Chip flip transfer apparatus

Abstract

The utility model relates to the technical field of semiconductor processing discloses a chip turnover conveying equipment. Wherein chip turnover conveying equipment includes two interval settings chip conveying mechanism, chip conveying mechanism includes rotary drive part, base and pickup device, and rotary drive part drive connection is in base, pickup device sets up in base, and the rotary drive part of first chip conveying mechanism is used for driving base rotation to make the pickup device of first chip conveying mechanism rotate to the loading position and first handover position, the rotary drive part of second chip conveying mechanism is used for driving base rotation to make the pickup device of second chip conveying mechanism rotate to the unloading position and second handover position, the pickup device of loading position can pick up chip, the pickup device of first handover position and the pickup device of second handover position are opposite setting and can respectively adsorb the both sides of chip, the pickup device of unloading position can convey chip to work carrier plate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a chip flipping and conveying device. Background Technology

[0002] In the semiconductor manufacturing and advanced packaging fields, efficient and precise wafer transfer is a core element in ensuring production yield and efficiency. Current technologies typically employ a vertical layout for wafer transfer devices, where the blue film and the work carrier are vertically positioned on opposite sides of the device. Wafers are picked up from the blue film via nozzles and horizontally transported to the work carrier, thus transferring the wafers from storage to the processing station. However, this technology has significant limitations: because both the blue film and the carrier maintain a fixed posture, the nozzles can only perform unilateral pickup and planar transport, making wafer flipping impossible. This necessitates manual intervention or multiple devices working together, increasing the risk of contamination and operational complexity, while also reducing production efficiency and raising costs.

[0003] Therefore, there is an urgent need for a chip flipping and transfer device to solve the aforementioned problems. Utility Model Content

[0004] Based on the above, the purpose of this utility model is to provide a chip flipping and conveying device that realizes the conveying of chips on the blue film to the working carrier board and the flipping of the chips to meet the working requirements.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] On one hand, a chip flipping and conveying device is provided, including two chip conveying mechanisms spaced apart; each chip conveying mechanism includes a rotary drive, a base, and a pickup device, wherein the rotary drive is driven and connected to the base; the pickup device is disposed on the base, wherein the rotary drive of the first chip conveying mechanism is used to drive the base to rotate, so that the pickup device of the first chip conveying mechanism rotates to the loading position and the first handover position; and the rotary drive of the second chip conveying mechanism is used to drive the base to rotate, so that the pickup device of the second chip conveying mechanism rotates to the unloading position and the second handover position.

[0007] The picking device located at the loading position can pick up the chip; the picking device located at the first handover position and the picking device located at the second handover position are arranged opposite each other and can respectively adsorb both sides of the chip to hand over the chip; the picking device located at the unloading position can transfer the chip to the work carrier board.

[0008] As a preferred technical solution for a chip flipping and transferring device, the chip transferring mechanism includes four picking devices, which are evenly spaced around the base in the circumferential direction.

[0009] As a preferred technical solution for a chip flipping and transferring device, the pickup device includes a nozzle, a driving component, and a first adjustment component, a second adjustment component, and a third adjustment component connected in sequence. The nozzle is slidably connected to the third adjustment component along the Y-axis direction. The driving component is driven and connected to the nozzle. The driving component is used to drive the nozzle to reciprocate along the Y-axis direction so that the nozzle approaches or moves away from the chip. The first adjustment component is connected to the base. The first adjustment component is used to adjust the displacement of the nozzle along the Z-axis direction, the second adjustment component is used to adjust the displacement of the nozzle along the X-axis direction, and the third adjustment component is used to adjust the angle of the nozzle relative to the Z-axis and the angle relative to the X-axis.

[0010] As a preferred technical solution for a chip flipping and transfer device, the first adjustment component includes a first adjustment block and two first adjustment screws. The first adjustment block is provided with two first oblong holes spaced apart along the Z-axis direction. The first oblong holes extend along the Z-axis direction. The base is provided with first threaded holes corresponding to the two first oblong holes. The first adjustment screws pass through the first oblong holes and are threadedly connected to the first threaded holes.

[0011] As a preferred technical solution of a chip flipping and transfer device, the second adjustment component includes a second adjustment block and a second adjustment screw. The second adjustment block is provided with a second oblong hole extending along the X-axis direction. The first adjustment block is provided with a second threaded hole corresponding to the second oblong hole. The second adjustment screw passes through the second oblong hole and is threadedly connected to the second threaded hole.

