A packaging structure

Abstract

The packaging structure provided by the embodiments of the present disclosure comprises: a substrate, the upper surface of the substrate is a copper layer; a protective layer above the copper layer; a green oil layer above the protective layer, the green oil layer is a reticular structure; and a chip above the green oil layer.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more particularly to a packaging structure. Background Technology

[0002] As integrated circuits become more powerful, perform better, and have higher integration levels, and as new types of integrated circuits emerge, packaging technology plays an increasingly important role in integrated circuit products, accounting for a larger proportion of the value of the entire electronic system.

[0003] In packaging structures, for integrated circuit (IC) substrates, electroless nickel-electroless palladium-immersion gold (ENEPIG) coatings are typically used to protect the copper layer. However, the ENEPIG coating without an oil-based coating has poor adhesion to organic materials, making it prone to delamination and subsequent failure. Utility Model Content

[0004] This disclosure provides a packaging structure, the packaging structure comprising:

[0005] A substrate, wherein the upper surface of the substrate is a copper layer;

[0006] A protective layer located above the copper layer;

[0007] The green oil layer located above the protective layer has a mesh structure;

[0008] The chip located above the green oil layer.

[0009] In some embodiments, the green oil layer is centrally symmetrical, and the center of symmetry of the green oil layer coincides with the center of the chip.

[0010] In some embodiments, the green oil layer includes at least one first sub-green oil layer extending along a first direction and at least one second sub-green oil layer extending along a second direction.

[0011] The first direction and the second direction intersect.

[0012] In some embodiments, the green oil layer has multiple blank areas;

[0013] The green oil layer also includes at least one third sub-green oil layer, and at least one of the blank areas is provided with the third sub-green oil layer.

[0014] In some embodiments, the center of the third sub-green oil layer coincides with the center of the blank area.

[0015] In some embodiments, the width of the first sub-green oil layer is not less than 80 micrometers, and the width of the second sub-green oil layer is not less than 80 micrometers.

[0016] In some embodiments, the third sub-green oil layer is circular in shape.

[0017] In some embodiments, the diameter of the third sub-green oil layer is not less than 150 micrometers.

[0018] In some embodiments, the encapsulation structure further includes a conductive material that fills the blank areas of the green oil layer.

[0019] In some embodiments, the conductive material is also located between the green oil layer and the chip, or the upper surface of the green oil layer is in contact with the lower surface of the chip.

[0020] In some embodiments, the ratio of the area of ​​the green oil layer to the area of ​​the protective layer meets a preset range.

[0021] In some embodiments, the protective layer is a chemically plated nickel-plated palladium-plated gold-plated coating.

[0022] In some embodiments, the encapsulation structure further includes an encapsulation material that fills the gaps within the encapsulation structure.

[0023] This disclosure provides a packaging structure comprising: a substrate with a copper layer on its upper surface; a protective layer above the copper layer; a green solder mask layer with a mesh structure above the protective layer; and a chip above the green solder mask layer. In this packaging structure, the green solder mask layer is located between the protective layer and the chip, and the bonding between the green solder mask layer and the protective layer is good. This enhances the adhesion between the protective layer and the organic materials in the packaging structure. Furthermore, the mesh structure of the green solder mask layer creates a height difference between the green solder mask layer and the protective layer, thereby forming a mechanical interlock between the green solder mask layer and the organic materials, further enhancing the adhesion between the protective layer and the organic materials and ensuring the reliability of the packaging structure. Attached Figure Description

[0024] In the accompanying drawings (which are not necessarily drawn to scale), similar reference numerals may describe similar parts in different views. Similar reference numerals with different letter suffixes may indicate different examples of similar parts. The drawings illustrate, by way of example and not limitation, the various embodiments discussed herein.

[0025] Figure 1 A schematic diagram of the composition structure of a packaging structure provided for related technologies;

[0026] Figure 2A physical schematic diagram of a packaging structure provided for related technologies;

[0027] Figure 3 A schematic diagram of a packaging structure provided for related technologies using a scanning electron microscope.

