A shield and thin film deposition apparatus

Abstract

This utility model provides a shielding cover and a thin film deposition equipment. The shielding cover includes a main body and an isolation component. The isolation component is fixed inside the main body and divides the internal space of the main body into an upper space and a lower space. The isolation component has heat dissipation holes that connect the upper space and the lower space. Electrical components, pipe joints, and a heat dissipation component are installed in the upper space. When the heat dissipation component is activated, heat and particles in the lower space flow to the upper space through the heat dissipation holes and are dissipated by the heat dissipation component together with the heat in the upper space. This application sets the shielding cover as a double-layer sealed box structure, fixing the electrical components, pipe joints, and heat dissipation component in the upper space. The electrical components and pipe joints are all located close to the heat dissipation component, avoiding the failure of electrical components and pipe joints due to high temperature, thus reducing costs. Furthermore, the heat dissipation component prevents the heating element and insulation cotton from being in a high-temperature state for a long time, preventing dust pollution caused by the heating element and insulation cotton inside the shielding cover, and creating a good process environment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a shielding cover and thin film deposition equipment. Background Technology

[0002] In semiconductor thin film deposition processes, temperature control of the gas pipeline above the equipment cavity is a core element in ensuring process effectiveness. It aims to improve the chemical activity of the reaction gas, accelerate the reaction rate within the cavity, and simultaneously ensure the uniformity of the deposited film thickness and the consistency of its composition.

[0003] To ensure the process temperature of the gas pipeline and provide space for the installation of electrical components such as solenoid valves, a single-layer sealed enclosure structure, i.e., a shield, is typically designed above the gas pipeline. However, existing single-layer sealed shields have significant drawbacks: on the one hand, the heating band is prone to material aging and shedding during long-term high-temperature operation, and the resulting particles can enter the thin film deposition chamber with the gas flow, thus adhering to the substrate surface and reducing the quality of the thin film, seriously affecting the chip yield; on the other hand, the high temperature inside the shield not only accelerates the aging and failure of electrical components, but also causes pipeline joints to loosen, thereby increasing maintenance costs. Utility Model Content

[0004] The present invention provides a shielding cover and a thin film deposition equipment to prevent dust pollution generated by heating belts and insulation cotton inside the shielding cover, thereby creating a good process environment. At the same time, it prevents pipeline joints and electrical components from failing due to high temperature, thereby reducing costs.

[0005] This utility model provides a shielding cover, which includes:

[0006] main body;

[0007] An isolation component is fixed inside the main body and divides the internal space of the main body into an upper space and a lower space. The isolation component is provided with heat dissipation holes, which connect the upper space and the lower space. Electrical components, pipe joints and heat dissipation components are installed in the upper space.

[0008] When the heat dissipation component is activated, the heat and particles in the lower space will flow to the upper space through the heat dissipation holes and be dissipated by the heat dissipation component together with the heat in the upper space.

[0009] In the shielding cover provided by this utility model, the isolation component includes a mounting plate and a fixing plate whose shapes are adapted to each other. The outer edge of the mounting plate is fixedly connected to one side of the main body, the outer edge of the fixing plate is fixedly connected to the other side of the main body, and the inner edge of the fixing plate abuts against the inner edge of the mounting plate.

[0010] In the shielding cover provided by this utility model, the mounting plate is provided with mounting holes that pass through its upper and lower sides, wherein the electrical components are installed in the mounting holes and the connecting wires of the electrical components are connected to the structural components of the lower space through the mounting holes.

[0011] In the shielding cover provided by this utility model, the mounting plate is further provided with an overlapping portion. The overlapping portion is located at the edge of the mounting plate on the side away from the main body. The overlapping portion extends toward the fixing plate and overlaps the top of the fixing plate.

[0012] In the shielding cover provided by this utility model, the heat dissipation hole is provided on the fixed plate, the heat dissipation assembly includes a cylinder and a heat dissipation plate, the cylinder is located on one side of the heat dissipation hole and one end is fixedly connected to the fixed plate, the telescopic part of the cylinder is fixedly connected to the heat dissipation plate, and the heat dissipation plate is used to adjust the opening degree of the heat dissipation hole.

