025] Next, pull the pressure plate 14 upwards in sequence. The return spring 15 is compressed. Then, hold the pull rod 16 and move the sliding plate 13 to the appropriate position so that the pressure plate 14 is directly above the bolt. At this time, release the pressure plate 14. The return spring 15 quickly returns to its original state, pushes the pressure plate 14 downwards and presses down on the bolt to prevent it from loosening or falling off due to vibration.

[0026] When the equipment is in a high-vibration working environment, the vibration of the circuit board body 3 will be transmitted to the heat sink assembly 6 through the contact plate 5. The vibration energy of the heat sink assembly 6 is absorbed by the damper 7. At the same time, the heat sink assembly 6 slides into the limit frame 8 during vibration, accurately contacting and squeezing the buffer airbag 9. At this time, the gas inside the buffer airbag 9 is discharged through the right connecting pipe 10, which plays a further buffering role. When the vibration weakens and the buffer airbag 9 recovers its deformation, it draws in external gas through the left connecting pipe 10 to complete the gas circulation and prepare for the next buffering process.

Claims

1. A shock-absorbing and buffering circuit board, comprising a base plate (1), a frame (2), and a circuit board body (3), wherein the base plate (1) is fixedly connected to the lower inner part of the frame (2), and its bottom surface is flush with the frame (2); the circuit board body (3) is slidably placed inside the frame (2); a mounting groove (4) is provided on multiple corners of the base plate (1) and the circuit board body (3), and the mounting groove (4) on the circuit board body (3) is perpendicularly aligned with the mounting groove (4) on the base plate (1); characterized in that: It also includes a contact plate (5), a heat sink assembly (6), a damper (7), a limit bracket (11), a guide rod (12), a sliding plate (13), a pressure plate (14), and a return spring (15). The contact plate (5) is also slidably placed inside the frame (2) and located below the circuit board body (3). The heat sink assembly (6) is fixed to the bottom of the contact plate (5). Multiple dampers (7) are arranged in a U-shape between the heat sink assembly (6) and the base plate (1). The fixed end of each damper (7) is fixedly connected to the base plate (1), and the movable end is connected to the heat sink assembly (6). The fixed connection is that the limiting frame (11) is installed on the upper part of the frame (2), and two guide rods (12) are fixedly connected inside it. Two sliding plates (13) are slidably arranged between the two guide rods (12). A pressure plate (14) is slidably arranged on each sliding plate (13). The bottom surface of the pressure plate (14) is higher than the mounting groove (4) of the circuit board body (3). A return spring (15) is sleeved at both ends of each pressure plate (14). The two ends of the return spring (15) are fixedly connected to the corresponding pressure plate (14) and the corresponding sliding plate (13) respectively.

2. A shock absorbing cushioned circuit board as defined in claim 1, wherein: It also includes a buffer airbag (9) and a connecting pipe (10). The buffer airbag (9) is fixed to the top of the base plate (1). Multiple dampers (7) are distributed around the buffer airbag (9). The heat sink assembly (6) is located above the buffer airbag (9). Two connecting pipes (10) are fixed to one side of the buffer airbag (9). The two connecting pipes (10) pass through the frame (2). One of the connecting pipes (10) is a one-way air intake pipe, and the other connecting pipe (10) is a one-way exhaust pipe.

3. A shock absorbing cushioned circuit board as defined in claim 2, wherein: It also includes a limiting frame (8), which is fixed to the top of the base plate (1) and located inside the frame (2). The total area of ​​the bottom of the heat sink assembly (6) is consistent with the area of ​​the inner cavity of the limiting frame (8).

4. A shock absorbing cushion circuit board according to claim 3, characterized in that: It also includes a pull rod (16), with a pull rod (16) fixed to the top of each sliding plate (13).

5. A shock absorbing cushioned circuit board as defined in claim 4 wherein: The frame (2) has multiple heat dissipation holes on all four sides, and the heat sink assembly (6) is at the same height as the heat dissipation holes.

6. A shock absorbing cushioned circuit board as defined in claim 5 wherein: The guide rod (12) is a damping rod.

Images