A special substrate photolithography machine processing device

Abstract

The utility model discloses a kind of special substrate photoetching machine processing device, it is related to photoetching substrate material processing technical field, including operation platform, cleaning mechanism is fixedly connected in operation platform upper portion, and fine adjustment mechanism is fixedly connected in operation platform upper portion, fine adjustment mechanism is located cleaning mechanism side face.The utility model, through the real-time closed-loop feedback control system formed by pressure sensor and second servo motor, when detecting that pressure is below threshold value, second servo motor rapidly drives cleaning head to slightly descend, ensure that enough peeling force is exerted to superhard particle, thoroughly remove adhered contaminant, avoid the scratch of mask plate or pattern transfer deviation in subsequent photoetching process due to residual particle, when pressure is close to threshold value upper limit, immediately drive cleaning head to slightly lift, accurately avoid scratch on diamond surface due to excessive pressure, protect its crystal structure integrity, maintain excellent heat conduction and insulating performance.

Description

Technical Field

[0001] This utility model relates to the field of photolithography substrate material technology, and in particular to a special substrate photolithography processing device. Background Technology

[0002] Special substrates, distinct from traditional silicon substrates, are made of special materials such as gallium arsenide, silicon carbide, sapphire, and diamond, or have special shapes such as curved surfaces or irregular shapes. They are used as base materials in high-end fields such as optoelectronics, high-frequency radio frequency, and aerospace. They not only provide physical support for devices, but also directly determine device performance due to their excellent electrical, optical, and thermal properties. To achieve high-precision photolithography on these special substrates, specialized photolithography processing equipment is indispensable. This equipment accurately transfers the design pattern onto the substrate through a series of processes such as pretreatment, coating, alignment and exposure, and development. Among these processes, the surface cleaning treatment equipment is a key link in ensuring processing quality in the photolithography processing equipment, and it undertakes the important task of removing impurities such as oil, particles, and oxide layers from the surface of the special substrate.

[0003] However, in existing technologies, when cleaning substrate materials such as diamonds and sapphires, which have extremely high hardness, are prone to the adhesion of ultra-hard particles, and are chemically inert and cannot be dissolved by conventional chemical reagents, the existing mechanical cleaning modules use electric cylinders to push the cleaning end downwards to apply pressure to scrub the material surface. However, it is difficult to precisely control the force. Insufficient pressure results in the residue of ultra-hard particles, affecting the accuracy of subsequent photolithography. On the other hand, excessive pressure can cause micro-scratches on the substrate surface, damaging its performance stability. Furthermore, excessive wear of the cleaning end may exacerbate the attenuation of cleaning force, increasing production costs and the risk of product failure. Utility Model Content

[0004] The purpose of this invention is to solve the problems existing in the prior art by proposing a special substrate lithography processing device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a special substrate lithography processing device, including an operating table, a cleaning mechanism fixedly connected to the upper part of the operating table, and a fine adjustment mechanism fixedly connected to the upper part of the operating table. The fine adjustment mechanism is located on the side of the cleaning mechanism. The fine adjustment mechanism includes a reduction motor, a third slide rail, and a sleeve. An eccentric shaft is fixedly connected to the output end of the reduction motor. The third slide rail is fixedly connected to the upper part of the operating table, and a third slider is slidably connected to the surface of the third slide rail. A third mounting plate is fixedly connected to the upper part of the third slider. One side of the third mounting plate is fixedly connected to the sleeve, the eccentric shaft is rotatably connected to the sleeve, and a mounting post is fixedly connected to the other side of the third mounting plate.

[0006] Preferably, the cleaning mechanism includes a first servo motor, the output end of which is fixedly connected to a first lead screw, a first lead block is threadedly connected to the surface of the first lead screw, a fixing plate is fixedly connected to the upper part of the first lead block, and the first lead block is slidably connected to the upper part of the operating table.

[0007] Preferably, a first slide rail is fixedly connected to the upper part of the operating table, a first slider is slidably connected to the surface of the first slide rail, and the first slider is fixedly connected to the bottom of the fixed plate.

[0008] Preferably, a mounting bracket is fixedly connected to the upper part of the fixed plate, a second servo motor is fixedly connected to the upper part of the mounting bracket, a second lead screw is fixedly connected to the output end of the second servo motor, a second threaded block is threadedly connected to the surface of the second lead screw, a second slide rail is fixedly connected to the inner side of the mounting bracket, a second slider is slidably connected to the surface of the second slide rail, the second slider is fixedly connected to the second threaded block, and a first mounting plate is fixedly connected to the surface of the second slider.