[0012] As a preferred technical solution for a chip flipping and transferring device, one of the bottom of the second adjusting block and the top of the first adjusting block is provided with a guide groove extending along the X-axis direction, and the other is provided with a guide boss extending along the X-axis direction, wherein the guide groove and the guide boss are slidably connected.

[0013] As a preferred technical solution for a chip flip-transfer device, the third adjustment component includes a third adjustment block and two third adjustment screws. The third adjustment block is provided with two third oblong holes spaced apart along the Y-axis direction. The third oblong holes extend along the X-axis direction. The top of the second adjustment block is provided with a third threaded hole corresponding to the two third oblong holes. The third adjustment screw passes through the third oblong holes and is threadedly connected to the third threaded holes.

[0014] As a preferred technical solution for a chip flipping and transfer device, the third adjustment component further includes a connecting block and two fourth adjustment screws. The third adjustment block is also provided with two fourth oblong holes spaced apart along the Y-axis direction. The fourth oblong holes extend along the Z-axis direction. The connecting block is provided with a fourth threaded hole corresponding to the two fourth oblong holes. The fourth adjustment screw passes through the fourth oblong holes and is threadedly connected to the fourth threaded holes. The suction nozzle is connected to the connecting block.

[0015] As a preferred technical solution for a chip flipping and transferring device, the driving component includes a first driving component, an elastic element, and a buffer block. The first driving component is disposed on the base and drivenly connected to the buffer block. The first driving component is used to drive the buffer block to reciprocate along the Y-axis direction. The buffer block is provided with an abutment portion. The abutment portion and the suction nozzle are spaced apart along the Y-axis direction. One end of the elastic element is connected to the abutment portion, and the other end is connected to the end of the suction nozzle away from the chip.

[0016] As a preferred technical solution for a chip flipping and transfer device, the drive assembly further includes an adjustment block and two fifth adjustment screws. The first drive component is driven and connected to the adjustment block. The buffer block is provided with an elongated hole extending along the Y-axis direction. The adjustment block is provided with two fifth threaded holes spaced apart along the Y-axis direction. The two fifth adjustment screws are respectively passed through the elongated hole and threadedly connected to the two fifth threaded holes.

[0017] The beneficial effects of this utility model are as follows:

[0018] This invention provides a chip flipping and conveying device. A blue film carrying a wafer is vertically positioned on one side of the loading position of a first chip conveying mechanism, and a work carrier is vertically positioned on one side of the unloading position of a second chip conveying mechanism. When wafer flipping and transfer are required, the first chip conveying mechanism performs the following steps: a rotary drive drives a picking device to rotate to the loading position, at which point the picking device picks up the front side of the chip from the blue film; then, the rotary drive drives the picking device to rotate to the first transfer position; the second chip conveying mechanism performs the following steps: a rotary drive drives the picking device to rotate to the second transfer position, where the picking device at the second transfer position picks up the chip from the picking device at the first transfer position, and the picking device picks up the back side of the chip; finally, the rotary drive drives the picking device to rotate to the unloading position, where the picking device attaches the front side of the chip to the work carrier, completing the chip flipping and conveying. This invention achieves the transfer of chips from the blue film to the work carrier and also enables chip flipping, meeting operational requirements. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the chip flipping and transferring device provided in a specific embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the chip transmission mechanism provided in a specific embodiment of this utility model;

[0022] Figure 3 This is one of the partial structural schematic diagrams of the chip transmission mechanism provided in a specific embodiment of this utility model;

[0023] Figure 4 This is an exploded view of the chip transmission mechanism provided in a specific embodiment of this utility model;

[0024] Figure 5 This is the second partial structural schematic diagram of the chip transmission mechanism provided in a specific embodiment of this utility model;

[0025] Figure 6 yes Figure 2 Enlarged view at point A.