[0013] In the shielding cover provided by this utility model, the heat dissipation plate is provided with a guide groove on one side edge along its moving direction, and the heat dissipation assembly also includes a pin. One end of the pin passes through the guide groove and is fixedly connected to the fixing plate, and the pin is slidably connected to the guide groove.

[0014] In the shielding cover provided by this utility model, the main body is provided with an air outlet on one side of the upper space, and the heat dissipation component also includes a fan, which is installed in the air outlet.

[0015] In the shielding cover provided by this utility model, the main body is provided with an air outlet on one side of the upper space, and the heat dissipation component also includes an air extraction pipe, one end of which is connected to the air outlet and the other end is connected to an air extraction device.

[0016] In the shielding cover provided by this utility model, the heat dissipation component further includes a first temperature sensor and a second temperature sensor. The first temperature sensor is fixed in the upper space near the electrical component, and the second temperature sensor is fixed in the lower space near the heat dissipation hole.

[0017] This utility model also provides a thin film deposition apparatus, which includes:

[0018] A shielding cover, wherein the shielding cover is any of the shielding covers described above.

[0019] In this embodiment, the shielding cover is configured as a double-layer sealed box structure. The upper and lower spaces of the main body are isolated by the insulating component. The electrical components, pipe joints, and heat dissipation components are fixed in the upper space. The heat dissipation components reduce the ambient temperature of the upper and lower spaces. The electrical components and pipe joints are all located away from the heat source (i.e., the heating band), and the electrical components, pipe joints, and heat dissipation components are all located in the upper space, that is, the electrical components and pipe joints are all set close to the heat dissipation components. This ensures that the ambient temperature of the electrical components and pipe joints does not become too high, thereby avoiding the failure of electrical components due to high temperature aging and the loosening of pipe joints due to high temperature, thus reducing costs. At the same time, the heat dissipation effect of the heat dissipation components prevents the heating band and the insulation cotton from being in a high-temperature state for a long time, reducing the generation of particulate impurities, thereby preventing dust pollution caused by the heating band and insulation cotton inside the shielding cover, and creating a good process environment. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figures 1a-1b This is a cross-sectional view of the shielding cover in an embodiment of this utility model;

[0022] Figure 2 for Figure 1a Enlarged view of point A in the middle;

[0023] Figure 3 This is a structural diagram of the shielding cover in an embodiment of the present invention;

[0024] Figure 4 This is another structural diagram of the shielding cover in an embodiment of this utility model;

[0025] Figure 5 This is a structural diagram of the main body in an embodiment of this utility model;

[0026] Figure 6 This is an exploded view of the main body in an embodiment of this utility model;

[0027] Figures 7a-7b This is an assembly diagram of the front plate and back plate in an embodiment of this utility model;

[0028] Figure 8 This is an assembly diagram of the isolation component, electrical components, and heat dissipation components in an embodiment of this utility model;

[0029] Figure 9 This is a structural diagram of the isolation component in an embodiment of the present utility model;

[0030] Figure 10 This is an exploded view of the isolation component in an embodiment of this utility model;

[0031] Figure 11 This is a structural diagram of the heat sink and cylinder in an embodiment of this utility model.

[0032] The labels for the attached figures are as follows:

[0033] 1. Main body; 11. Upper space; 12. Lower space; 13. Front panel; 14. Back panel; 141. Vent; 15. Top panel; 16. Air outlet; 17. Air vent; 18. First liner; 19. Second liner; 2. Isolation component; 21. Heat dissipation hole; 22. Mounting plate; 221. Mounting hole; 222. Overlap; 2221. Inclined section; 2222. Horizontal section; 23. Fixing plate; 3. Electrical components; 4. Pipe joint; 5. Heat dissipation components; 51. Cylinder; 52. Heat dissipation plate; 521. Guide groove; 53. Pin; 54. Fan; 55. Extraction pipe; 56. Filter screen; 57. Flange. Detailed Implementation

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0035] Reference Figures 1a to 11 The diagram illustrates an embodiment of the shielding cover and thin film deposition equipment of this invention. The shielding cover includes a main body and an isolation member. The isolation member is fixed inside the main body and divides the internal space of the main body into an upper space and a lower space. The isolation member has heat dissipation holes that connect the upper space and the lower space. Electrical components, pipe joints, and a heat dissipation assembly are installed in the upper space. When the heat dissipation assembly is activated, heat and particles from the lower space flow through the heat dissipation holes to the upper space and are dissipated together with the heat from the upper space by the heat dissipation assembly.