[0028] Figure 4 A schematic diagram of the composition of a packaging structure provided in this embodiment of the present disclosure. Figure 1 ;

[0029] Figure 5 A schematic diagram of the composition of a packaging structure provided in this embodiment of the present disclosure. Figure 2 ;

[0030] Figure 6 A schematic diagram of the composition of a packaging structure provided in this embodiment of the present disclosure. Figure 3 ;

[0031] Figure 7 A schematic diagram of the composition of a packaging structure provided in this embodiment of the present disclosure. Figure 4 . Detailed Implementation

[0032] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0033] In the following description, numerous details are set forth in order to provide a more thorough understanding of this disclosure. However, it will be apparent to those skilled in the art that this disclosure may be practiced without one or more of these details. In other instances, to avoid confusion with this disclosure, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0034] In the accompanying drawings, for clarity, the dimensions of layers, areas, and elements, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0035] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this disclosure, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this disclosure.

[0036] The terminology used herein is intended only to describe particular embodiments and is not intended to limit this disclosure. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprise” and / or “comprising,” when used in this specification, identify the presence of said features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0037] Compared to silicon chips, gallium arsenide (GaAs) chips are widely used in radio frequency (RF) modules due to their higher electron mobility and larger bandgap. In packaging design, GaAs chips are prone to hot spots due to their low thermal conductivity. The packaging structure typically requires large areas of exposed copper for heat dissipation to improve power and reduce power consumption, thereby extending their lifespan. However, large exposed copper areas lead to concentrated thermal and mechanical stresses. Given that power amplifier (PA) chips widely use wire bonding (WB) packaging, ENEPIG coating is typically used on IC substrates. During the subsequent packaging process, highly conductive adhesive pads are used to precisely attach the GaAs chips to the IC substrate for interconnection. Hot spots refer to abnormally high-temperature areas inside the chip caused by excessive localized power consumption or poor heat dissipation.

[0038] In encapsulation structures, the surface of the ENEPIG coating without green oil coverage has weak adhesion to organic materials (such as molding compound and conductive adhesive). Under tests such as Moisture Sensitivity Level (MSL), the ENEPIG coating, molding compound, and conductive adhesive are prone to delamination, which can lead to failure.

[0039] See Figure 1 It shows a schematic diagram of the composition structure of a packaging structure provided by related technologies. For example... Figure 1 As shown, the packaging structure 10 includes a substrate 11, a conductive material 12, a chip 13, and a molding compound 14.

[0040] It should be noted that the upper surface of substrate 11 is a copper layer. An ENEPIG copper layer (not shown in the figure) is formed on substrate 11; specifically, an ENEPIG copper layer is formed on top of the copper layer. Here, the ENEPIG copper layer refers to the ENEPIG coating formed on the copper layer in substrate 11.

[0041] It should also be noted that the conductive material 12 is located between the substrate 11 and the chip 13; the molding compound 14 fills the gaps in the packaging structure 10. Alternatively, the conductive material 12 can be a conductive adhesive.

[0042] exist Figure 1 In this case, there is no solder mask covering the ENEPIG copper layer, which makes the ENEPIG copper layer and organic materials (such as conductive material 12 and molding compound 14) prone to delamination. In addition, delamination also occurs between chip 13 and organic materials.

[0043] See Figure 2 It shows a physical schematic diagram of a packaging structure provided by related technologies. It should be noted that... Figure 2 This involves removing the molding compound 14 from the package structure 10 to more clearly demonstrate the positional relationship between the ENEPIG copper layer and the chip 13. Additionally, Figure 2 Specifically, this is a top view of the actual package structure, showing only a portion of the conductive material 12; the remaining conductive material 12 is located below the chip 13 and is not shown.

[0044] See Figure 3 It shows a schematic scanning electron microscope image of a packaging structure provided by related technologies, specifically a schematic diagram of the area where the ENEPIG copper layer, conductive material 12, and molding compound 14 are located. Figure 3 As shown, a delamination phenomenon can be observed, specifically the delamination of the ENEPIG copper layer, the conductive material 12, and the molding compound 14.