[0026] The markings in the image are as follows:

[0027] 100. Chip transfer mechanism; 101. Loading position; 102. First handover position; 103. Second handover position; 104. Unloading position;

[0028] 1. Rotary drive component;

[0029] 2. Base; 21. First threaded hole;

[0030] 3. Pickup device; 31. First adjustment assembly; 311. First adjustment block; 3111. First oblong hole; 3112. Second threaded hole; 3113. Guide boss; 32. Second adjustment assembly; 321. Second adjustment block; 3211. Second oblong hole; 3212. Guide groove; 3213. Third threaded hole; 33. Third adjustment assembly; 331. Third adjustment block; 3311. Third oblong hole; 3312. Fourth oblong hole; 332. Connecting block; 3321. Fourth threaded hole; 34. Suction 341. Mouth; 342. Positioning groove; 35. First stop pin; 36. Drive assembly; 37. Elastic element; 38. Buffer block; 39. Elongated hole; 30. Abutment part; 31. Positioning post; 32. First drive component; 33. Drive motor; 34. Cam; 35. Slide; 35. First follower; 35. Second follower; 36. Tension spring; 37. Fourth adjusting block; 38. Fifth threaded hole; 39. Second stop pin; 4. Support plate. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0032] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0034] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0035] like Figure 1 and Figure 2 As shown, this embodiment provides a chip flipping and conveying device, which includes two spaced-apart chip conveying mechanisms 100. Each chip conveying mechanism 100 includes a rotation drive 1, a base 2, and a pickup device 3. The rotation drive 1 is driven and connected to the base 2. The pickup device 3 is disposed on the base 2. The rotation drive 1 of the first chip conveying mechanism 100 drives the base 2 to rotate, so that the pickup device 3 of the first chip conveying mechanism 100 rotates to the loading position 101 and the first transfer position 102. The rotation drive 1 of the second chip conveying mechanism 100 drives the base 2 to rotate, so that the pickup device 3 of the second chip conveying mechanism 100 rotates to the unloading position 104 and the second transfer position 103. The pickup device 3 located at the loading position 101 can pick up the chip. The pickup device 3 located at the first transfer position 102 and the pickup device 3 located at the second transfer position 103 are arranged opposite each other and can respectively adsorb both sides of the chip to transfer the chip. The pickup device 3 located at the unloading position 104 can convey the chip to the work carrier.

[0036] During operation, a blue film carrying the wafer is vertically positioned on one side of the loading position 101 of the first chip transfer mechanism 100, and a work carrier is vertically positioned on one side of the unloading position 104 of the second chip transfer mechanism 100. When wafer flipping and transfer are required, the first chip transfer mechanism 100 performs the following steps: the rotary drive 1 drives the pickup device 3 to rotate to the loading position 101, at which time the pickup device 3 picks up the front side of the chip on the blue film; then, the rotary drive 1 drives the pickup device 3 to rotate to the first transfer position 102; the second chip transfer mechanism 100 performs the following steps: the rotary drive 1 drives the pickup device 3 to rotate to the second transfer position 103, the pickup device 3 at the second transfer position 103 picks up the chip at the pickup device 3 at the first transfer position 102, and the pickup device 3 picks up the back side of the chip; finally, the rotary drive 1 drives the pickup device 3 to rotate to the unloading position 104, and the pickup device 3 attaches the front side of the chip to the work carrier, completing the chip flipping and transfer. This invention enables the transfer of chips from the blue film to the work substrate and allows for chip flipping, thus meeting operational requirements.

[0037] Preferably, the chip transfer mechanism 100 includes four pickup devices 3, which are evenly spaced circumferentially on the base 2. In this embodiment, when the rotary drive 1 drives the base 2 to rotate, each chip transfer mechanism 100 uses four pickup devices 3 to transfer chips, thereby improving work efficiency.

[0038] like Figures 2-6 As shown, the pickup device 3 includes a nozzle 34, a drive assembly 35, and a first adjustment assembly 31, a second adjustment assembly 32, and a third adjustment assembly 33 connected in sequence. The nozzle 34 is slidably connected to the third adjustment assembly 33 along the Y-axis direction. The drive assembly 35 is driven and connected to the nozzle 34. The drive assembly 35 is used to drive the nozzle 34 to reciprocate along the Y-axis direction, so that the nozzle 34 moves closer to or away from the chip. The first adjustment assembly 31 is connected to the base 2. The first adjustment assembly 31 is used to adjust the displacement of the nozzle 34 along the Z-axis direction, the second adjustment assembly 32 is used to adjust the displacement of the nozzle 34 along the X-axis direction, and the third adjustment assembly 33 is used to adjust the angle of the nozzle 34 relative to the Z-axis and the angle relative to the X-axis. In this embodiment, the Z-axis extends vertically, the Y-axis extends radially along the base 2, and the X-axis, Y-axis, and Z-axis are perpendicular to each other.

