Compact frequency converter with modular heat sink structure

Abstract

The utility model discloses a compact frequency converter of modularization heat dissipation structure, including panel, box body and cooling mechanism, and the front end of panel fixed mounting is at the box body, and the bottom of box body is provided with a plurality of recess, and cooling mechanism is fixed in the outside of box body, and cooling mechanism includes fixed plate and heat dissipation board, and the top surface fixed mounting of fixed plate has cooling plate, and heat dissipation board is provided with several and is U type structure. The utility model discloses through fan and sends frequency converter inside air to fixed plate and with the contact of temperature guide column and semiconductor refrigeration piece, and the circulating air is cooled, and after cooling, the shunt is in the heat dissipation board, and after filtering board filtering in the heat dissipation board, along heat dissipation board downward flow, and circulating cooling air returns to frequency converter inside through the passage, and the inside of frequency converter is cooled continuously, and adopts the internal circulation cooling, improves the cooling effect, avoids the dust in the external air to enter the inside of frequency converter, improves frequency converter use security.

Description

Technical Field

[0001] This utility model relates to the field of frequency converter technology, specifically a compact frequency converter with a modular heat dissipation structure. Background Technology

[0002] A frequency converter is a power control device that uses frequency conversion technology and microelectronics technology to control an AC motor by changing the frequency of the motor's power supply.

[0003] Existing compact frequency inverters mostly rely on external air intake for heat dissipation during operation. However, the effectiveness of heat dissipation is greatly affected by the external environment, and dust from the outside air can enter the inverter during the cooling process. Dust accumulation can impair cooling efficiency and easily damage internal components. Therefore, a compact frequency inverter with a modular heat dissipation structure is proposed. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides a compact frequency converter with a modular heat dissipation structure, which solves the problems of: most existing compact frequency converters rely on external air intake for heat dissipation during use, the heat dissipation effect is greatly affected by the external environment, and dust in the external air can enter the frequency converter during the heat dissipation process. The accumulation of dust affects the cooling effect and can easily cause damage to the components in the frequency converter.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: a compact frequency converter with a modular heat dissipation structure, comprising a panel, a housing, and a cooling mechanism. The panel is fixedly installed at the front end of the housing. The housing surface has several heat dissipation holes. The cooling mechanism is fixedly arranged around the outside of the housing. The cooling mechanism includes a fixing plate and a heat dissipation plate. The top surface of the fixing plate is fixedly installed with the cooling plate. The ends of the heat dissipation plate are fixedly connected to both sides of the fixing plate, and the heat dissipation plate communicates internally with the fixing plate and the cooling plate. The surface of the cooling plate has mounting holes, and a semiconductor cooling chip is fixedly installed inside the mounting holes.

[0008] As a further preferred embodiment of this utility model, an installation tube is fixedly installed at the lower end of the fixing plate, the end of the installation tube extends into the interior of the box, and a fan is installed inside the fixing tube.

[0009] As a further preferred embodiment of this utility model, the cold end of the semiconductor refrigeration chip is placed below the mounting hole, and several temperature-conducting columns are vertically fixed on the cold end of the semiconductor refrigeration chip.

[0010] As a further preferred embodiment of this utility model, a plurality of through holes are uniformly formed on the inner wall of the heat sink, and the diameter of the through holes located below the heat sink is larger than the diameter of the through holes on both sides of the heat sink.

[0011] As a further preferred embodiment of this utility model, a filter plate is installed on the upper end of the heat sink, and magnets are provided on the surfaces of both the filter plate and the heat sink, and the filter plate and the heat sink are magnetically connected by the magnets.

[0012] As a further preferred embodiment of this utility model, the surface of the filter plate is provided with filter holes, the inner wall of the filter holes is provided with a plurality of filter screens, and the ends of the filter screens are fixedly connected with baffles.

