A MEMS sensor and electronic device

Abstract

The application discloses a MEMS sensor and an electronic device, wherein the MEMS sensor comprises a base, the base comprises a bottom plate, the bottom plate is provided with a first ventilation channel and an equalizing channel penetrating through the bottom plate, and the first ventilation channel and the equalizing channel are independent of each other; a cover body is fixedly connected with the base and jointly encloses the accommodation cavity with the base, the cover body is provided with a second ventilation channel; a MEMS chip is located in the accommodation cavity and is fixedly connected with the bottom plate and covers the opening of the first ventilation channel in the accommodation cavity; wherein the flow resistance of the equalizing channel to gas is greater than that of the first ventilation channel and also greater than that of the second ventilation channel. In the application, when the second ventilation channel is blocked by impurities such as dust and oil mist, the accommodation cavity can be communicated with the outside through the equalizing channel, so that the air pressure in the accommodation cavity is rapidly balanced, the signal anomaly caused by the complete sealing of the accommodation cavity is avoided, and the measurement accuracy and reliability of the MEMS sensor are effectively ensured.

Description

Technical Field

[0001] This application relates to the field of MEMS sensor technology, and more particularly to a MEMS sensor and electronic device. Background Technology

[0002] MEMS (Micro-Electro-Mechanical Systems) differential pressure sensors detect pressure changes by sensing the pressure difference across a diaphragm and are widely used in gas detection, industrial process control, automotive electronics, environmental monitoring, and aerospace.

[0003] In this type of sensor, the diaphragm of the MEMS chip corresponds to two independent cavity environments on each side. When the air pressure on one side decreases, that side is in a negative pressure state, causing the diaphragm to deform and thus changing the gap between it and the back electrode plate. This results in a change in capacitance, enabling the detection of pressure difference and signal output.

[0004] In practical applications, the front cavity of a MEMS differential pressure sensor is usually directly connected to the measured medium, with airflow entering the front cavity through a ventilation channel. If impurities (such as dust, oil mist, or condensate) entrained in the airflow block the ventilation channel, the front cavity will form a closed chamber. When the MEMS differential pressure sensor is working, the air pressure inside the cavity cannot quickly equalize with the external air pressure on the other side of the diaphragm, thus causing abnormalities in the output signal. Utility Model Content

[0005] This application provides a MEMS sensor and electronic device, which aims to at least partially solve the technical problem in the prior art where the sensor cavity cannot be evenly pressured in time due to blockage of the ventilation channel, resulting in abnormal output signal.

[0006] To achieve the above objectives, according to a first aspect of this application, a MEMS sensor is provided, comprising:

[0007] The base includes a base plate, and a first ventilation channel is provided on the base plate in a first direction;

[0008] The cover is fixedly connected to the base and together with the base, they enclose a cavity. The cover has a second ventilation channel.

[0009] The MEMS chip is located inside the accommodating cavity and is fixedly connected to the base plate, covering the opening of the first ventilation channel inside the accommodating cavity;

[0010] The base plate is also provided with a pressure equalization channel that runs through the base plate in a first direction. In the first direction, the projection of the pressure equalization channel does not overlap with the projection of the MEMS chip.

[0011] The pressure equalization channel has a greater resistance to gas flow than the first ventilation channel and the second ventilation channel.

[0012] Optionally, the base plate has a first surface and a second surface disposed opposite to each other along the first direction. The first surface has a first region and a second region. In the first region, the first surface and the second surface have a first dimension in the first direction. In the second region, the first surface and the second surface have a second dimension in the first direction. The first dimension is larger than the second dimension.

[0013] The opening of the first ventilation channel within the accommodating cavity is located in the first region, the MEMS chip is located in the first region, and the projection of the second ventilation channel in the first direction is located in the second region.

[0014] Optionally, the base plate has a pressure equalization through hole that passes through the first surface and the second surface;

[0015] The MEMS sensor further includes: a sealing plate, which is embedded in the base and covers the opening of the pressure equalization through hole on the second surface;

[0016] The sealing plate and the second surface have a first gap, and the pressure equalization through hole and the first gap together constitute the pressure equalization channel.