[0039] When the pickup device 3 is located at the loading position 101, the drive assembly 35 drives the suction nozzle 34 to approach the chip so that the suction nozzle 34 can pick up the chip. Then, the drive assembly 35 drives the suction nozzle 34 away from the chip to reset, waiting for the next process. When the pickup device 3 located at the first transfer position 102 and the pickup device 3 located at the second transfer position 103 are transferring chips, the drive assemblies 35 of the two pickup devices 3 respectively drive the suction nozzles 34 to approach each other. The suction nozzle 34 located at the second transfer position 103 comes into contact with the chip and performs vacuum adsorption. The suction nozzle 34 located at the first transfer position 102 stops vacuuming. Then, the two suction nozzles 34 reset, completing the chip transfer. When the pickup device 3 is located at the unloading position 104, the drive assembly 35 drives the suction nozzle 34 carrying the chip to approach the work carrier. After the chip is installed on the work carrier, the suction nozzle 34 stops vacuuming. Then, the drive assembly 35 drives the suction nozzle 34 away from the chip to reset, realizing the flipping and transfer of the chip. Furthermore, in this embodiment, the pickup device 3 adjusts the position of the nozzle 34 along the Z-axis direction through the first adjustment component 31, adjusts the position of the nozzle 34 along the X-axis direction through the second adjustment component 32, and adjusts the angle of the nozzle 34 relative to the Z-axis (i.e., the vertical tilt angle of the nozzle 34) and the angle relative to the X-axis (i.e., the horizontal tilt angle of the nozzle 34) through the third adjustment component 33, so that the nozzle 34 can face and be perpendicular to the chip. When the nozzle 34 picks up the chip, the suction force of the nozzle 34 is evenly distributed, improving the chip pickup success rate and ensuring the continuity and stability of the production process.

[0040] In this embodiment, the chip transfer mechanism 100 further includes a detection component, which is disposed on one side of the base 2 along the X-axis. When the rotation drive 1 drives the pickup device 3 carrying the chip to move in front of the detection component, the detection component can detect the chip. It should be noted that the detection component can be a visual inspection sensor, which is existing technology and will not be described in detail here.

[0041] In this embodiment, a blue film carrying a wafer, a first chip transfer mechanism 100, a second chip transfer mechanism 100, and a work substrate are spaced apart along one direction. After the nozzle 34 of the first chip transfer mechanism 100 picks up the chip from the blue film, the rotary drive 1 drives the base 2 to rotate 90°. At this time, the chip is transferred to the front of the detection component, which detects the back side of the chip. After detection, the rotary drive 1 drives the base 2 to continue rotating 90° for chip flipping and transfer. Then, the rotary drive 1 of the second chip transfer mechanism 100 drives the base 2 to rotate 90°. At this time, the chip is transferred to the front of the detection component, which detects the front side of the chip. After detection, the rotary drive 1 drives the base 2 to continue rotating 90° to the unloading position 104, and the chip is transferred to the work substrate via the nozzle 34. This embodiment achieves detection on both sides of the chip.

[0042] Preferably, the rotary drive component 1 is a servo motor, which facilitates the control of the rotation speed and rotation accuracy of the base 2.

[0043] In this embodiment, the suction surface of the suction nozzle 34 is vertically arranged, which can adsorb vertically arranged chips and transfer the chips to a vertically arranged work carrier.

[0044] Furthermore, the first adjustment assembly 31 includes a first adjustment block 311 and two first adjustment screws. The first adjustment block 311 is provided with two first oblong holes 3111 spaced apart along the Z-axis direction. The first oblong holes 3111 extend along the Z-axis direction. The base 2 is provided with first threaded holes 21 corresponding to the two first oblong holes 3111. The first adjustment screws pass through the first oblong holes 3111 and are threadedly connected to the first threaded holes 21. When it is necessary to adjust the position of the suction nozzle 34 along the Z-axis direction, the two first adjustment screws are loosened. Since the first oblong holes 3111 can slide relative to the first adjustment screws along the Z-axis direction, the position of the first adjustment block 311 along the Z-axis direction can be adjusted, thereby adjusting the position of the suction nozzle 34 along the Z-axis direction. After adjustment, the two first adjustment screws are finally tightened to fix the first adjustment block 311 on the base 2.