[0045] Based on this, the present disclosure provides a packaging structure comprising: a substrate, the upper surface of which is a copper layer; a protective layer above the copper layer; a green solder mask layer above the protective layer, the green solder mask layer having a mesh structure; and a chip above the green solder mask layer. In this packaging structure, the green solder mask layer is located between the protective layer and the chip, and the green solder mask layer has good adhesion to the protective layer, thereby enhancing the adhesion between the protective layer and the organic materials in the packaging structure. Furthermore, the mesh structure of the green solder mask layer creates a height difference between the green solder mask layer and the protective layer, thereby forming a mechanical interlock between the green solder mask layer and the organic materials, further enhancing the adhesion between the protective layer and the organic materials, and ensuring the reliability of the packaging structure.

[0046] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0047] In one embodiment of this disclosure, see [link to embodiment]. Figure 4 It illustrates a schematic diagram of the composition of a packaging structure provided in an embodiment of this disclosure. Figure 1 .like Figure 4 As shown, the packaging structure 20 may include:

[0048] Substrate 21, the upper surface of the substrate is a copper layer;

[0049] Protective layer 22 (not shown in the figure) located above the copper layer;

[0050] The green oil layer 23 is located above the protective layer 22 and has a mesh structure.

[0051] Chip 24 is located above the green oil layer 23.

[0052] It should be noted that the packaging structure 20 is specifically a packaging structure that can improve the delamination problem within the substrate. Here, the delamination problem refers to the delamination problem between the protective layer 22 and the organic material, and also includes the delamination problem between the chip 24 and the organic material. The organic material can be any material in the packaging structure 20 that performs bonding and encapsulation functions.

[0053] It should also be noted that substrate 21 can be called an IC packaging substrate or IC packaging carrier board. It is a key basic material used for integrated circuit packaging, and its main function is to protect the chip and provide an interface between the chip and external circuits. As a type of printed circuit board (PCB), substrate 21 can include multilayer boards, with its top layer being a copper layer, that is, the upper surface of substrate 21 is a copper layer; where the upper surface of substrate 21 refers to the surface used to connect electronic components (such as chip 24).

[0054] It should also be noted that surface treatment of substrate 21 yields protective layer 22. Surface treatment is an important step in PCB manufacturing and assembly, serving two main functions: protecting exposed copper circuitry (i.e., the copper layer) and providing solderable surface-mount components to the PCB during soldering. Surface treatment is located on the outermost layer of the PCB, above the copper layer, acting as a copper "coating." In this embodiment, protective layer 22 can also be referred to as the ENEPIG copper layer.

[0055] Here, chip 24 can be a GaAs chip, but there is no specific limitation on the type of chip 24.

[0056] It should also be noted that green solder mask, or liquid photoresist, is used to coat unsoldered circuits and substrates on a PCB board, or as a solder resist to protect the formed circuit patterns. Green solder mask can prevent physical circuit breaks and solder short circuits, improve circuit insulation, and resist environmental corrosion. In this embodiment, green solder mask layer 23 refers to the structure formed by the green solder mask. Green solder mask layer 23 can be formed using liquid green solder mask, or through a dry film and leveling process; no specific limitation is made in this regard.

[0057] In the encapsulation structure 20, a green oil layer 23 covers the protective layer 22, through which heat dissipation can be achieved. Furthermore, the green oil layer 23 has good adhesion to the protective layer 22, increasing the bonding force between the protective layer 22 and the organic material, thus enhancing adhesion. Further, the mesh-like structure of the green oil layer 23 creates a height difference with the protective layer 22, resulting in effective mechanical interlocking between the green oil layer 23 and the organic material, further strengthening the adhesion between the protective layer 22 and the organic material. In summary, the encapsulation structure 20 avoids… Figure 1 The delamination of the ENEPIG copper layer and organic materials in the middle is resolved, thus ensuring the performance of the packaging structure 20.

[0058] In some embodiments, the protective layer 22 is a chemically plated nickel-plated palladium-plated gold-plated coating.

[0059] It should be noted that the electroless nickel-electroless palladium immersion gold (ENEPIG) coating is a coating formed after surface treatment of the substrate 21. It is used to improve the conductivity, corrosion resistance and solderability of the substrate 21.