[0017] Optionally, a first sink groove is formed on the second surface, the sealing plate is located in the first sink groove, and there is a first gap between the side surface of the sealing plate facing the accommodating cavity and the bottom of the first sink groove, and there is also a second gap between the side wall of the sealing plate and the side wall of the first sink groove. The pressure equalization through hole, the first gap and the second gap together constitute the pressure equalization channel.

[0018] Optionally, it further includes: a plurality of pads embedded on the base, each pad being partially exposed in the accommodating cavity and partially exposed on the side surface of the base plate opposite to the accommodating cavity, the MEMS chip being electrically connected to at least one of the exposed portions of the pads in the accommodating cavity via leads.

[0019] Optionally, the base plate has a first surface and a second surface disposed opposite to each other along the first direction. The first surface includes a plurality of distributed areas, and the distance from the first surface to the second surface along the first direction is different in different distributed areas.

[0020] Within the accommodating cavity, the plurality of pads are exposed in different distribution areas.

[0021] Optionally, a partition is provided on the first surface, the partition is located between the first region and the second region, separating the first region and the second region, and a through hole is provided on the partition.

[0022] Optionally, it also includes an ASIC chip located in the second region.

[0023] Optionally, the base further includes:

[0024] A base side plate, which is disposed around the side wall of the base plate and integrally formed with the base plate;

[0025] The cover includes:

[0026] A cover plate is provided on the side plate of the base, and the second ventilation channel is opened on the cover plate;

[0027] The base plate, the base side plate, and the cover plate together form the accommodating cavity.

[0028] According to a second aspect of this application, an electronic device is provided, comprising the MEMS sensor described in any one of the foregoing claims.

[0029] In the MEMS sensor disclosed in this application, a first ventilation channel connects the back cavity of the MEMS chip to the outside of the MEMS sensor, a second ventilation channel connects the accommodating cavity to the pressure chamber of an external device, and a pressure equalization channel connects the accommodating cavity to the outside of the MEMS sensor. The pressure equalization channel has a greater flow resistance to gas than both the first and second ventilation channels, ensuring that the pressure equalization channel only gradually equalizes pressure when the second ventilation channel is blocked, preventing the pressure equalization channel from becoming the main airflow path and thus not affecting the normal measurement accuracy of the MEMS chip. Specifically, when the MEMS sensor is working normally, the airflow in the accommodating cavity mainly flows in through the second ventilation channel, and the airflow in the back cavity of the MEMS chip mainly flows in through the first ventilation channel. The MEMS chip senses the pressure difference between the accommodating cavity and the back cavity. When the second ventilation channel is blocked by impurities such as dust, oil mist, or condensate, the accommodating cavity can be connected to the outside through the pressure equalization channel, thereby achieving rapid pressure equalization within the accommodating cavity. This avoids signal abnormalities caused by the accommodating cavity being completely sealed, effectively ensuring the measurement accuracy and reliability of the MEMS sensor.

[0030] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0033] Figure 1 This is a schematic diagram of the structure of a base disclosed in an embodiment of this application;

[0034] Figure 2 yes Figure 1 Sectional view at point AA;

[0035] Figure 3 yes Figure 2 Enlarged view of point C in the middle;

[0036] Figure 4 This is a bottom view of a base disclosed in an embodiment of this application;

[0037] Figure 5 yes Figure 1 Sectional view at point BB.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Base; 101. Base plate; 1011. First surface; 10111. First region; 10112. Second region; 1012. Second surface; 1013. Base side plate; X1. First dimension; X2. Second dimension; 1014. First chamber; 1015. Second chamber;

[0040] 2. First ventilation channel;

[0041] 3. Pressure equalization channel; 301. Pressure equalization through hole; 302. First gap; 303. Second gap;

[0042] 4. Cover; 401. Receiving cavity; 402. Second ventilation channel; 403. Cover plate;

[0043] 5. MEMS chips;

[0044] 6. Seal the plate;

[0045] 7. First settling tank;

[0046] 8. Solder pads;

[0047] 9. Partition; 901. Through hole;

[0048] 10. ASIC chips;

[0049] 11. Protective netting. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0051] Reference Figure 1 , Figure 2 and Figure 5 Embodiment 1 of this application discloses a MEMS sensor, which includes a base 1, a cover 4, and a MEMS chip 5. It should be noted that, in order to facilitate observation of the internal structure of the base 1, this application... Figure 1 Only the base 1 structure is shown in the diagram; the cover 4 and the MEMS chip 5 are not shown. This application Figure 2 Depend on Figure 1 A cross-sectional view from the AA perspective shows the cover 4, where the solder pads 8 are for illustrative purposes only. This application Figure 5 Depend on Figure 1 A cross-sectional view from the middle BB perspective shows the cover 4 and the MEMS chip 5.