[0036] Specifically, the shield is used in a semiconductor thin film deposition equipment. The reaction chamber of the thin film deposition equipment is provided with pipelines for conveying reaction gases. In order to ensure that the reaction gases are heated to a specific temperature before entering the reaction chamber, heating belts and insulation cotton are currently installed outside the pipelines. In order to ensure the process temperature of the gas pipelines, a shield is installed outside the heating belts and insulation cotton.

[0037] The shielding cover in this embodiment includes a main body and an insulating component. The main body is the main structure of the shielding cover. The main body covers the heating belt and the insulation cotton outside. The main body encloses and forms an internal space. The heating belt, the insulation cotton and some electrical components are all located in the internal space.

[0038] The isolating member is fixedly connected to the main body and fixed within the main body. The edge of the isolating member is fixedly connected circumferentially along the inner wall of the main body. The isolating member separates the internal space of the main body, forming an upper space and a lower space. The upper space is a sealed space enclosed by the isolating member and the upper part of the main body; the lower space is a sealed space enclosed by the isolating member and the lower part of the main body. The upper space is located above the isolating member, and the lower space is located below the isolating member. The isolating member has heat dissipation holes that penetrate both the upper and lower sides of the isolating member, thereby connecting the upper space and the lower space. The heat dissipation holes allow heat to flow from the lower space to the upper space.

[0039] The upper space is used to install electrical components, pipe joints, and heat dissipation components. The electrical components are mainly used to precisely control the flow and disconnection of the reactant gas in the pipes and the flow rate of the reactant gas. The pipe joints are the "joints" connecting the various pipe sections and the electrical components, precisely connecting the gas source, solenoid valve, flow meter (MFC), and process chamber into a complete, sealed, leak-free, high-temperature "superhighway," ensuring that the reactant gas can be precisely controlled and delivered to the reaction chamber in the purest state. The heat dissipation components are used to dissipate heat from the internal space of the shielding cover, thereby preventing the temperature inside the shielding cover from becoming too high and affecting the use of other structural components.

[0040] The lower space is equipped with a heating belt and insulation cotton. The heating belt heats the pipeline, and the insulation cotton keeps the pipeline warm and prevents heat loss.

[0041] When the device is running, the heating element generates heat, raising the temperature of the lower space. Simultaneously, the electrical components in the upper space generate heat, raising the temperature of the upper space as well. To prevent the temperatures of both the upper and lower spaces from becoming too high, the heat dissipation component is activated. This allows heat from the lower space to flow through the heat dissipation holes to the upper space, where it is dissipated along with the heat from the upper space, thus reducing the temperatures of both spaces. Furthermore, the heating element and insulation cotton are prone to producing particles and other impurities at high temperatures. The heat dissipation component helps prevent these components from remaining at high temperatures for extended periods, reducing the generation of particulate impurities. These impurities also flow from the lower space through the heat dissipation holes to the upper space, preventing them from accumulating in the lower space and entering the thin film deposition chamber with the airflow. This would allow them to adhere to the substrate surface, reducing thin film quality and severely impacting chip yield.

[0042] In this embodiment, the shielding cover is configured as a double-layer sealed box structure. The upper and lower spaces of the main body are isolated by the insulating component. The electrical components, pipe joints, and heat dissipation components are fixed in the upper space. The heat dissipation components dissipate heat to the lower and upper spaces, reducing the ambient temperature of the upper and lower spaces. Furthermore, the electrical components and pipe joints are all located away from the heat source (i.e., the heating element), and all three components are situated within the upper space, meaning they are close to the heat dissipation components. This ensures the electrical components and pipe joints are securely mounted within the upper space. The ambient temperature of the pipe joints will not be too high, thus avoiding the failure of electrical components due to high-temperature aging and the loosening of pipe joints due to high temperatures, thereby reducing costs. At the same time, the heat dissipation effect of the heat dissipation component prevents the heating belt and the insulation cotton from being in a high-temperature state for a long time, reducing the generation of particulate impurities. Furthermore, under the action of the heat dissipation component, particulate impurities will also flow from the lower space to the upper space through the heat dissipation holes, thereby preventing particulate impurities from accumulating in the lower space and entering the thin film deposition chamber with the airflow, thus affecting the quality of thin film deposition. This also prevents dust pollution caused by the heating belt and insulation cotton inside the shielding cover, creating a good process environment.