[0060] The process begins with electroless nickel plating, depositing a layer of nickel on the surface of substrate 21 using a chemical method. This nickel layer not only has good conductivity but also provides a solid foundation for subsequent plating layers. Next, electroless palladium plating is performed, depositing another layer of palladium on top of the nickel layer. The palladium layer has excellent corrosion resistance and solderability, protecting the nickel layer from environmental corrosion and improving soldering reliability. Finally, immersion gold is performed, immersing the treated substrate 21 in a gold solution to allow gold ions to adhere to the surface of the palladium layer. The gold layer not only has excellent conductivity but also further enhances the corrosion resistance and solderability of substrate 21.

[0061] In some embodiments, such as Figure 5 As shown, the green oil layer 23 is centrally symmetrical, and the center of symmetry of the green oil layer 23 coincides with the center of the chip 24.

[0062] It should be noted that, Figure 4 This is a schematic diagram showing the protective layer 22, the solder mask layer 23, and the chip 24 stacked sequentially along a third direction, where the third direction is perpendicular to the surface of the substrate 21. For the specific structure of the solder mask layer 23, please refer to [link to relevant documentation]. Figure 5 To understand.

[0063] Understandably, the center of symmetry of the solder mask 23 coincides with the center of the chip 24. The solder mask 23 is symmetrical about the chip 24; that is, along a third direction, the projection of the center of symmetry of the solder mask 23 onto the center of the chip 24 coincides. This ensures that the bonding force around the solder mask 23 is evenly distributed, reducing the risk of chip 24 being packaged and mounted. In this embodiment, if the solder mask 23 is not centrally symmetrical, the chip 24 placed on the solder mask 23 will have a height difference, and the chip 24 will not be on a single plane, posing a potential risk of stress and warping. Therefore, the solder mask 23 needs to be centrally symmetrical, and its center of symmetry must coincide with the center of the chip 24.

[0064] In some embodiments, the ratio of the area of ​​the green oil layer 23 to the area of ​​the protective layer 22 meets a preset range.

[0065] It should be noted that the area of ​​the green oil layer 23 refers to the total area of ​​the green oil in the green oil layer 23, that is, the total area of ​​the area covered by the green oil in the green oil layer 23.

[0066] For example, in this embodiment, the preset range can be 30%-50%, but it is not specifically limited to this. That is, the area of ​​the green oil-covered region in the green oil layer 23 accounts for 30%-50% of the area of ​​the protective layer 22, thereby ensuring heat dissipation.

[0067] When the ratio of the area of ​​the green solder mask 23 to the area of ​​the protective layer 22 meets the preset range, the heat dissipation of the package structure 20 is not affected, that is, the heat dissipation will not decrease due to the increase of the area of ​​the green solder mask; however, when the ratio of the area of ​​the green solder mask 23 to the area of ​​the protective layer 22 does not meet the preset range, the increase of the area of ​​the green solder mask will lead to a decrease in heat dissipation, resulting in an increase in the power consumption of the chip 24.

[0068] In some embodiments, such as Figure 5 As shown, the green oil layer 23 includes at least one first sub-green oil layer 231 (only one label is shown in the figure) extending along a first direction and at least one second sub-green oil layer 232 (only one label is shown in the figure) extending along a second direction;

[0069] The first direction and the second direction intersect.

[0070] In the embodiments of this disclosure, the first direction and the second direction intersect. The first direction and the second direction can be perpendicular to each other or intersect at other angles, without specific limitation. Exemplarily, the specific implementation of the embodiments of this disclosure will be described in detail with the example of the first direction and the second direction being perpendicular to each other. It can be understood that on the surface where the substrate 21 is located, two mutually perpendicular directions are defined, namely the first direction and the second direction.

[0071] It should be noted that, as Figure 5 As shown, for the green oil layer 23, it is divided into a first sub-green oil layer 231 and a second sub-green oil layer 232 for ease of description. It can be understood that the first sub-green oil layer 231 and the second sub-green oil layer 232 are located in the same layer, and are integral; the first sub-green oil layer 231 and the second sub-green oil layer 232 together constitute the green oil layer 23. Therefore, in Figure 5 And the following Figure 6 In the diagram, the first sub-green oil layer 231 and the second sub-green oil layer 232 both use the same filler representation.