[0045] Furthermore, the second adjustment assembly 32 includes a second adjustment block 321 and a second adjustment screw. The second adjustment block 321 is provided with a second oblong hole 3211 extending along the X-axis direction, and the first adjustment block 311 is provided with a second threaded hole 3112 corresponding to the second oblong hole 3211. The second adjustment screw passes through the second oblong hole 3211 and is threadedly connected to the second threaded hole 3112. When it is necessary to adjust the position of the suction nozzle 34 along the X-axis direction, the second adjustment screw is loosened. Since the second oblong hole 3211 can slide relative to the second adjustment screw along the X-axis direction, the position of the second adjustment block 321 along the X-axis direction can be adjusted, thereby adjusting the position of the suction nozzle 34 along the X-axis direction. After adjustment, the second adjustment screw is finally tightened, thus fixing the second adjustment block 321 onto the first adjustment block 311.

[0046] Preferably, one of the bottom of the second adjusting block 321 and the top of the first adjusting block 311 is provided with a guide groove 3212 extending along the X-axis, and the other is provided with a guide boss 3113 extending along the X-axis. The guide groove 3212 and the guide boss 3113 are slidably connected. In this embodiment, both the guide groove 3212 and the guide boss 3113 are square. The bottom of the second adjusting block 321 is provided with the guide groove 3212, and the top of the first adjusting block 311 is provided with the guide boss 3113. When the second adjusting screw is loosened, the first adjusting block 311 can slide relative to the guide boss 3113 along the X-axis, improving the movement accuracy of the second adjusting block 321. The guide boss 3113 can restrict the second adjusting block 321 from rotating relative to the first adjusting block 311 around the X-axis. Finally, the second adjusting screw is tightened. After adjustment, only one second adjusting screw needs to be tightened for fixation. With the limiting effect of the guide boss 3113, the second adjusting block 321 can be fixed on the first adjusting block 311.

[0047] Furthermore, the third adjustment assembly 33 includes a third adjustment block 331 and two third adjustment screws. The third adjustment block 331 has two third oblong holes 3311 spaced apart along the Y-axis and extends along the X-axis. The top of the second adjustment block 321 has a third threaded hole 3213 corresponding to the two third oblong holes 3311. The third adjustment screws pass through the third oblong holes 3311 and are threaded into the third threaded holes 3213. When it is necessary to adjust the angle of the suction nozzle 34 relative to the Z-axis, the two third adjustment screws are loosened. Since the third oblong holes 3311 can slide relative to the third adjustment screws along the X-axis, when the two third oblong holes 3311 slide relative to the two third adjustment screws in opposite directions, the angle of the third adjustment block 331 relative to the Z-axis can be adjusted, thereby adjusting the angle of the suction nozzle 34 relative to the Z-axis. After adjustment, the two third adjustment screws are tightened to fix the third adjustment block 331 onto the second adjustment block 321. Furthermore, when the two third oblong holes 3311 slide relative to the two third adjusting screws in the same direction, the position of the suction nozzle 34 along the X-axis can be adjusted.

[0048] Furthermore, the third adjustment assembly 33 also includes a connecting block 332 and two fourth adjustment screws. The third adjustment block 331 is also provided with two fourth oblong holes 3312 spaced apart along the Y-axis direction, and the fourth oblong holes 3312 extend along the Z-axis direction. The connecting block 332 is provided with fourth threaded holes 3321 corresponding to the two fourth oblong holes 3312. The fourth adjustment screws pass through the fourth oblong holes 3312 and are threadedly connected to the fourth threaded holes 3321. The suction nozzle 34 is connected to the connecting block 332. When it is necessary to adjust the angle of the suction nozzle 34 relative to the X-axis, the two fourth adjustment screws are loosened. Since the fourth oblong holes 3312 can slide relative to the fourth adjustment screws along the Z-axis direction, when the two fourth oblong holes 3312 slide relative to the two fourth adjustment screws in opposite directions, the angle of the connecting block 332 relative to the X-axis can be adjusted, thereby realizing the adjustment of the angle of the suction nozzle 34 relative to the X-axis. After adjustment, the two fourth adjustment screws are finally tightened, thus fixing the connecting block 332 to the third adjustment block 331. Furthermore, when the two fourth oblong holes 3312 slide relative to the two fourth adjusting screws in the same direction, the position of the suction nozzle 34 along the Z-axis can be adjusted.

