Liquid-cooled power module and charging system with full-submersion self-dispersal cooling

Abstract

This application provides a fully immersion self-cooled liquid-cooled power module and charging system, relating to the field of heat dissipation technology for electronic devices. The liquid-cooled power module includes: a sealed housing, a power component, a first return port, a second return port, and electrical connection terminals, the electrical connection terminals being connected to the power component. The sealed housing forms a first cavity and a second cavity, which are adjacent to each other via a spacer sidewall. The power component is fixedly disposed within the first cavity, which contains insulating coolant immersing the power component. The first return port is located at a first position on the spacer sidewall, and the second return port is located at a second position on the spacer sidewall. The insulating coolant enters the second cavity through the second return port for heat dissipation and then re-enters the first cavity through the first return port. The electrical connection terminals are located outside the sealed housing. This application achieves heat dissipation through the self-circulation of the insulating coolant.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more specifically, to a fully immersion self-cooling liquid-cooled power module and charging system. Background Technology

[0002] In the design of existing electric vehicle power modules, air cooling, substrate-type liquid cooling, and independent air ducts are commonly used for heat dissipation.

[0003] In air-cooled power modules, the electronic components are in direct contact with the air, which inevitably leads to problems such as moisture, salt spray, sand, lint, dust, and insects, affecting the long-term reliability of the power module. Although substrate-type liquid-cooled power modules solve the problem of direct contact between electronic components and the air, substrate-type liquid-cooled power modules and other liquid-cooled power modules require the use of external circulation pumps and heat dissipation systems for cooling. Utility Model Content

[0004] The purpose of this application is to address the shortcomings of the prior art by providing a fully immersion self-cooling liquid-cooled power module and charging system, which dissipates heat through the self-circulation of insulating coolant.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows: In a first aspect, embodiments of this application provide a fully immersion self-dissipating cooling liquid-cooled power module, the liquid-cooled power module comprising: a sealed housing, a power component, a first reflux port, and a second reflux port, the sealed housing forming a first cavity and a second cavity, the first cavity and the second cavity being arranged adjacent to each other through spacer sidewalls; The power component is fixedly disposed in the first cavity, and the first cavity contains an insulating coolant that immerses the power component. The first return port is located at a first position on the side wall of the partition, and the second return port is located at a second position on the side wall of the partition. The first position is lower than the second position. After the insulating coolant enters the second cavity through the second return port for heat dissipation, it re-enters the first cavity through the first return port.

[0006] Optionally, the sealed housing is provided with heat dissipation teeth and a heat dissipation fan on the outer side wall corresponding to the second cavity. The heat dissipation fan is located outside the sealed housing and is used to dissipate heat from the heat dissipation teeth.

[0007] Optionally, the second cavity is provided with a heat dissipation channel formed by multiple guide plates, the multiple guide plates are arranged along the direction between the first return port and the second return port, and the multiple guide plates form a curved heat dissipation channel by the included angle.

[0008] Optionally, the guide plate is provided with through holes.

[0009] Optionally, the number of the second cavities is at least two, and the at least two second cavities are evenly arranged around the first cavity.

[0010] Optionally, there are two second cavities, with the two second cavities disposed on both sides of the first cavity and the first cavity located in the middle of the two second cavities; The first cavity is connected to the two second cavities through the first and second spacer sidewalls, respectively.

[0011] Optionally, the first reflux port includes multiple ports arranged horizontally at equal intervals on the spacer sidewall, and the second reflux port includes multiple ports arranged horizontally at equal intervals on the spacer sidewall; The first position is below the lowest point of the power component within the first cavity, and the second position is above the highest point of the power component within the first cavity.

[0012] Optionally, the liquid-cooled power module further includes an electrical connection terminal, which is disposed at a third position outside the sealed housing, the third position being higher than the second position.

[0013] Optionally, the diameter of the second reflux port is larger than the diameter of the first reflux port.

[0014] Secondly, embodiments of this application also provide a charging system, the charging system comprising: a plurality of liquid-cooled power modules, wherein the liquid-cooled power modules are fully immersed self-cooled liquid-cooled power modules as described in any of the first aspects.