[0072] It should also be noted that the mesh-structured green oil layer 23 can also be called a mesh-structured green oil bridge. Here, the number of the first sub-green oil layer 231 and the second sub-green oil layer 232 is not specifically limited, as long as the first sub-green oil layer 231 and the second sub-green oil layer 232 intersect to form a centrally symmetrical mesh structure. For example, as... Figure 5 As shown, the green oil layer 23 includes four first sub-green oil layers 231 and four second sub-green oil layers 232. The four first sub-green oil layers 231 are distributed at intervals along the second direction, and the four second sub-green oil layers 232 are distributed at intervals along the first direction, thus forming a centrally symmetrical network structure.

[0073] It should also be noted that the relationship between the quantities of the first sub-green oil layer 231 and the second sub-green oil layer 232 is not specifically limited. The quantity of the first sub-green oil layer 231 can be equal to the quantity of the second sub-green oil layer 232, or the quantity of the first sub-green oil layer 231 can be greater than the quantity of the second sub-green oil layer 232, or the quantity of the first sub-green oil layer 231 can be less than the quantity of the second sub-green oil layer 232. Furthermore, the parity of the quantities of the first sub-green oil layer 231 and the second sub-green oil layer 232 is not specifically limited. The quantity of both the first sub-green oil layer 231 and the second sub-green oil layer 232 can be even, or both the quantity of the first sub-green oil layer 231 and the second sub-green oil layer 232 can be odd, or the quantity of the first sub-green oil layer 231 can be even and the quantity of the second sub-green oil layer 232 can be odd, or the quantity of the first sub-green oil layer 231 can be odd and the quantity of the second sub-green oil layer 232 can be even. For example, as... Figure 6 As shown, the green oil layer 23 includes 3 first sub-green oil layers 231 and 4 second sub-green oil layers 232. The number of first sub-green oil layers 231 is odd and the number of second sub-green oil layers 232 is even.

[0074] Furthermore, the shape relationships between the first sub-green oil layers 231, the second sub-green oil layers 232, and the first sub-green oil layers 231 and second sub-green oil layers 232 are not specifically limited, as long as the green oil layer 23 is a centrally symmetrical mesh structure. For example, as shown... Figure 5 and Figure 6 As shown, both the first sub-green oil layer 231 and the second sub-green oil layer 232 are regular in shape, specifically long strips.

[0075] Furthermore, there are no specific limitations on the area relationships between the first sub-green oil layers 231, the second sub-green oil layers 232, or the first sub-green oil layer 231 and the second sub-green oil layer 232, as long as the green oil layer 23 is a centrally symmetrical mesh structure and the area of ​​the green oil layer 23 meets the requirements (the ratio of the area of ​​the green oil layer 23 to the area of ​​the protective layer 22 meets a preset range). For example, such as... Figure 5 As shown, the areas between each first sub-green oil layer 231 and each second sub-green oil layer 232 are all equal; as Figure 6 As shown, the areas of each first sub-green oil layer 231 are not equal, while the areas of each second sub-green oil layer 232 are equal.

[0076] In some embodiments, such as Figure 5 As shown, the green oil layer 23 has multiple blank areas a1 (only one label is shown in the figure);

[0077] Green oil layer 23 may also include at least one third sub-green oil layer 233, and at least one blank area a1 is provided with the third sub-green oil layer 233.

[0078] In this embodiment, the green oil layer 23 has a mesh structure, so there are areas without the green oil layer 23 between each first sub-green oil layer 231 and between each second sub-green oil layer 232, namely blank areas a1. In other words, blank areas a1 are areas above the protective layer 22 that are not covered with green oil. The mesh structure of the green oil layer 23 forms multiple blank areas a1.