[0049] In this embodiment, the connecting block 332 is provided with a first slide rail extending along the Y-axis direction, and the suction nozzle 34 is connected to a first slider. The first slider is slidably connected to the first slide rail, thereby realizing that the suction nozzle 34 is slidably connected to the third adjustment component 33 along the Y-axis direction.

[0050] like Figure 2 , Figure 5 and Figure 6As shown, in order to prevent damage to the chip caused by hard contact between the nozzle 34 and the chip when the nozzle 34 adsorbs or transports the chip, preferably, the driving component 35 includes a first driving component 353, an elastic element 351 and a buffer block 352. The first driving component 353 is disposed on the base 2 and drivenly connected to the buffer block 352. The first driving component 353 is used to drive the buffer block 352 to reciprocate along the Y-axis direction. The buffer block 352 is provided with an abutment portion 3522. The abutment portion 3522 and the nozzle 34 are spaced apart along the Y-axis direction. One end of the elastic element 351 is connected to the abutment portion 3522, and the other end is connected to the end of the nozzle 34 away from the chip. When a chip needs to be adsorbed, the chip is located in front of the nozzle 34 along the Y-axis. The first driving component 353 drives the buffer block 352 to move closer to the chip. The buffer block 352 drives the nozzle 34 to move closer to the chip through the elastic element 351. The nozzle 34 abuts against the chip and performs vacuum adsorption. When the contact force of the nozzle 34 against the chip is too large, the nozzle 34 slides relative to the third adjusting component 33 along the Y-axis and compresses the elastic element 351 to prevent the nozzle 34 from making hard contact with the chip, forming overload protection and improving the yield of the chip. Furthermore, the nozzle 34 is elastically connected to the buffer block 352 through the elastic element 351, so the nozzle 34 will not be over-constrained when adjusting its posture.

[0051] More preferably, the drive assembly 35 further includes a fourth adjusting block 354 and two fifth adjusting screws. The first drive component 353 is drivenly connected to the fourth adjusting block 354. The buffer block 352 is provided with an elongated hole 3521 extending along the Y-axis. The fourth adjusting block 354 is provided with two fifth threaded holes 3541 spaced apart along the Y-axis. The two fifth adjusting screws pass through the elongated hole 3521 and are threadedly connected to the two fifth threaded holes 3541. When the two fifth adjusting screws are loosened, the elongated hole 3521 can slide relative to the two fifth adjusting screws along the Y-axis, adjusting the position of the abutment part 3522 along the Y-axis, thereby adjusting the elastic force of the elastic element 351, ensuring that the suction nozzle 34 has sufficient abutment force to adsorb the chip.

[0052] In this embodiment, the chip transfer mechanism 100 further includes a support plate 4, a rotary drive member 1 connected to the support plate 4, and a first drive component 353 including a drive motor 3531, a cam 3532, a slide block 3533, a first follower 3534, a second follower 3535, and a tension spring 3536. The drive motor 3531 is connected to the support plate 4 and drives the cam 3532 to rotate. The slide block 3533 is slidably connected to the support plate 4 along the Y-axis direction. Plate 4, with one end of tension spring 3536 connected to base 2 and the other end connected to fourth adjusting block 354. First follower 3534 and second follower 3535 are respectively disposed on slide 3533. First follower 3534 is in contact with the side of cam 3532 closest to the chip. Tension spring 3536 pulls fourth adjusting block 354 inward, providing force for first follower 3534 to press against cam 3532. Second follower 3535 is located on the side of fourth adjusting block 354 away from the chip. When cam 3532 rotates, cam 3532 drives slide 3533 to move closer to the chip via first follower 3534, which in turn drives second follower 3535 to push fourth adjusting block 354, causing fourth adjusting block 354 and buffer block 352 to move closer to the chip, thereby driving nozzle 34 to move closer to the chip. When the cam 3532 resets, the tension spring 3536 can drive the fourth adjusting block 354 to pull inward, so that the suction nozzle 34 resets. In this embodiment, when the base 2 rotates, the drive motor 3531, cam 3532, slide 3533, first follower 3534, and second follower 3535 are all mounted on the support plate 4 and remain stationary. Therefore, the suction nozzles 34 of multiple pickup devices 3 can share the drive motor 3531, cam 3532, slide 3533, first follower 3534, and second follower 3535. The drive motor 3531, cam 3532, slide 3533, first follower 3534, and second follower 3535 only need to be set at the loading position 101, the first junction position 102, the unloading position 104, and the second junction position 103, which reduces equipment costs and eliminates the need to consider the cable entanglement problem of the first drive component 353 when the base 2 rotates, thus reducing design difficulty. In other embodiments, the first driving component 353 may also be a linear motor, cylinder, or other mechanism capable of linear reciprocating drive.