[0015] The beneficial effects of this application are: The fully immersion self-cooled liquid-cooled power module and charging system provided in this application form a first cavity and a second cavity through a sealed shell. The first cavity is used to house the power components and is filled with insulating coolant. The high-performance insulating coolant dissipates heat from the power components, resulting in advantages such as high heat dissipation efficiency, strong protection performance, and high long-term reliability of the power module. Furthermore, by utilizing the thermal expansion, convection, and top-heating-bottom-cooling characteristics of the insulating coolant, the high-temperature insulating coolant enters the second cavity through the second return port for heat dissipation, and then re-enters the first cavity through the first return port. This not only ensures the circulating heat dissipation of the insulating coolant but also enables the insulating coolant to self-cool based on the second cavity, eliminating the need for an external circulation pump and heat dissipation system for independent heat dissipation, allowing the power components to operate normally and reliably. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 1 ; Figure 2 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 2 ; Figure 3 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 3 ; Figure 4 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 4 ; Figure 5 Installation diagram of the power component provided in the embodiments of this application Figure 1 ; Figure 6 Installation diagram of the power component provided in the embodiments of this application Figure 2 ; Figure 7 A schematic diagram of temperature distribution provided for an embodiment of this application; Figure 8 The circuit schematic diagram of the charging module provided in the embodiments of this application; Figure 9 The circuit schematic diagram of the ACDC circuit provided in the embodiments of this application; Figure 10 The circuit schematic diagram of the DC-DC circuit provided in the embodiments of this application; Figure 11 A schematic diagram of the partitioning of a printed circuit board provided in the embodiments of this application. Figure 1 ; Figure 12 A schematic diagram of the partitioning of a printed circuit board provided in the embodiments of this application. Figure 2 . Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0019] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0020] In the description of this application, it should be noted that if the terms "upper", "lower", etc. appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in, it is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0022] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0023] Figure 1 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 1 ,like Figure 1 As shown, the liquid-cooled power module may include: a sealed housing 11, a power component 12, a first reflux port 13, and a second reflux port 14; the sealed housing 11 forms a first cavity 21 and a second cavity 22, and the first cavity 21 and the second cavity 22 are arranged adjacent to each other through a spacer sidewall 23.

[0024] The power component 12 is fixedly disposed in the first cavity 21, which contains an insulating coolant that immerses the power component 12.

[0025] The first return port 13 is located at a first position on the partition sidewall 23, and the second return port 14 is located at a second position on the partition sidewall 23. The first position is lower than the second position. After the insulating coolant enters the second cavity 22 through the second return port 14 for heat dissipation, it re-enters the first cavity 21 through the first return port 13.

[0026] In this embodiment, as Figure 1 As shown, the sealed housing 11 is made of aluminum profile or die-cast integral sealed housing. A first cavity 21 and a second cavity 22 are formed inside the sealed housing 11. The first cavity 21 and the second cavity 22 are separated by a partition sidewall 23. The first return port 13 is located at a first position on the partition sidewall 23, which is lower than the second return port 14 is located at a second position on the partition sidewall 23. The power component 12 is fixedly installed in the first cavity 21, and the first cavity 21 is filled with insulating coolant.

[0027] When the power component 12 starts working, the electronic devices on the power component 12 generate heat due to power consumption. Since the power component is completely immersed in the insulating coolant, the insulating coolant absorbs heat to reduce the temperature of the electronic devices. The temperature of the insulating coolant gradually rises. Due to the different densities of the insulating coolant at different temperatures and its large coefficient of expansion, the volume of the insulating coolant increases when the temperature is high. Also, because the insulating coolant generates convection and has the characteristic of being hot at the top and cold at the bottom when heated, when the power component heats up the insulating coolant, the hotter insulating coolant accumulates above the first cavity 21 and flows into the second cavity 22 through the second return port 14. After fully contacting the second cavity 22 for heat exchange and heat dissipation, the colder insulating coolant flows down to the bottom of the second cavity 22 due to gravity and convection, and then enters the first cavity 21 through the first return port 13 to continue participating in heat interaction.

[0028] In some embodiments, the insulating coolant may be a liquid with high insulation and high specific heat capacity, including but not limited to hydrocarbon oils, alkane oils, fluorinated liquids, silicone oils, mineral oils, etc., and this embodiment does not impose any restrictions on this.