[0043] More specifically, refer to Figures 5 to 7bAs shown, the main body includes a front panel, a back panel, and a top panel. The front panel includes a front side, a left side, and a right side. The two sides of the front side are respectively connected to one end of the left side and one end of the right side, meaning the front panel has a "U" shaped structure. The back panel is located opposite the front side, and its two ends are respectively connected to the other ends of the left side and the right side. The top panel is located above the front panel and the back panel and is detachably connected to them. Therefore, the front panel, the back panel, and the top panel together form an internal space, in which the electrical components, the heat dissipation components, insulation cotton, heating elements, and other structural components are installed. More specifically, the main body has a rectangular structure, thereby improving its structural stability.

[0044] More specifically, the four edges of the isolation member are fixedly connected to the inner sidewalls of the front plate and the back plate, thereby dividing the internal space into the upper space and the lower space.

[0045] In one embodiment, reference is made to Figures 8 to 10 As shown, the isolation component includes a mounting plate and a fixing plate whose shapes are adapted to each other. The outer edge of the mounting plate is fixedly connected to one side of the main body, and the outer edge of the fixing plate is fixedly connected to the other side of the main body. The inner edge of the fixing plate abuts against the inner edge of the mounting plate. Specifically, the isolation component includes a mounting plate and a fixing plate. The mounting plate is used to install the electrical components, pipe joints, and other structural components. The fixing plate is used to install and fix the heat dissipation components of the fixed part and to improve the structural strength of the isolation component. The shapes of the mounting plate and the fixing plate are adapted, that is, the edges of the mounting plate and the fixing plate that contact each other are completely fitted, so that the shape of the cross-section of the main body is consistent after the mounting plate and the fixing plate are spliced ​​together, thereby dividing the internal space of the main body into the upper space and the lower space.

[0046] The outer edge of the mounting plate is fixedly connected to one side of the main body. The outer edge refers to the edge of the mounting plate that does not contact the edge of the fixing plate. The outer edge is located outside the mounting plate, i.e., away from the inner edge of the fixing plate. The outer edge of the mounting plate is fixedly connected to the inner wall of one side of the main body. The outer edge of the fixing plate is fixedly connected to the other side of the main body. The outer edge refers to the edge of the fixing plate that does not abut against the edge of the mounting plate. The outer edge is located outside the fixing plate, i.e., away from the inner edge of the mounting plate. The outer edge of the fixing plate is fixedly connected to the inner wall of the other side of the main body.

[0047] Meanwhile, the inner edge of the fixing plate abuts against the inner edge of the mounting plate. The inner edge of the fixing plate refers to the edge of the fixing plate closer to the mounting plate, and the inner edge of the mounting plate refers to the edge of the mounting plate closer to the fixing plate. The shapes of the inner edges of the fixing plate and the mounting plate are adapted to each other, so that the fixing plate and the mounting plate can be spliced ​​together, improving the structural stability of the fixing plate and the mounting plate.

[0048] In this embodiment, the internal space of the main body is divided into the upper space and the lower space by the mounting plate and the fixing plate, so that the installation of the isolation component and the main body is convenient and the structure is highly stable.

[0049] More specifically, the outer edge of the mounting plate is fixedly connected to the inner wall of the back plate, and the outer edge of the fixing plate is fixedly connected to the inner wall of the front plate along the circumference of the front plate. During installation, the mounting plate can be fixed to the back plate first, the fixing plate can be fixed to the front plate, and then the back plate and the front plate can be fixedly connected. At this time, the inner edges of the mounting plate and the fixing plate abut against each other, so that the internal spaces of the front plate and the back plate form the upper space and the lower space. The installation method of the mounting plate, the fixing plate, the front plate, and the back plate is simple.

[0050] More specifically, refer to Figures 6 to 7b As shown, the inner wall of the front panel is provided with a first liner plate along its circumference. The first liner plate extends horizontally toward the center of the front panel and is used to fix the fixing plate. When installing the front panel and the fixing plate, the fixing plate is placed on the first liner plate, and the outer edge of the fixing plate and the first liner plate are fixedly connected by bolts. More specifically, the first liner plate is fixed to the inner wall of the front panel by welding.