[0052] Reference Figure 1 and Figure 2 The base 1 includes a base plate 101, on which a first ventilation channel 2 and a pressure equalization channel 3 are formed, both penetrating the base plate 101. The first ventilation channel 2 and the pressure equalization channel 3 are independent of each other. A cover 4 is fixedly connected to the base 1, and together with the base 1, they form a receiving cavity 401. The cover 4 has a second ventilation channel 402. The MEMS chip 5 is located within the receiving cavity 401 and is fixedly connected to the base plate 101, covering the opening of the first ventilation channel 2 within the receiving cavity 401. The projection of the pressure equalization channel 3 does not overlap with the projection of the MEMS chip 5. The pressure equalization channel 3 has a greater resistance to gas flow than both the first ventilation channel 2 and the second ventilation channel 402.

[0053] In this embodiment, the first ventilation channel 2 connects the back cavity of the MEMS chip 5 to the outside of the MEMS sensor, the second ventilation channel 402 connects the accommodating cavity 401 to the pressure chamber of an external device, and the pressure equalization channel 3 connects the accommodating cavity 401 to the outside of the MEMS sensor. The pressure equalization channel 3 has a greater flow resistance to gas than both the first ventilation channel 2 and the second ventilation channel 402, ensuring that the pressure equalization channel 3 only gradually equalizes pressure when the second ventilation channel 402 is blocked, thus preventing the pressure equalization channel 3 from becoming the main airflow path and not affecting the normal measurement accuracy of the MEMS chip 5. Specifically, when the MEMS sensor is working normally, the airflow in the accommodating cavity 401 mainly flows in through the second ventilation channel 402, and the airflow in the back cavity of the MEMS chip 5 mainly flows in through the first ventilation channel 2. The MEMS chip 5 senses the pressure difference between the accommodating cavity 401 and the back cavity. When the second ventilation channel 402 is blocked by impurities such as dust, oil mist or condensate, the accommodating cavity 401 can be connected to the outside through the pressure equalization channel 3, thereby achieving rapid equalization of the air pressure inside the accommodating cavity 401, avoiding signal abnormalities caused by the accommodating cavity 401 being completely sealed, and effectively ensuring the measurement accuracy and reliability of the MEMS sensor.

[0054] Reference Figure 2 In this embodiment, the base 1 further includes a base side plate 1013, which surrounds the side wall of the base plate 101 and is integrally formed with the base plate 101. The cover 4 includes a cover plate 403. The cover plate 403 covers the base side plate 1013, and a second ventilation channel 402 is formed on the cover plate 403. The base plate 101, the base side plate 1013, and the cover plate 403 together form a receiving cavity 401.

[0055] Specifically, refer to Figure 2 and Figure 5 In this embodiment, the base plate 101 has a first surface 1011 and a second surface 1012 disposed opposite to each other along a first direction. The first surface 1011 has a first region 10111 and a second region 10112. In the first region 10111, the first surface 1011 and the second surface 1012 have a first dimension X1 in the first direction. In the second region 10112, the first surface 1011 and the second surface 1012 have a second dimension X2 in the first direction. The first dimension X1 is larger than the second dimension X2. In other words, the first region 10111 is a higher step region compared to the second region 10112.

[0056] Furthermore, referring to Figure 1 and Figure 5 The opening of the first ventilation channel 2 in the accommodating cavity 401 is located in the first region 10111, the MEMS chip 5 is located in the first region 10111, and the projection of the second ventilation channel 402 in the first direction is located in the second region 10112.

[0057] In this embodiment, the opening of the first ventilation channel 2 within the accommodating cavity 401 is located in the first region 10111, and the MEMS chip 5 is also disposed in the first region 10111. With this structural arrangement, after the airflow enters the accommodating cavity 401 from the second ventilation channel 402, it first enters the second region 10112, and then flows along the high-step sidewall of the first region 10111 to the surface of the MEMS chip 5. Compared to the flow path that directly acts on the surface of the MEMS chip 5 in the prior art, this embodiment effectively extends the airflow path. Since impurities such as e-liquid are more easily deposited in a longer airflow path, the number of particles that directly reach the surface of the MEMS chip 5 is reduced, thereby reducing the probability that the surface of the MEMS chip 5 is covered by e-liquid. Therefore, this embodiment can further improve the reliability and lifespan of the MEMS sensor.

