A silicon light engine

Abstract

The utility model relates to a kind of silicon light engine, comprising: pedestal, the upper surface of pedestal is separately bonded and fixed heat sink and glass block using silver glue, the upper surface of heat sink is equipped with DFB chip, glass block has a recess on the side near heat sink, which penetrates its lower surface and is used to let glass block avoid the overflow silver glue of heat sink, the upper surface of glass block is bonded with a collimating lens coupled with DFB chip using ultraviolet glue. Advantageous effects are: the silver glue used to bond heat sink and the ultraviolet glue used to bond glass block both have enough overflow space, ensuring bonding effect and reliability, and do not interfere with each other. Since the ultraviolet glue will stay on the edge of the glass block, it will not bond with the heat sink. Since the glass block can transmit ultraviolet light, the ultraviolet glue below the collimating lens can receive the reflected light from the pedestal when UV light is irradiated, so it is completely cured and less likely to shift during the UV process.

Description

Technical Field

[0001] This utility model relates to the field of optical engine technology, specifically to a silicon photonic engine. Background Technology

[0002] The structure of a traditional silicon photonic engine is as follows: Figure 1 As shown, it includes: a base, a heat sink, a collimating lens, an optical isolator, a converging lens, and a silicon photonic chip. The heat sink is fixed to the upper surface of the base using silver adhesive. A DFB chip is mounted on the upper surface of the heat sink. The collimating lens is fixed to the upper surface of the base using UV adhesive. On the light-emitting side of the collimating lens, the optical isolator, the converging lens, and the silicon photonic chip are sequentially fixed to the upper surface of the base using UV adhesive. The converging lens is fixed to the upper surface of the base using UV adhesive. The base is made of tungsten copper, and the heat sink is made of ceramic. The emitted light from the DFB chip is coupled into the silicon photonic chip after passing through the collimating lens, the optical isolator, and the converging lens in sequence. To ensure high coupling efficiency, this scheme uses a dual-lens design, namely a collimating lens... + Converging lens, collimating lens is generally only 0.25mm±0.05mm away from DFB chip. Since the heat sink is bonded to the upper surface of the base with silver paste, in order to ensure high heat dissipation and reliability, silver paste is required to overflow around the heat sink. However, this overflow is difficult to control. When too much silver paste overflows, it will interfere with the UV adhesive of the collimating lens, or even interfere with the collimating lens itself, resulting in a decrease in the contact adhesion between the UV adhesive and the silver paste. In some cases, the collimating lens may even fail to couple due to silver paste interference. In order to save costs, the collimating lens is generally chosen as a silicon lens. UV light cannot pass through silicon material, so the UV adhesive under the collimating lens cannot cure. Only the UV adhesive around the collimating lens can cure. Therefore, it is easy to shift during the UV process. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a silicon photonics engine to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A silicon photonics engine includes: a base, a heat sink and a glass block are respectively bonded and fixed on the upper surface of the base with silver paste, a DFB chip is disposed on the upper surface of the heat sink, the glass block has a groove on the side adjacent to the heat sink that extends through its lower surface and is used to allow the glass block to avoid the silver paste overflowing from the heat sink, and a collimating lens coupled to the DFB chip is bonded to the upper surface of the glass block with ultraviolet adhesive.

[0005] The beneficial effects of this invention are as follows: Since the collimating lens is not located on the upper surface of the base, but on a glass block, and the glass block has a groove on the side adjacent to the heat sink that extends through its lower surface to allow the glass block to avoid the silver paste overflowing from the heat sink, both the silver paste used to bond the heat sink and the UV adhesive used to bond the glass block have sufficient overflow space, thereby ensuring bonding effect and reliability, and they do not interfere with each other. Since the UV adhesive stays at the edge of the glass block, it will not stick to the heat sink. Since the glass block can transmit UV light, the UV adhesive below the collimating lens can receive the reflected light from the base when irradiated by UV light, so it is thoroughly cured and not easy to shift during the UV process.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, the depth of the groove is 0.3mm to 0.5mm, the height is 0.3mm to 0.5mm, and the distance between the side of the glass block with the groove and the heat sink is 0.02mm to 0.05mm.

[0008] The further beneficial effects of adopting the above are: sufficient overflow space to ensure bonding effect and reliability. Furthermore, the glass block is made of quartz glass, with a thermal conductivity of less than 1 W / mk.