[0029] The fully immersion self-dissipating liquid-cooled power module provided in the above embodiment forms a first cavity and a second cavity through a sealed shell. The first cavity is used to place the power components and is filled with insulating coolant. The high-performance insulating coolant dissipates heat from the power components, resulting in advantages such as high heat dissipation efficiency, strong protection performance, and high long-term reliability of the power module. Furthermore, by utilizing the thermal expansion, convection, and top-heating-bottom-cooling characteristics of the insulating coolant, the high-temperature insulating coolant enters the second cavity through the second return port for heat dissipation, and then re-enters the first cavity through the first return port. This not only ensures the circulating heat dissipation of the insulating coolant but also enables the insulating coolant to self-dissipate heat based on the second cavity, eliminating the need for an external circulation pump and independent heat dissipation system, allowing the power components to operate normally and reliably.

[0030] In one possible implementation, Figure 2 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 2 ,like Figure 2 As shown, the sealed housing 11 is provided with heat dissipation teeth 24 and heat dissipation fan 25 on the outer side wall corresponding to the second cavity 22. The heat dissipation fan 25 is located outside the sealed housing 11 and is used to dissipate heat from the heat dissipation teeth 24.

[0031] In this embodiment, a heat dissipation tooth 24 is provided on the outer side wall adjacent to the second cavity 22, and a heat dissipation fan 25 is provided on the outer side wall adjacent to the outer side wall where the heat dissipation tooth 24 is located outside the sealed housing 11. The heat dissipation tooth 24 extends in a direction horizontal to the wind direction of the heat dissipation fan 25.

[0032] The heat dissipation teeth 24 can increase the contact area between the second cavity 22 and the environment for heat exchange. When the high-temperature insulating coolant enters the second cavity through the second return port, it exchanges heat with the air through the heat dissipation teeth 24, so that the insulating coolant can be cooled quickly.

[0033] The diameter of the cooling fan 25 is larger than the width of the outer wall. When the high-temperature insulating coolant enters the second cavity through the second return port, it exchanges heat with the air through the cooling teeth 24. The cooling fan 25 then cools the cooling teeth 24 by air, so that the insulating coolant can be cooled quickly.

[0034] The fully immersed self-cooled liquid-cooled power module provided in the above embodiment has heat dissipation teeth on the outside of the second cavity and a heat dissipation fan on the outside of the sealed shell. The heat dissipation teeth cool the insulating coolant, and the heat dissipation fan cools the heat dissipation teeth, which can improve the efficiency of cooling the insulating coolant and improve the heat dissipation effect.

[0035] In one possible implementation, Figure 3 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 3 ,like Figure 1 and Figure 3 As shown, the second cavity 22 is provided with a heat dissipation channel formed by multiple guide plates 26. The multiple guide plates 26 are arranged along the direction between the first return port and the second return port, and the multiple guide plates form a curved heat dissipation channel through the included angle.

[0036] In this embodiment, as Figure 3 As shown, in the second cavity 22 between the first reflux port and the second reflux port, a plurality of guide plates 26 are arranged at equal intervals, and the plurality of guide plates 26 are arranged along the longitudinal direction between the first reflux port and the second reflux port.

[0037] Multiple air deflectors 26 are all inclined downwards, forming an angle between each pair, with adjacent angles facing opposite directions to form a curved heat dissipation channel.

[0038] The multiple guide plates 26 have gaps between them that allow the insulating coolant to flow downwards. The inclined guide plates 26 can change the flow rate and flow direction of the insulating coolant, so that the insulating coolant can be fully cooled in the second cavity 22.

[0039] It should be noted that the high side of the uppermost guide plate 26 needs to be set below the second return port 14 so that the insulating coolant flowing out of the second return port 14 can flow downward through the through hole on the uppermost guide plate 26. The low side of the lowermost guide plate 26 needs to be set below the first return port 13 so that the cooled insulating coolant can flow into the first return port 13 through the lowermost guide plate.

[0040] In some embodiments, Figure 4 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 4 ,like Figure 4 As shown, a notch is formed between the lower end of the plurality of guide plates 26 and the side wall of the second cavity 22 so that the insulating coolant flows through the notch to the lower guide plate 26 after flowing on each guide plate 26.

[0041] The fully immersion self-dissipating cooling liquid-cooled power module provided in the above embodiment, by setting up a curved heat dissipation channel formed by multiple guide plates at an angle in the second cavity, slows down the downward flow speed of the insulating coolant and changes the flow direction of the insulating coolant, so that the insulating coolant can dissipate heat fully and improve the heat dissipation effect.

[0042] In some embodiments, such as Figure 3 As shown, the guide plate 26 is provided with a through hole 27.