[0013] (III) Beneficial Effects

[0014] This invention provides a compact frequency converter with a modular heat dissipation structure. It offers the following advantages:

[0015] This invention uses a fan to draw air from inside the frequency converter into a fixed plate, where it comes into contact with the temperature-conducting columns and semiconductor cooling chips, thus cooling the circulating air. After cooling, the air is diverted to a heat sink, filtered by a filter plate inside the heat sink, and then flows downwards along the heat sink. The cooled air then returns to the inside of the frequency converter through through-holes, continuously cooling the inside of the frequency converter. This internal circulation cooling method improves the cooling effect, prevents dust from the outside air from entering the inside of the frequency converter, and enhances the safety of the frequency converter during use. Attached Figure Description

[0016] Figure 1 This is a structural diagram of the compact frequency converter described in this utility model;

[0017] Figure 2 This is a structural diagram of the cooling mechanism described in this utility model;

[0018] Figure 3 This is an assembly structure diagram of the frequency converter and cooling mechanism described in this utility model.

[0019] Figure 4 This is a diagram showing the internal structure of the fixing plate and cooling plate described in this utility model;

[0020] Figure 5 for Figure 4 A magnified view of A in the middle.

[0021] Figure 6 This is a structural diagram of the motherboard in this utility model;

[0022] Figure 7 This is a structural diagram of the display panel in this utility model;

[0023] Figure 8 This is a structural diagram of the drive board in this utility model.

[0024] In the diagram: 1. Panel; 2. Cooling mechanism; 3. Box body; 4. Heat dissipation holes; 5. Heat dissipation plate; 6. Fixing plate; 7. Cooling plate; 8. Mounting hole; 9. Semiconductor cooling chip; 10. Filter plate; 11. Through hole; 12. Temperature guiding column; 13. Mounting tube; 14. Fan; 15. Magnet; 16. Filter hole; 17. Baffle; 18. Filter screen. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1-8 This utility model provides a technical solution: a compact frequency converter with a modular heat dissipation structure, including a panel 1, a housing 3, and a cooling mechanism 2. The panel 1 is fixedly installed at the front end of the housing 3. The housing 3 has several heat dissipation holes 4 on its surface. The cooling mechanism 2 is fixedly surrounding the outside of the housing 3. The cooling mechanism 2 includes a fixing plate 6 and a heat dissipation plate 5. A cooling plate 7 is fixedly installed on the top surface of the fixing plate 6. The ends of the heat dissipation plate 5 are fixedly connected to both sides of the fixing plate 6, and the heat dissipation plate 5 communicates internally with the fixing plate 6 and the cooling plate 7. The cooling plate 7 diverts circulating air to continuously cool different parts of the frequency converter. The surface of the cooling plate 7 has mounting holes 8, and a semiconductor cooling chip 9 is fixedly installed inside the mounting holes 8. The semiconductor cooling chip 9 cools the circulating air. The frequency converter internally includes a main board, a display board, and a driver board.

[0027] Further improvements include a mounting pipe 13 fixedly installed at the lower end of the mounting plate 6, with the end of the mounting pipe 13 extending into the interior of the housing 3. A fan 14 is installed inside the mounting pipe, which draws air from the inverter into the mounting plate 6, thereby circulating the cooling air.

[0028] In a further improvement, the cold end of the thermoelectric cooler 9 is positioned below the mounting hole 8, and several temperature-conducting columns 12 are vertically fixed on the cold end of the thermoelectric cooler 9. The temperature-conducting columns 12 and the cold end of the thermoelectric cooler 9 cool the circulating air, thereby increasing the cooling contact surface.

[0029] Further improvements include the uniform opening of several through holes 11 on the inner wall of the heat sink 5, and the cooling holes communicating with the through holes 11 on the surface of the box 3. The diameter of the through holes 11 located below the heat sink 5 is larger than the diameter of the through holes 11 on both sides of the heat sink 5, so that most of the circulating air enters the inverter through the through holes 11 at the lower end.

[0030] In a further improvement, a filter plate 10 is installed on the upper end of the heat sink 5. Magnets 15 are provided on the surfaces of both the filter plate 10 and the heat sink 5, and the filter plate 10 and the heat sink 5 are magnetically connected by the magnets 15, which facilitates installation and disassembly.

[0031] Further improvements include filter holes 16 on the surface of the filter plate 10, several filter screens 18 installed on the inner wall of the filter holes 16, and baffles 17 fixedly connected to the ends of the filter screens 18, which filter the circulating cooling air.