[0079] It should be noted that, as Figure 5 As shown, for the green oil layer 23, in addition to the first sub-green oil layer 231 and the second sub-green oil layer 232, the green oil layer 23 can also include a third sub-green oil layer 233. Dividing the green oil layer 23 into the first sub-green oil layer 231, the second sub-green oil layer 232, and the third sub-green oil layer 233 is for ease of description. It can be understood that the first sub-green oil layer 231, the second sub-green oil layer 232, and the third sub-green oil layer 233 are located in the same layer, and are an integral unit. The first sub-green oil layer 231, the second sub-green oil layer 232, and the third sub-green oil layer 233 together constitute the green oil layer 23. Therefore, in Figure 5 as well as Figure 6 In this context, the third sub-green oil layer 233 also uses the same fill designation as the first sub-green oil layer 231 and the second sub-green oil layer 232.

[0080] It should also be noted that there is no specific limit to the number of blank areas a1. For example, such as Figure 5 As shown, the green oil layer 23 includes 9 blank areas a1.

[0081] Furthermore, the shape of each blank region a1 is not specifically limited. For example, as shown... Figure 5 As shown, the nine blank areas a1 are rectangles. If the first sub-green oil layer 231 and the second sub-green oil layer 232 are regular shapes, then the resulting blank area a1 can be a regular shape (e.g., a rectangle); if the first sub-green oil layer 231 and the second sub-green oil layer 232 are irregular shapes, then the resulting blank area a1 can be an irregular shape.

[0082] In this embodiment, the area of ​​the green oil in the green oil layer 23 affects the area of ​​the blank area a1. When the ratio of the area of ​​the green oil layer 23 to the area of ​​the protective layer 22 meets the preset range, the area of ​​each blank area a1 is not specifically limited.

[0083] It should also be noted that the number of third sub-green oil layers 233 is not specifically limited. It can be that all blank areas a1 are provided with a third sub-green oil layer 233, or only some blank areas a1 are provided with a third sub-green oil layer 233, but each blank area a1 is provided with one third sub-green oil layer 233. For example, as shown... Figure 5 As shown, five of the nine blank areas a1 are respectively provided with a third sub-green oil layer 233. The projection of the five third sub-green oil layers 233 along the third direction is located at the four corners and the center of the projection of the chip 24 along the third direction, that is, the five third sub-green oil layers 233 are centrally symmetrical.

[0084] Furthermore, the area of ​​the third sub-green varnish layer 233 is not specifically limited. In this embodiment, provided that the area of ​​the green varnish layer 23 meets the requirements, setting the third sub-green varnish layer 233 in the blank area a1 can further enhance the adhesion between the green varnish layer 23 and the organic material. For example, if the ratio of the area of ​​the green varnish layer 23 to the area of ​​the protective layer 22 is 40%, a third sub-green varnish layer 233 can be further set in the blank area a1, as long as the ratio of the area of ​​the green varnish layer 23 to the area of ​​the protective layer 22 after setting the third sub-green varnish layer 233 meets the preset range.

[0085] In some embodiments, such as Figure 5 As shown, the center of the third sub-green oil layer 233 coincides with the center of the blank area a1.

[0086] In other words, along the third direction, the projection of the center of the third sub-green oil layer 233 coincides with the center of the blank area a1, so that the bonding force around the green oil layer 23 can be uniform.

[0087] In some embodiments, such as Figure 5 As shown, the third sub-green oil layer 233 is circular in shape.

[0088] Thus, the third sub-green oil layer 233 can also be called the green oil anchor point.

[0089] It should be noted that the shape of the third sub-green oil layer 233 can also be other shapes, such as a rectangle. There is no specific limitation on this, as long as the center of the third sub-green oil layer 233 coincides with the center of the blank area a1.

[0090] It should also be noted that there are no specific limitations on the shape relationship between each third sub-green oil layer 233. The shapes of each third sub-green oil layer 233 can be completely the same or partially the same, as long as the green oil layer 23 is centrally symmetrical and the center of the third sub-green oil layer 233 coincides with the center of the blank area a1.

[0091] Furthermore, there are no specific limitations on the area relationship between each third sub-green oil layer 233. The areas of each third sub-green oil layer 233 can be completely equal or partially equal, as long as the ratio of the area of ​​the green oil layer 23 formed by all the first sub-green oil layers 231, the second sub-green oil layer 232 and the third sub-green oil layer 233 to the area of ​​the protective layer 22 meets the preset range.