[0043] Specifically, the guide plate 26 is provided with through holes 27 so that the insulating coolant can flow downward through the through holes 27. When the high-temperature insulating coolant enters the second cavity through the second return port, it flows downward through the through holes 27 on the guide plate 26 and is cooled by the heat dissipation teeth 24 and the heat dissipation fan 25 during the flow. The guide plate 26 can slow down the downward flow speed of the insulating coolant so that the insulating coolant can be fully cooled.

[0044] Furthermore, the bottommost guide plate 26 may not have through holes 27.

[0045] The fully immersed self-dissipating liquid-cooled power module provided in the above embodiment improves the heat dissipation effect by setting through holes on the guide plate to slow down the downward flow speed of the insulating coolant.

[0046] In one possible implementation, the number of second cavities 22 is at least two, and the at least two second cavities 22 are evenly arranged around the first cavity 21.

[0047] In this embodiment, a second cavity 22 can be provided on at least two of the four side walls of the first cavity 21 to surround the first cavity 21. If a cooling fan 25 needs to be provided on one of the outer side walls, the second cavity 22 can be provided on the remaining three side walls. The specific configuration is determined according to the actual situation, and this embodiment does not impose any restrictions on this.

[0048] In another possible implementation, such as Figure 1 and Figure 3 As shown, there are two second cavities 22, which are located on both sides of the first cavity 21, and the first cavity 21 is located in the middle of the two second cavities 22. The first cavity 21 is connected to the two second cavities 22 through the first spacer sidewall 23_1 and the second spacer sidewall 23_2 respectively.

[0049] Specifically, a second cavity 22 is provided on each of the adjacent sides of the first cavity 21. One second cavity 22 is adjacent to the first cavity 21 through the first spacer sidewall 23_1, and the other second cavity 22 is adjacent to the first cavity 21 through the second spacer sidewall 23_2.

[0050] The first partition sidewall 23_1 is provided with a first return port 13 and a second return port 14. Coolant can enter a second cavity 22 through the second return port 14 on the first partition sidewall 23_1, and enter the first cavity 21 through the first return port 13 on the first partition sidewall 23_1.

[0051] The second partition sidewall 23_2 is also provided with a first return port 13 and a second return port 14. The coolant can enter another second cavity 22 through the second return port 14 on the second partition sidewall 23_2, and enter the first cavity 21 through the first return port 13 on the second partition sidewall 23_2.

[0052] The fully immersion self-dissipating cooling liquid-cooled power module provided in the above embodiment can improve heat dissipation efficiency and effect by setting multiple second cavities surrounding the first cavity, so that the coolant can dissipate heat through the multiple second cavities.

[0053] In one possible implementation, such as Figure 3 As shown, the first return port 13 includes multiple ports, which are horizontally arranged at equal intervals on the spacer sidewall 23. The second return port 14 includes multiple ports, which are horizontally arranged at equal intervals on the spacer sidewall 23. The first position is lower than the lowest point of the power component 12 in the first cavity 21, and the second position is higher than the highest point of the power component 12 in the first cavity 21.

[0054] In this embodiment, the first return port 13 is located on the partition sidewall 23 at a first position lower than the lowest point of the power component 12 in the first cavity 21, and the second return port 14 is located on the partition sidewall 23 at a second position higher than the highest point of the power component 12 in the first cavity 21. The partition sidewall 23 is parallel to the power component 12, and the arrangement direction of the first return port 13 and the second return port 14 is also parallel and horizontal to the power component 12.

[0055] Multiple first return ports 13 and second return ports 14 are provided to accelerate the speed at which the high-temperature insulating coolant enters the second cavity 22 for heat dissipation, and to accelerate the speed at which the cooled insulating coolant flows back into the first cavity 21.

[0056] The first return port 13 is lower than the lowest point of the power component 12 in the first cavity 21, which allows the insulating coolant with the lowest temperature after cooling to enter the bottom of the first cavity 21 first. The second return port 14 is higher than the highest point of the power component 12 in the first cavity 21, which allows the insulating coolant with the highest temperature after absorbing heat to enter the second cavity 22 first for cooling. This fully utilizes the characteristics of the insulating coolant's thermal expansion and the fact that it is colder at the top and hotter at the bottom to cool the insulating coolant.