[0058] Continue to refer to Figure 2 In this embodiment of the application, a partition 9 is provided on the first surface 1011. The partition 9 is located between the first region 10111 and the second region 10112, separating the first region 10111 and the second region 10112, and dividing the accommodating cavity 401 into the first chamber 1014 and the second chamber 1015. A through hole 901 is provided on the partition 9.

[0059] The first region 10111 and the second region 10112 are physically separated by the partition 9. The airflow entering the accommodating cavity 401 from the second ventilation channel 402 must pass through the through hole 901 of the partition 9 to further approach the MEMS chip 5. The through hole 901 restricts the speed and direction of the airflow directly hitting the chip, causing the airflow to flow around at the opening. This allows impurity particles (such as smoke droplets) to be deposited on the surface of the partition 9 due to inertia at the through hole 901, further reducing the probability of impurities reaching the surface of the MEMS chip 5.

[0060] Meanwhile, compared to the completely open accommodating cavity 401, the first chamber 1014 separated by the partition 9 has a smaller gas exchange volume during pressure equalization. Therefore, the flow volume required by the pressure equalization channel 3 is reduced, making it easier to maintain the pressure equalization function.

[0061] In some embodiments, the pressure equalization channel 3 includes a pressure equalization through hole 301 and a first gap 302 that are connected to each other. Specifically, a pressure equalization through hole 301 is formed on the base plate 101, penetrating the first surface 1011 and the second surface 1012, and the opening of the pressure equalization through hole in the accommodating cavity 401 is exposed in the first region 10111. A sealing plate 6 is embedded in the base 1, and the sealing plate 6 covers the opening of the pressure equalization through hole 301 on the second surface 1012. A first gap 302 is formed between the sealing plate 6 and the second surface 1012, and the pressure equalization through hole 301 and the first gap 302 together constitute the pressure equalization channel 3.

[0062] During application, the pressure equalization through-hole 301 and the first gap 302 are connected to form a narrow air passage with relatively large overall flow resistance. This ensures that the pressure equalization channel 3 only gradually equalizes pressure when the main air passage is blocked or the pressure difference accumulates, thus preventing the pressure equalization channel 3 from becoming the main airflow path and thus not affecting the normal measurement accuracy of the MEMS chip 5.

[0063] In the embodiments of this application, reference is made to Figure 2 and Figure 3 The pressure equalization channel 3 includes a connected pressure equalization through hole 301, a first gap 302, and a second gap 303. Specifically, a first recess 7 is formed on the second surface 1012, and a sealing plate 6 is located in the first recess 7. A first gap 302 exists between the side surface of the sealing plate 6 facing the second surface 1012 and the bottom of the first recess 7, and a second gap 303 also exists between the side wall of the sealing plate 6 and the side wall of the first recess 7. The pressure equalization through hole 301, the first gap 302, and the second gap 303 together constitute the pressure equalization channel 3.

[0064] In this embodiment, after the sealing plate 6 is embedded in the first recessed groove 7, the side surface of the sealing plate 6 away from the receiving cavity 401 is flush with or lower than the second surface 1012 of the base plate 101, and no protrusion is formed, thus avoiding interference during device assembly or bonding with external equipment and improving the assembly reliability of the structure.

[0065] Furthermore, the second gap 303 is connected to the first gap 302, and the first gap 302 is connected to the pressure equalization through hole 301. The pressure equalization through hole 301, the first gap 302, and the second gap 303 together form a narrow airflow passage, which increases the flow resistance of the pressure equalization channel 3. This allows the airflow to mainly enter the accommodating cavity 401 through the second ventilation channel 402 during normal operation. The pressure equalization channel 3 only plays a pressure equalization role when the main air passage is blocked.