[0009] The further beneficial effects of adopting the above are as follows: The heat generated by the DFB chip will cause the collimating lens to have a high temperature. The collimating lens is generally made of silicon lens. Silicon lens will have a change in refractive index due to temperature changes, which will lead to changes in the focal length of the optical path and a decrease in performance. In addition, the heat generated by the DFB chip will cause the temperature of the UV adhesive below the collimating lens to rise, causing thermal expansion and upward displacement, resulting in optical path displacement and a decrease in performance. However, the coefficient of thermal expansion of the quartz glass block is less than 1ppM / ℃, which can offset the upward displacement caused by the high coefficient of thermal expansion of the UV adhesive and avoid the heat generated by the DFB chip affecting the thermal expansion of the collimating lens.

[0010] Furthermore, the heat sink is made of ceramic.

[0011] Furthermore, on the upper surface of the base, an optical isolator, a converging lens, and a silicon photonic chip are sequentially fixed on the light-emitting side of the collimating lens. The DFB chip, collimating lens, optical isolator, converging lens, and silicon photonic chip are sequentially coupled along the light propagation direction.

[0012] Furthermore, the converging lens is bonded to the upper surface of the base using UV adhesive.

[0013] Furthermore, the upper surface of the base includes: a first plane, a second plane, and a third plane. The second plane is located between the first plane and the third plane. The second plane is higher than the third plane, and the third plane is higher than the first plane. The heat sink and the glass block are located on the first plane, the optical isolator is located on the second plane, and the converging lens and the silicon photonic chip are located on the third plane.

[0014] Furthermore, the base is made of tungsten copper. Attached Figure Description

[0015] Figure 1 This is a structural diagram of a silicon photonics engine in the prior art; Figure 2 This is a structural diagram of the silicon photonic engine in this utility model.

[0016] The attached diagram lists the components represented by each number as follows: 1. Base, 110. First plane, 120. Second plane, 130. Third plane, 2. Silver paste, 3. Heat sink, 4. Glass block, 410. Groove, 5. DFB chip, 6. UV adhesive, 7. Collimating lens, 8. Optical isolator, 9. Converging lens, 10. Silicon photonic chip. Detailed Implementation

[0017] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0018] Example 1 like Figure 2 As shown, a silicon photonics engine includes: a base 1, a heat sink 3, a glass block 4, and a DFB chip 5. The heat sink 3 is fixed to the upper surface of the base 1 with silver paste 2. The glass block 4 is fixed to the upper surface of the base 1 with silver paste 2. The DFB chip 5 is provided on the upper surface of the heat sink 3. The glass block 4 has a groove 410 on the side adjacent to the heat sink 3 that penetrates the lower surface of the glass block 4. The groove 410 is used to allow the glass block 4 to avoid the silver paste 2 overflowing from the heat sink 3. At this time, the shape of the glass block 4 can be understood as a flat inverted L-shape. A collimating lens 7 coupled to the DFB chip 5 is bonded to the upper surface of the glass block 4 with ultraviolet glue 6.

[0019] Since the collimating lens 7 is not located on the upper surface of the base 1, but on a glass block 4, and the glass block 4 has a groove 410 on its side near the heat sink 3 that runs through its lower surface and allows the glass block 4 to avoid the silver paste 2 overflowing from the heat sink 3, both the silver paste 2 used to bond the heat sink 3 and the UV adhesive 6 used to bond the glass block 4 have sufficient overflow space, thus ensuring bonding effect and reliability, and they do not interfere with each other. Since the UV adhesive 6 will stay at the edge of the glass block 4, it will not stick to the heat sink 3. Since the glass block 4 can transmit ultraviolet light, the UV adhesive 6 below the collimating lens 7 can receive the reflected light from the base 1 when irradiated by UV light, so it is thoroughly cured and not easy to shift during the UV process.

[0020] Example 2 like Figure 2 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The groove 410 has a depth of 0.3mm to 0.5mm and a height of 0.3mm to 0.5mm. The distance between the side of the glass block 4 with the groove 410 and the heat sink 3 is 0.02mm to 0.05mm.

