A multi-layer circuit board structure with high heat dissipation

Abstract

The utility model discloses a kind of multilayer circuit board structures of high efficiency heat dissipation, it is related to the field of circuit board.A kind of multilayer circuit board structures of high efficiency heat dissipation, including heat dissipation plate, further include: heat dissipation groove being opened on heat dissipation plate, heat dissipation groove is fixedly installed with heat dissipation fan, heat dissipation plate is fixedly connected with multiple groups of radiating fin and first heat pipe, first heat pipe is connected in radiating fin one end close to heat dissipation groove;The utility model passes through first heat pipe crossing circuit board surface and being located center, connect with radiating fin, heat dissipation groove, and construct the efficient heat conduction channel from circuit board core to heat dissipation terminal;Second heat pipe auxiliary collection heat dissipation plate and peripheral heat, double heat pipe cooperate radiating fin, substantially widen heat transfer path, can quickly gather and direct heat dissipation fan with the heat generated by circuit board work, compared with traditional single passive heat dissipation, heat conduction is more timely, comprehensive, and improves heat dissipation start speed and heat dissipation efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically, it relates to a multilayer circuit board structure with high-efficiency heat dissipation. Background Technology

[0002] With the continuous trend towards miniaturization and high performance in electronic devices, multilayer circuit boards are widely used in various electronic devices because they can integrate more circuit components. However, during operation, the components on a multilayer circuit board continuously generate heat. If this heat cannot be dissipated in time, the accumulated high temperature will affect the performance of electronic components, leading to signal transmission delays, increased errors, and even damage to components, thus reducing the reliability and lifespan of the equipment.

[0003] Traditional heat dissipation methods for multilayer circuit boards are relatively simple, relying mainly on the circuit board itself and simple heat dissipation structures (such as a few heat sinks) for passive cooling. However, with the increase in circuit board integration and power, the drawbacks of passive heat dissipation are becoming increasingly apparent. It is difficult to quickly conduct heat away and dissipate it to the external environment, which cannot meet the heat dissipation requirements of high-performance multilayer circuit boards. Therefore, developing a structure with efficient heat dissipation capabilities that can ensure the stable operation of the circuit board has become an urgent problem to be solved in the field of electronic device heat dissipation. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a multilayer circuit board structure with high efficiency in heat dissipation that can overcome or at least partially solve the above problems.

[0005] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is: a multi-layer circuit board structure with high-efficiency heat dissipation, including a heat sink, and further including: a heat dissipation groove formed on the heat sink, a heat dissipation fan fixedly installed on the heat dissipation groove, and multiple sets of heat sinks and a first heat pipe fixedly connected to the heat sink, the first heat pipe being connected to the end of the heat sink near the heat dissipation groove.

[0006] Furthermore, a circuit board is attached to the first heat pipe, and a circuit slot is formed on the circuit board, on which the first heat pipe is attached.

[0007] Furthermore, a mounting base is fixedly connected to the circuit board, a protrusion is fixedly connected to the mounting base, and a slot is opened on the mounting base, with the protrusions on the two sets of mounting bases corresponding to the slots.

[0008] Furthermore, the first heat pipe is located at the center of the circuit board and extends across the surface of the circuit board.

[0009] Furthermore, a second heat pipe is fixedly connected to the heat sink, and a start switch is fixedly connected to the second heat pipe.

[0010] Furthermore, the power switch is electrically connected to the cooling fan.

[0011] Furthermore, the mounting base on the circuit board has protrusions that fit into slots, facilitating circuit board assembly and fixation, ensuring structural stability, and preventing heat transfer processes from being affected by structural loosening. The coordinated structure of the heat sink, the first heat pipe, the second heat pipe, the cooling fan, and the circuit board creates a complete heat dissipation path of "heat generation - conduction and convergence - active exhaust". The multi-stage collaboration achieves efficient heat dissipation, ensuring that the multilayer circuit board maintains a suitable temperature during operation, and improving operational stability and lifespan.

[0012] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: 1. This utility model constructs an efficient heat conduction channel from the core of the circuit board to the heat dissipation terminal by having a first heat conduction pipe that runs across the surface of the circuit board and is located in the center, combined with the connection of the heat sink and heat dissipation groove; the second heat conduction pipe assists in collecting heat from the heat sink and the surrounding area. The dual heat conduction pipes, together with the heat sink, greatly widen the heat transfer path, which can quickly gather the heat generated by the circuit board and guide it to the cooling fan. Compared with traditional single passive heat dissipation, the heat conduction is more timely and comprehensive, improving the heat dissipation start-up speed and heat dissipation efficiency.

[0013] 2. This utility model uses a cooling fan connected to the circuit via a start switch. It can operate actively according to the heat situation and forcefully expel heat through air convection. The combination of active heat dissipation and multi-element heat conduction breaks through the efficiency bottleneck of passive heat dissipation. Even under high load and high heat generation scenarios on the circuit board, it can quickly reduce the temperature and ensure that the circuit board is in a stable operating temperature range, effectively avoiding performance degradation and component damage caused by overheating.

[0014] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0015] In the attached diagram: Figure 1 This is a schematic diagram of the overall structure of a multilayer circuit board structure with high-efficiency heat dissipation proposed in this utility model. Figure 2 This is a front view of a multilayer circuit board structure with high-efficiency heat dissipation proposed in this utility model. Figure 3 This is a schematic diagram of the back structure of a multilayer circuit board structure with high-efficiency heat dissipation proposed in this utility model.