[0051] The inner wall of the back plate has a second liner extending horizontally inward, which is used to fix the mounting plate. When installing the back plate and the mounting plate, the mounting plate is placed on the second liner, and the outer edge of the mounting plate and the second liner are fixed together with bolts. More specifically, the second liner is fixed to the inner wall of the back plate by welding.

[0052] In a specific embodiment, refer to Figures 9 to 10As shown, the mounting plate has mounting holes extending through its upper and lower sides. The electrical component is installed within these mounting holes, and its connecting wires connect to the structural components of the lower space via these holes. Specifically, the electrical component is mounted on the mounting plate, which has mounting holes extending through its upper and lower sides. These mounting holes allow the connecting wires of the electrical component to pass through. During installation, the electrical component is mounted on the mounting holes, completely sealing them to prevent heat and particulate impurities from the lower space from flowing into the upper space. Therefore, the connecting wires of the electrical component can extend through the mounting holes into the lower space to connect with other structural components, facilitating the connection between the electrical component and other structural components. For example, the electrical component may include an electrical adapter box, whose connecting wires extend through the mounting holes into the lower space and connect to the heating element.

[0053] More specifically, the bottom end of the electrical component is installed in the mounting hole, and the two sides of the electrical component are provided with fixing parts that extend horizontally outward. The fixing parts are fixedly connected to the mounting plate by bolts to improve the fixing stability of the electrical component.

[0054] More specifically, the isolation component includes one mounting plate and two fixing plates. The two fixing plates are arranged adjacently and symmetrically to facilitate the installation of the fixing plates. The two fixing plates abut against each other on their adjacent side edges, and the shape of the two fixing plates and the mounting plate after splicing is consistent with the shape of the cross-section of the main body.

[0055] In a specific embodiment, refer to Figures 1a to 2 , Figures 8 to 10As shown, the mounting plate also has an overlapping portion, which is located at the edge of the mounting plate away from the main body. The overlapping portion extends towards the fixing plate and overlaps the top of the fixing plate. Specifically, the mounting plate also has an overlapping portion, which allows one side of the mounting plate to overlap the top of the fixing plate, thereby increasing the load-bearing capacity of the mounting plate and enabling it to better support the electrical components. The overlapping portion is located at the edge of the mounting plate away from the main body, that is, opposite to the side of the mounting plate that is fixedly connected to the main body. The overlapping portion extends from the inner edge of the mounting plate towards the fixing plate. When the mounting plate and the fixing plate are joined, the overlapping portion overlaps the top of the fixing plate, so that both sides of the mounting plate have load-bearing points (one side is fixedly connected to the inner wall of the main body, and the other side overlaps with the fixing plate). This makes the support of the mounting plate for the electrical components more stable when the electrical components are installed on the mounting plate, improving the structural stability of the shielding cover.

[0056] More specifically, refer to Figure 2 As shown, the overlapping portion includes an inclined section and a horizontal section. The inclined section is connected to the inner edge of the mounting plate, and the inclined section extends obliquely upward from the side connected to the inner edge of the mounting plate and connects to one side of the horizontal section. The inclined section is used to avoid the inner edge of the fixing plate so that the horizontal section can be located above the fixing plate. The horizontal section is used to overlap the fixing plate, thereby improving the structural stability of the mounting plate and avoiding interference between the overlapping portion and the inner edge of the fixing plate.

[0057] More specifically, the mounting plate is also provided with a plurality of clearance holes, which extend through the upper and lower sides of the mounting plate to allow wires to pass through, so that the wires can connect the upper space structure and the lower space structure through the clearance holes.