[0092] For example, such as Figure 6 As shown, four of the nine blank areas a1 are provided with a third sub-green varnish layer 233. The four third sub-green varnish layers 233 include two circular third sub-green varnish layers 233 and two rectangular third sub-green varnish layers 233. The two circular third sub-green varnish layers 233 have equal areas, the two rectangular third sub-green varnish layers 233 have equal areas, and the areas of the circular and rectangular third sub-green varnish layers 233 are not equal. However, the four third sub-green varnish layers 233 are centrally symmetrical.

[0093] In some embodiments, when the third sub-green oil layer 233 is circular, the diameter of the third sub-green oil layer 233 is not less than 150 micrometers.

[0094] In other words, the minimum diameter (MIN) of the green oil anchor point is 150 micrometers (μm).

[0095] It should be noted that the diameter of the third sub-green oil layer 233 is related to the semiconductor process. The smaller the diameter of the third sub-green oil layer 233, the greater the flexibility in its fabrication.

[0096] In some embodiments, the width of the first sub-green oil layer 231 is not less than 80 micrometers, and the width of the second sub-green oil layer 232 is not less than 80 micrometers.

[0097] In other words, the minimum width of the green tarpaulin bridge is 80μm.

[0098] It should be noted that the widths of the first sub-green oil layer 231 and the second sub-green oil layer 232 are as follows: Figure 5 As indicated by the middle arrow. Specifically, the width of the first sub-green oil layer 231 is the dimension of the first sub-green oil layer 231 along the second direction, and the width of the second sub-green oil layer 232 is the dimension of the second sub-green oil layer 232 along the first direction.

[0099] It should also be noted that the width of the first sub-green oil layer 231 and the second sub-green oil layer 232 is related to the semiconductor process. The smaller the width of the first sub-green oil layer 231 and the second sub-green oil layer 232, the greater the flexibility of the fabrication.

[0100] In some embodiments, such as Figure 4As shown, the encapsulation structure 20 may also include a conductive material 25, which fills the blank area a1 of the green oil layer 23.

[0101] It should be noted that the mesh-structured green oil layer 23 has multiple blank areas a1, and each blank area a1 is filled with conductive material 25, so that the conductive material 25 and the green oil layer 23 form an effective mechanical interlock, enhancing the adhesion.

[0102] It should also be noted that the conductive material 25 can be a conductive adhesive, specifically a highly conductive adhesive, which is an adhesive material with excellent conductivity. The conductive material 25 can be used to firmly bond the chip 24 to the substrate 21 to achieve interconnection.

[0103] In some embodiments, such as Figure 4 or Figure 7 As shown, the conductive material 25 is also located between the green oil layer 23 and the chip 24, or the upper surface of the green oil layer 23 is in contact with the lower surface of the chip 24.

[0104] Specifically, such as Figure 4 As shown, conductive material 25 is also located between the green oil layer 23 and the chip 24; as Figure 7 As shown, the upper surface of the green oil layer 23 is in contact with the lower surface of the chip 24.

[0105] It should be noted that, in Figure 4 and Figure 7 The dimensions of the substrate 21, the solder mask 23, the chip 24, and the conductive material 25 are shown only as an example and do not represent their specific proportions. Here, the solder mask 23 is nearly flush with the substrate 21, or in other words, the solder mask 23 is nearly flush with the protective layer 22, thereby ensuring the flatness under the chip 24.

[0106] It should also be noted that the upper surface of the green solder mask layer 23 is in contact with the lower surface of the chip 24, meaning the thickness of the green solder mask in the green solder mask layer 23 is almost the same as the thickness of the conductive material 25. The green solder mask layer 23 and the chip 24 have good adhesion, which enhances the bonding between the chip 24 and the organic material. In this embodiment, the green solder mask in the green solder mask layer 23 is not only located on the protective layer 22, but also penetrates the conductive material 25. The green solder mask and the conductive material 25 are interlocked, forming an effective mechanical interlock, solving the delamination problem between the chip 24 and the conductive material 25. This not only enhances the bonding between the protective layer 22 and the organic material, but also enhances the bonding between the chip 24 and the organic material, improving the reliability of the packaging structure 20. The packaging structure 20 avoids... Figure 1 The layering of the chip 13 and organic materials ensures the performance of the packaging structure 20.