[0057] The fully immersion self-dissipating cooling liquid-cooled power module provided in the above embodiment can improve the flow rate and efficiency of insulating coolant between the first and second cavities and enhance heat dissipation by setting the first return port and the second return port parallel to the power components and arranging them horizontally.

[0058] In some embodiments, an oil inlet and an oil outlet (not shown in the figure) may be provided on the smooth sidewall of the sealed housing 11 without heat dissipation teeth and a heat dissipation fan. The oil inlet is located lower than the oil outlet. The oil inlet is used to inject coolant into the first cavity 21, and the oil outlet is used to extract coolant from the first cavity 21.

[0059] In one possible implementation, such as Figure 2 and Figure 3 As shown, the liquid-cooled power module may further include: an electrical connection terminal 15, which is disposed at a third position outside the sealed housing 11, and the third position is higher than the second position.

[0060] In this embodiment, the electrical connection terminal 15 is positioned higher than the second return port 14. Thus, when the insulating coolant fills the sealed housing 11, the highest liquid level of the insulating coolant is located at the second return port 14, preventing the insulating coolant from submerging the electrical connection terminal 15. This effectively prevents the insulating coolant from leaking through the part of the electrical connection terminal 15 that contacts the sealed housing 11. Furthermore, since the electrical connection terminal 15 does not contact the insulating coolant, a terminal with a lower protection level can be selected, reducing the cost of selecting the electrical connection terminal 15.

[0061] In some embodiments, the sealed housing 11 adopts a cuboid or cube structure with an opening at the top, and the liquid-cooled power module may further include: an upper cover plate 16, and electrical connection terminals 15 are vertically inserted into the upper cover plate 16.

[0062] The upper cover plate 16 covers the upper opening of the sealed housing 11 and is fixedly connected to the sealed housing 11 by screws, so that the sealed housing 11 forms a sealed housing.

[0063] Furthermore, since the highest liquid level of the insulating coolant reaches the height of the second return port 14, and the electrical connection terminal 15 is higher than the second return port 14, the insulating coolant will not completely fill the sealed housing 11, so the sealing design of the upper cover plate does not need to be tightened.

[0064] For example, an oil-resistant rubber ring made of oil-resistant fluororubber or nitrile rubber can be used for sealing.

[0065] The fully immersion self-dissipating cooling liquid-cooled power module provided in the above embodiment, by setting the electrical connection terminal at a position higher than the second return port, not only can the insulating coolant completely immerse the power component, but also, since the insulating coolant will not come into contact with the electrical connection terminal, it can effectively prevent the insulating coolant from leaking through the part of the electrical connection terminal that comes into contact with the sealed housing. In addition, terminals with a low protection level can be selected, reducing the cost of selecting electrical connection terminals.

[0066] In one possible implementation, such as Figure 3As shown, the diameter of the second reflux port 14 is larger than the diameter of the first reflux port 13.

[0067] In this embodiment, since the density of the insulating coolant increases and its volume increases after being heated, the second return port 14 needs to be a large-diameter cavity in order to facilitate the rapid flow of the insulating coolant into the second cavity 22. Similarly, after the insulating coolant is cooled by heat dissipation, its density decreases and its volume decreases, so the first return port can be a small-diameter cavity.

[0068] The fully immersion self-dissipating cooling liquid-cooled power module provided in the above embodiment has a second return port with a larger diameter than the first return port. This allows the insulating coolant to flow better based on its different temperatures and densities, preventing the first cavity from being pressured by the thermal expansion of the insulating coolant. This also allows the insulating coolant to flow more effectively between the first and second cavities for sufficient heat exchange.

[0069] In one possible implementation, Figure 5 Installation diagram of the power component provided in the embodiments of this application Figure 1 ,like Figure 5 As shown, the power assembly 12 may include a mounting plate 121 and a printed circuit board 122 fixed on the mounting plate 121. The printed circuit board 122 integrates power circuitry, and the mounting plate 121 is used to fix it inside the sealed housing 11. The mounting plate 121 may be a metal mounting plate.

[0070] In this embodiment, the sealed housing 11 may be provided with a mounting groove. After the printed circuit board 122 is mounted on the mounting plate 121, the mounting plate 121 can be installed in the sealed housing 11 through the mounting groove.

[0071] By detachably fixing the printed circuit board 122 to the mounting plate 121, the printed circuit board 122 can be flexibly removed and installed in the sealed housing 11 as needed. In addition, a new printed circuit board can be replaced after the printed circuit board 122 is damaged.