[0032] Working principle: After the fan 14 is started, the fan 14 drives the air inside the frequency converter to be drawn into the fixed plate 6. The air is cooled after contacting the heat conduction column 12 and the semiconductor cooling chip 9. The air is then diverted into the heat sink 5 and then returns to the inside of the frequency converter through the through hole 11, continuously cooling the inside of the frequency converter. The air that is circulated and cooled can be filtered by the filter screen 18 after entering the heat sink 5. The filter screen 10 can be pulled out by pulling it up for easy replacement and cleaning.

[0033] The components of this utility model are: 1. Panel; 2. Cooling mechanism; 3. Box body; 4. Groove; 5. Heat sink; 6. Fixing plate; 7. Cooling plate; 8. Mounting hole; 9. Semiconductor cooling chip; 10. Filter plate; 11. Through hole; 12. Temperature guiding column; 13. Mounting pipe; 14. Fan; 15. Magnet; 16. Filter hole; 17. Baffle; 18. Filter screen. All components are general standard parts or parts known to those skilled in the art. Their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods. The problem solved by this utility model is that most existing compact frequency inverters use external air intake for heat dissipation during use, and the heat dissipation effect is greatly affected by the external environment. During the heating process, dust from the outside air can enter the inverter. Dust accumulation can affect the cooling effect and easily damage components within the inverter. This invention addresses this issue by combining the aforementioned components. The fan 14 draws air from inside the inverter into the fixed plate 6, where it contacts the temperature-conducting column 12 and the semiconductor cooling chip 9, cooling the circulating air. After cooling, the air is diverted to the heat sink 5, filtered by the filter plate 10 inside the heat sink 5, and then flows downwards along the heat sink 5. The cooled air returns to the inverter through the through-hole 11, continuously cooling the inverter's interior. This internal circulation cooling system improves the cooling effect, prevents dust from the outside air from entering the inverter, and enhances the inverter's safety during operation.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0035] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A compact frequency converter with a modular heat dissipation structure, comprising a panel (1), a housing (3), and a cooling mechanism (2), characterized in that: The panel (1) is fixedly installed at the front end of the box body (3). The surface of the box body (3) is provided with a number of heat dissipation holes (4). The cooling mechanism (2) is fixed around the outside of the box body (3). The cooling mechanism (2) includes a fixing plate (6) and a heat dissipation plate (5). The top surface of the fixing plate (6) is fixedly installed with a cooling plate (7). The ends of the heat dissipation plate (5) are fixedly connected to the two sides of the fixing plate (6) respectively, and the heat dissipation plate (5) communicates with the inside of the fixing plate (6) and the cooling plate (7). The surface of the cooling plate (7) is provided with a mounting hole (8). A semiconductor cooling chip (9) is fixedly installed inside the mounting hole (8).

2. The compact frequency converter with a modular heat dissipation structure according to claim 1, characterized in that: The lower end of the fixing plate (6) is fixedly installed with an installation tube (13), the end of which extends into the interior of the box (3), and a fan (14) is installed inside the fixing tube.

3. The compact frequency converter with a modular heat dissipation structure according to claim 1, characterized in that: The cold end of the semiconductor cooling chip (9) is placed below the mounting hole (8), and several temperature-conducting columns (12) are vertically fixed on the cold end of the semiconductor cooling chip (9).

4. A compact frequency converter with a modular heat dissipation structure according to claim 1, characterized in that: The inner wall of the heat sink (5) is provided with a number of through holes (11) evenly distributed, and the diameter of the through hole (11) located below the heat sink (5) is larger than the diameter of the through holes (11) on both sides of the heat sink (5).

5. A compact frequency converter with a modular heat dissipation structure according to claim 1, characterized in that: A filter plate (10) is installed on the upper end of the heat sink (5). Magnets (15) are provided on the surfaces of both the filter plate (10) and the heat sink (5), and the filter plate (10) and the heat sink (5) are magnetically connected by the magnets (15).

6. A compact frequency converter with a modular heat dissipation structure according to claim 5, characterized in that: The filter plate (10) has filter holes (16) on its surface. Several filter screens (18) are installed on the inner wall of the filter holes (16). A baffle (17) is fixedly connected to the end of the filter screen (18).

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