[0009] Preferably, a limit rod is fixedly connected to the surface of the first mounting plate, a second mounting plate is inserted into the surface of the limit rod, a third servo motor is mounted on the side of the second mounting plate, a cleaning head is fixedly connected to the output end of the third servo motor, and a pressure sensor is installed between the first mounting plate and the second mounting plate.

[0010] Compared with the prior art, the advantages and positive effects of this utility model are as follows: 1. In this utility model, a real-time closed-loop feedback control system formed by a pressure sensor and a second servo motor is used. When the pressure is detected to be below the threshold, the second servo motor quickly drives the cleaning head to move slightly downward to ensure sufficient peeling force is applied to the superhard particles, thoroughly removing the attached contaminants and avoiding scratches on the mask or deviations in pattern transfer during subsequent photolithography due to residual particles. When the pressure approaches the upper limit of the threshold, the cleaning head is immediately driven to move slightly upward to precisely avoid scratches on the diamond surface caused by excessive pressure, protect its crystal structure integrity, and maintain excellent thermal conductivity and insulation performance. The fine adjustment mechanism drives the eccentric shaft and the sleeve through the geared motor to move the substrate on the mounting post to make a slight displacement adjustment along the third slide rail, so that the cleaning head can fully contact the substrate edges, corners and other areas where contaminants are easily left behind, avoiding cleaning dead corners and greatly improving the cleaning effect of a single cleaning.

[0011] 2. In this utility model, precise pressure control avoids micro-scratches on the sapphire optical surface due to excessive pressure, thus protecting its light transmittance. The micro-shaking of the fine-tuning mechanism and the rotation of the cleaning head work together to solve the problem of residual ultra-hard particles on the sapphire surface, improve the accuracy of subsequent photolithography pattern transfer, and at the same time, the real-time feedback of the pressure sensor reduces the wear of the cleaning head and extends its service life. Attached Figure Description

[0012] Figure 1This invention provides a first three-dimensional structural schematic diagram of a special substrate photolithography processing device; Figure 2 This invention provides a second three-dimensional structural schematic diagram of a special substrate photolithography processing device; Figure 3 This invention provides a cross-sectional three-dimensional structural diagram of the cleaning mechanism in a special substrate lithography machine processing device; Figure 4 This invention provides a top-view cross-sectional view of the sleeve in a special substrate lithography machine processing device. Figure 5 This invention presents a three-dimensional structural diagram of the second mounting plate in a special substrate lithography machine processing device.

[0013] Legend: 1. Operating table; 2. Cleaning mechanism; 21. Servo motor No. 1; 22. Lead screw No. 1; 23. Lead block No. 1; 24. Fixing plate; 25. Slide rail No. 1; 26. Slider No. 1; 27. Mounting bracket; 28. Servo motor No. 2; 29. ​​Lead screw No. 2; 210. Lead block No. 2; 211. Slide rail No. 2; 212. Slider No. 2; 213. Mounting plate No. 1; 214. Limit rod; 215. Mounting plate No. 2; 216. Servo motor No. 3; 217. Cleaning head; 218. Pressure sensor; 3. Fine adjustment mechanism; 31. Gear motor; 32. Sleeve; 33. Eccentric shaft; 34. Slide rail No. 3; 35. Slider No. 3; 4. Mounting plate No. 3; 5. Mounting column. Detailed Implementation

[0014] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0015] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0016] Example 1: As Figures 1-5As shown, this utility model provides a special substrate lithography machine processing device, including an operating table 1. A cleaning mechanism 2 is fixedly connected to the upper part of the operating table 1, and a fine adjustment mechanism 3 is fixedly connected to the upper part of the operating table 1. The fine adjustment mechanism 3 is located on the side of the cleaning mechanism 2. The fine adjustment mechanism 3 includes a reduction motor 31, a third slide rail 34, and a sleeve 32. An eccentric shaft 33 is fixedly connected to the output end of the reduction motor 31. The third slide rail 34 is fixedly connected to the upper part of the operating table 1, and a third slider 35 is slidably connected to the surface of the third slide rail 34. A third mounting plate 4 is fixedly connected to the upper part of the third slider 35. One side of the third mounting plate 4 is fixedly connected to the sleeve 32, and the eccentric shaft 33 is rotatably connected to the sleeve 32. A mounting post 5 is fixedly connected to the other side of the third mounting plate 4.