[0072] In some embodiments, Figure 6 Installation diagram of the power component provided in the embodiments of this application Figure 2 ,like Figure 6 As shown, the power component 12 may include two printed circuit boards 122, which are disposed on both sides of the mounting plate 121.

[0073] Specifically, when the power circuit is integrated on multiple printed circuit boards 122, printed circuit boards can be fixed on both sides of the mounting plate 121, with PCBA1 and PCBA2 being the two printed circuit boards respectively. In this way, the number of mounting plates 121 can be saved, and the volume of the liquid-cooled power module can be reduced.

[0074] The fully immersion self-dissipating liquid-cooled power module provided in the above embodiments allows for flexible disassembly and installation of the printed circuit board within a sealed housing as needed by detachably fixing the printed circuit board to the mounting plate. Furthermore, it facilitates the replacement of a new printed circuit board after it is damaged.

[0075] In one possible implementation, the printed circuit board has multiple temperature regions arranged sequentially along the oil depth direction. Multiple types of devices in the power circuit are respectively arranged in the multiple temperature regions; wherein, along the oil depth direction from bottom to top, the temperature thresholds of the multiple types of devices increase from low to high.

[0076] In this embodiment, Figure 7 A temperature distribution diagram provided for an embodiment of this application, such as... Figure 7 As shown, based on the characteristics of convection and heating at the top and cooling at the bottom when the insulating coolant is heated, the temperature of the insulating coolant in the sealed housing 11 increases from bottom to top. According to the temperature distribution of the insulating coolant, the printed circuit board can be divided into multiple temperature zones along the oil depth direction, that is, along the longitudinal direction. Each temperature zone corresponds to a temperature range of the insulating coolant.

[0077] Based on the characteristics of insulating coolant, the first return port is positioned below the lowest point of the power component in the first cavity 21, so that the coolant with the lowest temperature can directly enter the bottom of the second cavity 22.

[0078] It should be noted that the insulating coolant filling the sealed housing 11 is a single unit, and the temperature of the insulating coolant at different heights does not have a clear boundary. Therefore, the multiple temperature zones divided for the printed circuit board do not have fixed boundaries. It is only necessary to clarify that the temperature of the insulating coolant immersed in the printed circuit board from bottom to top is from low to high.

[0079] Based on the temperature threshold of the electronic devices contained in the power circuit of the printed circuit board, electronic devices with different temperature thresholds are set in different temperature regions.

[0080] Since the temperature of the insulating coolant near the first return port is the lowest and the temperature of the insulating coolant near the second return port is the highest, the electronic devices can be arranged in order from low to high according to their temperature thresholds. Specifically, the electronic devices with low temperature thresholds are arranged in the temperature region near the first return port, the electronic devices with high temperature thresholds are arranged in the temperature region near the second return port, and the electronic devices with medium temperature thresholds are arranged in the middle temperature region.

[0081] Among them, the temperature threshold can represent the temperature resistance of an electronic device, or it can represent the heat dissipation of an electronic device. Temperature resistance is a property parameter of an electronic device, while heat dissipation is the measured temperature of an electronic device.

[0082] In some embodiments, the low-temperature resistant device is disposed in the temperature region near the first reflux port, the high-temperature resistant device is disposed in the temperature region near the second reflux port, and the medium-temperature resistant device is disposed in the middle temperature region.

[0083] In some embodiments, the low-heat-dissipation device is located in the temperature region near the first return port, the high-heat-dissipation device is located in the temperature region near the second return port, and the medium-heat-dissipation device is located in the middle temperature region.

[0084] In some embodiments, the height of the electronic device is positively correlated with its temperature threshold, wherein the lower the height of the electronic device, the lower the temperature threshold, and the higher the height of the electronic device, the higher the temperature threshold.

[0085] The power component provided in the above embodiments divides the printed circuit board into multiple temperature zones according to the temperature distribution of the insulating coolant. Multiple types of devices in the power circuit are arranged in each of the multiple temperature zones. This allows for the arrangement of electronic devices according to their temperature thresholds, effectively balancing the heat dissipation of the electronic devices and controlling the temperature rise of each electronic device within a small range, thus ensuring the normal operation of the power component.