[0021] Example 3 like Figure 2 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: Glass block 4 is made of quartz glass with a thermal conductivity of less than 1 W / mk. The heat generated by the DFB chip 5 will cause the collimating lens 7 to have a high temperature. The collimating lens 7 is generally made of silicon lens. Silicon lens will have a change in refractive index due to temperature changes, which will lead to changes in the focal length of the optical path and a decrease in performance. In addition, the heat generated by the DFB chip 5 will cause the temperature of the UV adhesive 6 below the collimating lens 7 to rise, causing thermal expansion and upward displacement, resulting in optical path displacement and a decrease in performance. However, the thermal expansion coefficient of the quartz glass block 4 is less than 1 ppM / ℃, which can offset the upward displacement caused by the high thermal expansion coefficient of the UV adhesive 6 and prevent the heat generated by the DFB chip 5 from affecting the thermal expansion of the collimating lens 7.

[0022] Example 4 like Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 3, as detailed below: The heat sink 3 is preferably made of ceramic, which is consistent with existing technology.

[0023] Example 5 like Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 4, as detailed below: On the upper surface of the base 1, an optical isolator 8, a converging lens 9, and a silicon photonic chip 10 are sequentially fixed on the light-emitting side of the collimating lens 7. The DFB chip 5, collimating lens 7, optical isolator 8, converging lens 9, and silicon photonic chip 10 are coupled sequentially along the light propagation direction. That is, the emitted light from the DFB chip 5 is coupled into the silicon photonic chip 10 after passing through the collimating lens 7, optical isolator 8, and converging lens 9 in sequence. This part is still consistent with the existing technology.

[0024] Furthermore, the converging lens 9 is bonded to the upper surface of the base 1 using UV adhesive 6.

[0025] The upper surface of the base 1 includes a first plane 110, a second plane 120, and a third plane 130. The second plane 120 is located between the first plane 110 and the third plane 130. The second plane 120 is higher than the third plane 130, and the third plane 130 is higher than the first plane 110. That is, the first plane 110 is the shortest. The heat sink 3 and the glass block 4 are located on the first plane 110. The optical isolator 8 is located on the second plane 120. The converging lens 9 and the silicon photonic chip 10 are located on the third plane 130.

[0026] The base 1 is preferably made of tungsten copper, which is consistent with the existing technology.

[0027] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A silicon photonics engine, characterized in that, include: The base (1) has a heat sink (3) and a glass block (4) bonded and fixed on its upper surface with silver paste (2). The heat sink (3) has a DFB chip (5) on its upper surface. The glass block (4) has a groove (410) on its side adjacent to the heat sink (3) that runs through its lower surface and allows the glass block (4) to avoid the silver paste (2) overflowing from the heat sink (3). A collimating lens (7) coupled to the DFB chip (5) is bonded to the upper surface of the glass block (4) with ultraviolet glue (6).

2. A silicon photonics engine according to claim 1, characterized in that, The groove (410) has a depth of 0.3mm to 0.5mm and a height of 0.3mm to 0.5mm; the distance between the side of the glass block (4) with the groove (410) and the heat sink (3) is 0.02mm to 0.05mm.

3. A silicon photonics engine according to claim 1, characterized in that, The glass block (4) is made of quartz glass with a thermal conductivity of less than 1 W / mk.

4. A silicon photonics engine according to claim 1, characterized in that, The heat sink (3) is made of ceramic.

5. A silicon photonics engine according to claim 1, characterized in that, On the upper surface of the base (1), an optical isolator (8), a converging lens (9), and a silicon photonic chip (10) are sequentially fixed on the light-emitting side of the collimating lens (7). The DFB chip (5), collimating lens (7), optical isolator (8), converging lens (9), and silicon photonic chip (10) are sequentially coupled along the light propagation direction.

6. A silicon photonics engine according to claim 5, characterized in that, The converging lens (9) is bonded to the upper surface of the base (1) with UV adhesive (6).

7. A silicon photonics engine according to claim 5, characterized in that, The upper surface of the base (1) includes: a first plane (110), a second plane (120) and a third plane (130), the second plane (120) is located between the first plane (110) and the third plane (130), the second plane (120) is higher than the third plane (130), the third plane (130) is higher than the first plane (110), the heat sink (3) and the glass block (4) are located on the first plane (110), the optical isolator (8) is located on the second plane (120), and the converging lens (9) and the silicon photonic chip (10) are located on the third plane (130).

8. A silicon photonics engine according to any one of claims 1 to 7, characterized in that, The base (1) is made of tungsten copper.

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