[0053] In this embodiment, the elastic member 351 applies a spring force to the suction nozzle 34 in the direction of the chip. The suction nozzle 34 is also provided with a first stop pin 342, and the fourth adjusting block 354 is provided with a second stop pin 3542. The second stop pin 3542 is located on the side of the first stop pin 342 that is close to the chip. The spring force of the elastic member 351 can drive the first stop pin 342 of the suction nozzle 34 to abut against the second stop pin 3542. The second stop pin 3542 can limit the maximum displacement of the suction nozzle 34.

[0054] Preferably, the abutment portion 3522 is provided with a positioning post 3523, and the elastic element 351 is a spring. The spring is sleeved on the positioning post 3523 to prevent the spring from deviating relative to the abutment portion 3522; and / or the end of the suction nozzle 34 away from the chip is provided with a positioning groove 341, and the spring is embedded in the positioning groove 341 to prevent the spring from deviating relative to the suction nozzle 34. This improves the working reliability of the chip transfer mechanism 100 and improves the assembly convenience of the spring.

[0055] In this embodiment, the chip transfer mechanism 100 uses a servo motor as a rotation drive 1 to drive the four suction nozzles 34 to rotate. The suction nozzles 34 are adjusted along the X-axis, Z-axis, relative X-axis angle, and relative Z-axis angle by the first adjustment component 31, the second adjustment component 32, and the third adjustment component 33, realizing the adjustment of the suction nozzles 34 in multiple dimensions. The pickup device 3 can reduce the rotation radius of the suction nozzles 34 to 65mm, thereby improving the positional accuracy of the suction nozzles 34.

[0056] This embodiment also provides a chip flipping and transfer method, which uses the chip flipping and transfer equipment described above; the chip flipping and transfer method includes the following steps:

[0057] The first chip transfer mechanism 100 performs the following steps:

[0058] The rotary drive 1 drives the pickup device 3 to rotate to the loading position 101, whereby the pickup device 3 picks up the front side of the chip. The rotary drive 1 then drives the pickup device 3 to rotate to the first transfer position 102.

[0059] The second chip transfer mechanism 100 performs the following steps:

[0060] The rotary drive 1 drives the pickup device 3 to rotate to the second transfer position 103. The pickup device 3 at the second transfer position 103 picks up the chip located at the pickup device 3 at the first transfer position 102, and the pickup device 3 picks up the back side of the chip. The rotary drive 1 drives the pickup device 3 to rotate to the unloading position 104, and the pickup device 3 attaches the front side of the chip to the work carrier, completing the chip flipping and transfer.

[0061] In this embodiment, the chip flipping and transfer are completed by two chip transfer mechanisms 100, which eliminates the need for manual intervention, thereby improving production efficiency and reducing production costs.

[0062] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A chip flipping and transferring device, characterized in that, The device includes two spaced-apart chip transfer mechanisms (100); each chip transfer mechanism (100) includes a rotary drive (1), a base (2), and a pickup device (3). The rotary drive (1) is driven to the base (2); the pickup device (3) is disposed on the base (2). The rotary drive (1) of the first chip transfer mechanism (100) drives the base (2) to rotate, so that the pickup device (3) of the first chip transfer mechanism (100) rotates to the loading position (101) and the first transfer position (102); the rotary drive (1) of the second chip transfer mechanism (100) drives the base (2) to rotate, so that the pickup device (3) of the second chip transfer mechanism (100) rotates to the unloading position (104) and the second transfer position (103). The picking device (3) located at the loading position (101) can pick up the chip; the picking device (3) located at the first transfer position (102) and the picking device (3) located at the second transfer position (103) are arranged opposite each other and can respectively adsorb the two sides of the chip to transfer the chip; the picking device (3) located at the unloading position (104) can transfer the chip to the work carrier board.

2. The chip flipper conveyor apparatus of claim 1, wherein, The chip transfer mechanism (100) includes four pickup devices (3), which are evenly spaced around the base (2).