[0058] In one embodiment, reference is made to Figure 4 , Figure 8 and Figure 11As shown, the heat dissipation hole is located on the fixed plate. The heat dissipation assembly includes a cylinder and a heat dissipation plate. The cylinder is located on one side of the heat dissipation hole and one end is fixedly connected to the fixed plate. The telescopic part of the cylinder is fixedly connected to the heat dissipation plate. The heat dissipation plate is used to adjust the opening degree of the heat dissipation hole. Specifically, the heat dissipation hole is located on the fixed plate, that is, the heat dissipation hole extends through the upper and lower sides of the fixed plate. The heat dissipation assembly includes a cylinder and a heat dissipation plate. The cylinder is used to drive the heat dissipation plate to perform telescopic movement. The size of the heat dissipation plate is equal to or larger than the size of the heat dissipation hole, where the size refers to the length and width. The heat dissipation plate is located above the heat dissipation hole, so that the heat dissipation plate can block the heat dissipation hole. According to the degree of blocking of the heat dissipation hole by the heat dissipation plate, the opening degree of the heat dissipation hole can be adjusted by the heat dissipation plate, thereby controlling the temperature of the lower space and providing an effective working temperature for the structural components in the lower space.

[0059] The bottom end of the cylinder is fixedly connected to the top end of the fixed plate. The cylinder is located on one side of the heat dissipation hole, and the cylinder includes a telescopic part. The telescopic part can move closer to and away from the heat dissipation hole under the drive of the power source. One end of the telescopic part is fixedly connected to the heat dissipation plate, so that the telescopic part can drive the heat dissipation plate to move closer to and away from the heat dissipation hole, thereby allowing the heat dissipation plate to adjust the opening degree of the heat dissipation hole. The opening degree of the heat dissipation hole is related to the heat dissipation degree of the lower space.

[0060] When the heat sink moves away from the heat dissipation hole under the action of the telescopic part (i.e., the telescopic part retracts, causing the heat sink to move towards the cylinder), the opening degree of the heat dissipation hole increases, more and more heat flows from the lower space to the upper space, the heat dissipation efficiency increases, and the temperature of the lower space decreases. The heat dissipation efficiency of the lower space is highest when the heat sink completely does not block the heat dissipation hole. Conversely, when the heat sink moves closer to the heat dissipation hole under the action of the telescopic part (i.e., the telescopic part extends, causing the heat sink to move away from the cylinder), the opening degree of the heat dissipation hole decreases, less heat flows from the lower space to the upper space, the heat dissipation efficiency decreases, and the temperature of the lower space increases. The heat dissipation efficiency of the lower space is lowest when the heat sink completely blocks the heat dissipation hole.

[0061] This embodiment controls the opening degree of the heat dissipation holes by setting the cylinder and the heat sink, thereby controlling the heat dissipation efficiency of the lower space and thus controlling the temperature of the lower space, so that the temperature of the lower space can be kept constant. Users or systems can control the cylinder and the heat sink according to actual usage needs, thereby adjusting the temperature of the lower space and keeping the temperature of the lower space constant, providing a stable and effective working temperature for the structural components of the lower space.

[0062] In one embodiment, reference is made to Figure 8 , Figure 11 As shown, the heat sink has a guide groove at one edge along its direction of movement. The heat dissipation assembly also includes a pin, one end of which passes through the guide groove and is fixedly connected to the fixing plate. The pin is slidably connected to the guide groove. Specifically, the heat sink has a guide groove that guides the direction of movement of the heat sink, causing it to move along the direction of the guide groove and preventing it from deviating from the direction of movement, thereby improving the stability of the heat sink's movement. The guide groove extends along the direction of movement of the heat sink and is located at the edge of the heat sink. The heat dissipation assembly also includes a pin. One end of the pin passes through the guide groove and is fixedly connected to the fixing plate. The pin is positioned close to the heat dissipation hole, and the other end of the pin is engaged above the guide groove. The pin is slidably connected to the guide groove. The pin is used to ensure that the heat dissipation plate moves along the extension direction of the guide groove, thereby allowing the heat dissipation plate to extend and retract along the extension direction of the guide groove under the action of the telescopic part. This prevents the heat dissipation plate from deviating from the direction of the heat dissipation hole, improves the movement stability of the heat dissipation plate, and ensures the shielding effect of the heat dissipation plate on the heat dissipation hole.

[0063] More specifically, the heat sink is provided with guide grooves on both sides, thereby further improving the motion stability and structural stability of the heat sink.