[0086] In another possible implementation, the multiple temperature zones are arranged from bottom to top as follows: a first temperature zone, a second temperature zone, and a third temperature zone, wherein the first temperature zone has the lowest temperature of the insulating coolant and the third temperature zone has the highest temperature of the insulating coolant; the first temperature zone includes at least a control device, the second temperature zone includes at least a capacitor and a power device, and the third temperature zone includes at least a magnetic field.

[0087] Specifically, the first temperature zone has the lowest insulating coolant temperature, the third temperature zone has the highest insulating coolant temperature, and the second temperature zone has a moderate insulating coolant temperature. The first, second, and third temperature zones can also be referred to as the low-temperature zone, the moderate-temperature zone, and the high-temperature zone, respectively.

[0088] Taking 1U height as an example, electronic devices with a height lower than U / 3 can be placed in the low temperature zone, electronic devices with a height of U / 3 to 2U / 3 can be placed in the suitable temperature zone, and electronic devices with a height higher than 2U / 3 can be placed in the high temperature zone.

[0089] In some embodiments, electronic devices on a printed circuit board can be divided into three categories: control devices, capacitors and power devices, and magnetic devices. Control devices, such as microcontrollers, can be located in a low-temperature region, capacitors and power devices can be located in a suitable-temperature region, and magnetic devices, such as transformers, can be located in a high-temperature region.

[0090] It should be noted that the placement of electronic components follows the principle of backward compatibility, meaning that electronic components can be placed in a temperature range lower than their own temperature threshold. For example, a transformer can be placed in a high-temperature range, but it can also be placed in a suitable temperature range with backward compatibility. However, under normal circumstances, electronic components should not be placed in a temperature range higher than their own temperature threshold.

[0091] Taking a charging module as an example, this section explains the positional arrangement of various electronic components on the printed circuit board within the charging module.

[0092] For example, Table 1 is an example of the distribution of electronic devices provided in the embodiments of this application. As shown in Table 1, the electronic devices placed in each temperature zone follow the corresponding placement principles. Among them, low-temperature threshold devices with low device height and low power consumption can be placed in the low-temperature zone, medium-temperature threshold devices with moderate device height and moderate power consumption can be placed in the suitable temperature zone, and high-temperature threshold devices with high device height and high power consumption can be placed in the high-temperature zone.

[0093] Table 1 Examples of Electronic Component Distribution

[0094] It can be seen that components with low height, such as the Digital Signal Processing (DSP) unit, Microcontroller (MCU), Field Programmable Gate Array (FPGA), optocoupler, analog chip, and various surface-mount devices in the charging module, can be placed in the low-temperature zone; auxiliary power supply unit, relay, main power transistor, aluminum electrolytic capacitor, and other components can be placed in the suitable temperature zone; magnetic components, EMC unit, and other components are placed in the high-temperature zone.

[0095] Example, Figure 8 The circuit schematic diagram of the charging module provided in the embodiments of this application is as follows: Figure 8As shown, the charging module may include: an input electromagnetic compatibility (EMC) module, an input soft-start module, an ACDC controller, an ACDC circuit, a DCDC controller, a DCDC circuit, an auxiliary power supply, an output EMC module, and other control auxiliary circuits.

[0096] Figure 9 The circuit schematic diagram of the ACDC circuit provided in the embodiments of this application is as follows: Figure 9 As shown, the key components of an ACDC circuit may include: MOSFETs, diodes, resistors, insulated-gate bipolar transistors (IGBTs), capacitors, and resonant inductors.

[0097] Figure 10 The circuit schematic of the DCDC circuit provided in the embodiments of this application is as follows: Figure 10 As shown, the key components of a DC-DC circuit may include: transformer, diode, capacitor, and relay.

[0098] As can be seen, the electronic components in charging modules, ACDC circuits, and DCDC circuits can be categorized into the following types: transformers, inductors, switching devices, capacitors, relays, and controllers. Figure 11 A schematic diagram of the partitioning of a printed circuit board provided in the embodiments of this application. Figure 1 ,like Figure 11 As shown, high-temperature threshold devices such as transformers and inductors are placed in the high-temperature zone, medium-temperature threshold devices such as switching devices, relays, and capacitors are placed in the suitable-temperature zone, and low-temperature threshold devices such as ACDC controllers and DCDC controllers are placed in the low-temperature zone.

[0099] In some embodiments, the space available for each temperature zone on a printed circuit board is limited, and the number of electronic devices that can be accommodated is also limited. Therefore, the AC-CDC and DC-CDC sections of the charging module can be separated and laid out on two separate printed circuit boards, such as... Figure 6 As shown, the electronic components of the ACDC section can be laid out on PCBA1, and the electronic components of the DCDC section can be laid out on PCBA2.