[0107] In some embodiments, such as Figure 4 or Figure 7 As shown, the encapsulation structure 20 may also include encapsulation material 26, which fills the gaps in the encapsulation structure 20.

[0108] In this embodiment, the encapsulation material 26 can be a molding compound, but there is no specific limitation on it.

[0109] It should be noted that the green oil can also form an effective mechanical interlock with the molding compound, enhancing the adhesion between the protective layer 22 and the organic material, and between the chip 24 and the organic material.

[0110] This disclosure provides a packaging structure 20, which ensures heat dissipation by designing a mesh of solder mask bridges and solder mask anchors (i.e., solder mask layer 23) on the ENEPIG copper layer (i.e., protective layer 22). The area covered by solder mask in the solder mask layer 23 accounts for 30%-50% of the area of ​​the protective layer 22. The minimum width of the solder mask bridges is 80 μm, and the minimum diameter of the solder mask anchors is 150 μm. The solder mask layer 23 in the packaging structure 20 is symmetrical about the chip 24, reducing the risk of chip packaging and mounting. It also enhances the adhesion between the molding compound, conductive adhesive, and ENEPIG copper layer. Furthermore, the height difference between the solder mask and the ENEPIG copper layer allows for effective mechanical interlocking with the molding compound and conductive adhesive, further enhancing adhesion.

[0111] For details not disclosed in the embodiments of this disclosure, please refer to the description of the foregoing embodiments for understanding.

[0112] In the several embodiments provided in this disclosure, it should be understood that the disclosed structures and methods can be implemented in a non-target manner. The structural embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the various components shown or discussed are coupled to each other or directly coupled.

[0113] The features disclosed in the several method or structural embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new method or structural embodiments.

[0114] The above are merely some embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A packaging structure, characterized in that, The packaging structure includes: A substrate, wherein the upper surface of the substrate is a copper layer; A protective layer located above the copper layer; The green oil layer located above the protective layer has a mesh structure; The chip located above the green oil layer.

2. The packaging structure according to claim 1, characterized in that, The green oil layer is centrally symmetrical, and the center of symmetry of the green oil layer coincides with the center of the chip.

3. The packaging structure according to claim 1, characterized in that, The green oil layer includes at least one first sub-green oil layer extending along a first direction and at least one second sub-green oil layer extending along a second direction. The first direction and the second direction intersect.

4. The packaging structure according to claim 3, characterized in that, The green oil layer has multiple blank areas; The green oil layer also includes at least one third sub-green oil layer, and at least one of the blank areas is provided with the third sub-green oil layer.

5. The packaging structure according to claim 4, characterized in that, The center of the third sub-green oil layer coincides with the center of the blank area.

6. The packaging structure according to claim 3, characterized in that, The width of the first sub-green oil layer is not less than 80 micrometers, and the width of the second sub-green oil layer is not less than 80 micrometers.

7. The packaging structure according to claim 4, characterized in that, The third sub-green oil layer is circular in shape.

8. The packaging structure according to claim 7, characterized in that, The diameter of the third sub-green oil layer is not less than 150 micrometers.

9. The packaging structure according to claim 4, characterized in that, The encapsulation structure also includes a conductive material that fills the blank areas of the green oil layer.

10. The packaging structure according to claim 9, characterized in that, The conductive material is also located between the green oil layer and the chip, or the upper surface of the green oil layer is in contact with the lower surface of the chip.

11. The packaging structure according to claim 1, characterized in that, The ratio of the area of ​​the green oil layer to the area of ​​the protective layer meets a preset range.

12. The packaging structure according to claim 1, characterized in that, The protective layer is a chemically plated nickel-plated palladium-plated gold-plated coating.

13. The packaging structure according to claim 1, characterized in that, The encapsulation structure also includes an encapsulation material, which fills the gaps in the encapsulation structure.

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