[0016] In the diagram: 1. Heat sink; 11. Heat sink groove; 2. Cooling fan; 3. Heat sink fin; 4. First heat pipe; 5. Circuit board; 51. Circuit groove; 52. Mounting base; 53. Protrusion; 54. Slot; 6. Second heat pipe; 7. Power switch. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0018] Example: Refer to Figures 1-3 A high-efficiency heat dissipation multilayer circuit board structure includes a heat sink 1 and a heat dissipation groove 11 formed on the heat sink 1. A cooling fan 2 is fixedly installed on the heat dissipation groove 11. Multiple heat sinks 3 and a first heat pipe 4 are fixedly connected to the heat sink 1. The first heat pipe 4 is connected to one end of the heat sink 3 near the heat dissipation groove 11.

[0019] A circuit board 5 is attached to the first heat pipe 4. A circuit groove 51 is provided on the circuit board 5, and the first heat pipe 4 is attached to the circuit groove 51.

[0020] A mounting base 52 is fixedly connected to the circuit board 5, and a protrusion 53 is fixedly connected to the mounting base 52. A slot 54 is opened on the mounting base 52, and the protrusions 53 on the two sets of mounting bases 52 correspond to the slots 54.

[0021] The first heat pipe 4 is located at the center of the circuit board 5 and runs across the surface of the circuit board 5.

[0022] A second heat pipe 6 is fixedly connected to the heat sink 1, and a start switch 7 is fixedly connected to the second heat pipe 6.

[0023] The start switch 7 is electrically connected to the cooling fan 2.

[0024] The mounting base 52 on the circuit board 5 has a protrusion 53 that matches the slot 54, which facilitates the assembly and fixation of the circuit board 5, ensures structural stability, and prevents heat transfer and other processes from being affected by structural loosening. The structure of the heat sink 3, the first heat pipe 4, the second heat pipe 6, the cooling fan 2, and the circuit board 5 work together to build a complete heat dissipation path of "heat generation - conduction and convergence - active exhaust". The multi-stage collaboration achieves efficient heat dissipation, ensuring that the multilayer circuit board 5 maintains a suitable temperature during operation and improving operational stability and lifespan.

[0025] This utility model generates heat when the circuit board 5 is working. Since the first heat pipe 4 is snapped into the circuit groove 51 of the circuit board 5 and runs across the surface and is located in the center, it can quickly contact all parts of the circuit board 5. The heat is transferred from the circuit board 5 to the first heat pipe 4 through thermal conduction. At the same time, the multiple heat sinks 3 on the heat sink 1 increase the contact area with the air and can also initially receive the surrounding heat to assist in heat collection.

[0026] The first heat pipe 4 is connected to the end of the heat sink 3 near the heat sink 11. The heat received is transferred along the first heat pipe 4 towards the heat sink 11, concentrating the dispersed heat towards the area where the cooling fan 2 is located. The second heat pipe 6 is fixedly connected to the heat sink 1, which can further collect the heat from the heat sink 1 and the surrounding area. Together with the first heat pipe 4, it accelerates the convergence of heat towards the heat sink 11.

[0027] The cooling fan 2 on the heat sink 11 is controlled by the start switch 7. The start switch 7 is electrically connected to the cooling fan 2, and the start switch 7 on the second heat pipe 6 can turn on the cooling fan 2 according to the heat situation, such as temperature sensing trigger. The fan generates airflow, which quickly exhausts the heat transferred from the heat sink 11 and the surrounding area through the heat pipe through air convection, thereby achieving active heat dissipation and reducing the overall temperature.

[0028] The mounting base 52 on the circuit board 5 has a protrusion 53 that matches the slot 54, which facilitates the assembly and fixation of the circuit board 5, ensures structural stability, and prevents heat transfer and other processes from being affected by structural loosening. The structure of the heat sink 3, the first heat pipe 4, the second heat pipe 6, the cooling fan 2, and the circuit board 5 work together to build a complete heat dissipation path of "heat generation - conduction and convergence - active exhaust". The multi-stage collaboration achieves efficient heat dissipation, ensuring that the multilayer circuit board 5 maintains a suitable temperature during operation and improving operational stability and lifespan.

[0029] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A multilayer circuit board structure with high-efficiency heat dissipation, comprising a heat sink (1), characterized in that, Also includes: A heat dissipation groove (11) is formed on the heat dissipation plate (1), and a heat dissipation fan (2) is fixedly installed on the heat dissipation groove (11). Multiple heat dissipation fins (3) and a first heat pipe (4) are fixedly connected on the heat dissipation plate (1). The first heat pipe (4) is connected to one end of the heat dissipation fin (3) near the heat dissipation groove (11).

2. The multilayer circuit board structure with high-efficiency heat dissipation according to claim 1, characterized in that, A circuit board (5) is attached to the first heat pipe (4), and a circuit groove (51) is provided on the circuit board (5). The first heat pipe (4) is attached to the circuit groove (51).

3. The multilayer circuit board structure with high-efficiency heat dissipation according to claim 2, characterized in that, A mounting base (52) is fixedly connected to the circuit board (5), a protrusion (53) is fixedly connected to the mounting base (52), and a slot (54) is provided on the mounting base (52). The protrusions (53) on the two sets of mounting bases (52) correspond to the slots (54).

4. The multilayer circuit board structure with high-efficiency heat dissipation according to claim 2, characterized in that, The first heat pipe (4) is located at the center of the circuit board (5) and runs across the surface of the circuit board (5).

5. The multilayer circuit board structure with high-efficiency heat dissipation according to claim 1, characterized in that, A second heat pipe (6) is fixedly connected to the heat sink (1), and a start switch (7) is fixedly connected to the second heat pipe (6).

6. The multilayer circuit board structure with high-efficiency heat dissipation according to claim 5, characterized in that, The start switch (7) is electrically connected to the cooling fan (2).

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