[0017] The cleaning mechanism 2 includes a first servo motor 21, the output end of which is fixedly connected to a first lead screw 22. A first lead screw block 23 is threaded onto the surface of the first lead screw 22. A fixing plate 24 is fixedly connected to the upper part of the first lead screw block 23, and the first lead screw block 23 is slidably connected to the upper part of the operating table 1. A mounting bracket 27 is fixedly connected to the upper part of the fixing plate 24. A second servo motor 28 is fixedly connected to the upper part of the mounting bracket 27. A second lead screw 29 is fixedly connected to the output end of the second servo motor 28. A second lead screw block 210 is threaded onto the surface of the second lead screw 29. A second lead screw block 210 is fixedly connected to the inner side of the mounting bracket 27. The second slide rail 211 has a second slider 212 slidably connected to its surface. The second slider 212 is fixedly connected to the second thread block 210. The surface of the second slider 212 is fixedly connected to the first mounting plate 213. The surface of the first mounting plate 213 is fixedly connected to the limit rod 214. The surface of the limit rod 214 is inserted into the second mounting plate 215. The side of the second mounting plate 215 is equipped with the third servo motor 216. The output end of the third servo motor 216 is fixedly connected to the cleaning head 217. The pressure sensor 218 is installed between the first mounting plate 213 and the second mounting plate 215.

[0018] The specific settings and functions of this embodiment are described below. The diamond substrate is fixed on the mounting post 5. In the cleaning mechanism 2, the first servo motor 21 drives the first lead screw 22 to rotate, which drives the first wire block 23 to move laterally along the first slide rail 25, so that the mounting bracket 27 and the cleaning head 217 on the fixing plate 24 are aligned with the substrate. The second servo motor 28 drives the second lead screw 29 to rotate, which drives the second wire block 210 to move longitudinally along the second slide rail 211, adjusting the height of the cleaning head 217 so that it contacts the substrate surface. At this time, the pressure sensor 218 detects the pressure of the cleaning head 217 on the substrate in real time and feeds back the signal to control the second servo motor 28 to fine-tune the height to ensure accurate pressure. In the fine adjustment mechanism 3, the reduction motor 31 drives the eccentric shaft 33 to rotate, which drives the third slider 35 to slide along the third slide rail 34 through the sleeve 32, so that the substrate on the third mounting plate 4 and the mounting post 5 is slightly displaced, which, together with the cleaning head 217, achieves comprehensive cleaning.

[0019] Through real-time feedback from the pressure sensor 218 and precise control from the second servo motor 28, the residual ultra-hard particles caused by insufficient pressure and the scratches on the diamond surface caused by excessive pressure are avoided. The micro-displacement adjustment of the fine adjustment mechanism 3 ensures that the cleaning head 217 makes full contact with the substrate, improving cleaning efficiency, while reducing excessive wear of the cleaning head 217, reducing production costs and the risk of product failure.

[0020] Example 2: Figures 1-5 As shown, the cleaning mechanism 2 includes a first servo motor 21, the output end of which is fixedly connected to a first lead screw 22. A first lead screw block 23 is threaded onto the surface of the first lead screw 22. A fixing plate 24 is fixedly connected to the upper part of the first lead screw block 23, and the first lead screw block 23 is slidably connected to the upper part of the operating table 1. A first slide rail 25 is fixedly connected to the upper part of the operating table 1. A first slider 26 is slidably connected to the surface of the first slide rail 25. The first slider 26 is fixedly connected to the bottom of the fixing plate 24. A mounting bracket 27 is fixedly connected to the upper part of the fixing plate 24. A second servo motor 28 is fixedly connected to the upper part of the mounting bracket 27. A second lead screw 29 is fixedly connected to the output end of the second servo motor 28. A second threaded block 210 is threaded onto the surface of rod 29. A second slide rail 211 is fixedly connected to the inner side of mounting bracket 27. A second slider 212 is slidably connected to the surface of slide rail 211. The second slider 212 is fixedly connected to the second threaded block 210. A first mounting plate 213 is fixedly connected to the surface of the second slider 212. A limit rod 214 is fixedly connected to the surface of the first mounting plate 213. A second mounting plate 215 is inserted into the surface of the limit rod 214. A third servo motor 216 is mounted on the side of the second mounting plate 215. A cleaning head 217 is fixedly connected to the output end of the third servo motor 216. A pressure sensor 218 is installed between the first mounting plate 213 and the second mounting plate 215.