[0066] In this embodiment, the pressure equalization through hole 301 is a stepped hole, and the diameter of the end of the pressure equalization through hole 301 facing the accommodating cavity 401 is larger than the diameter of the end of the pressure equalization through hole 301 away from the accommodating cavity 401; in some other embodiments, the pressure equalization through hole 301 is a tapered hole, and the diameter of the pressure equalization through hole 301 gradually decreases from the first surface 1011 to the second surface 1012; in other embodiments, the pressure equalization through hole 301 is a constant diameter hole.

[0067] Reference Figure 4 In this embodiment, the sealing plate 6 has a second gap 303 between the outer peripheral wall of the first settling tank 7 and the side wall of the first settling tank 7. Since the second gap 303 is distributed along the outer peripheral wall of the sealing plate 6, even if the second gap 303 is locally blocked due to particle deposition or slight displacement of the sealing plate 6, the airflow can still be maintained at other positions, ensuring that the pressure equalization channel 3 always has gas transmission capability.

[0068] It should be noted that, Figure 1 The pressure equalization channel 3 shown is located within the first chamber 1014. In some other embodiments, the pressure equalization channel 3 may also be located within the second chamber 1015, as long as the receiving cavity 401 can be connected to the outside of the MEMS sensor. Preferably, the sealing plate 6 corresponding to the pressure equalization channel 3 is not provided with solder wires during subsequent processing to avoid the gap of the pressure equalization channel 3 being blocked by flux.

[0069] Reference Figure 1 and Figure 4 In this embodiment of the application, the MEMS sensor further includes a plurality of pads 8. The pads 8 are embedded on the base 1, and each pad 8 is partially exposed in the accommodating cavity 401 and partially exposed on the side surface of the base plate 101 opposite to the accommodating cavity 401. The MEMS chip 5 is electrically connected to at least one portion of the pad 8 exposed in the accommodating cavity 401 via leads.

[0070] It should be noted that the pad 8 can be a U-shaped or C-shaped structure. One end of the pad 8 is exposed in the receiving cavity 401, and the other end is exposed on the surface of the base plate 101 away from the receiving cavity 401. The pad 8 can also be a bent structure. The bent structure is embedded in the base plate 101, with one side exposed in the receiving cavity 401 and the other side exposed on the surface of the base plate 101 away from the receiving cavity 401.

[0071] The pads 8 can be made of copper, aluminum, or a copper-aluminum alloy. It should be noted that the cover plate 6 is also made of copper, aluminum, or a copper-aluminum alloy. The base 1 is formed by injection molding, encasing a metal frame composed of multiple pads 8 and the cover plate 6. Part of the pads 8 are exposed within the receiving cavity 401, while another part is exposed on the surface of the base plate 101 facing away from the receiving cavity 401, allowing the MEMS chip 5 and ASIC chip 10 to transmit electrical signals. During injection molding, the base 1 completely encapsulates the metal frame composed of the pads 8, ensuring a firm connection between the pads 8 and the base 1, and avoiding the problems of easy detachment and displacement of traditional independent pads 8.

[0072] Furthermore, in some other embodiments, the first surface 1011 includes multiple distribution regions (such as the aforementioned first region 10111 and second region 10112; in the technical solutions disclosed in this application, the distribution regions of the first surface 1011 are not limited to only the first region 10111 and the second region 10112). In different distribution regions, the distance from the first surface 1011 to the second surface 1012 along the first direction is different. Within the accommodating cavity 401, multiple pads 8 are exposed in different distribution regions. This arrangement allows for flexible layout within the accommodating cavity 401 according to circuit requirements, reducing lead crossings and spatial interference.

[0073] In this embodiment, the MEMS sensor further includes an ASIC chip 10, which is located in the second region 10112. The ASIC chip 10 is fixed within the accommodating cavity 401 and is electrically connected to the MEMS chip 5.

[0074] In this embodiment, the MEMS sensor further includes a protective mesh 11. The protective mesh 11 is connected to the cover plate 403 and covers the opening of the second ventilation channel 402. In some embodiments, the protective mesh 11 is located on the side of the cover plate 403 away from the receiving cavity 401; in some embodiments, the protective mesh 11 is located on the side of the cover plate 403 facing the receiving cavity 401. Specifically, the protective mesh 11 and the cover plate 403 can be fixed by means of snap-fit, welding, or bonding. The protective mesh 11 can prevent larger impurities such as dust, flux spatter, and soot droplets from entering the receiving cavity 401.

