PCB multilayer board electroplating device

Abstract

This utility model belongs to the technical field of PCB board processing equipment, and particularly relates to a PCB multilayer board electroplating device, including a frame, an electroplating mechanism, an exhaust mechanism, and a control mechanism. The electroplating mechanism includes a first electroplating component, a second electroplating component, a third electroplating component, and a fourth electroplating component. The exhaust mechanism includes an exhaust hood and an exhaust fan. The first electroplating component includes a first electroplating tank and a first limiting post. The second electroplating component includes a second electroplating tank and a second limiting post. The third electroplating component includes a third electroplating tank and a third limiting post. The fourth electroplating component includes a fourth electroplating tank and a fourth limiting post. The PCB multilayer board electroplating device provided in this application has four independent electroplating components, which can simultaneously perform electroplating operations on multiple PCB multilayer boards. Compared with traditional single electroplating tank devices, it significantly reduces waiting time and improves the efficiency of electroplating operations.

Description

Technical Field

[0001] This utility model belongs to the technical field of PCB board processing equipment, and in particular relates to a PCB multilayer board electroplating device. Background Technology

[0002] Electroplating is a crucial process in the production of multilayer PCBs. Its purpose is to form a uniform and dense metal coating on the PCB surface through electrolysis, thereby improving the conductivity, wear resistance and corrosion resistance of the PCB.

[0003] Traditional PCB electroplating equipment typically uses a single electroplating tank structure, allowing only one PCB board to be electroplated at a time. This method has several drawbacks: First, the electroplating efficiency is low. After each PCB board is electroplated, a series of operations such as removing the board, cleaning, and clamping the new board are required before the next board can be electroplated, resulting in a significant waste of time and reduced electroplating efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a PCB multilayer board electroplating device, which aims to solve the technical problem of reduced electroplating efficiency in the prior art.

[0005] To achieve the above objectives, the PCB multilayer board electroplating apparatus provided in this embodiment includes a frame, an electroplating mechanism, an exhaust mechanism, and a control mechanism. The electroplating mechanism is disposed on the frame and at the bottom of the exhaust mechanism; the exhaust mechanism is disposed on the top of the frame and electrically connected to the control mechanism; the control mechanism is disposed on the frame.

[0006] The electroplating mechanism includes a first electroplating component, a second electroplating component, a third electroplating component, and a fourth electroplating component, which are arranged independently in sequence on the frame.

[0007] The exhaust mechanism includes an exhaust hood and an exhaust fan. The exhaust hood is fixed to the frame and located on one side of the control mechanism. The exhaust fan is fixed inside the exhaust hood and electrically connected to the control mechanism.

[0008] As an optional solution of this utility model, the first electroplating component includes a first electroplating box and a first limiting post. The first electroplating box is fixedly connected to the frame and is provided with a first electroplating tank. There are two first limiting posts, both of which are fixedly connected to the top of the first electroplating box and are located inside the first electroplating tank.

[0009] As an optional solution of this utility model, the second electroplating component includes a second electroplating box and a second limiting post. The second electroplating box is fixedly connected to the frame and is provided with a second electroplating tank. There are two second limiting posts, both of which are fixedly connected to the top of the second electroplating box and are located inside the second electroplating tank.

[0010] As an optional solution of this utility model, the third electroplating component includes a third electroplating box and a third limiting post. The third electroplating box is fixedly connected to the frame and is provided with a third electroplating tank. There are two third limiting posts, both of which are fixedly connected to the top of the third electroplating box and are located inside the third electroplating tank.

[0011] As an optional embodiment of this utility model, the fourth electroplating component includes a fourth electroplating box and a fourth limiting post. The fourth electroplating box is fixedly connected to the frame and is provided with a fourth electroplating tank. There are two fourth limiting posts, both of which are fixedly connected to the top of the fourth electroplating box and are located inside the fourth electroplating tank.