[0021] The overall effect of this embodiment is as follows: after the sapphire substrate is fixed to the mounting post 5, in the cleaning mechanism 2, the third servo motor 216 drives the cleaning head 217 to rotate, and the first servo motor 21 and the second servo motor 28 work together to drive the cleaning head 217 to move laterally and longitudinally along the substrate surface; the pressure sensor 218 monitors the contact pressure between the cleaning head 217 and the sapphire surface in real time, and when the pressure exceeds the preset threshold, it immediately feeds back to the second servo motor 28, causing it to drive the cleaning head 217 to lift slightly; in the fine adjustment mechanism 3, the reduction motor 31 drives the eccentric shaft 33 to rotate at low speed, and through the sleeve 32 drives the third slider 35 to slide back and forth along the third slide rail 34, so that the sapphire substrate shakes slightly with the mounting post 5, and the rotating cleaning head 217 removes the ultra-hard particles attached to the edge.

[0022] Precise pressure control prevents micro-scratches from forming on the sapphire optical surface due to excessive pressure, thus protecting its light transmittance. The micro-shaking of the fine-tuning mechanism 3, in conjunction with the rotation of the cleaning head 217, solves the problem of residual ultra-hard particles on the sapphire surface, improves the pattern transfer accuracy of subsequent photolithography, and at the same time, the real-time feedback from the pressure sensor 218 reduces the wear and tear on the cleaning head 217, extending its service life.

[0023] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A special substrate lithography processing apparatus, comprising an operating table (1), wherein a cleaning mechanism (2) is fixedly connected to the upper part of the operating table (1), and a fine adjustment mechanism (3) is fixedly connected to the upper part of the operating table (1), wherein the fine adjustment mechanism (3) is located on the side of the cleaning mechanism (2), characterized in that: The fine adjustment mechanism (3) includes a geared motor (31), a third slide rail (34), and a sleeve (32). The output end of the geared motor (31) is fixedly connected to an eccentric shaft (33). The third slide rail (34) is fixedly connected to the upper part of the operating table (1), and a third slider (35) is slidably connected to the surface of the third slide rail (34). A third mounting plate (4) is fixedly connected to the upper part of the third slider (35). One side of the third mounting plate (4) is fixedly connected to the sleeve (32), and the eccentric shaft (33) is rotatably connected to the sleeve (32). A mounting column (5) is fixedly connected to the other side of the third mounting plate (4).

2. The special substrate photolithography processing apparatus according to claim 1, characterized in that: The cleaning mechanism (2) includes a first servo motor (21), the output end of which is fixedly connected to a first lead screw (22), and a first lead block (23) is threadedly connected to the surface of the first lead screw (22). A fixing plate (24) is fixedly connected to the upper part of the first lead block (23), and the first lead block (23) is slidably connected to the upper part of the operating table (1).

3. The special substrate photolithography processing apparatus according to claim 1, characterized in that: The upper part of the operating table (1) is fixedly connected to a slide rail (25), and a slider (26) is slidably connected to the surface of the slide rail (25). The slider (26) is fixedly connected to the bottom of the fixed plate (24).

4. The special substrate photolithography processing apparatus according to claim 3, characterized in that: A mounting bracket (27) is fixedly connected to the upper part of the fixed plate (24). A second servo motor (28) is fixedly connected to the upper part of the mounting bracket (27). A second lead screw (29) is fixedly connected to the output end of the second servo motor (28). A second lead screw block (210) is threadedly connected to the surface of the second lead screw (29). A second slide rail (211) is fixedly connected to the inner side of the mounting bracket (27). A second slider (212) is slidably connected to the surface of the second slide rail (211). The second slider (212) is fixedly connected to the second lead screw block (210). A first mounting plate (213) is fixedly connected to the surface of the second slider (212).

5. The special substrate photolithography processing apparatus according to claim 4, characterized in that: A limiting rod (214) is fixedly connected to the surface of the first mounting plate (213). A second mounting plate (215) is inserted into the surface of the limiting rod (214). A third servo motor (216) is installed on the side of the second mounting plate (215). A cleaning head (217) is fixedly connected to the output end of the third servo motor (216). A pressure sensor (218) is installed between the first mounting plate (213) and the second mounting plate (215).

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