[0064] In a specific embodiment, refer to Figure 1a , Figure 3 , Figures 4 to 7bAs shown, the main body has an air outlet on one side of the upper space, and the heat dissipation assembly also includes a fan installed inside the air outlet. Specifically, the air outlet on one side of the main body, which extends through the inner and outer sides of the main body, is used to exhaust heat from the upper space. The heat dissipation assembly also includes a fan, which is used to guide heat from inside the upper space to the outside of the upper space. The fan is installed inside the air outlet, and the fan blades are located inside the upper space. When the fan is activated, heat and impurities such as particles in the lower space flow with the airflow toward the fan, and together with the heat from the upper space, flow toward the fan, and are finally exhausted into the upper space through the air outlet, thereby reducing the temperature of both the lower and upper spaces.

[0065] In this embodiment, heat dissipation is achieved through the fan, which is a simple, low-cost, and highly efficient method.

[0066] More specifically, the fan is fixed to the back panel and is close to the electrical component, thereby improving the heat dissipation efficiency of the electrical component.

[0067] More specifically, refer to Figure 7b As shown, there are two fans spaced apart. The back plate also has air vents located between the two fans. These air vents are used to connect hoses to supply air to the interior space of the shielding cover, thereby ensuring stable air pressure inside the shielding cover. The air vents are φ8 vents.

[0068] In one embodiment, reference is made to Figures 1a to 3 , Figures 5 to 6 As shown, the main body is provided with an air outlet on one side of the upper space. The heat dissipation assembly also includes an exhaust pipe, one end of which is connected to the air outlet, and the other end of which is connected to an exhaust device. Specifically, the main body is provided with an air outlet located in the upper space, which connects the upper space and the external space; the heat dissipation assembly also includes an exhaust pipe, one end of which is connected to the air outlet, and the other end of which is connected to an exhaust device.

[0069] When the exhaust device is activated, the heat and impurities such as particles in the lower space will flow to the upper space, and together with the heat in the upper space, flow to the air outlet and then through the exhaust pipe to the outside of the upper space, thereby dissipating heat from both the upper and lower spaces and reducing their heat levels.

[0070] This embodiment dissipates heat through the exhaust pipe and the exhaust device, achieving secondary heat dissipation on top of the fan's heat dissipation. This enables more efficient heat dissipation of the interior of the shielding cover and structural components such as the electrical components, the heating belt, and the insulation cotton. At the same time, the exhaust pipe and the exhaust device have higher heat dissipation efficiency, and the entire shielding cover is slowly evacuated through the exhaust pipe to achieve effective heat dissipation.

[0071] More specifically, refer to Figures 1a to 1b As shown, the heat dissipation assembly also includes a filter screen, which is fixed inside the exhaust pipe to intercept the airflow towards the exhaust pipe, filtering out impurities such as particles and lint from the side of the exhaust pipe near the exhaust port, thus preventing these impurities from entering the exhaust device and affecting its operation. The filter screen is welded inside the exhaust pipe.

[0072] More specifically, the heat dissipation assembly further includes a flange, which is disposed at the bottom end of the extraction pipe and fixedly connected to the extraction pipe. The flange is also fixedly connected to the main body, thereby fixing the extraction pipe and the main body together, improving the connection stability between the extraction pipe and the main body, and simplifying installation. The flange is fixedly connected to the main body by bolts.

[0073] In this embodiment, the air extraction pipe is installed on the top plate, which can more evenly extract air from various positions in the upper space and improve the stability of the internal environment of the upper space and the lower space.

[0074] In a specific embodiment, the heat dissipation assembly further includes a first temperature sensor and a second temperature sensor (not shown in the figure). The first temperature sensor is fixed in the upper space near the electrical component, and the second temperature sensor is fixed in the lower space near the heat dissipation hole. Specifically, the heat dissipation assembly further includes a first temperature sensor and a second temperature sensor. The first temperature sensor is used to detect the temperature of the upper space in real time. The first temperature sensor is fixed in the upper space near the electrical component, thereby enabling monitoring of the temperature of the upper space. Especially at the location of the electrical component, the system can adjust the fan speed according to the temperature detected by the first temperature sensor to adjust the temperature of the upper space in real time, effectively dissipate heat, and prevent the electrical component from overheating.

[0075] The second temperature sensor is used to detect the temperature of the lower space in real time. The second temperature sensor is fixed in the lower space near the heat dissipation hole, so that the temperature of the lower space can be monitored. In particular, at the location of the heat dissipation hole, the system can adjust the extension and retraction length of the cylinder according to the temperature detected by the second temperature sensor, thereby adjusting the opening size of the heat dissipation hole to adjust the temperature of the lower space in real time, ensuring that the temperature of the lower space is kept constant, and providing a stable working temperature environment for the structural components of the lower space.