3. The chip flipper conveyor apparatus of claim 1, wherein, The pickup device (3) includes a nozzle (34), a drive assembly (35), and a first adjustment assembly (31), a second adjustment assembly (32), and a third adjustment assembly (33) connected in sequence. The nozzle (34) is slidably connected to the third adjustment assembly (33) along the Y-axis direction. The drive assembly (35) is driven and connected to the nozzle (34). The drive assembly (35) is used to drive the nozzle (34) to slide back and forth along the Y-axis direction so that the nozzle (34) moves closer to or away from the chip. The first adjustment assembly (31) is connected to the base (2). The first adjustment assembly (31) is used to adjust the displacement of the nozzle (34) along the Z-axis direction. The second adjustment assembly (32) is used to adjust the displacement of the nozzle (34) along the X-axis direction. The third adjustment assembly (33) is used to adjust the angle of the nozzle (34) relative to the Z-axis and the angle relative to the X-axis.

4. The chip flipper conveyor apparatus of claim 3, wherein, The first adjustment component (31) includes a first adjustment block (311) and two first adjustment screws. The first adjustment block (311) is provided with two first waist-shaped holes (3111) spaced apart along the Z-axis direction. The first waist-shaped holes (3111) extend along the Z-axis direction. The base (2) is provided with a first threaded hole (21) corresponding to the two first waist-shaped holes (3111). The first adjustment screw passes through the first waist-shaped hole (3111) and is threaded to the first threaded hole (21).

5. The chip flipper conveyor apparatus of claim 4, wherein, The second adjustment component (32) includes a second adjustment block (321) and a second adjustment screw. The second adjustment block (321) is provided with a second oblong hole (3211) extending along the X-axis direction. The first adjustment block (311) is provided with a second threaded hole (3112) corresponding to the second oblong hole (3211). The second adjustment screw passes through the second oblong hole (3211) and is threadedly connected to the second threaded hole (3112).

6. The chip flipper conveyor apparatus of claim 5, wherein, One of the bottom of the second adjusting block (321) and the top of the first adjusting block (311) is provided with a guide groove (3212) extending along the X-axis direction, and the other is provided with a guide boss (3113) extending along the X-axis direction. The guide groove (3212) and the guide boss (3113) are slidably connected.

7. The chip flipper conveyor apparatus of claim 5, wherein, The third adjustment component (33) includes a third adjustment block (331) and two third adjustment screws. The third adjustment block (331) is provided with two third oblong holes (3311) spaced apart along the Y-axis. The third oblong holes (3311) extend along the X-axis. The top of the second adjustment block (321) is provided with a third threaded hole (3213) corresponding to the two third oblong holes (3311). The third adjustment screw passes through the third oblong holes (3311) and is threaded to the third threaded hole (3213).

8. The chip flipper conveyor apparatus of claim 7, wherein, The third adjustment component (33) further includes a connecting block (332) and two fourth adjustment screws. The third adjustment block (331) is also provided with two fourth oblong holes (3312) spaced apart along the Y-axis direction. The fourth oblong holes (3312) extend along the Z-axis direction. The connecting block (332) is provided with a fourth threaded hole (3321) corresponding to the two fourth oblong holes (3312). The fourth adjustment screw passes through the fourth oblong holes (3312) and is threaded to the fourth threaded hole (3321). The suction nozzle (34) is connected to the connecting block (332).

9. The chip flipper conveyor apparatus of claim 3, wherein, The driving component (35) includes a first driving component (353), an elastic element (351), and a buffer block (352). The first driving component (353) is disposed on the base (2) and drivenly connected to the buffer block (352). The first driving component (353) is used to drive the buffer block (352) to reciprocate along the Y-axis. The buffer block (352) is provided with an abutment portion (3522). The abutment portion (3522) and the suction nozzle (34) are spaced apart along the Y-axis. One end of the elastic element (351) is connected to the abutment portion (3522), and the other end is connected to the end of the suction nozzle (34) away from the chip.

10. The chip flipping and conveying device according to claim 9, characterized in that, The drive assembly (35) further includes an adjusting block (354) and two fifth adjusting screws. The first drive component (353) is driven to the adjusting block (354). The buffer block (352) is provided with an elongated hole (3521) extending along the Y-axis. The adjusting block (354) is provided with two fifth threaded holes (3541) spaced apart along the Y-axis. The two fifth adjusting screws are respectively passed through the elongated hole (3521) and threaded to the two fifth threaded holes (3541).

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