[0012] As an optional solution of this utility model, the exhaust hood includes an exhaust hood body, exhaust holes, and exhaust pipes. The exhaust hood body is fixedly connected to the top side of the frame. Multiple exhaust holes are provided and evenly fixedly connected to the exhaust hood body, and the exhaust holes are arranged in a strip shape. The exhaust pipe is fixedly connected to the top side of the hood body. The exhaust fan is fixedly connected to the exhaust hood body and is disposed between the exhaust holes and the exhaust pipes.

[0013] As an optional embodiment of this utility model, the control mechanism includes a control panel and control buttons. The control panel is fixedly connected to the frame, and the control buttons are fixedly connected to the control panel and electrically connected to the control panel. The exhaust fan is electrically connected to the control panel.

[0014] The PCB multilayer board electroplating apparatus provided in this embodiment of the utility model has at least one of the following technical effects:

[0015] The PCB multilayer board electroplating apparatus provided in this application is equipped with four independent electroplating components, which can perform electroplating operations on multiple PCB multilayer boards simultaneously. Compared with the traditional single electroplating tank apparatus, it significantly reduces waiting time and improves the efficiency of electroplating operations. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A perspective view of the PCB multilayer board electroplating apparatus provided in an embodiment of this utility model.

[0018] Figure 2 A perspective view of the electroplating mechanism of the PCB multilayer board electroplating apparatus provided in this embodiment of the utility model.

[0019] Figure 3 An exploded view of the exhaust mechanism of the PCB multilayer board electroplating device provided in this embodiment of the utility model.

[0020] Figure 4 An exploded view of the exhaust mechanism of the PCB multilayer board electroplating device provided in this embodiment of the utility model.

[0021] The following are the labeling elements in the figure:

[0022] 1. Frame; 2. Electroplating mechanism; 3. Exhaust system; 4. Control system;

[0023] 21. First electroplating assembly; 22. Second electroplating assembly; 23. Third electroplating assembly; 24. Fourth electroplating assembly;

[0024] 31. Exhaust hood; 32. Exhaust fan;

[0025] 41. Control panel; 42. Control buttons;

[0026] 211. First electroplating box; 212. First limiting post; 213. First electroplating tank;

[0027] 221. Second electroplating box; 222. Second limiting post; 223. Second electroplating tank;

[0028] 231. Third electroplating box; 232. Third limiting post; 233. Third electroplating tank;

[0029] 241. Fourth electroplating box; 242. Fourth limiting post; 243. Fourth electroplating tank;

[0030] 311. Fan cover body; 312. Exhaust vent; 313. Exhaust pipe. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of this utility model, and should not be construed as limiting the utility model.

[0032] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0034] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0035] In one embodiment of this utility model, such as Figures 1-4 As shown, a PCB multilayer board electroplating apparatus is provided, including a frame 1, an electroplating mechanism 2, an exhaust mechanism 3, and a control mechanism 4. The frame 1 is welded from high-strength steel, providing stable support for the entire apparatus.

[0036] The electroplating mechanism 2 is set on the frame 1 and located on the bottom side of the exhaust mechanism 3. It includes a first electroplating component 21, a second electroplating component 22, a third electroplating component 23, and a fourth electroplating component 24. These four electroplating components are installed independently on the frame 1 in sequence. The independent electroplating components make it easy for the four PCB boards to be electroplated without affecting each other.

[0037] The first electroplating assembly 21 includes a first electroplating tank 211 and first limiting posts 212. The first electroplating tank 211 is made of corrosion-resistant PP material and is fixedly connected to the frame 1 by bolts. It has a first electroplating tank 213 inside to hold the electroplating solution. The first limiting posts 212 are made of stainless steel and are two in number. Both are welded to the top of the first electroplating tank 211, and their lower ends extend into the first electroplating tank 213. The distance between the two first limiting posts 212 matches the width of the PCB board to be electroplated, thus limiting and fixing the PCB board.