[0100] Figure 12 A schematic diagram of the partitioning of a printed circuit board provided in the embodiments of this application. Figure 2 ,like Figure 12As shown, after separating the ACDC and DCDC sections and laying them out on two separate printed circuit boards, the electronic components of the DCDC section can be partitioned on the printed circuit board as follows: high-temperature threshold devices such as transformers and inductors are placed in the high-temperature zone; medium-temperature threshold devices such as relays and diodes are placed in the suitable-temperature zone; and low-temperature threshold devices such as the DCDC controller are placed in the low-temperature zone. Since there is sufficient space for each temperature zone on the printed circuit board after separating the ACDC and DCDC sections and laying them out on two separate printed circuit boards, capacitors and switching devices can be placed in the suitable-temperature zone or the low-temperature zone as needed, based on the principle of backward compatibility. Figure 12 The circles shown represent capacitors.

[0101] The fully immersion self-dissipating cooling liquid-cooled power module provided in the above embodiment divides the printed circuit board into multiple temperature zones according to the temperature distribution of the insulating coolant. Low-temperature resistant devices are set in the temperature zone near the first return port, and high-temperature resistant devices are set in the temperature zone near the second return port. This arrangement of electronic devices according to their temperature resistance can effectively balance the heat dissipation of electronic devices, control the temperature rise of each device within a small range, and ensure the normal operation of the power components.

[0102] Based on the fully immersion self-cooled liquid-cooled power module provided in the above embodiments, this application also provides a charging system, which may include multiple fully immersion self-cooled liquid-cooled power modules.

[0103] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fully immersion self-cooled liquid-cooled power module, characterized in that, The liquid-cooled power module includes: a sealed housing, a power component, a first reflux port, and a second reflux port. The sealed housing forms a first cavity and a second cavity, which are arranged adjacent to each other through a spacer sidewall. The power component is fixedly disposed in the first cavity, and the first cavity contains an insulating coolant that immerses the power component. The first return port is located at a first position on the side wall of the partition, and the second return port is located at a second position on the side wall of the partition. The first position is lower than the second position. After the insulating coolant enters the second cavity through the second return port for heat dissipation, it re-enters the first cavity through the first return port.

2. The liquid-cooled power module as described in claim 1, characterized in that, The sealed housing is provided with heat dissipation teeth and a heat dissipation fan on the outer side wall corresponding to the second cavity. The heat dissipation fan is located outside the sealed housing and is used to dissipate heat from the heat dissipation teeth.

3. The liquid-cooled power module as described in claim 1, characterized in that, The second cavity is provided with a heat dissipation channel formed by multiple guide plates. The multiple guide plates are arranged along the direction between the first return port and the second return port, and the multiple guide plates form a curved heat dissipation channel by the included angle.

4. The liquid-cooled power module as described in claim 3, characterized in that, The guide plate is provided with through holes.

5. The liquid-cooled power module as described in claim 1, characterized in that, The number of the second cavity is at least two, and the at least two second cavities are evenly arranged around the first cavity.

6. The liquid-cooled power module as described in claim 1, characterized in that, There are two second cavities, which are located on both sides of the first cavity, and the first cavity is located in the middle of the two second cavities; The first cavity is connected to the two second cavities through the first and second spacer sidewalls, respectively.

7. The liquid-cooled power module as described in claim 1, characterized in that, The first reflux port includes multiple ports, which are horizontally arranged at equal intervals on the spacer sidewall; the second reflux port includes multiple ports, which are horizontally arranged at equal intervals on the spacer sidewall. The first position is below the lowest point of the power component within the first cavity, and the second position is above the highest point of the power component within the first cavity.

8. The liquid-cooled power module as described in claim 7, characterized in that, The liquid-cooled power module further includes an electrical connection terminal, which is disposed at a third position outside the sealed housing, the third position being higher than the second position.

9. The liquid-cooled power module as described in claim 1, characterized in that, The diameter of the second reflux port is larger than the diameter of the first reflux port.

10. A charging system, characterized in that, The charging system includes: a plurality of liquid-cooled power modules, wherein the liquid-cooled power modules are fully immersed self-cooled liquid-cooled power modules as described in any one of claims 1-9.

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