[0076] This embodiment uses the first temperature sensor and the second temperature sensor to automatically adjust the heat dissipation capacity of the heat dissipation component based on the real-time temperature of the upper space and the lower space. This improves the flexible control of the temperature of the upper space and the lower space, ensures that the components work within a suitable temperature range, solves the problem of particulate impurities caused by temperature rise, effectively reduces equipment failure rate, improves process quality, and reduces costs.

[0077] More specifically, the number of the second temperature sensors is the same as the number of cylinders, so that the system can independently adjust the extension length of each cylinder according to the temperature detected by each of the second temperature sensors, thereby improving the accuracy and flexibility of the adjustment.

[0078] This embodiment also provides a thin film deposition apparatus (not shown in the figure), which includes a shield. The shield can be any type of shield provided by this utility model. Since the specific structure and working principle of the shield have been described in detail in the previous description, they will not be repeated here for the sake of brevity.

[0079] The thin film deposition equipment in this embodiment uses the shielding cover provided by this utility model. The shielding cover can solve the problem of particulate impurities caused by temperature rise, and can also effectively reduce the equipment failure rate, improve process quality, and reduce costs. Therefore, it can improve the deposition quality of the thin film deposition equipment, avoid the influence of particulate impurities during thin film deposition, reduce the failure rate of the thin film deposition equipment, increase the service life of the thin film deposition equipment, and reduce maintenance costs.

[0080] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A shield characterized by, include: main body; An isolation component is fixed inside the main body and divides the internal space of the main body into an upper space and a lower space. The isolation component is provided with heat dissipation holes, which connect the upper space and the lower space. Electrical components, pipe joints and heat dissipation components are installed in the upper space. When the heat dissipation component is activated, the heat and particles in the lower space will flow to the upper space through the heat dissipation holes and be dissipated by the heat dissipation component together with the heat in the upper space.

2. The shield of claim 1, wherein, The isolation component includes a mounting plate and a fixing plate whose shapes are adapted to each other. The outer edge of the mounting plate is fixedly connected to one side of the main body, and the outer edge of the fixing plate is fixedly connected to the other side of the main body. The inner edge of the fixing plate abuts against the inner edge of the mounting plate.

3. The shield of claim 2, wherein, The mounting plate is provided with mounting holes that extend through its upper and lower sides, wherein the electrical components are installed in the mounting holes and the connecting wires of the electrical components are connected to the structural components of the lower space through the mounting holes.

4. The shield of claim 2, wherein, The mounting plate is also provided with an overlapping portion, which is located at the edge of the mounting plate away from the main body. The overlapping portion extends toward the fixing plate and overlaps the top of the fixing plate.

5. The shield of claim 2, wherein, The heat dissipation hole is provided on the fixed plate. The heat dissipation assembly includes a cylinder and a heat dissipation plate. The cylinder is located on one side of the heat dissipation hole and one end is fixedly connected to the fixed plate. The telescopic part of the cylinder is fixedly connected to the heat dissipation plate. The heat dissipation plate is used to adjust the opening degree of the heat dissipation hole.

6. The shield of claim 5, wherein, The heat sink is provided with a guide groove on one side edge along its direction of movement. The heat sink assembly also includes a pin. One end of the pin passes through the guide groove and is fixedly connected to the fixing plate. The pin is slidably connected to the guide groove.

7. The shield of claim 1, wherein, The main body is provided with an air outlet on one side of the upper space, and the heat dissipation component also includes a fan, which is installed in the air outlet.

8. The shield of claim 1, wherein, The main body is located on one side of the upper space and is provided with an air outlet. The heat dissipation component also includes an air extraction pipe, one end of which is connected to the air outlet and the other end is connected to an air extraction device.

9. The shield of claim 1, wherein, The heat dissipation assembly further includes a first temperature sensor and a second temperature sensor. The first temperature sensor is fixed in the upper space near the electrical component, and the second temperature sensor is fixed in the lower space near the heat dissipation hole.

10. A thin film deposition apparatus, characterized in that, include: A shielding cover, wherein the shielding cover is the shielding cover according to any one of claims 1-9.

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