[0038] The second electroplating assembly 22 includes a second electroplating tank 221 and a second limiting post 222. The second electroplating tank 221 is made of corrosion-resistant PP material and is fixedly connected to the frame 1 by bolts. A second electroplating tank 223 is provided inside the tank to hold the electroplating solution. The second limiting post 222 is made of stainless steel and has two posts, both welded to the top of the second electroplating tank 221 and extending their lower ends into the second electroplating tank 223. The distance between the two second limiting posts 222 matches the width of the PCB board to be electroplated, thus limiting and fixing the PCB board.

[0039] The third electroplating assembly 23 includes a third electroplating tank 231 and third limiting posts 232. The third electroplating tank 231 is made of corrosion-resistant PP material and is fixedly connected to the frame 1 by bolts. It has a third electroplating tank 233 inside to hold the electroplating solution. The third limiting posts 232 are made of stainless steel and there are two of them. They are both fixed to the top of the third electroplating tank 231 by welding, and their lower ends extend into the third electroplating tank 233. The distance between the two third limiting posts 232 matches the width of the PCB board to be electroplated, and is used to limit and fix the PCB board.

[0040] The fourth electroplating assembly 24 includes a fourth electroplating tank 241 and fourth limiting posts 242. The fourth electroplating tank 241 is made of corrosion-resistant PP material and is fixedly connected to the frame 1 by bolts. It has a fourth electroplating tank 243 inside to hold the electroplating solution. The fourth limiting posts 242 are made of stainless steel and are two in number. Both are welded to the top of the fourth electroplating tank 241, and their lower ends extend into the fourth electroplating tank 243. The distance between the two fourth limiting posts 242 matches the width of the PCB board to be electroplated, thus limiting and fixing the PCB board.

[0041] The exhaust system 3 is installed on the top of the frame 1 and includes an exhaust hood 31 and an exhaust fan 32. The exhaust hood 31 consists of a hood body 311, exhaust holes 312, and an exhaust pipe 313. The hood body 311 is made of galvanized steel sheet and is bolted to the top side of the frame 1, located above the first electroplating assembly 21 and the second electroplating assembly 22. Multiple exhaust holes 312 are evenly distributed in a strip shape at the bottom of the hood body 311. The strip-shaped exhaust holes 312 are 10-15 cm long and 2-3 cm wide, which facilitates the even intake of harmful gases generated during the electroplating process. The exhaust pipe 313 is made of PVC, with one end fixedly connected to the middle of the top side of the hood body 311 via a flange, and the other end connected to the factory's waste gas treatment system. The exhaust fan 32 is a centrifugal fan, which is fixed inside the hood body 311 by a bracket and located between the exhaust hole 312 and the exhaust pipe 313. It is used to exhaust harmful gases in the hood body 311 through the exhaust pipe 313.

[0042] The control mechanism 4 is located on one side of the frame 1 and includes a control panel 41 and control buttons 42. The control panel 41 uses a PLC control system and is fixed to the frame 1 with bolts, and integrates control circuitry internally. The control buttons 42 include a start button, a stop button, and a fan speed adjustment button, which are fixedly installed on the surface of the control panel 41 and electrically connected to the internal circuitry of the control panel 41. The exhaust fan 32 is electrically connected to the control panel 41 via wires, and the operator can control the start / stop and fan speed of the exhaust fan 32 using the control buttons 42.

[0043] The working process of this embodiment is as follows:

[0044] First, according to the electroplating process requirements, the corresponding electroplating solutions are added to the first electroplating tank 213, the second electroplating tank 223, the third electroplating tank 233 and the fourth electroplating tank 243 respectively.

[0045] Then, the PCB multilayer board to be electroplated is placed into the electroplating tanks of the four electroplating components respectively, and the PCB board is positioned and fixed by the limiting posts to ensure that the PCB board is stably immersed in the electroplating solution.

[0046] Next, the operator presses the start button in the control button 42 to start the exhaust fan 32. The exhaust fan 32 starts to work and draws the harmful gases generated during the electroplating process into the hood body 311 through the exhaust hole 312, and then discharges them to the waste gas treatment system through the exhaust pipe 313.