[0075] This application also discloses an electronic device including any of the MEMS sensors disclosed above.

[0076] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0077] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0078] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0079] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A MEMS sensor, characterized in that, include: The base (1) includes a base plate (101) and a first ventilation channel (2) is provided on the base plate (101) through the base plate (101) in a first direction; The cover (4) is fixedly connected to the base (1) and together with the base (1) forms a cavity (401). The cover (4) has a second ventilation channel (402). The MEMS chip (5) is located in the accommodating cavity (401) and is fixedly connected to the base plate (101), covering the opening of the first ventilation channel (2) in the accommodating cavity (401); The base plate (101) is also provided with a pressure equalization channel (3) that runs through the base plate (101) in a first direction. In the first direction, the projection of the pressure equalization channel (3) does not overlap with the projection of the MEMS chip (5). The pressure equalization channel (3) has a greater resistance to gas flow than the first ventilation channel (2) and the second ventilation channel (402).

2. The MEMS sensor according to claim 1, characterized in that, The base plate (101) has a first surface (1011) and a second surface (1012) disposed opposite to each other along the first direction. The first surface (1011) has a first region (10111) and a second region (10112). In the first region (10111), the first surface (1011) and the second surface (1012) have a first dimension X1 in the first direction. In the second region (10112), the first surface (1011) and the second surface (1012) have a second dimension X2 in the first direction. The first dimension X1 is greater than the second dimension X2. The opening of the first ventilation channel (2) in the accommodating cavity (401) is located in the first region (10111), the MEMS chip (5) is located in the first region (10111), and the projection of the second ventilation channel (402) in the first direction is located in the second region (10112).

3. The MEMS sensor according to claim 2, characterized in that, The base plate (101) has a pressure equalization through hole (301) that passes through the first surface (1011) and the second surface (1012); The MEMS sensor further includes: a sealing plate (6), which is embedded in the base (1) and covers the opening of the equalizing through hole (301) on the second surface (1012); The sealing plate (6) and the second surface (1012) have a first gap (302), and the pressure equalization through hole (301) and the first gap (302) together constitute the pressure equalization channel (3).

4. The MEMS sensor according to claim 3, characterized in that, A first sink groove (7) is provided on the second surface (1012). The sealing plate (6) is located in the first sink groove (7). The sealing plate (6) has a first gap (302) between the side surface facing the accommodating cavity (401) and the bottom of the first sink groove (7). The side wall of the sealing plate (6) has a second gap (303) between it and the side wall of the first sink groove (7). The pressure equalization through hole (301), the first gap (302) and the second gap (303) together constitute the pressure equalization channel (3).

5. The MEMS sensor according to claim 1, characterized in that, Also includes: Multiple pads (8) are embedded on the base (1). Each pad (8) is partially exposed in the accommodating cavity (401) and partially exposed on the side surface of the base plate (101) opposite to the accommodating cavity (401). The MEMS chip (5) is electrically connected to at least one of the pads (8) exposed in the accommodating cavity (401) via leads.

6. The MEMS sensor according to claim 5, characterized in that, The base plate (101) has a first surface (1011) and a second surface (1012) disposed opposite to each other along the first direction. The first surface (1011) includes a plurality of distribution areas. In different distribution areas, the distance from the first surface (1011) to the second surface (1012) along the first direction is different. Within the accommodating cavity (401), the plurality of pads (8) are exposed in different distribution areas.

7. The MEMS sensor according to claim 2, characterized in that, A partition (9) is provided on the first surface (1011). The partition (9) is located between the first region (10111) and the second region (10112), separating the first region (10111) and the second region (10112). A through hole (901) is provided on the partition (9).

8. The MEMS sensor according to claim 2, characterized in that, It also includes an ASIC chip (10) located in the second region (10112).

9. The MEMS sensor according to claim 1, characterized in that, The base (1) further includes: a base side plate (1013), which is arranged around the side wall of the base plate (101) and integrally formed with the base plate (101); The cover (4) includes: A cover plate (403) is provided on the side plate (1013) of the base, and the second ventilation channel (402) is opened on the cover plate (403); The base plate (101), the base side plate (1013), and the cover plate (403) together enclose the accommodating cavity (401).

10. An electronic device, characterized in that, Including the MEMS sensor as described in any one of claims 1-9.

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