[0047] During the electroplating process, four electroplating components simultaneously perform electroplating operations on their respective PCB boards, thereby improving electroplating efficiency.

[0048] After electroplating is completed, turn off the exhaust fan 32, remove the electroplated PCB board from the electroplating tank, and proceed with subsequent processing.

[0049] This utility model achieves simultaneous electroplating of multiple PCB multilayer boards by setting up four independent electroplating components, thus improving production efficiency; the design of the exhaust mechanism 3 effectively improves the working environment; the control mechanism 4 makes operation more convenient; the overall device has a reasonable structure and strong practicality.

[0050] The PCB multilayer board electroplating apparatus provided in this application is equipped with four independent electroplating components, which can perform electroplating operations on multiple PCB multilayer boards simultaneously. Compared with the traditional single electroplating tank apparatus, it significantly reduces waiting time and improves the efficiency of electroplating operations.

[0051] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A PCB multilayer board electroplating apparatus, characterized in that, The device includes a frame, an electroplating mechanism, an exhaust mechanism, and a control mechanism. The electroplating mechanism is disposed on the frame and located at the bottom of the exhaust mechanism. The exhaust mechanism is disposed on the top of the frame and is electrically connected to the control mechanism. The control mechanism is disposed on the frame. The electroplating mechanism includes a first electroplating component, a second electroplating component, a third electroplating component, and a fourth electroplating component, which are arranged independently in sequence on the frame. The exhaust mechanism includes an exhaust hood and an exhaust fan. The exhaust hood is fixed to the frame and located on one side of the control mechanism. The exhaust fan is fixed inside the exhaust hood and electrically connected to the control mechanism.

2. The PCB multilayer board electroplating apparatus according to claim 1, characterized in that, The first electroplating assembly includes a first electroplating tank and a first limiting post. The first electroplating tank is fixedly connected to the frame and is provided with a first electroplating tank. There are two first limiting posts, both of which are fixedly connected to the top of the first electroplating tank and are located inside the first electroplating tank.

3. The PCB multilayer board electroplating apparatus according to claim 1, characterized in that, The second electroplating assembly includes a second electroplating tank and a second limiting post. The second electroplating tank is fixedly connected to the frame and is provided with a second electroplating tank. There are two second limiting posts, both of which are fixedly connected to the top of the second electroplating tank and are located inside the second electroplating tank.

4. The PCB multilayer board electroplating apparatus according to claim 1, characterized in that, The third electroplating assembly includes a third electroplating tank and a third limiting post. The third electroplating tank is fixedly connected to the frame and is provided with a third electroplating tank. There are two third limiting posts, both of which are fixedly connected to the top of the third electroplating tank and are located inside the third electroplating tank.

5. The PCB multilayer board electroplating apparatus according to claim 1, characterized in that, The fourth electroplating component includes a fourth electroplating tank and a fourth limiting post. The fourth electroplating tank is fixedly connected to the frame and is provided with a fourth electroplating tank. There are two fourth limiting posts, both of which are fixedly connected to the top of the fourth electroplating tank and are located inside the fourth electroplating tank.

6. The PCB multilayer board electroplating apparatus according to claim 1, characterized in that, The exhaust hood includes an exhaust hood body, exhaust holes, and exhaust pipes. The exhaust hood body is fixedly connected to the top side of the frame. Multiple exhaust holes are provided and evenly fixedly connected to the exhaust hood body, and the exhaust holes are arranged in a strip shape. The exhaust pipe is fixedly connected to the top side of the hood body. The exhaust fan is fixedly connected to the exhaust hood body and is disposed between the exhaust holes and the exhaust pipes.

7. The PCB multilayer board electroplating apparatus according to claim 6, characterized in that, The control mechanism includes a control panel and control buttons. The control panel is fixedly connected to the frame, and the control buttons are fixedly connected to the control panel and electrically connected to the control panel. The exhaust fan is electrically connected to the control panel.

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